Micron-sized self-adaptive balanced grinding and thinning device based on large-size sample
By designing an adaptive balance grinding and thinning device, a matching structure of a balance outer sleeve and a cap-shaped locking inner sleeve is adopted. Combined with high-elasticity double-sided adhesive and ball bearings, the device monitors and compensates for sample deviations in real time, solving the problems of uncontrollable thickness, poor verticality, and sample damage in existing technologies. This achieves high-precision sample thinning, expands the sample size range, and reduces costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENYANG BOYAN KEQI TECH CO LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-05-15
AI Technical Summary
Existing ultrathin sample preparation techniques suffer from large thickness deviations, poor verticality, easy sample damage, and size limitations. Although traditional ion thinning methods can be used for transmission electron microscopy, they are costly and result in small sample sizes.
A micron-level adaptive balance grinding and thinning device for large-size samples is designed. It adopts a matching structure of a balance outer sleeve and a cap-shaped locking inner sleeve, combined with high-elasticity double-sided adhesive and ball bearings. The bottom surface is ensured to be flat by a sample loading platform. The downward displacement is monitored in real time by a differential positioning instrument and a micrometer rod to achieve adaptive compensation for thickness deviation and vibration offset. Combined with high-resolution differential head for precise drive, transmission error is eliminated to achieve sub-micron-level thickness control.
It achieves a thickness control accuracy of ±1μm and a verticality error of ≤0.05°, avoiding sample damage, expanding the sample size range, and reducing equipment costs.
Smart Images
Figure CN224239196U_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of micro-nano manufacturing and precision characterization technology, and in particular to a micron-level adaptive balanced grinding and thinning device based on large-size samples. Background Technology
[0002] The micron-level sample thinning device is specifically designed for preparing metallographic samples that meet the Class 1 requirements of the ASTM E3-22 standard and ultrathin specimens required for TEM observation. It can achieve stress-free clamping of samples with diameters of 1-30 mm, and the grinding thickness control resolution reaches ±1 μm. The vertical flatness error is ≤0.05°. It can be widely used in the preparation of cross-scale interface integrity for third-generation semiconductor wafers, metal additive manufacturing parts, and biomedical microdevices.
[0003] In existing technologies, ultrathin samples are usually prepared by embedding or mechanically clamping and then grinding. However, this method has drawbacks such as uncontrollable thickness, poor flatness, sample damage, and size limitations. The shrinkage of the embedding resin or uneven clamping force usually results in a thickness deviation of more than 0.01 mm. The tilting of the clamping or uneven grinding pressure causes the sample surface to tilt by more than 0.5 degrees. Mechanical clamping is prone to micron-level cracking or stress deformation. Although the traditional ion thinning method can prepare transmission electron microscopy samples, the equipment cost is high and the sample size is usually no more than 3 mm.
[0004] Therefore, in view of the problems of large thickness deviation, poor flatness, easy damage to samples and limited size in the existing ultrathin sample preparation technology, and the high cost and small sample size of the traditional ion thinning method, it is urgent to design a new micron-level adaptive balance grinding and thinning device based on large-size samples. Utility Model Content
[0005] To overcome the problems of large thickness deviation, poor verticality, easy damage to samples and size limitations in existing ultrathin sample preparation techniques, traditional ion thinning methods, although applicable to transmission electron microscopy, are costly and have small sample sizes.
[0006] The technical solution of this utility model is as follows: a micron-level adaptive balance grinding and thinning device based on large-size samples, including a balance adjustment component; it also includes a locking component, a differential positioning component, a positioning component, a sample stage and a differential positioning fixing stage. The balance adjustment component consists of a balance outer sleeve, a slag discharge groove and an annular end face. The locking component consists of a cap-shaped locking inner sleeve and a mounting hole. The differential positioning component consists of a differential positioning instrument, a micrometer rod and a differential head. The positioning component consists of an upper bearing positioner and a lower bearing positioner.
