Cleaning mechanism for IGBT (Insulated Gate Bipolar Translator) module cooling fin
By combining ultrasonic cleaning and water rinsing, and utilizing a stirring component to ensure uniform mixing of the cleaning agent and optimizing the water flow path in the rinsing tank, the problem of inconsistent cleaning of IGBT module heat sinks was solved, achieving a highly efficient and environmentally friendly cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-06
- Publication Date
- 2026-05-15
AI Technical Summary
In the current IGBT module heatsink cleaning process, uneven concentration of water-based cleaning agent leads to inconsistent cleaning results, low rinsing efficiency, and a high rate of defective products.
It combines ultrasonic cleaning and water rinsing mechanisms, uses a stirring component to ensure uniform mixing of the cleaning agent, optimizes the water flow path in the rinsing tank to enhance rinsing efficiency, and uses water-based cleaning agents instead of traditional solvent cleaning agents to reduce environmental pollution.
This improved the cleaning effect, ensured consistent cleanliness of the IGBT module heatsink surface, reduced the defect rate, lowered labor costs, and achieved environmentally friendly cleaning.
Smart Images
Figure CN224237737U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of IGBT module heat sink cleaning technology, specifically a cleaning mechanism for IGBT module heat sinks. Background Technology
[0002] An IGBT module heat sink is a component specifically designed to dissipate the heat generated by IGBT (Insulated Gate Bipolar Transistor) devices during operation. Since IGBTs generate a large amount of heat during operation, if it is not dissipated in time, it will cause the device to overheat, affecting performance or even causing damage. Therefore, heat sinks are crucial to ensuring the normal operation of IGBTs.
[0003] IGBT module heat sinks typically use high-purity copper as the substrate material to ensure good thermal conductivity and strength. IGBT module heat sinks include a heat dissipation copper plate and heat dissipation pins evenly distributed on the top of the heat dissipation copper plate. The manufacturing process of IGBT module heat sinks includes steps such as mold design and development, cold precision forging, shaping punches, CNC machining, cleaning, annealing, sandblasting, bending, and electroplating.
[0004] During the production of IGBT modules, especially after soldering, the pins on the module need to be ultrasonically cleaned to remove the residue generated during the soldering process. Solder paste is often used during soldering, and there will be residue after soldering. The residue needs to be cleaned, and the surface oxides need to be removed during the cleaning process.
[0005] With the increasing environmental awareness of enterprises, the cleaning of IGBT module heat sinks is carried out using ultrasonic technology combined with water-based cleaning agents to achieve a safe and environmentally friendly cleaning process. The cleaning process mainly includes ultrasonic cleaning and water rinsing. In the cleaning tank, if the ultrasonic energy density is constant (ultrasonic energy is constant), because most water-based cleaning agents are two-phase liquids, unlike ordinary solvent cleaning agents, the two-phase liquids will separate into layers. Under certain flow conditions and the action of certain physical forces, they will be in different uniform mixing states, resulting in poor uniformity. This causes the concentration of the cleaning agent to be different in different positions during the use of the water-based cleaning agent. This leads to inconsistent cleaning agent concentrations in different positions of the cleaning basket, resulting in poor cleaning effect and inconsistent cleaning.
[0006] During rinsing, the existing rinsing system mainly includes a first rinsing tank, a second rinsing tank, and a third rinsing tank. The rinsing tanks are distributed from top to bottom. Water from the third rinsing tank overflows into the second rinsing tank, and vice versa. The cleanliness of the water in the third rinsing tank is greater than that in the second rinsing tank, and vice versa. Since the GBT module heatsinks are placed in a cleaning basket for cleaning, after the GBT module heatsinks exit the cleaning solution... The surface still contains cleaning agent and dirt. After multiple rinses and replacements, the cleaning agent and dirt on the GBT module heat sink are cleaned. The final residue on the GBT module heat sink is clean water. However, because the water in the third rinsing tank overflows into the second rinsing tank, and the second rinsing tank overflows into the first rinsing tank, the water flow is only surface flow. During cleaning, the water flow inside the rinsing tank is poor, resulting in a low replacement rate of the rinsed GBT module heat sink. As a result, the final rinse is not clean, making the GBT module heat sink a defective product. Utility Model Content
[0007] The purpose of this invention is to provide a cleaning mechanism for the heat sink of an IGBT module, so as to solve the problems mentioned in the background art.
