Water-cooling heat dissipation assembly and vehicle machine using same

Abstract

The utility model discloses a water-cooling heat dissipation assembly and a vehicle machine using the same, the water-cooling heat dissipation assembly comprises a middle frame, and a cavity is arranged in the middle frame; a water inlet and a water outlet; the multiple sets of flow guide components are arranged close to the water inlet and the water outlet, the heat dissipation fins are arranged in the cavity, and adjacent heat dissipation fins or the heat dissipation fins and the inner wall of the cavity form a heat dissipation flow channel. The vehicle machine comprises a water-cooling heat dissipation assembly, a PCB is fixed to the back face of the water-cooling heat dissipation assembly, a chip is fixed to the PCB, and the chip corresponds to the position of a shielding cavity in the water-cooling heat dissipation assembly. According to the water-cooling heat dissipation assembly, the heat dissipation medium can be divided into a plurality of branches through the flow guide part, the branches enter the different heat dissipation channels respectively, the heat dissipation medium can be evenly distributed in each heat dissipation channel, heat dissipation is effectively conducted on a chip of the vehicle machine, performance exertion of the chip of the vehicle machine is guaranteed, and the service life of the vehicle machine is prolonged. And the risk of high-temperature damage of the chip is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of vehicle infotainment system heat dissipation, specifically to a water-cooled heat dissipation component and a vehicle infotainment system using the component. Background Technology

[0002] With the development of automotive intelligence, high-performance chips are increasingly being used in automobiles. However, high-performance chips often lead to high power consumption and high heat generation. Especially when a car is outdoors, its internal temperature is high, so the heat dissipation effect of the vehicle's infotainment system is particularly important.

[0003] In related technologies, water-cooling solutions are used in the automotive field to optimize the heat dissipation of the vehicle's infotainment system and internal chips. For example, heat dissipation fins are installed in the water-cooling cavity, forming a complete water-cooling channel with the inlet and outlet. However, due to the different flow resistances of different channels formed by the heat dissipation fins, some channels cannot be filled with fluid, resulting in insufficient cooling water. This fails to effectively dissipate heat from the chips, preventing them from fully utilizing their performance and even causing chip damage. Utility Model Content

[0004] The purpose of this utility model is to solve the above problems by providing a water-cooled heat dissipation component and a vehicle infotainment system using the component.

[0005] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0006] Design a water-cooled heat dissipation component, including a middle frame, wherein the middle frame has a cavity for accommodating heat dissipation medium;

[0007] The inlet and outlet are used for the entry and exit of the heat dissipation medium;

[0008] The flow guiding component has multiple sets of flow guiding components near the inlet and outlet, and the flow guiding components and the flow guiding components form branch channels.

[0009] Heat dissipation fins are disposed in the cavity, and adjacent heat dissipation fins or heat dissipation fins and the inner wall of the cavity form heat dissipation channels, wherein the heat dissipation channels are connected to the corresponding branch channels.

[0010] As a further description of the above technical solution, the flow guiding component is a flow guiding column. In the region between the water inlet and the end of the heat dissipation fin and in the region between the water outlet and the end of the heat dissipation fin, the number of the flow guiding columns is positively correlated with the distance of the flow guiding column near the heat dissipation fin from the water inlet or the water outlet.

[0011] As a further description of the above technical solution, two sets of guiding components are provided near the inlet and near the outlet. The guiding components include a first guiding component group and a second guiding component group. The first guiding component group includes one guiding component, and the second guiding component group includes two guiding components.

[0012] As a further description of the above technical solution, the cavity is provided with a baffle wall, and multiple sets of heat dissipation fins are arranged radially outward around the baffle wall.

[0013] As a further description of the above technical solution, the plurality of heat dissipation fins are evenly distributed outward in a ring shape around the baffle wall, wherein the heat dissipation fins include two straight segments and an arc segment connecting the two straight segments.

[0014] As a further description of the above technical solution, multiple sets of the flow guiding components and multiple sets of heat dissipation channels are symmetrically arranged about the central axis of the baffle wall.

[0015] As a further description of the above technical solution, the middle frame is provided with multiple heat dissipation protrusions on the side opposite to the cavity.

[0016] As a further description of the above technical solution, a shielding cavity is provided on the other side of the middle frame opposite to the cavity, and the four corners of the inner wall of the shielding cavity are coated with conductive adhesive.

[0017] As a further description of the above technical solution, the surface of the cavity is covered and fixed with a cover plate.

