Bonding device and bonding system

Abstract

The utility model discloses bonding equipment and a bonding system, and belongs to the technical field of semiconductor material processing equipment. The bonding apparatus includes a carrier, a holding assembly, and a calibration assembly. The carrier is used for carrying a semiconductor material. The holding assembly comprises a containing part and a holding tool, the containing part is used for storing the holding tool, the containing part is directly or indirectly connected to the bearing part, the containing part is arranged on the peripheral side of the bearing part, and the holding tool is used for picking up and holding the semiconductor material. The calibration assembly is arranged on the peripheral side of the bearing part, the calibration assembly comprises a detection part, a control part and a calibration mark, and the calibration assembly is configured to enable the detection part to detect the position information of the calibration mark held by the holding tool and adjust the pose of the holding tool through the control part, so that the holding tool is opposite to the preset area in position. According to the utility model, the bonding precision can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a bonding device and a bonding system. Background Technology

[0002] In semiconductor bonding processes, bonding materials of different specifications, such as wafers to wafers and wafers to heterogeneous chips, requires size-matched pressure heads to ensure uniform pressure distribution at the bonding interface. Traditionally, multiple pressure heads are configured for different bonding scenarios and stored on separate storage racks. The storage rack and the bonding station are two independent and separately arranged workstations. When switching pressure heads, the pressurizing device must travel back and forth between the storage rack and the bonding station to retrieve and replace the pressure head, leading to increased equipment idle time and limited production efficiency. Furthermore, frequent long-distance movements exacerbate the cumulative errors in the mechanical motion system (such as slide rails and transmission mechanisms), such as mechanical backlash and positioning drift, causing a gradual decrease in the alignment accuracy between the pressure head and the bonding platform, directly affecting bonding alignment quality and product yield.

[0003] This section provides background information related to this application, which is not necessarily prior art. Utility Model Content

[0004] The purpose of this invention is to provide a bonding device and a bonding system that can improve bonding accuracy.

[0005] To achieve the above objectives, the following technical solution is provided:

[0006] A bonding device, comprising:

[0007] Support components, used to support semiconductor materials;

[0008] A holding assembly includes a receiving element and a holding fixture. The receiving element is used to store the holding fixture. The receiving element is directly or indirectly connected to the carrier and is disposed on the periphery of the carrier. The holding fixture is used to pick up and hold semiconductor material.

[0009] A calibration component is disposed on the periphery of the carrier. The calibration component includes a detection component, a control component, and a calibration mark. The calibration component is configured such that the detection component detects the position information of the calibration mark held by the holding fixture and adjusts the position of the holding fixture by the control component so that the holding fixture and the preset area are relative to each other.

[0010] As an optional solution for the bonding device, the calibration component includes a first calibration element, and the calibration mark includes a first calibration mark. The first calibration mark is disposed on the first calibration element, and the first calibration element is configured such that the holding fixture picks up the first calibration element so that the detection element detects the position information of the first calibration mark.

[0011] As an optional solution for the bonding device, the calibration assembly further includes a second calibration element, and the calibration mark further includes a second calibration mark. The second calibration mark is disposed on the second calibration element, and the second calibration element is disposed on the carrier. The first calibration element is located on the side of the second calibration element facing away from the carrier.

[0012] The calibration component is configured such that the detection element detects the position information of the first calibration mark and the second calibration mark held by the holding fixture, and the control element adjusts the pose of the holding fixture so that the holding fixture is relative to a preset position.

[0013] As an optional solution for the bonding device, the calibration assembly further includes a first adsorption channel and a second adsorption channel. The second adsorption channel is used to adsorb a second calibration piece. The second calibration piece is provided with an avoidance structure. The first adsorption channel adsorbs the first calibration piece through the avoidance structure.

[0014] As an alternative to the bonding device, the carrier includes an integrally structured mounting portion and a bearing portion, the mounting portion being disposed on the periphery of the bearing portion, and the retaining component being disposed on the mounting portion.