[0008] To achieve the above objectives, this utility model provides the following technical solution:
[0009] A cleaning mechanism for IGBT module heat sinks includes a cleaning device for cleaning the IGBT module heat sinks. The cleaning device includes an ultrasonic cleaning mechanism and a water rinsing mechanism. The ultrasonic cleaning mechanism is located on one side of the water rinsing mechanism. The ultrasonic cleaning mechanism includes a cleaning table and an ultrasonic cleaner located on top of the cleaning table. A water filling component is provided on one side of the top of the ultrasonic cleaner. A cleaning basket is provided inside the ultrasonic cleaner. Water-based cleaning agent mixing and agitating components are provided on both sides of the cleaning basket. A placement rack for placing and cleaning the IGBT module heat sink is provided inside the cleaning basket. The placement rack includes a frame body, and placement baskets are evenly staggered on both sides of the frame body. The IGBT module heat sink is located inside the placement basket.
[0010] As a preferred embodiment of this utility model, the water filling component includes a water pump and a water filling pipe. The water pump is located on the cleaning platform outside the ultrasonic cleaner. The water outlet of the water pump is connected to the water filling pipe. The water outlet of the water filling pipe is located inside the ultrasonic cleaner. The water inlet of the water pump is connected to an external water supply tank through a pipeline.
[0011] As a preferred embodiment of this utility model, the water-based cleaning agent mixing and stirring assembly includes a first stirring motor and a first stirring shaft. The first stirring shaft is located on both sides of the ultrasonic cleaner inside the ultrasonic cleaner. The first stirring motor is symmetrically located on the outer wall of the ultrasonic cleaner. The end of the first stirring shaft extends through the ultrasonic cleaner housing to its outside and is connected to the output end of the first stirring motor near it via a coupling.
[0012] As a preferred embodiment of this utility model, the water rinsing mechanism includes a first water rinsing tank, a second water rinsing tank, and a third water rinsing tank arranged in sequence. The first water rinsing tank, the second water rinsing tank, and the third water rinsing tank are arranged from low to high. Each of the first water rinsing tank, the second water rinsing tank, and the third water rinsing tank is equipped with a water rinsing inlet component on the side of the third water rinsing tank away from the second water rinsing tank.
[0013] As a preferred embodiment of this utility model, the water inlet assembly for rinsing includes a water inlet pump, a water inlet pipe, and a water inlet tap. The water inlet pump is located on the outer wall of the third water rinsing pool. The water inlet pipe is located at the top of the third water rinsing pool on the side away from the second water rinsing pool. Water inlet holes are evenly distributed through the bottom of the water inlet pipe. The water inlet tap is connected to the water inlet holes. The inlet of the water inlet pump is connected to the external red water pool.
[0014] As a preferred embodiment of this utility model, the rinsing water flow agitation components are distributed inside both sides of the first, second, and third flowing water rinsing tanks. Each rinsing water flow agitation component includes a second stirring motor and a second stirring shaft. The second stirring shaft is located inside the rinsing tank, and the second stirring motor is located at the bottom of the rinsing tank. The bottom of each second stirring shaft penetrates the rinsing tank and is connected to the output end of the second stirring motor at its bottom via a coupling.
[0015] Compared with the prior art, the beneficial effects of this utility model are:
[0016] In response to the problems mentioned in the background art, the IGBT module heat sink cleaning mechanism of this application achieves environmentally friendly cleaning through ultrasonic technology and water-based cleaning agent. Through the ultrasonic cleaning mechanism and water rinsing mechanism, the stirring component is used to ensure uniform mixing of the cleaning agent, thereby improving the cleaning effect. The rinsing tank design optimizes the water flow path, enhances rinsing efficiency, and ensures consistent surface cleanliness of the IGBT module heat sink.
[0017] By combining ultrasonic cleaning and running water rinsing, dirt and impurities on the heat sink of the IGBT module can be removed more effectively;
[0018] The use of water-based cleaning agents can improve cleaning effect and reduce environmental pollution. However, since most water-based cleaning agents are two-phase liquids, unlike ordinary solvent cleaning agents, two-phase liquids will separate into layers and, under certain flow conditions and physical forces, will be in different uniform mixing states. This poor uniformity results in different concentrations of the cleaning agent at different locations during use, leading to inconsistent cleaning concentrations in different parts of the cleaning basket and causing poor cleaning effect and inconsistent cleaning. This application solves the problem by setting a water-based cleaning agent mixing and stirring component inside the sonic cleaner to uniformly mix the water-based cleaning agent with water inside the sonic cleaner, thus ensuring cleaning efficiency.