[0007] Preferably, by setting a balancing outer sleeve, the cap-brimming locking inner sleeve and the balancing outer sleeve are placed on the sample loading platform. The reference plane of the platform ensures that the bottom surfaces of the two are strictly flush (flatness ≤ 0.005 mm), eliminating the initial assembly tilt error. The sample is temporarily bonded to the lower end of the sample stage with stretchable double-sided adhesive. The elastic properties of the double-sided adhesive (stretch rate ≥ 300%) can adaptively compensate for the sample thickness deviation (± 1 μm) and avoid mechanical clamping stress. The bottom annular end face of the balancing outer sleeve contacts the rotating grinding disk. The weight of the outer sleeve distributes pressure evenly around the circumference through the slag discharge groove, making the initial contact pressure of the sample uniform. When the rotation speed of the grinding disk changes, the sliding fit (H7 / g6 tolerance) between the balancing outer sleeve and the cap-brimming locking inner sleeve allows for axial micro-movement. The radial freedom of the ball bearing (clearance ≤ 0.002 mm) compensates for the offset caused by grinding vibration in real time. The micrometer rod of the differential positioning instrument is rigidly connected to the sample stage through a bearing positioner. The micrometer head monitors the downward displacement in real time with a resolution of 0.1 μm and feeds the data back to the control system. When the micrometer head drives the micrometer rod to press down, the thrust is converted into pure axial motion of the sample stage through the ball bearing, decoupling the rotational and translational degrees of freedom and avoiding errors introduced by the threaded transmission clearance. When the sample is locally over-grinded, the sliding pair between the inner and outer sleeves tilts slightly, triggering the shear deformation of the double-sided adhesive (shear modulus 0.01 MPa). The tilting torque is absorbed by the viscoelastic hysteresis effect, allowing the sample surface to automatically return to its original level (angle compensation rate ≥85%). After rough grinding, the cap is locked to the inner sleeve, the micrometer positioning instrument, and the micrometer positioning fixed stage with bolts, increasing the system stiffness to 500 N / μm and suppressing the fine grinding stage (abrasive particle size ≤1 μm). The micro-vibration of the differential head drives the sample stage with a step size of 0.01 μm / pulse. The preload of the bearing (10 ± 0.2 N) eliminates the backlash, ultimately achieving a thickness control accuracy of ±1 μm. This solves the problem that in the existing technology, the preparation of ultrathin samples usually adopts the method of embedding or mechanical clamping and then grinding, but there are defects such as uncontrollable thickness, poor flatness, sample damage and size limitation. The shrinkage of the embedding resin or uneven clamping force usually causes the thickness deviation to exceed 0.01 mm. The clamping tilt or uneven grinding pressure causes the sample surface to tilt by more than 0.5 degrees. Mechanical clamping is prone to micron-level breakage or stress deformation. Although the traditional ion thinning method can prepare transmission electron microscopy samples, the equipment cost is high and the sample size is usually no more than 3 mm.
[0008] Preferably, the outer sleeve of the balance sleeve has multiple longitudinal slag discharge grooves on its wall, which are distributed circumferentially. The bottom edge of the outer sleeve of the balance sleeve is machined with an annular end face, which contacts the grinding disc.
[0009] Preferably, an installation hole is provided on the upper right side of the inner sleeve of the brim locking sleeve, and the inner sleeve of the brim locking sleeve is slidably nested inside the outer sleeve.
[0010] Preferably, a micrometer rod is installed at the bottom of the differential positioner, and a differential head is installed at the top of the differential positioner. The micrometer rod is rigidly connected to the sample stage through a bearing positioner.
[0011] Preferably, the differential positioner has an accuracy of 0.001 mm, and the bearing positioner has a bearing preload of 10 ± 0.2 N.
[0012] Preferably, a screw hole is provided on the upper front side of the differential positioning fixing platform, and the cap-shaped locking inner sleeve, differential positioning instrument and differential positioning fixing platform are locked together by bolts.
[0013] Preferably, the upper part of the bearing positioner is connected to the upper end of the groove of the sample stage, and the lower part of the bearing positioner is connected to the bottom of the differential positioner.