[0018] Design an in-vehicle infotainment system, including any of the water-cooled heat dissipation components described above;

[0019] A PCB board is fixed to the back of the water-cooled heat dissipation component, and a chip is fixed on the PCB board. The chip is positioned corresponding to the shielding cavity inside the water-cooled heat dissipation component.

[0020] As a further description of the above technical solution, thermal conductive gel is provided between the chip and the heat dissipation protrusions on the surface of the water-cooled heat dissipation component.

[0021] The beneficial effects of this utility model are as follows:

[0022] The water-cooled heat dissipation component of this invention, by setting a flow guiding component, allows the heat dissipation medium entering from the inlet to be divided into several branches, which enter different heat dissipation channels, i.e., flow channels. This allows the heat dissipation medium to be evenly distributed in each heat dissipation channel, which can effectively improve the heat dissipation effect of the water-cooled heat dissipation component, effectively dissipate heat from the vehicle's chips, ensure the performance of the vehicle's chips, and reduce the risk of chip damage due to high temperature.

[0023] To more clearly illustrate the structural features and functions of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0024] Figure 1 This is a three-dimensional view of the internal structure of the water-cooled heat dissipation component provided by this utility model.

[0025] Figure 2 This is a three-dimensional view of the heat dissipation channel and branch channel in the water-cooled heat dissipation component provided by this utility model.

[0026] Figure 3 This is a three-dimensional view of the back of the water-cooled heat dissipation component provided by this utility model.

[0027] Figure 4 This is a perspective view of another embodiment of the water-cooled heat dissipation component provided by this utility model.

[0028] Figure 5 This is a top view of another embodiment of the water-cooled heat dissipation component provided by this utility model.

[0029] Figure 6 This is a perspective view of the water-cooled heat dissipation component provided by this utility model.

[0030] Figure 7 This is a perspective view of the back of the water-cooled heat dissipation component provided by this utility model.

[0031] Reference numerals: 1. Middle frame; 2. Cover plate; 3. Guide column; 4. Heat dissipation fins; 5. Water inlet; 6. Water outlet; 7. Water inlet area; 8. Water outlet area; 9. Heat dissipation channel; 901. First channel; 902. Second channel; 903. Third channel; 904. Fourth channel; 10. Branch channel; 1001. First branch; 1002. Second branch; 1003. Third branch; 11. Baffle; 12. Heat dissipation boss; 13. Shielding cavity; 14. PCB board. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0033] like Figures 1-3 As shown, in one embodiment, a water-cooled heat dissipation component includes a middle frame 1, within which a cavity is provided to contain a heat dissipation medium. The heat dissipation medium can be water (pure water, deionized water) or a solution based on deionized water with added rust inhibitors, antifoaming agents, and inhibitors.

[0034] A water inlet 5 and a water outlet 6 are provided at one end of the middle frame 1. By providing the water inlet 5 and the water outlet 6, the middle frame 1 is used to form a heat dissipation cavity. The heat dissipation medium can circulate in the cavity and transfer the heat of the chip to the heat dissipation fins 4 below, thereby realizing the heat dissipation of the chip.

[0035] Multiple sets of flow guiding components are provided at both the inlet 5 and the outlet 6. These flow guiding components, as well as the flow guiding components and the inner wall of the cavity, form branch channels 10. It is understood that when the heat dissipation medium enters through the inlet 5, after passing through the first set of flow guiding components, the heat dissipation medium is decomposed into a first branch 1001 and a second branch 1002. After passing through the second set of flow guiding components, the first branch 1001 and the second branch 1002 are further decomposed into a first branch 1001, a second branch 1002, and a third branch 1003. In other feasible embodiments, more than two sets of flow guiding components can be provided, and adjustments can be made according to specific needs; this is not limited here.

[0036] The cavity contains multiple sets of heat dissipation fins 4 arranged in a nested configuration. This nested configuration means that each heat dissipation fin 4 includes a first, second, and third heat dissipation fin. The major and minor axes of the third heat dissipation fin are longer than those of the second heat dissipation fin, which in turn are longer than those of the first heat dissipation fin. This creates a layered distribution of heat dissipation fins 4 with gaps between adjacent fins. These adjacent fins, or the fins themselves, along with the cavity wall, form heat dissipation channels 9, which are connected to corresponding branch channels 10. For example, three sets of heat dissipation fins 4 can form four heat dissipation channels. The first branch 1001 flows into the first channel 901 and the second channel 902, while the second branch 1002 and the third branch 1003 flow into the third channel 903 and the fourth channel 904. The heat dissipation medium then flows out from the outlet 6 after being collected by the guide component.