[0019] By installing rinsing water flow agitation components inside multiple rinsing tanks, the rinsing water can form a circulating flow within the rinsing tanks, further improving the rinsing effect. This solves the problem that the existing rinsing tanks only have surface water flow, resulting in poor water flow inside the rinsing tanks during cleaning. This leads to a low replacement rate of the GBT module heat sinks being rinsed, resulting in incomplete rinsing and causing the GBT module heat sinks to be defective.
[0020] The entire cleaning process is highly automated, easy to operate, and saves labor costs.
[0021] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description
[0022] Figure 1 This is a top view of the overall cleaning process of this utility model;
[0023] Figure 2 This is a top view of the ultrasonic cleaning mechanism of this utility model;
[0024] Figure 3 This is a side view of the water rinsing mechanism of this utility model;
[0025] Figure 4 This is a top view of the water rinsing mechanism of this utility model.
[0026] In the diagram: 1. Ultrasonic cleaning mechanism; 11. Cleaning table; 12. Sonic cleaning machine; 13. Cleaning basket; 131. Placement rack; 1311. Frame; 1312. Placement basket; 14. Water pump; 141. Water pipe; 15. First stirring motor; 151. First stirring shaft; 2. Water rinsing mechanism; 21. First water rinsing tank; 22. Second water rinsing tank; 23. Third water rinsing tank; 24. Water pump; 241. Water pipe; 242. Water tap; 25. Second stirring motor; 251. Second stirring shaft. Detailed Implementation
[0027] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, which show several embodiments of the utility model. However, the utility model can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the disclosure of the utility model more thorough and comprehensive. Example
[0028] Please see Figure 1-4 This utility model provides a technical solution: a cleaning mechanism for IGBT module heat sinks, including a cleaning device for cleaning IGBT module heat sinks. The cleaning device includes an ultrasonic cleaning mechanism 1 and a water rinsing mechanism 2. The ultrasonic cleaning mechanism 1 is located on one side of the water rinsing mechanism 2. The ultrasonic cleaning mechanism 1 includes a cleaning table 11 and an ultrasonic cleaner 12 located on top of the cleaning table 11. A water filling component is provided on one side of the top of the ultrasonic cleaner 12. A cleaning basket 13 is provided inside the ultrasonic cleaner 12. Water-based cleaning agent mixing and agitating components are provided on both sides of the cleaning basket 13. A placement rack 131 for placing and cleaning the IGBT module heat sink is provided inside the cleaning basket 13. The placement rack 131 includes a frame body 1311, and placement baskets 13 are evenly staggered on both sides of the frame body 1311. 12. The IGBT module heat sink is located inside the placement basket 1312; the water filling assembly includes a water pump 14 and a water pipe 141. The water pump 14 is located on the cleaning table 11 outside the ultrasonic cleaner 12. The outlet of the water pump 14 is connected to the water pipe 141. The outlet of the water pipe 141 is located inside the ultrasonic cleaner 12. The inlet of the water pump 14 is connected to an external water supply tank through a pipeline; the water-based cleaning agent mixing and stirring assembly includes a first stirring motor 15 and a first stirring shaft 151. The first stirring shaft 151 is located on both sides of the ultrasonic cleaner 12 inside the ultrasonic cleaner 12. The first stirring motor 15 is symmetrically located on the outer wall of the ultrasonic cleaner 12. The end of the first stirring shaft 151 extends through the housing of the ultrasonic cleaner 12 to its outside and is connected to the output end of the first stirring motor 15 near it through a coupling.
[0029] It should be noted that in this embodiment, the IGBT module heat sink cleaning mechanism achieves environmentally friendly cleaning through ultrasonic technology and water-based cleaning agent. The ultrasonic cleaning mechanism and the water rinsing mechanism use a stirring component to ensure uniform mixing of the cleaning agent, thereby improving the cleaning effect. The rinsing tank is designed with an optimized water flow path to enhance rinsing efficiency and ensure consistent surface cleanliness of the IGBT module heat sink.