[0014] The beneficial effects of this utility model are:
[0015] 1. By setting up a balancing outer sleeve, this device adopts a matching structure between the balancing outer sleeve and the cap-brimming locking inner sleeve. A sample loading platform ensures that the bottom surfaces of both are strictly flush (flatness ≤ 0.005 mm). The sample is bonded to the sample stage with high-elasticity double-sided adhesive (tensile strength ≥ 300%), adaptively compensating for ±1 μm thickness deviation. During grinding, the self-weight of the balancing outer sleeve is evenly pressurized through the slag discharge groove. Its H7 / g6 sliding fit with the cap-brimming locking inner sleeve and the ball bearing with a clearance ≤ 0.002 mm can compensate for grinding vibration offset in real time. The differential positioning instrument (resolution 0.1 μm) is used... A micrometer rod with a rigid connection monitors the downward displacement and provides feedback control. The ball bearing converts the downward pressure into pure axial motion to avoid thread transmission errors. When there is local over-grinding, the shear deformation of the double-sided adhesive (shear modulus 0.01MPa) absorbs the tilting torque to achieve ≥85% angle self-compensation. After rough grinding, the inner sleeve and the differential positioning fixed table are locked to increase the system stiffness to 500N / μm. In the fine grinding stage (abrasive particles ≤1μm), the micrometer head is driven at a step of 0.01μm / pulse, combined with a bearing preload of 10±0.2N to eliminate backlash, ultimately achieving a thickness control accuracy of ±1μm. Attached Figure Description
[0016] Figure 1 The diagram shown is a three-dimensional structural schematic of a micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to this utility model.
[0017] Figure 2 The diagram shown is a three-dimensional structural diagram of the outer sleeve of a micron-level adaptive balance grinding and thinning device based on large-size samples according to this utility model.
[0018] Figure 3 The diagram shown is a schematic diagram of the cap locking inner sleeve structure of a micron-level adaptive balance grinding and thinning device based on large-size samples according to this utility model.
[0019] Figure 4 The diagram shows a three-dimensional structure of the sample stage of a micron-level adaptive balance grinding and thinning device for large-size samples according to this utility model.
[0020] Figure 5 The diagram shown is a three-dimensional structural schematic of the differential positioning and fixing stage of a micron-level adaptive balance grinding and thinning device based on large-size samples according to this utility model.
[0021] Explanation of reference numerals in the attached drawings: 11. Balance outer sleeve; 12. Slag discharge trough; 13. Annular end face; 21. Cap brimming locking inner sleeve; 22. Mounting hole; 31. Differential positioning instrument; 32. Micrometer rod; 33. Differential head; 41. Upper part of bearing positioner; 42. Lower part of bearing positioner; 5. Sample stage; 6. Differential positioning fixing stage; 7. Screw hole. Detailed Implementation
[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0023] Please see Figures 1-5 This utility model provides an embodiment: a micron-level adaptive balance grinding and thinning device based on large-size samples, including a balance adjustment component; it also includes a locking component, a differential positioning component, a positioning component, a sample stage 5, and a differential positioning fixing stage 6. The balance adjustment component consists of a balance outer sleeve 11, a slag discharge groove 12, and an annular end face 13. The locking component consists of a cap-shaped locking inner sleeve 21 and a mounting hole 22. The differential positioning component consists of a differential positioning instrument 31, a micrometer rod 32, and a differential head 33. The positioning component consists of an upper bearing positioner 41 and a lower bearing positioner 42. By setting the balance outer sleeve 11 and adopting the matching structure between the balance outer sleeve 11 and the cap-shaped locking inner sleeve 21, the precision sample loading platform ensures that the bottom surfaces of the two are strictly flush. The sample is made of highly elastic double-sided... The adhesive is fixed to the sample stage 5, which can adaptively compensate for thickness deviation. During the grinding process, the self-weight of the balancing outer sleeve 11 is evenly pressurized through the specially designed slag discharge groove 12. Its precise sliding cooperation with the cap brim locking inner sleeve 21 and the high-precision ball bearing can compensate for the offset caused by grinding vibration in real time. The differential positioning instrument 31 monitors the downward displacement in real time and provides feedback control through the rigidly connected micrometer rod 32. At the same time, the ball bearing is used to convert the downward pressure into pure axial motion to ensure transmission accuracy. When local over-grinding occurs, the viscoelastic properties of the double-sided adhesive can effectively absorb the tilting torque to achieve automatic compensation. After the rough grinding is completed, the locking mechanism greatly improves the system rigidity. In the fine grinding stage, the high-resolution micrometer head 33 drives the system precisely, and the bearing preload eliminates the transmission gap, ultimately achieving sub-micron level thickness control accuracy.
