Vacuum device for etching equipment

Abstract

The utility model belongs to the technical field of semiconductor manufacturing, and discloses a vacuum device for etching equipment, which comprises a cavity upper cover, a reaction cavity, a supporting cavity and a connecting cavity, the cavity upper cover is in sealed connection with the reaction cavity, and the reaction cavity is in sealed connection with the supporting cavity; the reaction cavity is provided with a transmission port which is used for wafer in and out. A plurality of vacuumizing passages are vertically arranged in the supporting cavity, the reaction cavity is communicated with a connecting cavity through the vacuumizing passages, and the connecting cavity is used for a molecular pump; and the reaction cavity, the cavity upper cover, the bottom wafer chuck and the vacuumizing passage form a closed space. The modular vertical cavity design is adopted, splicing gaps are reduced, partial part replacement is achieved through modular quick disassembly, and the maintenance cost is reduced; the vacuum in the reaction chamber is not influenced by the disassembly of the supporting chamber part; the molecular pumps are vertically distributed, so that the flow stability of gas in the cavity can be maintained; the etching precision is further improved, and technical support is provided for semiconductor equipment.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a vacuum device for etching equipment. Background Technology

[0002] In semiconductor manufacturing processes, etching (ETCH) is a key step in constructing the microstructure of integrated circuits. Its core equipment relies on a highly stable vacuum chamber to maintain a low-pressure or vacuum environment, ensuring high precision and uniformity of plasma reactions. The structural design and reliability of the vacuum chamber directly affect etching accuracy and equipment lifespan.

[0003] While traditional vacuum chambers offer excellent sealing performance, they are costly to manufacture and lack maintenance flexibility. The entire chamber needs to be disassembled to replace damaged parts, resulting in downtime of up to 48 hours or more, which affects production line uptime. Furthermore, with the molecular pump mounted on the side, gas flows towards the molecular pump side during vacuuming, causing different gas flow velocities and uneven pressure distribution within the chamber. The pressure is lower near the molecular pump, which in turn affects flow stability. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a vacuum device for etching equipment. The technical solution adopted by this utility model is as follows:

[0005] A vacuum device for etching equipment includes a cavity cover, a reaction cavity, a support cavity, and a connecting cavity;

[0006] The cavity cover maintains a vacuum environment within the reaction chamber, and the cavity cover is sealed to the reaction chamber. The reaction chamber is used for etching reactions and is sealed to the support chamber. The reaction chamber has a transfer port for wafer entry and exit. The support chamber has a vertically arranged vacuum passage, and the reaction chamber is connected to a connecting chamber via the vacuum passage. The connecting chamber is used for a molecular pump. The reaction chamber, the cavity cover, the bottom wafer chuck, and the vacuum passage form a sealed space.

[0007] This invention adopts a modular vertical cavity design to reduce splicing gaps, and modular quick disassembly allows for the replacement time of local components to be less than 2 hours, thus reducing maintenance costs. The disassembly of various components in the supporting cavity does not affect the vacuum inside the reaction cavity. The molecular pump is placed at the bottom, and the vacuum is drawn by multiple vacuum channels. The gas flow direction is vertically downward, the flow is more uniform, and the pressure change is more balanced, which is conducive to the stability of the gas flow inside the cavity. The vertical distribution of the molecular pump is conducive to maintaining the stability of the gas flow inside the cavity.

[0008] Furthermore, the sidewall of the support cavity is provided with at least one cavity side opening; the cavity side opening is not interconnected with the vacuum passage.

[0009] The cavity side opening of the supporting cavity facilitates the installation of various cavity components and the lifting pin (PIN LIFT) assembly.

[0010] Furthermore, the support cavity is provided with a central receiving chamber, and the side opening of the cavity is connected through the central receiving chamber.

[0011] Furthermore, the cavity cover is connected to the reaction cavity by fasteners.

[0012] Furthermore, the reaction chamber is connected to the support chamber via fasteners.

[0013] Furthermore, the support cavity is connected to the connecting cavity by fasteners.

[0014] Furthermore, a sealing ring is provided between the cavity cover and the reaction cavity.

[0015] Furthermore, a sealing ring is provided between the reaction chamber and the support chamber.

[0016] Furthermore, a sealing ring is provided between the supporting cavity and the connecting cavity.

[0017] This invention proposes a vacuum device for etching equipment, which adopts a modular vertical cavity design to reduce splicing gaps, modular quick disassembly to realize partial component replacement, and reduces maintenance costs; the disassembly of the support cavity components does not affect the vacuum in the reaction chamber; the vacuum path is vertically distributed, which is conducive to maintaining the stability of gas flow inside the cavity; it can further improve etching accuracy and provide key technical support for semiconductor equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the vacuum device structure for the etching equipment of this utility model;

[0019] Figure 2 This is a cross-sectional view of the vacuum device for etching equipment of this utility model;

[0020] Figure 3 This is a longitudinal sectional view of the vacuum device for etching equipment of this utility model.