[0015] As an alternative to the bonding device, a connection assembly is also included, the connection assembly including a first connection end and a second connection end, the first connection end being connected to the side of the carrier opposite to the side carrying the semiconductor material, and the second connection end being connected to the side of the receiving member opposite to the side where the holding fixture is stored.

[0016] As an alternative to the bonding device, the connection assembly includes a movable component and a support. The movable component includes a first connection end, and the support includes a second connection end. The movable component is connected to the support, and the movable component is movably disposed relative to the support.

[0017] As an alternative to the bonding device, a positioning element is also included. The carrier includes a carrier portion for carrying semiconductor material, and the positioning element is disposed on the periphery of the carrier portion for defining the position of the semiconductor material.

[0018] As an alternative to the bonding apparatus, the semiconductor material includes a wafer with its edge extending beyond the carrier portion, and the positioning member is movably disposed relative to the carrier along the thickness direction of the carrier to lift the wafer.

[0019] As an optional solution for the bonding device, the carrier also includes a placement area for placing abnormal components during the bonding process, the abnormal components including fixtures for holding abnormal positions.

[0020] A bonding system is also provided, including a bonding apparatus as described in any of the foregoing embodiments and a pressurizing apparatus, the pressurizing apparatus being capable of using the holding fixture to bond semiconductor materials.

[0021] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0022] The bonding equipment and system provided by this invention shorten the distance between the receiving component and the carrier by connecting the receiving component to the carrier, thereby reducing the travel distance of the pressurizing device between the receiving component and the carrier. Furthermore, a calibration assembly is provided around the carrier to calibrate the position of the holding fixture relative to a preset area, ensuring that the semiconductor material held on the holding fixture is aligned with the semiconductor material carried on the carrier during subsequent bonding, thus improving the alignment accuracy of the semiconductor material held on the holding fixture and the semiconductor material carried on the carrier, and consequently improving bonding accuracy. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0024] Figure 1 This is a simplified schematic diagram of a bonding system according to an embodiment of the present invention;

[0025] Figure 2 This is a simplified schematic diagram illustrating the calibration of a pressure device pickup and holding fixture in a bonding system according to an embodiment of this utility model.

[0026] Figure 3 This is a simplified schematic diagram illustrating the calibration of a pressure device pickup and holding fixture in another bonding system according to an embodiment of this utility model.

[0027] Figure 4 This is a top view of a bonding device according to an embodiment of the present utility model;

[0028] Figure 5 This is a top view schematic diagram of another bonding device in this utility model embodiment;

[0029] Figure 6 This is a front view schematic diagram of a bonding device according to an embodiment of the present utility model.

[0030] Figure label:

[0031] 1. Bonding equipment; 2. Pressurizing equipment; 10. Bearing component; 11. Mounting part; 12. Bearing part; 20. Holding assembly; 21. Receiving part; 22. Holding fixture; 30. Calibration assembly; 31. Detection component; 32. First calibration component; 33. Second calibration component; 331. Clearance structure; 34. First adsorption channel; 35. Second adsorption channel; 40. Connecting assembly; 41. Movable part; 42. Support; 50. Positioning component; 60. Placement area; D1. First connecting end; D2. Second connecting end. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] Figure 1 This is a simplified schematic diagram of a bonding system according to an embodiment of the present invention. Figure 2 This is a simplified schematic diagram of a pressure device in a bonding system for calibration using a pick-and-hold fixture, as described in an embodiment of this utility model. Figure 3 This is a simplified schematic diagram of a pressure device picking up and holding a fixture for calibration in another bonding system according to an embodiment of this utility model. Figure 4 This is a top view schematic diagram of a bonding device according to an embodiment of the present utility model. Figure 5 This is a top view schematic diagram of another bonding device in an embodiment of this utility model. Figure 6 This is a front view schematic diagram of a bonding device according to an embodiment of the present utility model.

[0037] like Figures 1 to 2 As shown, this embodiment of the present invention provides a bonding system, which includes a bonding apparatus 1 and a pressure applying apparatus 2. The pressure applying apparatus 2 is capable of using a holding fixture 22 to bond semiconductor materials.

