Multifunctional test equipment for intelligent card
By integrating a main control module and a data monitoring module, the smart card multi-functional testing equipment achieves efficient integration and flexible switching of multiple testing functions, solving the problems of single function and inaccurate monitoring of existing equipment, and improving testing efficiency and equipment adaptability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG CHUTIAN DRAGON SMART CARD
- Filing Date
- 2025-05-15
- Publication Date
- 2026-05-15
AI Technical Summary
Existing smart card testing equipment has limited functionality, requiring multiple devices to perform tests separately, which is cumbersome and costly. Furthermore, the integration between the monitoring device and the main testing equipment is not high, affecting the accuracy of the monitoring data.
Design a multi-functional smart card testing device that integrates a main control module and a data monitoring module, supports contact and contactless smart card testing, and achieves efficient integration and flexible switching of multiple testing functions through modular combination, including clock processing circuit and level conversion circuit to stably capture high-speed communication signals, and is compatible with multi-level smart cards.
It improves testing efficiency and ease of operation, ensures the accuracy of data monitoring and the practicality of equipment, reduces configuration complexity and cost, and is compatible with communication testing of different types of smart cards.
Smart Images
Figure CN224247832U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of smart card testing technology, and in particular to a multi-functional smart card testing device. Background Technology
[0002] During the research, development, production, and application of smart cards, comprehensive functional testing and communication data monitoring of the smart cards and their interaction with reading and writing devices are required. To ensure the effectiveness and coverage of the testing, the testing equipment must not only support multiple testing functions but also have convenient connection methods and reliable signal acquisition capabilities.
[0003] Currently, commercially available smart card testing solutions often have limited functionality. Users may need to configure multiple independent devices to perform card reading tests, anti-tamper tests, power consumption analysis, or data monitoring separately, resulting in complex testing environments, cumbersome operations, and high costs. Especially when performing data monitoring, some existing monitoring devices may have low integration with the main testing equipment in their physical structure. Their connection methods to the read / write module and smart card under test are not flexible or convenient enough, potentially requiring additional adapters or complex wiring. This discrete or non-standardized structure not only occupies a significant amount of experimental space but may also affect the accuracy of monitoring data due to unreliable connections. Utility Model Content
[0004] In view of this, the purpose of this application is to provide a multi-functional smart card testing device that can efficiently integrate and flexibly switch multiple testing functions on a single testing device, thereby improving the testing efficiency, ease of operation, and accuracy of data monitoring of smart card testing.
[0005] In a first aspect, this application provides a multi-functional smart card testing device, comprising: a main control module and a data monitoring module; the main control module includes a main control chip, a first smart card slot connected to the main control chip, and a functional testing module; the data monitoring module includes a second smart card slot, an analog smart card, and an output connection component; the second smart card slot is connected to the analog smart card; the second smart card slot is used to install the smart card under test; the data monitoring module is pluggably connected to the first smart card slot via the output connection component; the analog smart card can be pluggably connected to the third smart card slot of the read / write module under test to establish a signal path for monitoring communication data between the smart card under test and the read / write module under test; the main control chip is configured to perform preset functional tests on the smart card under test through the functional testing module when the smart card under test is placed in the first smart card slot; the main control chip is further configured to monitor communication data between the smart card under test and the read / write module under test through the data monitoring module when the data monitoring module is connected to the first smart card slot and the smart card under test is placed in the second smart card slot.
[0006] In an optional implementation, the data monitoring module further includes a clock processing circuit; the input terminals of the clock processing circuit are connected to the analog smart card and the second smart card slot respectively; the output terminal of the clock processing circuit is connected to the main control chip through an output connection component; the clock processing circuit includes a connected tri-state buffer and a frequency divider; the frequency divider is composed of multiple cascaded D-type flip-flops.
[0007] In an optional implementation, the data monitoring module further includes a level conversion circuit; the input terminal of the level conversion circuit is connected to the analog smart card and the second smart card slot respectively; the output terminal of the level conversion circuit is connected to the main control chip through an output connection component; the level conversion circuit includes at least one buffer; the preset input high level recognition range of the buffer is 1.5V to 5.0V.
[0008] In an optional implementation, the main control module further includes a contactless circuit connected to the main control chip; the contactless circuit includes a connected baseband chip and an antenna; a first smart card slot is used to install a contact smart card; the contactless circuit is used to connect the contactless smart card; the baseband chip is connected to the SPI bus of the main control chip; the baseband chip pre-stores a contactless communication protocol conforming to a preset standard.
