Chip thermal desealing equipment with temperature feedback control

Abstract

The utility model relates to the technical field of chip thermal decapsulation, and discloses chip thermal decapsulation equipment with temperature feedback control, which comprises a thermal decapsulation box body, an electric push rod and an auxiliary decapsulation device, the auxiliary decapsulation device consists of a lifting part, an auxiliary part and a loading plate, the electric push rod is arranged at the top end of the thermal decapsulation box body, and the electric push rod is arranged at the top end of the thermal decapsulation box body. The electric push rod is connected with the top of the thermal deblocking box body in a matched mode through an adaptive bolt, an auxiliary deblocking device is arranged in the thermal deblocking box body, a main body of the auxiliary deblocking device is a lifting part, an auxiliary part and a carrying plate are arranged in the lifting part, and the top end of the auxiliary part is correspondingly welded to an output push rod of the electric push rod. And a group of chip bodies which are distributed at equal intervals are arranged in the loading plate, the chip thermal desealing equipment is simple in structure, large-batch accurate thermal desealing treatment can be realized in cooperation with an auxiliary desealing device, and the working efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of chip thermal desealing technology, specifically a chip thermal desealing device with temperature feedback control. Background Technology

[0002] In the research and development, production and fault detection of semiconductor chips, the thermal desealing operation is extremely critical. With the rapid development of semiconductor technology, the integration of chips is constantly increasing and the internal structure is becoming more and more complex, which makes the requirements for thermal desealing equipment increasingly stringent.

[0003] Traditional chip thermal desealing equipment suffers from significant deficiencies in temperature control. On the one hand, its temperature control accuracy is low, making it difficult to meet the stringent temperature requirements of different chips. Due to variations in chip manufacturing processes, the optimal desealing temperature range for different chip types is narrow. Traditional equipment cannot precisely regulate the temperature, which can easily lead to overheating and damage to the internal circuitry of the chip during desealing, or insufficient temperature to effectively remove the packaging material, thus affecting the desealing effect. On the other hand, the lack of an effective temperature feedback mechanism means that traditional equipment cannot monitor temperature changes in real time during the chip desealing process and cannot adjust heating parameters in a timely manner, resulting in poor stability and reliability of the desealing process and difficulty in guaranteeing product yield. Furthermore, with the rapid development of the chip industry, higher demands are being placed on the efficiency of chip thermal desealing. Existing equipment has a slow desealing speed, which cannot meet the needs of large-scale production and rapid testing, severely restricting the development of the chip industry. Therefore, we propose a chip thermal desealing equipment with temperature feedback control. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a chip thermal desealing device with temperature feedback control, which solves the aforementioned problems.

[0006] (II) Technical Solution

[0007] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a chip thermal desealing device with temperature feedback control, comprising a thermal desealing chamber and an electric push rod, and an auxiliary desealing device composed of a lifting component, an auxiliary component, and a carrying plate. The top end of the thermal desealing chamber is provided with an electric push rod, which is connected to the top of the thermal desealing chamber by an adapter bolt. An auxiliary desealing device is provided inside the thermal desealing chamber. The main body of the auxiliary desealing device is a lifting component, which contains an auxiliary component and a carrying plate. The top end of the auxiliary component is welded to the output push rod of the electric push rod. A group of chip bodies are evenly distributed inside the carrying plate.

[0008] Preferably, the bottom of the heat-unsealing box is provided with a heating platform, and two axially symmetrically distributed sliding grooves are provided on both opposite side walls of the heat-unsealing box. A mating hole is provided at the center of the top end of the heat-unsealing box, and four axially symmetrically distributed connecting holes are provided around the mating hole. The connecting holes are connected to the electric push rod by means of adapter bolts. A control device is provided on the side wall of the heat-unsealing box, and a rectangular opening is provided at the top end of the side wall corresponding to the control device, which penetrates the heat-unsealing box.

[0009] Preferably, the lifting component has an inverted U-shaped structure. A mating hole 2 is provided at the center of the top end of the lifting component, which corresponds to the mating hole 1. Two sliders 1 are provided on the two opposite side walls of the outer side of the lifting component in an axisymmetrical arrangement. The sliders 1 are slidably connected to the slide groove 1. A slide groove 3 is provided on the two opposite side walls of the inner side of the lifting component. A fixing groove is provided at both ends of the slide groove 3. A slide groove 2 is provided in the middle of the slide groove 3. The slide groove 2 and the slide groove 3 are perpendicularly distributed.