[0030] By combining ultrasonic cleaning and running water rinsing, dirt and impurities on the heat sink of the IGBT module can be removed more effectively;
[0031] Furthermore, the use of water-based cleaning agents can improve the cleaning effect while reducing environmental pollution. Since most water-based cleaning agents are two-phase liquids, unlike ordinary solvent cleaning agents, two-phase liquids will separate into layers and, under certain flow conditions and physical forces, will be in different uniform mixing states, resulting in poor uniformity. This causes the concentration of the cleaning agent to be different in different locations during the use of the water-based cleaning agent, resulting in inconsistent cleaning agent concentrations at different locations in the cleaning basket, leading to poor cleaning effect and inconsistent cleaning. This application solves the problem by setting a water-based cleaning agent mixing and stirring component inside the sonic cleaner 12 to uniformly mix the water-based cleaning agent and water inside the sonic cleaner 12, ensuring cleaning efficiency.
[0032] Furthermore, the water pump 14 is started to draw water from the external water supply tank and send it into the ultrasonic cleaner 12 through the water pipe 141. The first stirring motor 15 is started to drive the first stirring shaft 151 to rotate, so that the water-based cleaning agent and water are evenly mixed. The IGBT module heat sink is placed in the placement basket 1312 on the placement rack 131 inside the cleaning basket 13. The cleaning basket 13 is placed into the ultrasonic cleaner 12, and the ultrasonic cleaner 12 is turned on to clean the IGBT module heat sink using ultrasonic vibration.
[0033] Ultrasonic cleaning combined with water-based cleaning agents can more effectively remove dirt and impurities from the heat sinks of IGBT modules. Ultrasonic vibrations can penetrate deep into crevices, ensuring that every corner is cleaned. Using water-based cleaning agents instead of traditional solvent-based cleaning agents reduces environmental pollution, and the water used in the cleaning process can be recycled, saving water.
[0034] The water-based cleaning agent mixing and agitation component ensures uniform mixing of the cleaning agent, avoiding inconsistent cleaning results due to uneven concentration. The entire cleaning process is highly automated, reducing the need for manual operation, saving labor costs. Automated equipment can reduce human error, improve production efficiency and product quality.
[0035] Please see Figure 1 , 34. The water rinsing mechanism 2 includes a first water rinsing tank 21, a second water rinsing tank 22, and a third water rinsing tank 23 arranged sequentially from low to high. Each of the three tanks has a water flow agitation component. A water inlet component is located on the outer side of the third water rinsing tank 23 away from the second water rinsing tank 22. The water inlet component includes a water pump 24, a water pipe 241, and a water tap 242. The water pump 24 is located on the outer wall of the third water rinsing tank 23, and the water pipe 241 is located on the outer wall of the third water rinsing tank 23. The top of the three-flow rinsing tank 23, away from the second-flow rinsing tank 22, has an inlet pipe 241 with evenly spaced inlet holes at the bottom. The inlet tap 242 is connected to the inlet holes. The inlet of the water pump 24 is connected to the external red water tank. The rinsing water flow agitation components are distributed inside both sides of the first-flow rinsing tank 21, the second-flow rinsing tank 22, and the third-flow rinsing tank 23. Each rinsing water flow agitation component includes a second stirring motor 25 and a second stirring shaft 251. The second stirring shaft 251 is located inside the rinsing tank, and the second stirring motor 25 is located at the bottom of the rinsing tank. The bottom of each second stirring shaft 251 penetrates the rinsing tank and is connected to the output end of the second stirring motor 25 at its bottom via a coupling.
[0036] It should be noted that, in this embodiment, reference is made to the appendix. Figure 3 The tops of the first water rinsing tank 21, the second water rinsing tank 22, and the third water rinsing tank 23 are interconnected. The first water rinsing tank 21, the second water rinsing tank 22, and the third water rinsing tank 23 are arranged in order from low to high. The water inside the third water rinsing tank 23 flows to the second water rinsing tank 22, and the water inside the second water rinsing tank 22 flows to the first water rinsing tank 21. The water used to rinse the water inside the third water rinsing tank 23 is close to clean water.
[0037] By installing rinsing water flow agitation components inside multiple rinsing tanks, the rinsing water can form a circulating flow within the rinsing tanks, further improving the rinsing effect. This solves the problem that the existing rinsing tanks only have surface water flow, resulting in poor water flow inside the rinsing tanks during cleaning. This leads to a low replacement rate of the GBT module heat sinks being rinsed, resulting in incomplete rinsing and causing the GBT module heat sinks to be defective.