[0009] In an optional implementation, the functional test module includes an anti-pull-out test unit; the anti-pull-out test unit includes a first switching circuit connected to the first smart card slot and a second switching circuit connected to the contactless circuit; the first switching circuit includes a transistor, the emitter of which is connected to the main control chip and the collector of which is connected to the first smart card slot; the second switching circuit includes a MOSFET, the source of which is connected to the main control chip and the drain of which is connected to the contactless circuit.
[0010] In an optional implementation, the functional test module includes a power consumption test unit; the power consumption test unit includes a sampling resistor connected in series with the first smart card slot, and a signal amplification circuit connected across the sampling resistor; the signal amplification circuit is connected to the analog-to-digital conversion interface of the main control chip.
[0011] In an optional implementation, the main control module further includes a voltage regulator circuit; the voltage regulator circuit includes a linear regulator connected in series and a third diode; the voltage regulator circuit is configured to output an operating voltage applicable to different smart cards under test; the operating voltage range is 1.5V to 5.0V.
[0012] In an optional implementation, the simulated smart card includes a probe board; the probe board is provided with standard contact points conforming to a preset smart card standard, and the size of the probe board is suitable for insertion into a third smart card slot.
[0013] In an optional implementation, the shape and contact point arrangement of the output connection component are adapted to the first smart card slot.
[0014] In an optional implementation, the main control module further includes a communication interface connected to the main control chip; the main control module is connected to a peripheral host computer through the communication interface; the main control module is configured to receive test instructions sent by the host computer and return the test results to the host computer; the test instructions include at least one of an anti-unplug test instruction, a power consumption sampling test instruction, and a data monitoring instruction.
[0015] This application provides a multi-functional smart card testing device. Through a modular combination of a main control module and a data monitoring module, it can perform card reading tests, anti-tampering tests, power consumption detection, and communication data monitoring for both contact and contactless smart cards. This improves the device's integrated testing functions and system adaptability, effectively reducing the configuration complexity and operating costs. The data monitoring module, with its standard pluggable interface, simulated smart card, and signal processing structure, allows for simultaneous monitoring of communication data without affecting normal communication between the smart card under test and the reader / writer under test. This ensures the integrity and accuracy of the monitored data, thereby improving the reliability of the test results. By incorporating clock processing and level conversion circuits, it achieves stable capture of high-speed communication signals and broad compatibility with multi-level smart card signals, enhancing the system's adaptability to different types of smart cards and significantly improving the device's practicality and engineering application value.
[0016] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the application. The objectives and other advantages of this application are realized and obtained through the structures particularly pointed out in the description, claims and drawings.
[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of a smart card multi-functional testing device provided in an embodiment of this application;
[0020] Figure 2 This is a schematic diagram of the main control chip of the main control module provided in the embodiments of this application;
[0021] Figure 3A schematic diagram of the first smart card slot and the first switch circuit of the main control module provided in this application embodiment;
[0022] Figure 4 A schematic diagram of the second smart card slot, analog smart card, and output connection component of the data monitoring module provided in this application embodiment;
[0023] Figure 5 A schematic diagram of the clock processing circuit of the data monitoring module provided in the embodiments of this application;
[0024] Figure 6 A schematic diagram of the level conversion circuit of the data monitoring module provided in the embodiments of this application;
[0025] Figure 7 A schematic diagram of the non-contact circuit and the second switch circuit of the main control module provided in the embodiments of this application;
[0026] Figure 8 This is a schematic diagram of the signal amplification circuit of the data monitoring module provided in the embodiments of this application;
[0027] Figure 9 A schematic diagram of the voltage regulation circuit of the main control module provided in the embodiments of this application.
[0028] Icons: 1-Main control module; 2-Data monitoring module; 3-Read / write module under test; 4-Smart card under test. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0030] To facilitate understanding of this embodiment, the embodiments of this application will be described in detail below.
[0031] Figure 1 This is a schematic diagram of a smart card multi-functional testing device provided in an embodiment of this application.
[0032] Reference Figure 1 A multi-functional smart card testing device, comprising: a main control module 1 and a data monitoring module 2. (Refer to...) Figure 2 The main control module 1 includes the main control chip U11. (Refer to...) Figure 3 The main control module 1 also includes a first smart card slot CARD1 connected to the main control chip U11 and a functional test module. (Refer to...) Figure 4The data monitoring module 2 includes a second smart card slot SIM2 or CARD2, an analog smart card SIM3, and an output connection component J1; the second smart card slot SIM2 or CARD2 is connected to the analog smart card SIM3; the second smart card slot SIM2 or CARD2 is used to install the smart card under test 4.
[0033] Here, refer to Figure 4 The second smart card slot is compatible with IC cards of different sizes available on the market. SIM2 is for small-sized cards, and CARD2 is for large-sized cards.