[0010] Preferably, the auxiliary component is a rectangular plate, and two sliders are provided at the center of opposite sidewalls of the auxiliary component in an axisymmetric manner. The sliders are slidably connected to the grooves. The bottom end of the auxiliary component has a set of equidistant inner cavities, and the inner cavities are provided with elastic elements. The bottom end of the elastic elements is attached to the top of the chip body.

[0011] Preferably, the output push rod of the electric actuator passes through mating hole one and mating hole two, and the bottom end of the output push rod of the electric actuator is welded to the center of the top end of the auxiliary component.

[0012] Preferably, the two opposite sidewalls of the carrier plate are provided with two sliders three that are symmetrically distributed on the axis. The sliders three are slidably connected to the sliding grooves three and are snapped into the bottom of the fixed grooves. The end face of the carrier plate is provided with a set of chip placement slots that are equidistantly distributed. The chip placement slots are used to place the chip body. A temperature sensor is provided at the center of the end face of the carrier plate. The bottom end of the carrier plate is attached to the top end face of the heating platform.

[0013] (III) Beneficial Effects

[0014] Compared with the prior art, this utility model provides a chip thermal desealing device with temperature feedback control, which has the following beneficial effects:

[0015] 1. This chip thermal desealing equipment with temperature feedback control provides precise temperature control and improves desealing quality. The equipment monitors the heating temperature of the chip body in real time through a temperature sensor and feeds the data back to the control device, achieving precise temperature control. During the chip thermal desealing process, the temperature is strictly controlled within the optimal desealing range, effectively preventing damage to the internal circuitry due to overheating and also preventing insufficient temperature from affecting the desealing effect. This significantly improves desealing quality and product yield. In semiconductor chip production, precise temperature control ensures that the internal structure of the chip is not damaged during desealing, providing a reliable sample for subsequent testing and analysis.

[0016] 2. This chip thermal desealing equipment with temperature feedback control is highly efficient and convenient, improving work efficiency. The equipment uses an electric push rod to control the lifting and lowering of the auxiliary desealing device, facilitating the replacement and placement of the carrier plate. Operation is simple and quick. At the same time, the heating platform can uniformly heat multiple chip bodies, enabling large-scale thermal desealing. In chip R&D and fault detection scenarios, it can quickly complete the desealing of a large number of chips, meeting the needs of large-scale production and rapid testing, effectively improving work efficiency and promoting the development of the chip industry. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the chip thermal desealing equipment of this utility model;

[0018] Figure 2 This is a cross-sectional schematic diagram of the chip thermal desealing equipment of this utility model;

[0019] Figure 3 This is a schematic diagram of the heat-dissolving box of this utility model;

[0020] Figure 4 This is a schematic diagram of the lifting component of this utility model;

[0021] Figure 5 This is a cross-sectional view of the auxiliary component of this utility model;

[0022] Figure 6 This is a schematic diagram of the carrier plate of this utility model.

[0023] In the diagram: 1. Thermal unsealing chamber; 2. Electric push rod; 3. Lifting component; 4. Auxiliary component; 5. Control device; 6. Carrier plate; 7. Chip body; 8. Heating platform; 9. Mating hole one; 10. Slide groove one; 11. Slider one; 12. Mating hole two; 13. Slide groove two; 14. Slide groove three; 15. Fixing groove; 16. Slider two; 17. Inner cavity; 18. Elastic component; 19. Slider three; 20. Chip placement slot; 21. Temperature sensor. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] Please see Figure 1-6 A chip thermal desealing device with temperature feedback control includes a thermal desealing chamber 1 and an electric push rod 2, as well as an auxiliary desealing device composed of a lifting component 3, an auxiliary component 4 and a carrier plate 6. The top end of the thermal desealing chamber 1 is provided with an electric push rod 2, which is connected to the top of the thermal desealing chamber 1 by an adapter bolt. The thermal desealing chamber 1 is provided with an auxiliary desealing device, the main body of which is the lifting component 3. The lifting component 3 is provided with an auxiliary component 4 and a carrier plate 6 inside. The top end of the auxiliary component 4 is welded to the output push rod of the electric push rod 2. The carrier plate 6 is provided with a group of chip bodies 7 distributed at equal intervals.

[0026] Furthermore, a heating platform 8 is provided at the bottom of the interior of the thermal desealing chamber 1, and two axially symmetrically distributed sliding grooves 10 are provided on both opposite side walls of the interior of the thermal desealing chamber 1. A mating hole 9 is provided at the center of the top end of the thermal desealing chamber 1, and four axially symmetrically distributed connecting holes are provided around the mating hole 9. The connecting holes are connected to the electric push rod 2 by means of matching bolts. A control device 5 is provided on the side wall of the thermal desealing chamber 1, and a rectangular opening is provided at the top end of the side wall of the thermal desealing chamber 1 corresponding to the control device 5. The rectangular opening penetrates the thermal desealing chamber 1. The heating platform 8 inside the thermal desealing chamber 1 can uniformly heat the carrier plate 6 and the chip body 7 group, realize large-scale thermal desealing work, and improve work efficiency.