[0038] As an example, during the bonding process of semiconductor materials, the pressurizing device 2 can apply pressure to the semiconductor material to enable bonding under specific conditions. The pressurizing device 2 can remove a retaining fixture 22, matching the specifications of the semiconductor material to be pressurized, from the receiving container 21. The retaining fixture 22 can pick up and hold the semiconductor material, reducing the possibility of it falling during pickup and alignment with the semiconductor material on the carrier 10. Once the semiconductor material on the retaining fixture 22 and the semiconductor material on the carrier 10 are aligned, the pressurizing device 2 can apply pressure to both semiconductor materials. Optionally, the side of the pressurizing head of the pressurizing device 2 used to pick up the retaining fixture 22 has a flexible mechanism to cushion the pressurizing head when picking up the retaining fixture 22, reducing the possibility of damage to the pressurizing head, retaining fixture 22, and receiving container 21.

[0039] This utility model provides a bonding device 1, which includes a carrier 10, a holding assembly 20, and a calibration assembly 30. The carrier 10 is used to hold semiconductor material. The holding assembly 20 includes a receiving member 21 and a holding fixture 22. The receiving member 21 is used to store the holding fixture 22 and is directly or indirectly connected to the carrier 10, and is disposed on the periphery of the carrier 10. The holding fixture 22 is used to pick up and hold the semiconductor material. The calibration assembly 30 is disposed on the periphery of the carrier 10 and includes a detection member 31, a control member, and calibration marks. The calibration assembly 30 is configured such that the detection member 31 detects the position information of the calibration marks held by the holding fixture 22, and the control member adjusts the pose of the holding fixture 22 so that the holding fixture 22 and a preset area are positioned relative to each other.

[0040] As an example, taking the semiconductor material carried on the carrier 10 as the first semiconductor material and the semiconductor material held on the holding fixture 22 as the second semiconductor material, the first semiconductor material can be placed in a specific area of ​​the carrier 10 by other means. The holding fixture 22 can pick up the second semiconductor material from the semiconductor material storage device and hold the second semiconductor material. Here, "holding" means that the second semiconductor material is fixed on the holding fixture 22, and the second semiconductor material can move with the movement of the holding fixture 22. Optionally, the holding fixture 22 can fix the second semiconductor material by adsorption. Optionally, the semiconductor material includes wafers and chips. Optionally, one of the first semiconductor material and the second semiconductor material may include a wafer, and the other may include a chip; of course, both may include wafers or chips.

[0041] As an example, the receiving member 21 may have one or more receiving positions, each receiving position storing a retaining fixture 22. Optionally, the receiving size of the receiving position and the size of the retaining fixture 22 may be matched so that the pressurizing device 2 can use the corresponding retaining fixture 22, reducing the risk of the pressurizing device 2 mistakenly using a retaining fixture 22 of the wrong size. Optionally, the multiple receiving members 21 may be distributed at intervals along the periphery of the carrier member 10.

[0042] The receiving element 21 can be directly connected to the carrier element 10, or the receiving element 21 can be indirectly connected to the carrier element 10 through other structures.

[0043] Optionally, the calibration component 30 can be disposed between the receiving member 21 and the carrier member 10. Of course, the calibration component 30 and the receiving member 21 can also be disposed side by side.

[0044] The detection element 31 can be used to acquire the position information of the calibration mark. For example, the detection element 31 includes a camera to acquire the position information of the calibration mark by taking a picture. Optionally, the position information includes offset, offset angle, and relative distance, etc.