[0034] The smart card under test 4 refers to the smart IC card being tested during the testing process. This includes, but is not limited to, financial IC cards (such as bank cards), social security cards, mobile communication SIM cards, and transportation cards.
[0035] The read / write module under test 3 refers to the smart card read / write device being tested during the testing process. This includes, but is not limited to, the following: bank IC card readers / writers, social security card readers / writers, SIM card readers / writers, transportation card ticket gates or recharge terminals, and commercial IC card payment terminals such as POS machines.
[0036] Data monitoring module 2 is pluggably connected to the first smart card slot CARD1 via output connection component J1. Analog smart card SIM3 can be pluggably connected to the third smart card slot of the read / write module under test 3 to establish a signal path for monitoring communication data between the smart card under test 4 and the read / write module under test 3.
[0037] Reference Figure 2 The main control module 1 includes the main control chip U11, which is responsible for the logic control, data processing and communication with the external host computer of the entire device.
[0038] Connected to the main control chip U11 are also the first smart card slot CARD1 and the functional test module.
[0039] The first smart card slot, CARD1, is typically an ID-1 type half-insertion contact IC card socket structure. It serves as the interface for the main control module 1 to directly connect physically and electrically with the smart card under test, 4. Each contact of the first smart card slot, CARD1 (such as VCC, GND, RST, CLK, I / O), is connected to the corresponding pin of the main control chip U11 or to a circuit controlled by the main control chip U11.
[0040] The functional test module is a circuit unit integrated on the main control module 1. It is connected to the main control chip U11 and partially connected to the contacts of the first smart card slot CARD1. It is used to perform various preset functional tests on the smart card 4 under test that is directly inserted into the first smart card slot CARD1.
[0041] Data monitoring module 2 is used to monitor the communication data between the external read / write module 3 under test and the smart card 4 under test. (Refer to...) Figure 4 The data monitoring module 2 includes a second smart card slot SIM2 or CARD2, an analog smart card SIM3, and an output connection component J1.
[0042] The second smart card slot, SIM2 or CARD2, is located on the board of the data monitoring module 2 and is used to install the smart card 4 under test. When data monitoring is performed, the user inserts the actual smart card whose communication content is being monitored into this second smart card slot, SIM2 or CARD2.
[0043] The analog smart card SIM3 is an interface component of the data monitoring module 2 used to connect to the read / write module 3 under test. The analog smart card SIM3 includes a probe board; the probe board has standard contact points conforming to a preset smart card standard, and its size is suitable for insertion into a third smart card slot. The probe board is connected to the main circuit board of the data monitoring module 2 via a flexible cable (such as a ribbon cable). The analog smart card SIM3 can be plugged into the third smart card slot of the read / write module 3 under test (i.e., the slot on the read / write module 3 originally used for inserting ordinary IC cards).
[0044] In data monitoring module 2, the corresponding signal contacts of the second smart card slot SIM2 or CARD2 and the analog smart card SIM3 are electrically connected. When the analog smart card SIM3 is inserted into the read / write module 3 under test, and the smart card 4 under test is inserted into the second smart card slot SIM2 or CARD2, a complete signal path for monitoring the communication data between the read / write module 3 and the smart card 4 under test can be established.
[0045] Output connection component J1 is the interface used by data monitoring module 2 to connect to main control module 1. Its structure conforms to the form of a standard IC card edge connector. The shape and contact point arrangement of output connection component J1 are adapted to the first smart card slot CARD1.
[0046] Data monitoring module 2 is pluggably connected to the first smart card slot CARD1 of main control module 1 via its output connection component J1. Once the connection is established, the communication signals captured and processed by data monitoring module 2 can be transmitted to main control module 1 through this connection.
[0047] The main control chip U11 is configured to perform preset function tests on the smart card under test 4 through the function test module when the smart card under test 4 is set in the first smart card slot CARD1.
[0048] The main control chip U11 is also configured to monitor the communication data between the smart card under test 4 and the read / write module under test 3 through the data monitoring module 2 when the data monitoring module 2 is connected to the first smart card slot CARD1 and the smart card under test 4 is set in the second smart card slot SIM2 or CARD2.
[0049] Here, the main control chip U11 of the smart card multi-function test equipment is configured to support at least two main operating modes.
[0050] Direct Function Test Mode: When the smart card under test 4 is directly installed in the first smart card slot CARD1 of the main control module 1 (at this time, the data monitoring module 2 is not connected or is not used), the main control chip U11 performs preset function tests on the smart card under test 4 through its internally connected function test module. For example, voltage compatibility tests, anti-removal tests, power consumption tests, or direct read / write operations can be performed.