[0038] After ultrasonic cleaning, the IGBT module heat sink is transferred to the water rinsing mechanism 2. The water pump 24 is started to draw water from the external red water pool and send it into the third water rinsing pool 23 through the water inlet pipe 241. The second stirring motor 25 is started to drive the second stirring shaft 251 to rotate, so that the rinsing water flows in the rinsing pool. The IGBT module heat sink passes through the first water rinsing pool 21, the second water rinsing pool 22 and the third water rinsing pool 23 in sequence. The rinsing pools are set from low to high to form a gradually rising cleaning process. Each rinsing pool is equipped with a rinsing water flow agitation component to maintain the uniformity of the water flow and enhance the cleaning effect. Each component includes the second stirring motor 25 and the second stirring shaft 251. The stirring shaft is connected to the output end of the stirring motor at the bottom through a coupling. The high and low arrangement of the rinsing pools and the configuration of the stirring components are all to optimize the cleaning process and improve efficiency. The water pump 24 and the stirring motor are equipped with an automatic control system to achieve precise operation and monitoring. Example
[0039] Ensure the inside of the ultrasonic cleaner 12 is clean and free of residue. Check that the water-based cleaning agent is sufficient and prepare the IGBT module heat sink to be cleaned. Start the water pump 14 to draw water from the external water supply tank and send it into the ultrasonic cleaner 12 through the water pipe 141. At the same time, start the first stirring motor 15 to drive the first stirring shaft 151 to rotate, ensuring that the water-based cleaning agent and water are evenly mixed. Carefully place the IGBT module heat sink into the placement basket 1312 on the placement rack 131 inside the cleaning basket 13. Place the cleaning basket containing the heat sink into the ultrasonic cleaner 12 and turn on the ultrasonic cleaner 12. Use ultrasonic vibration to perform deep cleaning on the IGBT module heat sink. Ultrasonic waves can penetrate into crevices and effectively remove dirt and impurities.
[0040] The water pump 24 is started to draw water from the external red water pool and send it into the third rinsing pool 23 through the water inlet pipe 241. At the same time, the second stirring motor 25 is started to drive the second stirring shaft 251 to rotate, so that the rinsing water flows in the rinsing pool to ensure that the internal cleaning of the first rinsing pool 21, the second rinsing pool 22 and the third rinsing pool 23 reaches the rated depth. The ultrasonically cleaned IGBT module heat sinks are then transferred to the water rinsing mechanism 2. The IGBT module heat sinks pass through the first rinsing pool 21 and the second rinsing pool 22 in sequence. The IGBT module heat sink is then rinsed in the third rinsing tank 23. The water agitation components inside each rinsing tank maintain the uniformity of the water flow and enhance the cleaning effect. The rinsing tanks are set up sequentially from low to high, forming a gradually increasing cleaning process. After thorough rinsing in the three rinsing tanks, the IGBT module heat sink should reach the expected level of cleanliness. The heat sink is then removed and subjected to a final inspection to ensure that there is no residual dirt or impurities. Through the above process, the IGBT module heat sink can be cleaned efficiently and in an environmentally friendly manner, while reducing environmental pollution and improving production efficiency and product quality.
[0041] The working process of this utility model:
[0042] When using the ultrasonic cleaner 12, ensure that the inside of the ultrasonic cleaner 12 is clean and free of residue. Check that the water-based cleaning agent is sufficient and prepare the IGBT module heat sink to be cleaned. Start the water pump 14 to draw water from the external water supply tank and send it into the ultrasonic cleaner 12 through the water pipe 141. At the same time, start the first stirring motor 15 to drive the first stirring shaft 151 to rotate, ensuring that the water-based cleaning agent and water are evenly mixed. Carefully place the IGBT module heat sink into the placement basket 1312 on the placement rack 131 inside the cleaning basket 13. Place the cleaning basket containing the heat sink into the ultrasonic cleaner 12 and turn on the ultrasonic cleaner 12. Use ultrasonic vibration to perform deep cleaning of the IGBT module heat sink. Ultrasonic waves can penetrate into the crevices and effectively remove dirt and impurities.