[0045] Optionally, the detection element 31 communicates with the control element. The position information detected by the detection element 31 can be transmitted to the control element, which can adjust the position and orientation of the holding fixture 22 to make the holding fixture 22 and the preset area relatively parallel. Optionally, the parallelism between the holding fixture 22 and the preset area can be adjusted by adjusting the angle at which the holding fixture 22 holds the calibration mark. Optionally, the position of the holding fixture 22 after picking up the calibration mark can be adjusted to make the holding fixture 22 relatively parallel to the preset area. Optionally, the preset area may include a virtual bonding area. After the holding fixture 22 and the virtual bonding area are relatively parallel, the pressure device 2 moves the holding fixture 22 above the first semiconductor material to make the holding fixture 22 relatively parallel to the bonding area, thereby improving the alignment accuracy of the first semiconductor material and the second semiconductor material, and also helping to reduce the difficulty of the alignment process of the first semiconductor material and the second semiconductor material, and reduce the manufacturing cost. It should be noted that after the positions of the semiconductor material held on the fixture 22 and the semiconductor material carried on the carrier 10 are aligned and adjusted, the pressurizing device 2 needs to drive the fixture 22 to move toward the carrier 10 and bring the first semiconductor material and the second semiconductor material into contact. The positional accuracy of the calibration component 30 during and after this movement plays a calibrating role.

[0046] Optionally, the calibration mark can be picked up by the retaining fixture 22; of course, the calibration mark can be set on the retaining fixture 22.

[0047] In the bonding apparatus 1 provided in this application embodiment, by connecting the receiving member 21 to the carrier member 10, the distance between the receiving member 21 and the carrier member 10 is shortened, thereby shortening the travel distance of the pressurizing device 2 between the receiving member 21 and the carrier member 10. Furthermore, a calibration component 30 is provided around the carrier member 10 to calibrate the position of the holding fixture 22 relative to a preset area, ensuring that the semiconductor material held on the holding fixture 22 is aligned with the semiconductor material carried on the carrier member 10 during subsequent bonding processes. This improves the alignment accuracy of the semiconductor material held on the holding fixture 22 and the semiconductor material carried on the carrier member 10, thereby improving bonding accuracy.

[0048] In some alternative embodiments, the calibration component 30 includes a first calibration element 32, and a calibration mark includes a first calibration mark disposed on the first calibration element 32. The first calibration element 32 is configured to hold the fixture 22 to pick up the first calibration element 32 so that the detection element 31 detects the position information of the first calibration mark.

[0049] In some examples, the detector 31 can adjust the pose of the holding fixture 22 by acquiring only the position information of the first calibration mark. Of course, the detector 31 can also adjust the pose of the holding fixture 22 by acquiring the position information of the first calibration mark and the position information of other structures.

[0050] Optionally, the first calibration mark may be located on the side of the first calibration piece 32 facing away from the retaining fixture 22.

[0051] Optionally, the carrier 10 may include an installation area and a carrier area, the first calibration element 32 may be disposed in the installation area, and the carrier area is used to carry semiconductor materials.

[0052] It is understood that after the holding fixture 22 picks up the first calibration piece 32, the first calibration piece 32 moves away from the carrier 10 and maintains a preset distance from the carrier 10, so that the detection piece 31 can detect the position information of the first calibration mark. Optionally, the preset distance between the first calibration piece 32 and the carrier 10 can be the distance that the holding fixture 22 moves to align with the first semiconductor material after picking up the second semiconductor material.

[0053] In some optional embodiments, the calibration assembly 30 further includes a second calibration element 33, and the calibration mark further includes a second calibration mark disposed on the second calibration element 33. The second calibration element 33 is disposed on the carrier 10, and the first calibration element 32 is located on the side of the second calibration element 33 facing away from the carrier 10. The calibration assembly 30 is configured such that the detection element 31 detects the position information of the first calibration mark and the second calibration mark held by the holding fixture 22, and adjusts the pose of the holding fixture 22 by the control element so that the holding fixture 22 is relative to a preset position.

[0054] Optionally, the second calibration element 33 may be disposed in the mounting area of ​​the carrier 10.

[0055] Optionally, the second calibration element 33 is detachably connected to the carrier 10.

[0056] As an example, when no calibration process is performed, the second calibration element 33 is disposed in the installation area, and the first calibration element 32 is disposed on the side of the second calibration element 33 facing away from the carrier 10, that is, the second calibration element 33 and the first calibration element 32 are stacked on the carrier 10 in sequence.