[0051] Data monitoring mode: When the data monitoring module 2 is connected to the first smart card slot CARD1 of the main control module 1 via its output connection component J1, and the smart card under test 4 is placed in the second smart card slot SIM2 or CARD2 of the data monitoring module 2 (while the analog smart card SIM3 of the data monitoring module 2 is connected to the external read / write module 3 under test), the main control chip U11 is configured to monitor the communication data between the smart card under test 4 and the read / write module under test through the data monitoring module 2. In this mode, the data monitoring module 2 is responsible for capturing and preprocessing the raw communication signals, and transmitting the processed signals to the main control chip U11 through the first smart card slot CARD1. After receiving these signals, the main control chip U11 decodes and analyzes them, and finally reconstructs the actual communication content between the smart card under test 4 and the read / write module 3 under test.
[0052] The smart card multi-functional testing device provided in this application embodiment achieves integrated testing functions and flexible operation modes through the specific structural design of the main control module 1 and the data monitoring module 2 and their ingenious connection method, providing an effective technical means for comprehensive testing and in-depth analysis of smart cards.
[0053] In one embodiment, reference is made to Figure 5 The data monitoring module 2 also includes a clock processing circuit; the input of the clock processing circuit is connected to the analog smart card SIM3 and the second smart card slot SIM2 or CARD2 respectively; the output of the clock processing circuit is connected to the main control chip U11 through the output connection component J1.
[0054] The clock processing circuit includes a connected tri-state buffer U5 and a frequency divider; the frequency divider is composed of multiple cascaded D-type flip-flops.
[0055] Here, the clock processing circuit is used to optimize the captured raw clock signal to improve the accuracy of data decoding by the subsequent main control chip U11.
[0056] The input terminals of the clock processing circuit are connected to the analog smart card SIM3 and the second smart card slot SIM2 or CARD2, respectively. The raw clock signal C_CLK generated by the read / write module under test 3 is introduced into the data monitoring module 2 through the analog smart card SIM3. Inside the data monitoring module 2, the raw clock signal C_CLK is connected to the C_CLK pin of the second smart card slot SIM2 or CARD2 to ensure that the smart card under test 4 located in the second smart card slot SIM2 or CARD2 can receive the correct clock signal for synchronous operation; on the other hand, the raw clock signal C_CLK also serves as the input signal source for the clock processing circuit.
[0057] The output of the clock processing circuit is connected to the main control chip U11 via output connection component J1. After processing the original clock signal, the clock processing circuit generates a down-frequency clock signal DT_CLK. The down-frequency clock signal is transmitted to the first smart card slot CARD1 of the main control module 1 through the corresponding contact of the output connection component J1 of the data monitoring module 2, and is finally received by the main control chip U11 in the main control module 1 for subsequent bit duration calculation and data decoding.
[0058] The clock processing circuit includes a connected tri-state buffer U5 and a frequency divider.
[0059] The input of the tri-state buffer U5 is connected to the C_CLK signal, which is used to perform preliminary level buffering and driving of the original clock signal to provide a stable, high-quality signal to the subsequent frequency divider.
[0060] The input of the frequency divider is connected to the output of the tri-state buffer U5. This frequency divider consists of multiple cascaded D-type flip-flops. Specifically, for example, four dual D-type flip-flop chips (U1, U2, U3, and U4) can be cascaded in series to form an eight-stage frequency divider, thereby achieving a 256-fold frequency division of the buffered clock signal. Each D-type flip-flop is configured in divide-by-two mode, using the output of the previous stage as the clock input of the next stage.
[0061] In one embodiment, reference is made to Figure 6 The data monitoring module 2 also includes a level conversion circuit; the input terminal of the level conversion circuit is connected to the analog smart card SIM3 and the second smart card slot SIM2 or CARD2 respectively; the output terminal of the level conversion circuit is connected to the main control chip U11 through the output connection component J1.
[0062] The level shifting circuit includes at least one buffer; the buffer's preset input high-level recognition range is 1.5V to 5.0V.
[0063] Here, the level conversion circuit is used to perform level adaptation and buffering of the captured original reset signal and original communication data signal to ensure that these signals can be correctly recognized by the main control chip U11 in the main control module 1 and are compatible with smart cards with different operating voltage levels.