[0021] Explanation of markings in the diagram:

[0022] 1. Cavity top cover; 2. Reaction chamber; 3. Transfer port; 4. Cavity side opening; 5. Support chamber; 6. Connecting chamber; 7. Vacuum passage; 8. Middle receiving chamber; 9. Bottom wafer chuck. Detailed Implementation

[0023] To better understand the purpose, structure, and function of this utility model, a more detailed description of this utility model is provided below with reference to the accompanying drawings.

[0024] Example:

[0025] like Figures 1 to 3 As shown, this utility model discloses a vacuum device for etching equipment, including a cavity cover 1, a reaction chamber 2, a support chamber 5, and a connecting chamber 6. The cavity cover 1 is used to maintain a vacuum environment inside the reaction chamber 2. The reaction chamber 2 is a chamber used for etching reactions. A transfer port 3 is provided on the side wall of the reaction chamber 2 for wafer entry and exit. The transfer port is controlled by a slit valve to open and close. The support chamber 5 has a central receiving chamber 8, and the side wall of the support chamber 5 has at least one cavity side opening 4. In this embodiment, four cavity side openings 4 are provided, which are connected through the central receiving chamber 8. The central receiving chamber 8 is used to place the bottom wafer chuck 9 and part of the PIN. The LIFT mechanism; the support cavity 5 has multiple vertically arranged vacuum passages 7 inside, and in this embodiment there are four vacuum passages 7; the cavity side opening 4 is not connected to the vacuum passages 7; the reaction cavity 2, the cavity cover 1, the bottom wafer chuck 9 and the vacuum passages 7 form a sealed space for etching process; the connecting cavity 6 is used to install gate valves and molecular pumps.

[0026] Among them, sealing rings are provided between the cavity cover 1 and the reaction cavity 2, between the reaction cavity 2 and the support cavity 5, and between the support cavity 5 and the connecting cavity 6, and are connected by fasteners, which are bolts or screws.

[0027] This invention employs a modular vertical cavity design to reduce splicing gaps and enables quick disassembly, achieving a partial component replacement time of less than 2 hours and reducing maintenance costs. Disassembly of components within the support cavity 5 does not affect the vacuum within the reaction cavity 2. The cavity side opening 4 of the support cavity 5 facilitates the installation of various cavity components and the PIN LIFT mechanism. The molecular pump is placed at the bottom, and multiple vacuum channels provide evacuation, with the gas flow direction vertically downwards, resulting in more uniform flow and more balanced pressure changes, which is beneficial to the stability of gas flow within the cavity. The vertical distribution of the molecular pump helps maintain the stability of gas flow within the cavity, further improving etching accuracy and providing key technical support for semiconductor equipment.

[0028] It is understood that this utility model has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this utility model. Furthermore, under the teachings of this utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this utility model.

Claims

1. A vacuum device for etching equipment, characterized in that, Includes a cavity cover, a reaction cavity, a support cavity, and a connecting cavity; The cavity cover maintains a vacuum environment within the reaction chamber, and the cavity cover is sealed to the reaction chamber. The reaction chamber is used for etching reactions and is sealed to the support chamber. The reaction chamber has a transfer port for wafer entry and exit. The support chamber has multiple vertically arranged vacuum passages inside, and the reaction chamber is connected to a connecting chamber via these vacuum passages. The connecting chamber is used for a molecular pump. The reaction chamber, the cavity cover, the bottom wafer chuck, and the vacuum passages form a sealed space.

2. The vacuum device for etching equipment according to claim 1, characterized in that, The sidewall of the support cavity is provided with at least one cavity side opening, which is not interconnected with the vacuum passage.

3. The vacuum device for etching equipment according to claim 2, characterized in that, The support cavity has a central receiving chamber, and the side opening of the cavity is connected through the central receiving chamber.

4. The vacuum device for etching equipment according to claim 1, characterized in that, The cavity cover is connected to the reaction cavity by fasteners.

5. The vacuum device for etching equipment according to claim 1, characterized in that, The reaction chamber is connected to the support chamber by fasteners.

6. The vacuum device for etching equipment according to claim 1, characterized in that, The support cavity is connected to the connecting cavity by fasteners.

7. The vacuum device for etching equipment according to claim 1 or 4, characterized in that, A sealing ring is provided between the top cover of the cavity and the reaction cavity.

8. The vacuum device for etching equipment according to claim 1 or 5, characterized in that, A sealing ring is provided between the reaction chamber and the support chamber.

9. The vacuum device for etching equipment according to claim 1 or 6, characterized in that, A sealing ring is provided between the support cavity and the connecting cavity.

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