Electronic device

Abstract

The utility model discloses electronic equipment. The electronic equipment comprises a mainboard support; a circuit board; the decoration ring is provided with a protruding part, and the mainboard support is located between the circuit board and the decoration ring; and the protruding part is electrically connected with the circuit board through the flexible conductive carrier.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and specifically relates to an electronic device. Background Technology

[0002] As electronic devices continue to develop, the requirements for their imaging capabilities and appearance are becoming increasingly stringent. Camera modules in electronic devices are becoming larger, leading to a corresponding increase in the height and area of ​​the decorative rings. These decorative rings are made of metal and are increasingly positioned closer to the edges of the electronic devices. However, antennas are typically located at the edges of electronic devices, and the larger decorative rings would be placed too close to them. When a large metal decorative ring is near an antenna, it can introduce noise or reduce antenna efficiency, thus affecting the performance of the electronic device. Utility Model Content

[0003] This application aims to provide an electronic device that solves one of the problems in the related art where a large area of ​​metal decorative ring near the edge area of ​​the antenna of the electronic device will bring clutter or reduce the efficiency of the antenna.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] This application provides an electronic device, including: a motherboard bracket; a circuit board; a decorative ring having a protrusion, the motherboard bracket being located between the circuit board and the decorative ring; and a flexible conductive carrier, the protrusion being electrically connected to the circuit board via the flexible conductive carrier.

[0006] In embodiments of this application, the electronic device includes a motherboard bracket, a circuit board, a decorative ring, and a flexible conductive carrier.

[0007] The motherboard bracket is located between the circuit board and the decorative ring. The decorative ring has a protrusion.

[0008] The protrusion is electrically connected to the circuit board via a flexible conductive carrier; that is, the decorative ring is electrically connected to the circuit board via a flexible conductive carrier. It is understood that the circuit board has a ground, and the decorative ring can be electrically connected to the circuit board's ground via the flexible conductive carrier. When the decorative ring is electrically connected to the circuit board, the induced current flows into the circuit board's ground through the grounding path, and will not be coupled to the antenna at the edge of the electronic device through spatial radiation. This reduces clutter caused by the decorative ring being close to the antenna of the electronic device, ensuring antenna efficiency.

[0009] Understandably, the shape of the flexible conductive carrier is variable. This allows the fit dimensions with the protrusion to be adjusted by bending the flexible conductive carrier according to the position of the protrusion of the decorative ring. This enables the protrusion to be effectively electrically connected to the flexible conductive carrier. In other words, while meeting the usage requirements of the decorative ring being electrically connected to the circuit board through the flexible conductive carrier, the restrictions on the setting position of the protrusion of the decorative ring are reduced, making the processing and manufacturing of the decorative ring easier.

[0010] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0012] Figure 1 This is a schematic diagram of the first part of the structure of an electronic device according to the first embodiment of this application;

[0013] Figure 2 This is a schematic diagram of the second part of the structure of the electronic device according to the first embodiment of this application;

[0014] Figure 3 This is a schematic diagram of the third part of the electronic device according to the first embodiment of this application;

[0015] Figure 4 This is a schematic diagram of the first part of the structure of an electronic device according to the second embodiment of this application;

[0016] Figure 5 This is a schematic diagram of the second part of the structure of an electronic device according to the second embodiment of this application;

[0017] Figure 6 This is a schematic diagram of the third part of the electronic device according to the second embodiment of this application;

[0018] Figure 7 This is a schematic diagram of the first part of the structure of an electronic device according to the third embodiment of this application;

[0019] Figure 8 This is a schematic diagram of the second part of the structure of an electronic device according to the third embodiment of this application;

[0020] Figure 9 This is a schematic diagram of the third part of the structure of the electronic device according to the third embodiment of this application;

[0021] Figure 10 This is a schematic diagram of the first part of the structure of the electronic device according to the fourth embodiment of this application;

[0022] Figure 11 This is a schematic diagram of the second part of the electronic device according to the fourth embodiment of this application.