[0064] The input terminals of the level conversion circuit are connected to the analog smart card SIM3 and the second smart card slot SIM2 or CARD2, respectively. Specifically, the original reset signal C_RST emitted by the read / write module under test 3 and the original communication data signal IO_Port transmitted bidirectionally between the read / write module under test 3 and the smart card under test 4 are both introduced into the data monitoring module 2 through the analog smart card SIM3. Inside the data monitoring module 2, the C_RST and IO_Port signals are connected to the C_RST and C_IO pins of the second smart card slot SIM2 or CARD2 to ensure that the smart card under test 4 located in the second smart card slot SIM2 or CARD2 can receive and send these signals; on the other hand, they also serve as the input signal source for the level conversion circuit.
[0065] The output of the level conversion circuit is connected to the main control chip U11 via output connection component J1. After processing the original reset signal and the original data signal, the level conversion circuit generates a standardized reset signal DT_RST and a standardized communication data signal DT_IO. These processed signals are transmitted to the first smart card slot CARD1 of the main control module 1 through the corresponding contacts of the output connection component J1 of the data monitoring module 2, and are finally received by the main control chip U11 in the main control module 1 for communication data decoding and protocol analysis.
[0066] The level conversion circuit includes at least one buffer. Separate buffers can be configured for the raw reset signal and the raw data signal. For example, a tri-state buffer U7 can be used to process the raw reset signal C_RST, and another tri-state buffer U6 can be used to process the raw communication data signal IO_Port.
[0067] The buffers have a preset input high-level recognition range of 1.5V to 5.0V. This means that these buffers can correctly identify and process signals from smart cards and read / write modules operating at logic levels of 1.8V (Class C cards), 3.0V (Class B cards), or 5.0V (Class A cards). Through this wide voltage range compatibility, the level conversion circuit can convert input signals of different levels into a unified logic level signal suitable for processing by the main control chip U11, while simultaneously buffering and driving the signal to enhance its driving capability and improve signal quality.
[0068] The level conversion circuit of the data monitoring module 2 provided in this application embodiment can effectively obtain signals from the original reset and data signal path shared by the analog smart card SIM3 and the second smart card slot SIM2 or CARD2. After level adaptation and driving through a buffer with wide voltage compatibility, the standardized signal is provided to the main control chip U11 through the output connection component J1, thereby enabling the entire test equipment to reliably monitor the communication data of various types of smart cards.
[0069] In one embodiment, refer to Figure 7 The main control module 1 also includes a contactless circuit connected to the main control chip U11; the contactless circuit includes a connected baseband chip U13 and an antenna; the first smart card slot CARD1 is used to install a contact smart card; the contactless circuit is used to connect the contactless smart card.
[0070] The baseband chip U13 is connected to the SPI bus of the main control chip U11; the baseband chip U13 has a pre-stored contactless communication protocol that conforms to a preset standard.
[0071] Here, the contactless circuitry is used for wireless communication and functional testing with the contactless smart card.
[0072] The contactless circuit includes a connected baseband chip U13 and an antenna.
[0073] The baseband chip U13 is used to handle tasks such as modulation and demodulation of underlying radio frequency signals and encoding and decoding of protocol frames.
[0074] The antenna is a radio frequency antenna consisting of the TX1 and TX2 pins connected to the baseband chip U13, used to transmit and receive electromagnetic waves required for communication with the contactless smart card. The specific shape and parameters of the antenna are designed according to the supported contactless standards (such as ISO / IEC 14443 Type A / B).
[0075] The first smart card slot, CARD1, is used to install contact smart cards for communication via physical contacts; while the contactless circuit is used to connect contactless smart cards for communication via wireless radio frequency fields.
[0076] The baseband chip U13 is connected to the SPI bus of the main control chip U11. The main control chip U11 communicates with the baseband chip U13 bidirectionally via the SPI signal lines (RC523_NSS, RC523_SCK, RC523_MISO, RC523_MOSI). The main control chip U11 sends configuration commands, read / write commands, etc., to the baseband chip U13 through the SPI bus, and receives status information and data read from the contactless smart card from the baseband chip U13.
[0077] Furthermore, the baseband chip U13 typically has pre-stored or is capable of executing contactless communication protocols conforming to preset standards. For example, the MFRC523 chip itself supports the low-level operations of contactless communication protocols such as ISO / IEC 14443 Type A / B. This means that the main control chip U11 does not need to handle complex RF modulation and demodulation and low-level protocol details; it only needs to send high-level commands via the SPI bus for the baseband chip U13 to complete the standardized communication with the contactless smart card.
[0078] The smart card multifunctional testing device provided in this application embodiment can not only perform comprehensive functional testing and data monitoring on contact smart cards, but also effectively test contactless smart cards, and has versatility and practical value.