[0027] Furthermore, the lifting component 3 has an inverted U-shaped structure. A mating hole 2 12 is provided at the center of the top end of the lifting component 3, which corresponds to the mating hole 1 9. Two sliders 11 are provided on the two opposite side walls of the outer side of the lifting component 3 in an axisymmetrical manner. The sliders 11 are slidably connected to the slide groove 10. A slide groove 3 14 is provided on the two opposite side walls inside the lifting component 3. A fixing groove 15 is provided at both ends of the slide groove 3 14. A slide groove 2 13 is provided in the middle of the slide groove 3 14. The slide groove 2 13 is perpendicular to the slide groove 3 14. The lifting component 3 provides a stable working space for the carrying plate 6 and the auxiliary component 4, and ensures the stability of the overall structure and the uniformity of heating, thereby improving the heat desealing efficiency.

[0028] Furthermore, the auxiliary component 4 is a rectangular plate, and the auxiliary component 4 has two symmetrically distributed sliders 16 at the center of its two opposite side walls. The sliders 16 are slidably connected to the slide grooves 13. The bottom end of the auxiliary component 4 has a set of equidistant inner cavities 17. The inner cavity 17 is provided with elastic elements 18. The bottom end of the elastic elements 18 is attached to the top of the chip body 7. The elastic elements 18 at the bottom of the auxiliary component 4 help the chip body 7 to be stably fixed on the carrier plate 6, ensuring uniform heating process and preventing uneven heating of the chip body 7 from causing unsealing failure.

[0029] Furthermore, the output push rod of the electric push rod 2 passes through the mating hole 9 and the mating hole 12 respectively, and the bottom end of the output push rod of the electric push rod 2 is welded to the center of the top end of the auxiliary component 4. The output push rod of the electric push rod 2 controls the auxiliary component 4 to rise and fall. When the auxiliary component 4 slides to the top of the inside of the lifting component 3, it drives the lifting component 3 to rise and fall as a whole. Therefore, the carrying plate 6 can be replaced and placed, improving the practicality of the structure.

[0030] Furthermore, the two opposite sidewalls of the carrier plate 6 are provided with two sliders 19 arranged symmetrically on the axis. The sliders 19 are slidably connected to the slide grooves 14 and are also engaged with the bottom of the fixing grooves 15. The end face of the carrier plate 6 is provided with a set of chip placement slots 20 arranged at equal intervals. The chip placement slots 20 are used to place the chip bodies 7. The center of the end face of the carrier plate 6 is provided with a temperature sensor 21. The bottom end of the carrier plate 6 is attached to the top end face of the heating stage 8. The chip bodies 7 to be unsealed are placed on the carrier plate 6, and the sliders 19 slide horizontally into the slide grooves 14. Finally, they slide down the fixing grooves 15 to fix the position. During unsealing, the temperature sensor 21 provides real-time feedback of the unsealing heating temperature to the control device 5 to ensure that the temperature does not exceed the threshold and prevent the chip bodies 7 from being damaged by excessive temperature.

[0031] Structural Description:

[0032] Thermal desealing chamber 1: Thermal desealing chamber 1 is the main outer shell of the equipment. It is equipped with a heating platform 8 and an auxiliary desealing device inside. An electric push rod 2 is installed on the top, and a control device 5 is provided on the side wall to provide space for thermal desealing.

[0033] Electric push rod 2: The electric push rod 2 is installed on the top of the heat-dissipating box 1 and is connected by an adapter bolt. Its output push rod controls the lifting and lowering of the auxiliary component 4, which facilitates the replacement and placement of the loading plate 6.

[0034] Lifting component 3: Lifting component 3 is inverted U-shaped, providing stable space for auxiliary component 4 and carrier plate 6. Through the cooperation of slider 11 and slide groove 10, the overall structure is stable and the heating is uniform.

[0035] Auxiliary component 4: Auxiliary component 4 is a rectangular plate that is slidably connected to slide groove 13 via slider 2 16. The bottom elastic component 18 helps to fix the chip body 7 to ensure uniform heating.

[0036] Control device 5: The control device 5 is installed on the side wall of the thermal desealing chamber 1, receives temperature data fed back by the temperature sensor 21, controls the temperature of the heating table 8, and prevents the chip from overheating and being damaged.