[0043] The water pump 24 is started to draw water from the external red water pool and send it into the third rinsing pool 23 through the water inlet pipe 241. At the same time, the second stirring motor 25 is started to drive the second stirring shaft 251 to rotate, so that the rinsing water flows in the rinsing pool and ensures that the internal cleaning of the first rinsing pool 21, the second rinsing pool 22 and the third rinsing pool 23 reaches the rated depth. The ultrasonically cleaned IGBT module heat sink is transferred to the water rinsing mechanism 2. The IGBT module heat sink passes through the first rinsing pool 21, the second rinsing pool 22 and the third rinsing pool 23 in sequence for rinsing. The water flow stirring component inside each rinsing pool maintains the uniformity of the water flow and enhances the cleaning effect. The rinsing pools are set up from low to high to form a gradually increasing cleaning process. After thorough rinsing in the three rinsing pools, the IGBT module heat sink should reach the expected cleanliness. The heat sink is taken out and a final inspection is performed to ensure that there is no residual dirt or impurities.
[0044] The present invention has been described above by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.
Claims
1. A cleaning mechanism for IGBT module heat sinks, comprising cleaning equipment for cleaning IGBT module heat sinks, characterized in that: The cleaning equipment includes an ultrasonic cleaning mechanism (1) and a water rinsing mechanism (2). The ultrasonic cleaning mechanism (1) is located on one side of the water rinsing mechanism (2). The ultrasonic cleaning mechanism (1) includes a cleaning table (11) and an ultrasonic cleaner (12) located on the top of the cleaning table (11). A water filling component is provided on one side of the top of the ultrasonic cleaner (12). A cleaning basket (13) is provided inside the ultrasonic cleaner (12). A water-based cleaning agent mixing and stirring component is provided on both sides of the cleaning basket (13). A placement rack (131) for placing and cleaning the heat sink of the IGBT module is provided inside the cleaning basket (13). The placement rack (131) includes a frame (1311). Placement baskets (1312) are evenly staggered on both sides of the frame (1311). The heat sink of the IGBT module is located inside the placement basket (1312).
2. The cleaning mechanism for IGBT module heat sinks according to claim 1, characterized in that: The water supply assembly includes a water pump (14) and a water pipe (141). The water pump (14) is located on the cleaning table (11) outside the ultrasonic cleaner (12). The outlet of the water pump (14) is connected to the water pipe (141). The outlet of the water pipe (141) is located inside the ultrasonic cleaner (12). The inlet of the water pump (14) is connected to an external water supply tank through a pipeline.
3. A cleaning mechanism for IGBT module heat sinks according to claim 1, characterized in that: The water-based cleaning agent mixing and stirring assembly includes a first stirring motor (15) and a first stirring shaft (151). The first stirring shaft (151) is located on both sides of the ultrasonic cleaner (12) inside the ultrasonic cleaner (12). The first stirring motor (15) is symmetrically located on the outer wall of the ultrasonic cleaner (12). The end of the first stirring shaft (151) extends through the housing of the ultrasonic cleaner (12) to its outside and is connected to the output end of the first stirring motor (15) near it via a coupling.
4. A cleaning mechanism for IGBT module heat sinks according to claim 1, characterized in that: The water rinsing mechanism (2) includes a first water rinsing tank (21), a second water rinsing tank (22), and a third water rinsing tank (23) arranged in sequence. The first water rinsing tank (21), the second water rinsing tank (22), and the third water rinsing tank (23) are arranged in sequence from low to high. The first water rinsing tank (21), the second water rinsing tank (22), and the third water rinsing tank (23) are all equipped with rinsing water flow agitation components. The third water rinsing tank (23) is equipped with a water rinsing inlet component on the side away from the second water rinsing tank (22).
5. A cleaning mechanism for IGBT module heat sinks according to claim 4, characterized in that: The water inlet assembly for rinsing includes a water inlet pump (24), a water inlet pipe (241), and a water inlet tap (242). The water inlet pump (24) is located on the outer wall of the third water rinsing pool (23). The water inlet pipe (241) is located on the inner top of the third water rinsing pool (23) away from the second water rinsing pool (22). The bottom of the water inlet pipe (241) is uniformly provided with water inlet holes. The water inlet tap (242) is connected to the water inlet holes. The inlet of the water inlet pump (24) is connected to the external red water pool.
6. A cleaning mechanism for IGBT module heat sinks according to claim 4, characterized in that: The rinsing water agitation components are distributed inside both sides of the first rinsing pool (21), the second rinsing pool (22), and the third rinsing pool (23). Each rinsing water agitation component includes a second stirring motor (25) and a second stirring shaft (251). The second stirring shaft (251) is located inside the rinsing pool, and the second stirring motor (25) is located at the bottom of the rinsing pool. The bottom of each second stirring shaft (251) passes through the rinsing pool and is connected to the output end of the second stirring motor (25) at its bottom via a coupling.