[0079] In one embodiment, the functional test module includes an anti-pull-out test unit; the anti-pull-out test unit includes a first switching circuit connected to the first smart card slot CARD1, and a second switching circuit connected to the contactless circuit; the first switching circuit includes a transistor Q1, the emitter of transistor Q1 is connected to the main control chip U11, and the collector is connected to the first smart card slot CARD1; the second switching circuit includes a MOSFET Q5, the source of MOSFET Q5 is connected to the main control chip U11, and the drain is connected to the contactless circuit.
[0080] Here, the anti-pull-out test unit is used to simulate the situation where the smart card SIM3 is accidentally pulled out or disconnected during operation, in order to test the response and data integrity of the smart card and related systems.
[0081] The anti-pull-out test unit includes a first switch circuit connected to the first smart card slot CARD1 and a second switch circuit connected to the contactless circuit.
[0082] Reference Figure 3 The first switching circuit is mainly used to control the power supply to the contact smart card connected to the first smart card slot CARD1 of the main control module 1. The first switching circuit includes a transistor Q1. The emitter of transistor Q1 is connected to the main control chip U11, and the collector is connected to the power supply VCC pin of the first smart card slot CARD1. The main control chip U11 controls the conduction and cutoff states of this transistor Q1 (by controlling the base of the PNP transistor Q1 through control signals IC_PWR18 and IC_PWR33, thereby controlling its switching), which can quickly turn on or off the power supply to the contact smart card under test in the first smart card slot CARD1, thereby simulating the sudden power failure behavior when the card is removed.
[0083] Reference Figure 7The second switching circuit is mainly used to control the power supply to the radio frequency field or key parts of the contactless circuit of the main control module 1, to simulate the situation where the contactless smart card is removed from the sensing field or communication is suddenly interrupted. The second switching circuit includes a MOSFET Q5. The source of MOSFET Q5 is connected to the main control chip U11, and the drain is connected to the power supply or enable control terminal of the radio frequency part of the baseband chip U13 in the contactless circuit. The main control chip U11 controls the conduction and cutoff state of MOSFET Q5 (by controlling the gate of the P-type MOSFET Q5 through the control signal RC523_RF, thereby controlling its switching), which can quickly turn on or off the electromagnetic wave emission or its working state of the contactless circuit, thereby simulating the behavior of contactless smart card communication interruption.
[0084] In one embodiment, the functional test module includes a power consumption test unit; the power consumption test unit includes a sampling resistor connected in series with the first smart card slot CARD1, and a signal amplification circuit connected to both ends of the sampling resistor; the signal amplification circuit is connected to the analog-to-digital conversion interface of the main control chip U11.
[0085] Here, the power consumption test unit is used to accurately measure the current consumption of the contact smart card connected to the first smart card slot CARD1 of the main control module 1 when it is working, and then calculate its power consumption.
[0086] The power consumption test unit includes a sampling resistor connected in series with the first smart card slot CARD1 of the main control module 1, and a signal amplification circuit connected across the sampling resistor.
[0087] Specifically, the sampling resistor is connected in series in the ground path of the first smart card slot CARD1. When the contact smart card under test is inserted into the first smart card slot CARD1 and operates, all the current it consumes will flow through this sampling resistor. According to Ohm's law, when current flows through the resistor, a small voltage drop proportional to the magnitude of the current will be generated across its terminals.
[0088] Reference Figure 8 The signal amplification circuit is connected across the sampling resistor to capture and amplify this small voltage drop signal. The signal amplification circuit can be a differential or non-inverting amplifier structure with a specific amplification factor (e.g., approximately 19 times) constructed from an operational amplifier U18 and associated resistors (R36 and R37). The input of the signal amplification circuit is connected across the sampling resistor R3, and the output provides an amplified voltage signal.
[0089] The output of the signal amplification circuit is connected to the analog-to-digital converter (ADC) interface of the main control chip U11 in the main control module 1. The output signal AD_IN of the operational amplifier U18 is connected to the ADC input pin of the main control chip. The main control chip U11 periodically samples this amplified voltage signal through its built-in ADC module, converting it into a digital value. Based on the sampled digital voltage value, the known amplification factor, the precise resistance value of the sampling resistor, and the operating voltage of the smart card, the main control chip U11 calculates the instantaneous current and power consumption of the smart card under test 4 in different operating states.
[0090] In one embodiment, reference is made to Figure 9 The main control module 1 also includes a voltage regulator circuit; the voltage regulator circuit includes a linear regulator U15 connected in series and a third diode D3.
[0091] The voltage regulator circuit is configured to output an operating voltage suitable for different smart cards under test; the operating voltage range is 1.5V to 5.0V.
[0092] Here, the voltage regulator circuit is used to output multiple voltage levels to be compatible with contact smart cards of different standards (such as Class A, Class B, and Class C).