[0037] Carrier plate 6: Carrier plate 6 is used to place chip body 7. It is fixed by sliding block 3 19, sliding groove 3 14, and fixing groove 15. Temperature sensor 21 is provided on the end face to monitor temperature.

[0038] Chip body 7: Chip body 7 is placed in the chip placement slot 20 of the carrier plate 6 and is the object of the thermal desealing operation, which is carried out in the equipment.

[0039] Heating platform 8: The heating platform 8 is located at the bottom of the interior of the thermal desealing box 1. It heats the carrier plate 6 and the chip body 7 evenly to achieve large-scale thermal desealing.

[0040] Mating hole 19: Mating hole 19 is located at the center of the top of the heat-unsealing box 1, and mates with the output push rod of the electric push rod 2. The surrounding connecting holes are used to install the electric push rod 2.

[0041] Slide 10: Slide 10 is symmetrically distributed on two opposite side walls inside the heat-unsealing box 1, and slides in cooperation with slider 11 to guide the lifting component 3 to rise and fall smoothly;

[0042] Slider 11: Slider 11 is symmetrically arranged on two opposite side walls of the outside of the lifting component 3, and cooperates with slide groove 10 to ensure that the lifting component 3 slides stably in the heat-unsealing box 1.

[0043] Matching hole 2 12: Matching hole 2 12 is located at the top center of the lifting component 3, corresponding to matching hole 1 9, through which the output push rod of the electric push rod 2 passes and connects to the auxiliary component 4;

[0044] Slide groove 2 13: Slide groove 2 13 is formed on two opposite side walls inside the lifting component 3 and slides in cooperation with slider 2 16, thereby allowing auxiliary component 4 to move up and down inside the lifting component 3;

[0045] Slide groove 3 14: Slide groove 3 14 is located on two opposite side walls inside the lifting component 3, with fixing grooves 15 at both ends, which cooperate with slider 3 19 to fix the load plate 6;

[0046] Fixed groove 15: Fixed groove 15 is located at both ends of slide groove 3 14 and is engaged with the bottom of slider 3 19 to ensure that the load plate 6 is stably placed inside the lifting component 3;

[0047] Slider 2 16: Slider 2 16 is symmetrically arranged at the center of the two opposite side walls of the auxiliary component 4, and cooperates with slide groove 2 13 to enable the auxiliary component 4 to slide smoothly within the lifting component 3;

[0048] Inner cavity 17: The inner cavity 17 is evenly distributed at the bottom end of the auxiliary component 4, and an elastic component 18 is provided inside to help fix the chip body 7 and ensure the heating effect.

[0049] Elastic element 18: The elastic element 18 is located inside the inner cavity 17, with its bottom attached to the top of the chip body 7, which helps to stably fix the chip body 7 on the carrier plate 6.

[0050] Slider 3 19: Slider 3 19 is symmetrically distributed on the two opposite side walls of the carrying plate 6, and cooperates with slide groove 3 14 and fixing groove 15 to realize the installation and fixation of the carrying plate 6;

[0051] Chip placement slots 20: Chip placement slots 20 are evenly distributed on the end face of the carrier plate 6 and are used to place the chip body 7 to ensure the chip is in a stable position during thermal desealing;

[0052] Temperature sensor 21: Temperature sensor 21 is located at the center of the end face of the carrier plate 6, which monitors the heating temperature of the chip body 7 in real time and feeds it back to the control device 5.

[0053] Working Principle: Install the chip thermal desealing device with temperature feedback control correctly according to the diagram. During operation, first place the chip body 7 to be desealed in the chip placement slot 20 of the carrier plate 6. Through the cooperation of slider 3 19, slide groove 3 14, and fixing slot 15, the carrier plate 6 is stably fixed to the top of the heating platform 8 inside the thermal desealing chamber 1. The bottom of the carrier plate 6 is in contact with the top of the heating platform 8, ready for thermal desealing. After starting the device, the heating platform 8 inside the thermal desealing chamber 1 begins to work, uniformly heating the carrier plate 6 and the chip body 7. During the heating process, the temperature sensor 21 at the center of the end face of the carrier plate 6 monitors the temperature in real time and feeds the temperature data back to the control device 5 on the side wall of the thermal desealing chamber 1. After receiving the temperature data, the control device 5 compares it with the preset desealing temperature threshold. If the actual temperature is close to or exceeds the threshold, the control device 5 will issue a command to adjust the heating power of the heating platform 8 to ensure that the temperature remains within acceptable limits. Within a suitable range, the chip body 7 is prevented from being damaged due to overheating. At the same time, the electric push rod 2 can control the lifting and lowering of the auxiliary desealing device as needed. The output push rod of the electric push rod 2 passes through the mating hole 1 9 and the mating hole 2 12, and its bottom is welded to the center of the top of the auxiliary component 4. When it is necessary to replace the carrier plate 6 or operate the equipment, the electric push rod 2 pushes the auxiliary component 4 to rise. The auxiliary component 4 drives the lifting component 3 to rise as a whole through the sliding engagement of the slider 2 16 and the slide groove 2 13. Since the lifting component 3 is connected to the thermal desealing box 1 through the sliding engagement of the slider 1 11 and the slide groove 10, it can perform stable lifting and lowering movements. The elastic element 18 at the bottom of the auxiliary component 4 plays a role in helping to fix the chip body 7 during the heating process, so that the chip body 7 remains stable on the carrier plate 6, ensuring uniform heating and preventing desealing failure due to uneven heating. Through such temperature feedback control and the coordinated work of the auxiliary desealing device, efficient and stable thermal desealing of the chip body 7 is achieved.