[0037] The water-cooled heat dissipation component in this application, by setting a flow guiding component, allows the heat dissipation medium entering from the inlet 5 to be divided into several branches, and the several branches enter different heat dissipation channels, i.e., flow channels, so that the heat dissipation medium can be evenly distributed in each heat dissipation channel, which can effectively improve the heat dissipation effect of the water-cooled heat dissipation component.

[0038] Optionally, such as Figures 1-2As shown, the flow guiding component is the flow guiding column 3. In the area between the inlet 5 and outlet 6 and the end of the heat dissipation fins 4, the number of flow guiding components is positively correlated with the distance of the flow guiding components near the heat dissipation fins 4 from the inlet 5 or outlet 6. This means that the farther the distance from the inlet 5 or outlet 6, the more flow guiding components there are. For example, there are two groups of flow guiding components near the inlet 5 or outlet 6. The first group, which is closer, includes one flow guiding component. The second group, which is farther from the inlet 5 or outlet 6, includes two flow guiding components. The flow guiding column 3 is located in the inlet area 7 near the inlet 5 and the outlet area 8 of the outlet 6. These inlet areas 7 and outlet areas 8 form the transition area connecting the inlet 5 / outlet 6 to the heat dissipation channel. The guide column 3 is a cylindrical or conical structure. The height of the guide column 3 is the same as the depth of the cavity, or the height of the guide column 3 is slightly less than the depth of the cavity, so that the heat dissipation medium can be diverted while ensuring that the cavity can be properly encapsulated.

[0039] Optionally, such as Figures 1-2 As shown, a baffle wall 11 is provided inside the cavity. In this embodiment, the baffle wall 11 is located on the central axis of the cavity, and multiple sets of heat dissipation fins 4 are arranged radially outward around the baffle wall 11. In some embodiments, multiple heat dissipation fins 4 are evenly distributed outward in a ring shape with the baffle wall 11 as the center, and each heat dissipation fin 4 includes two straight segments and an arc segment connecting the two straight segments. The baffle wall 11 and the innermost heat dissipation fin 4, i.e., the first heat dissipation fin 4, constitute a first flow channel 901, so that the heat dissipation medium can flow in and out along the first flow channel 901. At the same time, multiple sets of guide columns 3 and multiple sets of heat dissipation flow channels 9 are symmetrically arranged about the central axis of the baffle wall 11. For example, the three guide columns 3 of the inlet 5 and the three guide columns 3 of the outlet 6 are symmetrically designed about the baffle wall 11. The first flow channel 901, the second flow channel 902, the third flow channel 903, and the fourth flow channel 904 are all symmetrically designed about the baffle 11, which facilitates water cooling layout on the entire vehicle and effectively avoids the risk of incorrectly installing the inlet 5 and outlet 6 during water pipe installation. Understandably, due to the symmetrical design, there is no need to specify the inlet 5 and outlet 6 separately; it is sufficient for the cooling medium to flow into one outlet and out of the other.

[0040] Optionally, multiple heat dissipation protrusions 12 are provided on the back of the middle frame 1. The heat dissipation protrusions 12 can be raised cubes or other regular shapes, which are not limited here. It should be noted that the back of the middle frame 1 refers to the other side without the water-cooling cavity. The material of the heat dissipation protrusions 12 is the same as that of the middle frame 1, and the two are integrally formed. The heat dissipation protrusions 12 correspond to the positions of the chips on the PCB board 14. The heat dissipation protrusions 12 are provided on the back of the water-cooling cavity in the middle frame 1. The heat generated by the chips on the PCB board 14 is transferred to the heat dissipation fins 4 through the heat dissipation protrusions 12, and then the heat is carried away by the coolant flowing between the heat dissipation fins 4, thereby achieving effective heat dissipation of the chips.

[0041] Optionally, such as Figure 3 As shown, a shielding cavity 13 is provided on the back of the middle frame 1. The shielding cavity 13 is a recessed cavity, and conductive adhesive is applied to the four corners of the inner wall of the shielding cavity 13. The shielding cavity 13 is grounded through the conductive adhesive to form an electromagnetic shielding environment. After the PCB board 14 is fixed to the back of the middle frame 1 with screws, the chip is located inside the shielding cavity 13, which provides shielding for the chip. Compared with the existing technology, a separate shielding cover can be saved, effectively saving parts and labor costs.

[0042] Optionally, the water-cooled cover plate 2 is welded to the water-cooled middle frame 1 by friction welding to form a complete water-cooled cavity. Specifically, the water-cooled cover plate 2 and the cavity are consistent in size and shape, and the welding ensures the airtightness of the water-cooled cavity.