[0057] The embodiments of this application do not limit the shape or size of the first calibration element 32 and the second calibration element 33.

[0058] The embodiments of this application do not limit the shape or size of the first calibration mark and the second calibration mark. Optionally, the second calibration mark may be located on the side of the second calibration member 33 facing the first calibration member 32.

[0059] exist Figure 2and Figure 3 In the middle, inspection item 31 can be inspected first. Figure 2 The position information of the first calibration mark and the position information of the second calibration mark are obtained. Then, the pressurizing device 2 places the first calibration piece 32 on the second calibration piece 33, and the detection piece 31 then performs the detection. Figure 3 The position information of the first calibration mark and the position information of the second calibration mark are obtained, and then the pose of the holding fixture 22 is adjusted according to the two different position information. Optionally, the pose adjustment of the holding fixture 22 can be made by moving the position of the pressure head in the pressurizing device 2.

[0060] The detection component 31 can adjust the orientation of the holding fixture 22 by detecting the position information of the first calibration mark and the second calibration mark. Furthermore, by setting the first calibration component 32 and the second calibration component 33, and setting the first calibration mark on the first calibration component 32 and the second calibration mark on the second calibration component 33, the calibration accuracy is improved, so that the alignment accuracy between the holding fixture 22 and the preset position reaches the nanometer level. This allows the alignment accuracy of the first semiconductor material and the second semiconductor material to reach the nanometer level, further improving the bonding accuracy.

[0061] In some alternative embodiments, the calibration component 30 further includes a first adsorption channel 34 and a second adsorption channel 35. The second adsorption channel 35 is used to adsorb a second calibration element 33. The second calibration element 33 is provided with an avoidance structure 331. The first adsorption channel 34 adsorbs the first calibration element 32 through the avoidance structure 331.

[0062] Optionally, the first adsorption channel 34 can be embedded in the carrier 10. For example, the first adsorption channel 34 is a vacuum passage, and the adsorption port of the first adsorption channel 34 is located on the side of the carrier 10 facing the first calibration member 32.

[0063] Optionally, the second adsorption channel 35 can be embedded in the carrier 10. For example, the second adsorption channel 35 is a vacuum passage, and the adsorption port of the second adsorption channel 35 is located on the side of the carrier 10 facing the second calibration member 33.

[0064] Optionally, the clearance structure 331 may include a clearance hole.

[0065] In these alternative embodiments, the above-described configuration helps to improve the integration of the calibration component 30 and improve the alignment accuracy when the first calibration component 32 and the second calibration component 33 are stacked.

[0066] In some alternative embodiments, the carrier 10 includes an integrally structured mounting portion 11 and a carrier portion 12, with the mounting portion 11 disposed on the periphery of the carrier portion 12 and the retaining component 20 disposed on the mounting portion 11.

[0067] The integrated mounting part 11 and the supporting part 12 help to shorten the distance between the accommodating part 21 and the supporting part 12, reduce the distance when the pressurizing equipment 2 changes the holding tool 22, improve work efficiency, and at the same time enable the supporting part 12 and the accommodating part 21 to move together under the drive of other moving devices, further reducing the distance between the accommodating part 21 and the supporting part 12.

[0068] Optionally, the mounting part 11 can be a plate-like structure, the mounting part 11 is arranged around the support part 12, and the support part 12 can protrude from the mounting part 11.

[0069] In some alternative embodiments, the bonding device 1 further includes a connection component 40, which includes a first connection end D1 and a second connection end D2. The first connection end D1 is connected to the side of the carrier 10 facing away from the semiconductor material, and the second connection end D2 is connected to the side of the receiving member 21 facing away from the storage and holding fixture 22.

[0070] In some examples, the first connection end D1 of the connecting component 40 is connected to the carrier 10, and the second connection end D2 is connected to the receiving component 21. The carrier 10 and the receiving component 21 can be relatively fixed. Of course, they can also be relatively movable.