[0054] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip thermal desealing device with temperature feedback control, comprising a thermal desealing chamber (1) and an electric push rod (2), and an auxiliary desealing device composed of a lifting component (3), an auxiliary component (4), and a carrier plate (6), characterized in that: The top end of the heat-desealing box (1) is provided with an electric push rod (2). The electric push rod (2) is connected to the top of the heat-desealing box (1) by an adapter bolt. An auxiliary desealing device is provided inside the heat-desealing box (1). The main body of the auxiliary desealing device is a lifting component (3). An auxiliary component (4) and a carrying plate (6) are provided inside the lifting component (3). The top end of the auxiliary component (4) is welded to the output push rod of the electric push rod (2). A set of chip bodies (7) are distributed at equal intervals inside the carrying plate (6).

2. The chip thermal desealing device with temperature feedback control according to claim 1, characterized in that: The heat-unsealing box (1) has a heating platform (8) at the bottom inside, and two axially symmetrical sliding grooves (10) are opened on the two opposite side walls inside the heat-unsealing box (1). A mating hole (9) is opened at the center of the top end of the heat-unsealing box (1), and four axially symmetrical connecting holes are opened around the mating hole (9). The connecting holes are connected to the electric push rod (2) by the matching bolts. A control device (5) is provided on the side wall of the heat-unsealing box (1), and a rectangular opening is opened at the top end of the side wall of the heat-unsealing box (1) corresponding to the control device (5). The rectangular opening penetrates the heat-unsealing box (1).

3. The chip thermal desealing device with temperature feedback control according to claim 1, characterized in that: The lifting component (3) has an inverted U-shaped structure. The top end of the lifting component (3) has a mating hole 2 (12) at its center, which corresponds to the mating hole 1 (9). The two opposite sidewalls of the outer sidewall of the lifting component (3) are provided with two sliders 1 (11) that are symmetrically distributed. The sliders 1 (11) are slidably connected to the slide groove 1 (10). The two opposite sidewalls inside the lifting component (3) are provided with slide groove 3 (14). The two ends of slide groove 3 (14) are provided with fixing grooves (15). The middle position of slide groove 3 (14) is provided with slide groove 2 (13), which is perpendicular to slide groove 3 (14).

4. The chip thermal desealing device with temperature feedback control according to claim 1, characterized in that: The auxiliary component (4) is a rectangular plate, and the auxiliary component (4) has two opposing sidewalls with two sliders (16) arranged in an axially symmetrical manner. The sliders (16) are slidably connected to the grooves (13). The bottom end of the auxiliary component (4) has a set of equidistant cavities (17), and the cavities (17) are provided with elastic elements (18). The bottom end of the elastic elements (18) is attached to the top of the chip body (7).

5. A chip thermal desealing device with temperature feedback control according to claim 2, characterized in that: The output push rod of the electric push rod (2) passes through the mating hole one (9) and the mating hole two (12), and the bottom end of the output push rod of the electric push rod (2) is welded to the center of the top end of the auxiliary part (4).

6. The chip thermal desealing device with temperature feedback control according to claim 1, characterized in that: The two opposite sidewalls of the carrier plate (6) are provided with two sliders (19) that are symmetrically distributed. The sliders (19) are slidably connected to the slide grooves (14) and are also engaged with the bottom of the fixing groove (15). The end face of the carrier plate (6) is provided with a set of chip placement slots (20) that are equidistantly distributed. The chip placement slots (20) are used to place the chip body (7). The center of the end face of the carrier plate (6) is provided with a temperature sensor (21). The bottom end of the carrier plate (6) is attached to the top end face of the heating table (8).

Images