[0043] like Figures 4-5 As shown, in one embodiment, a water-cooled heat dissipation component differs from the previous embodiment in that the heat dissipation channel is in series, meaning there is only one heat dissipation channel. Specifically, multiple sets of heat dissipation fins 4 are staggered, and one end of adjacent heat dissipation fins 4 is alternately connected to the middle frame 1 to form an integrated structure, making the entire heat dissipation channel an S-shaped structure. The two ends of the heat dissipation channel are connected to the inlet 5 and the outlet 6, respectively, to achieve effective cooling. This embodiment can accommodate installation at a wider angle, and under sufficient water pressure, all heat dissipation media can be evenly distributed within the heat dissipation channel, achieving uniform heat dissipation for the chip.

[0044] like Figure 6-7 As shown, this application also provides a vehicle infotainment system using the above-mentioned water-cooled heat dissipation component, including the above-mentioned water-cooled heat dissipation component;

[0045] A PCB board 14 is fixed on the back of the water cooling heat dissipation component. A chip is fixed on the PCB board 14. The chip is positioned corresponding to the shielding cavity 13 inside the water cooling heat dissipation component. The shielding cavity 13 can effectively shield a certain chip on the PCB board 14.

[0046] Thermally conductive gel is provided between the chip and the heat dissipation protrusion 12 of the water-cooled heat dissipation component. The heat generated by the chip is transferred to the heat dissipation fins 4 through the thermally conductive gel and the heat dissipation protrusion 12, and then the heat is carried away by the coolant, so as to achieve effective and uniform heat dissipation of the chip.

[0047] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A water-cooled heat dissipation component, characterized in that, Includes a middle frame, wherein the middle frame has a cavity for accommodating a heat dissipation medium; The inlet and outlet are used for the entry and exit of the heat dissipation medium; The flow guiding component has multiple sets of flow guiding components near the inlet and outlet, and the flow guiding components and the flow guiding components form branch channels. Heat dissipation fins are disposed in the cavity, and adjacent heat dissipation fins or heat dissipation fins and the inner wall of the cavity form heat dissipation channels, wherein the heat dissipation channels are connected to the corresponding branch channels.

2. The water-cooled heat dissipation component according to claim 1, characterized in that, The flow guiding component is a flow guiding column. In the area between the water inlet and the end of the heat dissipation fin and in the area between the water outlet and the end of the heat dissipation fin, the number of flow guiding columns is positively correlated with the distance of the flow guiding column near the heat dissipation fin from the water inlet or the water outlet.

3. The water-cooled heat dissipation component according to claim 1, characterized in that, Two sets of flow guiding components are provided near the inlet and near the outlet. The flow guiding components include a first flow guiding component group and a second flow guiding component group. The first flow guiding component group includes one flow guiding component, and the second flow guiding component group includes two flow guiding components.

4. The water-cooled heat dissipation component according to claim 1, characterized in that, The cavity is equipped with a baffle wall, and multiple sets of heat dissipation fins are arranged radially outward around the baffle wall.

5. The water-cooled heat dissipation component according to claim 4, characterized in that, The heat dissipation fins are evenly distributed outward in a ring around the baffle wall, wherein each heat dissipation fin includes two straight segments and an arc segment connecting the two straight segments.

6. The water-cooled heat dissipation component according to claim 4, characterized in that, Multiple sets of the aforementioned flow guiding components and multiple sets of heat dissipation channels are symmetrically arranged about the central axis of the retaining wall.

7. The water-cooled heat dissipation component according to claim 1, characterized in that, The middle frame has multiple heat dissipation protrusions on the opposite side of the cavity.

8. The water-cooled heat dissipation component according to claim 1, characterized in that, A shielding cavity is provided on the side of the middle frame opposite to the cavity body, and the four corners of the inner wall of the shielding cavity are coated with conductive adhesive.

9. The water-cooled heat dissipation component according to claim 1, characterized in that, The surface of the cavity is covered and fixed with a cover plate.

10. A vehicle infotainment system, characterized in that, Includes the water-cooled heat dissipation component as described in any one of claims 1-9; A PCB board is fixed to the back of the water-cooled heat dissipation component, and a chip is fixed on the PCB board. The chip is positioned corresponding to the shielding cavity inside the water-cooled heat dissipation component.

11. The vehicle infotainment system according to claim 10, characterized in that, Thermal conductive gel is provided between the chip and the heat dissipation protrusions on the surface of the water-cooled heat dissipation component.

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