[0071] The present application embodiment, by setting the connecting component 40, is conducive to increasing the arrangement of the carrier 10 and the accommodating component 21, improving the arrangement flexibility, while reducing the space occupied by the connecting component 40 in the area carrying semiconductor material and the area carrying and holding tooling 22, thus improving space utilization.

[0072] In some alternative embodiments, the connecting component 40 includes a movable member 41 and a bracket 42. The movable member 41 includes a first connecting end D1, and the bracket 42 includes a second connecting end D2. The movable member 41 is connected to the bracket 42, and the movable member 41 is movably disposed relative to the bracket 42.

[0073] Optionally, the movable component 41 includes a multi-degree-of-freedom motion platform, and the carrier component 10 can move in one or more directions.

[0074] Optionally, the carrier 10 may include a wafer chuck, such as a porous ceramic chuck, a chuck with vacuum channels on its surface, etc.

[0075] Optionally, the accommodating member 21 may be distributed within the allowable movement range of the movable member 41.

[0076] In these alternative embodiments, the movable member 41 is movably disposed relative to the support 42 so that the carrier 10 is movably disposed relative to the receiving member 21, thereby eliminating the possibility of interference between the receiving member 21 and other structures when the carrier 10 moves, and increasing the travel and direction of movement of the carrier 10.

[0077] In some alternative embodiments, a positioning element 50 is also included. The carrier 10 includes a carrier portion 12 for carrying semiconductor material. The positioning element 50 is disposed on the periphery of the carrier portion 12 and is used to define the position of the semiconductor material.

[0078] Optionally, the positioning element 50 may only define the position of the semiconductor material. For example, multiple positioning elements 50 may enclose a positioning space, and the semiconductor material, once placed in the positioning space, cannot extend beyond the positioning space due to the obstruction of the positioning elements 50. Alternatively, the positioning element 50 may define the orientation of the semiconductor material, such as the bearing angle between the semiconductor material and the carrier 10. Optionally, the number of positioning elements 50 may include multiple elements or a single element.

[0079] Optionally, the positioning element 50 may be equipped with a sensor to detect whether semiconductor material is carried inside the bearing portion 12.

[0080] In some alternative embodiments, the semiconductor material includes a wafer with its edge extending beyond the support portion 12, and the positioning member 50 is movably disposed relative to the support portion 10 along the thickness direction of the support portion 10 for lifting the wafer.

[0081] Optionally, the positioning element 50 includes a pin.

[0082] Optionally, after the wafer and other semiconductor materials are bonded, the ejector pin can extend in a direction away from the carrier 10 to lift the wafer, thereby separating the wafer from the carrier 10 for subsequent wafer pickup.

[0083] Optionally, a portion of the edge of the wafer may extend beyond the support portion 12; of course, all edges of the wafer may extend beyond the support portion 12.

[0084] In some alternative embodiments, the carrier 10 further includes a placement area 60 for placing abnormal components during the bonding process, including a retaining fixture 22 for abnormal orientation.

[0085] As an example, the abnormal pose holding fixture 22 can refer to the position of the holding fixture 22 not being relative to the position of the preset area, or only partially relative; it can also refer to the holding fixture 22 not being parallel to the preset area.

[0086] Optionally, the placement area 60 can be located in the mounting section 11.

[0087] If the holding fixture 22 is in an abnormal orientation during the bonding process and cannot complete the bonding process normally, the pressurizing device 2 can place the holding fixture 22 in the placement area 60 to reduce the risk of subsequent bonding yield decrease due to the holding fixture 22 being reused after being returned to the receiving component 21. Optionally, the abnormal component may also include other abnormal materials, such as abnormal second semiconductor material.

[0088] This embodiment provides a bonding system, including a bonding apparatus 1 and a pressure device 2 as described in any of the above embodiments. The pressure device 2 is capable of using a holding fixture 22 to bond semiconductor materials. Since the bonding system provided in this application includes the bonding apparatus 1 of any of the above embodiments, the bonding system provided in this application has the beneficial effects of the bonding apparatus 1 of any of the above embodiments, which will not be described again here.