[0093] The voltage regulator circuit consists of a linear regulator U15 connected in series and a third diode D3.
[0094] For powering Class C (1.8V) smart cards, a linear regulator U15 with an output voltage slightly higher than the target voltage (e.g., 1.8V) can be used, with a third diode D3 connected in series with its output. The linear regulator U15 provides a preliminary stable voltage. The series-connected third diode D3 utilizes its forward voltage drop characteristic to further refine the final output voltage to the smart card (e.g., a 2V regulator output, after a voltage drop of approximately 0.2V through the diode, yields a voltage close to 1.8V), leaving a margin for the diode voltage drop to ensure the final operating voltage supplied to the Class C card reaches 1.8V. Furthermore, if a higher output voltage (e.g., 3.0V or 5.0V) is required, it can be achieved through other parallel voltage regulation paths or switching circuits. When supplying Class A or Class B cards, the third diode D3 also protects against reverse voltage flow into the low-voltage linear regulator U15.
[0095] The main control module 1's voltage regulation circuit, through the series-connected linear regulator U15 and the third diode D3, can provide a variety of operating voltage outputs covering the range of 1.5V to 5.0V. The power supply pin VCC of the first smart card slot CARD1 in the main control module 1 is applied to the smart card under test 4, thus meeting the operating voltage requirements of different types of contact smart cards, such as Class A (typically 5.0V), Class B (typically 3.0V), and Class C (typically 1.8V). The main control chip U11 can control the voltage regulation circuit to output the appropriate voltage level according to the type of smart card under test 4 or the testing requirements.
[0096] The main control module 1 of this application embodiment can provide a stable and compatible power supply for various smart cards 4 under test inserted into its first smart card slot CARD1.
[0097] In one embodiment, the main control module 1 further includes a communication interface connected to the main control chip U11; the main control module 1 is connected to the peripheral host computer through the communication interface.
[0098] The main control module 1 is configured to receive test commands sent by the host computer and return the test results to the host computer; the test commands include at least one of the following: anti-unplug test command, power consumption sampling test command, and data monitoring command.
[0099] Here, the communication interface is the physical and logical channel for data exchange between the main control module 1 and the peripheral host computer (such as a personal computer or a dedicated control terminal). The communication interface can be a standard serial communication interface, and the transmit and receive pins of the communication interface are connected to the corresponding serial communication pins (such as TXD, RXD) of the main control chip U11 of the main control module 1.
[0100] Through the communication interface, the main control module 1 can be connected to the peripheral host computer, so that the host computer can act as the initiator of test tasks and the display and storage platform for test results.
[0101] The main control module 1 is configured to receive test commands sent by the host computer and return the test results to the host computer. Specifically, the main control chip U11 uses its firmware to send, receive, and parse data from the communication interface. When the host computer sends predefined test commands to the main control module 1 through the communication interface, the main control chip U11 receives and parses these commands.
[0102] The test commands include at least one of the following: anti-unplug test command, power consumption sampling test command, and data monitoring command.
[0103] Specifically, after the host computer sends the anti-pull-out test command, the main control chip U11 will control the anti-pull-out test unit in the functional test module to perform the corresponding power or radio frequency field cut-off operation and record the test results.
[0104] After the host computer sends the power consumption sampling test command, the main control chip U11 will control the power consumption test unit in the functional test module to perform current sampling and power consumption calculation, and then send back the sampled data or calculation results.
[0105] After the host computer sends the data monitoring command, the main control chip U11 will configure itself to enter the data monitoring mode, receive and decode the signal from the data monitoring module 2, and send back the restored communication data.
[0106] After completing the corresponding test operations or data processing, the main control chip U11 will package the test results, collected data, or monitored communication content and send them back to the host computer through the communication interface. The accompanying software on the host computer can then display, store, analyze, or generate test reports from these results.
[0107] The smart card multifunctional testing device provided in this application embodiment can be easily remotely controlled and automated by a host computer, which significantly improves testing efficiency and data management capabilities, making it more suitable for complex R&D and production testing environments.
[0108] The smart card multi-functional testing device provided in this application, through the modular combination of a main control module and a data monitoring module, can realize card reading tests, anti-extraction tests, power consumption detection, and communication data monitoring for both contact and contactless smart cards. This improves the integration of testing functions and system adaptability, thereby effectively reducing the configuration complexity and usage cost of the testing device. Through the standard pluggable interface and simulated smart card signal processing structure set in the data monitoring module, communication data can be monitored synchronously without affecting the normal communication between the smart card under test and the reader / writer under test, thus ensuring the integrity and accuracy of the monitored data and improving the reliability of the test results. By setting up clock processing circuits and level conversion circuits, stable capture of high-speed communication signals and broad compatibility with multi-level smart card signals can be achieved, thereby improving the system's adaptability to different types of smart cards and significantly enhancing the practicality and engineering application value of the device.