[0024] Please see Figures 1-3In this embodiment, the outer sleeve 11 has multiple longitudinal slag discharge grooves 12 on its wall, which are distributed circumferentially. The bottom edge of the outer sleeve 11 is machined with an annular end face 13, which contacts the grinding disc. By setting the slag discharge grooves 12, the rotating airflow of the grinding disc actively removes debris, preventing scratches on the sample surface. The upper right side of the cap locking inner sleeve 21 has an installation hole 22. The cap locking inner sleeve 21 is slidably nested inside the outer sleeve. By setting the installation hole 22, the cap locking inner sleeve 21 can be fixed to the differential positioning instrument 31 by screwing in bolts. The bottom of the differential positioning instrument 31 is equipped with a micrometer rod 32, and the top of the differential positioning instrument 31 is equipped with a differential head 33. The micrometer rod 32 is rigidly connected to the sample stage 5 through a bearing locator. By setting the micrometer rod 32 and the differential head 33, the downward displacement can be monitored and adjusted.
[0025] Please see Figures 1-5 In this embodiment, the differential positioning instrument 31 has an accuracy of 0.001mm, and the preload of the bearing in the bearing positioner is 10±0.2N. The bearing is used to bear the axial and radial loads during rotational motion, reducing friction and resistance, thereby improving mechanical efficiency and reducing energy consumption. It achieves this purpose by rolling balls between the inner and outer rings, and is suitable for providing smooth rotational motion in high-speed, high-precision and heavy-load applications. A screw hole 7 is provided on the upper front side of the differential positioning fixing table 6, and the cap is used to lock the inner sleeve. 21. The differential positioning device 31 and the differential positioning fixing platform 6 are locked together by bolts. By setting the screw hole 7, the cap brim can be locked with bolts to fix the inner sleeve 21, the differential positioning device 31 and the differential positioning fixing platform 6. The upper part 41 of the bearing locator is connected to the upper end of the groove of the sample stage 5, and the lower part 42 of the bearing locator is connected to the bottom of the differential positioning device 31. By setting the upper part 41 of the bearing locator, the differential positioning device 31 connected to the lower part 42 of the bearing locator is controlled, so that the differential positioning device 31 rotates inside the sample stage 5.
[0026] During operation, the sample is temporarily attached to the lower end of the sample stage 5 using stretchable double-sided tape. The elastic properties of the double-sided tape are used to adaptively compensate for thickness deviations. During the grinding process, the bottom annular end face 13 of the balancing outer sleeve 11 contacts the rotating grinding disk. Its own weight achieves circumferential pressure distribution through the slag discharge groove 12. At the same time, the radial degree of freedom of the sliding ball bearing between the balancing outer sleeve 11 and the cap locking inner sleeve 21 is compensated for grinding vibration offset in real time. The micrometer rod 32 of the differential positioning instrument 31 is rigidly connected to the sample stage 5 through the bearing positioner. The differential head 33 monitors the downward displacement in real time and provides feedback control. The thrust is converted into pure axial motion through the ball bearing. The grinding chips are discharged along the longitudinal slag discharge groove 12. When there is local over-grinding, the slight tilt generated by the sliding pair triggers the shear deformation of the double-sided tape to achieve self-correction. After rough grinding, the bolt locking mechanism significantly improves the system rigidity. In the fine grinding stage, the differential head 33 drives the sample stage 5 with a precision step distance. The bearing preload eliminates the backlash, ultimately achieving high-precision thickness control.