[0089] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A bonding apparatus, characterized in that, include: The carrier (10) is used to support the semiconductor material; The holding assembly (20) includes a receiving member (21) and a holding fixture (22). The receiving member (21) is used to store the holding fixture (22). The receiving member (21) is directly or indirectly connected to the carrier (10) and the receiving member (21) is disposed on the periphery of the carrier (10). The holding fixture (22) is used to pick up and hold semiconductor materials. A calibration component (30) is disposed on the periphery of the carrier (10). The calibration component (30) includes a detection component (31), a control component, and a calibration mark. The calibration component (30) is configured such that the detection component (31) detects the position information of the calibration mark held by the holding fixture (22) and adjusts the pose of the holding fixture (22) by the control component so that the holding fixture (22) and the preset area are relative to each other.

2. The bonding apparatus according to claim 1, characterized in that, The calibration component (30) includes a first calibration element (32), the calibration mark includes a first calibration mark, the first calibration mark is disposed on the first calibration element (32), and the first calibration element (32) is configured such that the holding fixture (22) picks up the first calibration element (32) so that the detection element (31) detects the position information of the first calibration mark.

3. The bonding apparatus according to claim 2, characterized in that, The calibration component (30) further includes a second calibration element (33), and the calibration mark further includes a second calibration mark. The second calibration mark is disposed on the second calibration element (33), and the second calibration element (33) is disposed on the carrier (10). The first calibration element (32) is located on the side of the second calibration element (33) facing away from the carrier (10). The calibration component (30) is configured such that the detection element (31) detects the position information of the first calibration mark and the second calibration mark held by the holding fixture (22) and adjusts the pose of the holding fixture (22) by the control element so that the holding fixture (22) is relative to a preset position.

4. The bonding apparatus according to claim 3, characterized in that, The calibration component (30) further includes a first adsorption channel (34) and a second adsorption channel (35). The second adsorption channel (35) is used to adsorb a second calibration element (33). The second calibration element (33) is provided with a clearance structure (331). The first adsorption channel (34) adsorbs the first calibration element (32) through the clearance structure (331).

5. The bonding apparatus according to claim 1, characterized in that, The carrier (10) includes an integral mounting part (11) and a carrier part (12), the mounting part (11) is disposed on the periphery of the carrier part (12), and the retaining component (20) is disposed on the mounting part (11).

6. The bonding apparatus according to claim 1, characterized in that, It also includes a connecting component (40), which includes a first connecting end (D1) and a second connecting end (D2). The first connecting end (D1) is connected to the side of the carrier (10) facing away from the semiconductor material, and the second connecting end (D2) is connected to the side of the receiving member (21) facing away from the holding fixture (22).

7. The bonding apparatus according to claim 6, characterized in that, The connecting component (40) includes a movable part (41) and a bracket (42). The movable part (41) includes a first connecting end (D1), and the bracket (42) includes a second connecting end (D2). The movable part (41) is connected to the bracket (42), and the movable part (41) is movably disposed relative to the bracket (42).

8. The bonding apparatus according to claim 1, characterized in that, It also includes a positioning element (50), the carrier (10) includes a carrier portion (12) for carrying semiconductor material, the positioning element (50) is disposed on the periphery of the carrier portion (12) and the positioning element (50) is used to define the position of semiconductor material.

9. The bonding apparatus according to claim 8, characterized in that, The semiconductor material includes a wafer with the edge of the wafer extending beyond the support portion (12). The positioning member (50) is movably disposed relative to the support portion (10) along the thickness direction of the support portion (10) to lift the wafer.

10. The bonding apparatus according to claim 1, characterized in that, The carrier (10) further includes a placement area (60) for placing abnormal parts during the bonding process, the abnormal parts including a retaining fixture (22) for abnormal pose.

11. A bonding system, comprising: The bonding apparatus (1) as described in any one of claims 1 to 10; as well as A pressurizing device (2) is capable of using the holding fixture (22) to bond semiconductor materials.

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