[0109] The computer program product provided in this application includes a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the methods described in the preceding method embodiments. For specific implementation details, please refer to the method embodiments, which will not be repeated here.
[0110] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the system and apparatus described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.
[0111] Furthermore, in the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0112] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0113] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The scope of protection of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.
Claims
1. A multi-functional testing device for smart cards, characterized in that, include: The system includes a main control module and a data monitoring module. The main control module includes a main control chip, a first smart card slot connected to the main control chip, and a functional testing module. The data monitoring module includes a second smart card slot, an analog smart card, and an output connection component. The second smart card slot is connected to the analog smart card. The second smart card slot is used to install the smart card under test. The data monitoring module is pluggably connected to the first smart card slot via the output connection component; the simulated smart card is pluggably connected to the third smart card slot of the read / write module under test to establish a signal path for monitoring the communication data between the smart card under test and the read / write module under test. The main control chip is configured to perform preset function tests on the smart card under test through the function test module when the smart card under test is placed in the first smart card slot. The main control chip is also configured to, when the data monitoring module is connected to the first smart card slot and the smart card under test is placed in the second smart card slot, monitor the communication data between the smart card under test and the read / write module under test through the data monitoring module.
2. The smart card multi-functional testing device according to claim 1, characterized in that, The data monitoring module further includes a clock processing circuit; the input terminal of the clock processing circuit is connected to the analog smart card and the second smart card slot respectively; the output terminal of the clock processing circuit is connected to the main control chip through the output connection component. The clock processing circuit includes a connected tri-state buffer and a frequency divider; the frequency divider is composed of multiple cascaded D-type flip-flops.
3. The smart card multi-functional testing device according to claim 1, characterized in that, The data monitoring module further includes a level conversion circuit; the input terminal of the level conversion circuit is connected to the analog smart card and the second smart card slot respectively; the output terminal of the level conversion circuit is connected to the main control chip through the output connection component. The level conversion circuit includes at least one buffer; the preset input high level recognition range of the buffer is 1.5V to 5.0V.
4. The smart card multi-functional testing device according to claim 1, characterized in that, The main control module also includes a contactless circuit connected to the main control chip; the contactless circuit includes a connected baseband chip and an antenna; the first smart card slot is used to install a contact smart card; the contactless circuit is used to connect a contactless smart card. The baseband chip is connected to the SPI bus of the main control chip; the baseband chip has a pre-stored contactless communication protocol that conforms to a preset standard.
5. The smart card multi-functional testing device according to claim 4, characterized in that, The functional testing module includes an anti-pull-out testing unit; the anti-pull-out testing unit includes a first switching circuit connected to the first smart card slot and a second switching circuit connected to the contactless circuit; the first switching circuit includes a transistor, the emitter of which is connected to the main control chip and the collector of which is connected to the first smart card slot; the second switching circuit includes a MOSFET, the source of which is connected to the main control chip and the drain of which is connected to the contactless circuit.
6. The smart card multi-functional testing device according to claim 1, characterized in that, The functional testing module includes a power consumption testing unit; the power consumption testing unit includes a sampling resistor connected in series with the first smart card slot, and a signal amplification circuit connected across the sampling resistor; the signal amplification circuit is connected to the analog-to-digital conversion interface of the main control chip.
7. The smart card multifunctional testing device according to claim 1, characterized in that, The main control module also includes a voltage regulator circuit; the voltage regulator circuit includes a linear regulator connected in series and a third diode; The voltage regulator circuit is configured to output an operating voltage applicable to different smart cards under test; the operating voltage range is 1.5V to 5.0V.
8. The smart card multi-functional testing device according to claim 1, characterized in that, The simulated smart card includes a probe board; the probe board is provided with standard contact points that conform to a preset smart card standard, and the size of the probe board is suitable for insertion into the third smart card slot.
9. The smart card multifunctional testing device according to claim 1, characterized in that, The shape and contact point arrangement of the output connection component are adapted to the first smart card slot.
10. The smart card multi-functional testing device according to claim 1, characterized in that, The main control module also includes a communication interface connected to the main control chip; the main control module is connected to the peripheral host computer through the communication interface; The main control module is configured to receive test commands sent by the host computer and return the test results to the host computer; the test commands include at least one of anti-unplug test commands, power consumption sampling test commands, and data monitoring commands.