[0027] Through the above steps, the outer sleeve 11 and the inner sleeve 21 of the brim locking are fitted together, and the precision sample loading platform ensures their strict alignment. The sample is fixed with high-elasticity double-sided tape to adaptively compensate for thickness deviations. During the grinding process, the weight of the outer sleeve 11 is evenly pressurized through the slag discharge groove 12. Its precise sliding fit with the inner sleeve 21 of the brim locking, combined with high-precision ball bearings, can offset vibration offsets in real time. The differential positioning instrument 31 monitors the downward displacement in real time and performs closed-loop control through the rigid micrometer rod 32. At the same time, the ball bearings convert the downward pressure into pure axial motion to ensure transmission accuracy. When local over-grinding occurs, the viscoelastic properties of the double-sided tape can absorb the tilting torque to achieve automatic compensation. After coarse grinding, the sample is locked. The mechanism enhances the system rigidity. During the fine grinding stage, a high-resolution microhead 33 precisely drives the process and, in conjunction with bearing preload, eliminates gaps, ultimately achieving submicron-level thickness control. This addresses the shortcomings of existing technologies, which typically involve grinding after embedding or mechanical clamping to prepare ultrathin samples. These methods suffer from uncontrollable thickness, poor flatness, sample damage, and size limitations. Embedding resin shrinkage or uneven clamping force can cause thickness deviations exceeding 0.01 mm. Clamping tilt or uneven grinding pressure can cause sample surface tilt exceeding 0.5 degrees. Mechanical clamping can easily cause micron-level fragmentation or stress deformation. While traditional ion thinning methods can prepare transmission electron microscopy samples, they are costly and sample sizes typically do not exceed 3 mm.
Claims
1. A micron-scale adaptive balance grinding and thinning device for large-size samples, comprising a balance adjustment component; characterized in that: It also includes a locking assembly, a differential positioning assembly, a positioning assembly, a sample stage (5) and a differential positioning fixing stage (6). The balance adjustment assembly consists of a balance outer sleeve (11), a slag discharge trough (12) and an annular end face (13). The locking assembly consists of a cap locking inner sleeve (21) and a mounting hole (22). The differential positioning assembly consists of a differential positioning instrument (31), a micrometer rod (32) and a differential head (33). The positioning assembly consists of the upper part (41) of the bearing positioner and the lower part (42) of the bearing positioner.
2. The micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to claim 1, characterized in that: The outer sleeve (11) has multiple longitudinal slag discharge grooves (12) on its wall. The multiple slag discharge grooves (12) are distributed in a circle. The bottom edge of the outer sleeve (11) is machined with an annular end face (13), which contacts the grinding disc.
3. The micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to claim 1, characterized in that: An installation hole (22) is provided on the upper right side of the inner sleeve (21) for locking the brim, and the inner sleeve (21) for locking the brim is slidably nested inside the outer sleeve (1).
4. The micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to claim 1, characterized in that: The bottom of the differential positioner (31) is equipped with a micrometer rod (32) and the top of the differential positioner (31) is equipped with a differential head (33). The micrometer rod (32) is rigidly connected to the sample stage (5) through a bearing positioner.
5. The micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to claim 4, characterized in that: The accuracy of the differential positioning instrument (31) is 0.001mm, and the preload of the bearing positioner bearing is 10±0.2N.
6. The micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to claim 1, characterized in that: A screw hole (7) is provided on the upper front side of the differential positioning fixing platform (6). The cap locking inner sleeve (21), the differential positioning instrument (31) and the differential positioning fixing platform (6) are locked together by bolts.
7. The micron-level adaptive equilibrium grinding and thinning device based on large-size samples according to claim 1, characterized in that: The upper part (41) of the bearing locator is connected to the upper end of the groove of the sample stage (5), and the lower part (42) of the bearing locator is connected to the bottom of the differential locator (31).