[0023] Figure label:

[0024] Figures 1 to 11 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0025] 10 Electronic device, 100 Motherboard bracket, 110 First through hole, 120 Second through hole, 200 Circuit board, 210 Third through hole, 300 Decorative ring, 310 Protrusion, 400 Flexible conductive carrier, 410 Conductive part, 420 Conductive cloth, 430 Second flexible circuit board, 500 Electronic component, 500a Flash lamp, 500b Camera, 600 Connection structure, 600a Connector, 600b Spring, 610 First connecting part, 620 Second connecting part, 630 Conductive sheet, 700 Conductive component, 800 Isolation part. Detailed Implementation

[0026] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0028] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] The following is combined with Figures 1 to 11 An electronic device 10 according to an embodiment of this application is described.

[0031] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, an electronic device 10 according to some embodiments of this application includes: a motherboard bracket 100; a circuit board 200; a decorative ring 300 having a protrusion 310, the motherboard bracket 100 being located between the circuit board 200 and the decorative ring 300; and a flexible conductive carrier 400, the protrusion 310 being electrically connected to the circuit board 200 via the flexible conductive carrier 400.

[0032] The electronic device 10 according to an embodiment of this application includes a motherboard bracket 100, a circuit board 200, a decorative ring 300, and a flexible conductive carrier 400.

[0033] The motherboard bracket 100 is located between the circuit board 200 and the decorative ring 300. The decorative ring 300 has a protrusion 310.

[0034] The protrusion 310 is electrically connected to the circuit board 200 via a flexible conductive carrier 400; that is, the decorative ring 300 is electrically connected to the circuit board 200 via the flexible conductive carrier 400. It is understood that the circuit board 200 has a ground, and the decorative ring 300 can be electrically connected to the ground of the circuit board 200 via the flexible conductive carrier 400. When the decorative ring 300 is electrically connected to the circuit board 200, the induced current flows into the ground of the circuit board 200 through the grounding path, and will not be coupled to the antenna at the edge of the electronic device 10 through spatial radiation. This reduces clutter caused by the decorative ring 300 being close to the antenna of the electronic device 10, thus ensuring antenna efficiency.

[0035] It is understandable that the shape of the flexible conductive carrier 400 is variable. In this way, the fitting size between the flexible conductive carrier 400 and the protrusion 310 can be adjusted by bending the flexible conductive carrier 400 according to the position of the protrusion 310 of the decorative ring 300. This allows the protrusion 310 to be effectively electrically connected to the flexible conductive carrier 400. That is, while meeting the usage requirements of the decorative ring 300 being electrically connected to the circuit board 200 through the flexible conductive carrier 400, the restrictions on the setting position of the protrusion 310 of the decorative ring 300 can be reduced, making it easier to process and manufacture the decorative ring 300.

[0036] For example, the flexible conductive carrier 400 has a conductive portion 410, and the protrusion 310 is electrically connected to the conductive portion 410.

[0037] Optionally, the electronic device 10 may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device), and a handheld game console, etc.

[0038] In some embodiments, such as Figure 1 As shown, the electronic device 10 further includes: an electronic component 500; a connection structure 600 disposed on the side of the circuit board 200 facing the motherboard bracket 100; the electronic component 500 is electrically connected to the circuit board 200 via a flexible conductive carrier 400 and the connection structure 600, or the electronic component 500 is electrically connected to the circuit board 200 via the connection structure 600; and the protrusion 310 is electrically connected to the circuit board 200 via the flexible conductive carrier 400 and the connection structure 600.

[0039] In this embodiment, the electronic device 10 further includes electronic components 500 and a connection structure 600.

[0040] The connection structure 600 is located on the side of the circuit board 200 facing the motherboard bracket 100, and the connection structure 600 is electrically connected to the circuit board 200.

[0041] Electronic component 500 is electrically connected to circuit board 200 via flexible conductive carrier 400 and connection structure 600. That is, flexible conductive carrier 400 connects electronic component 500 and connection structure 600, and is also electrically connected to the protrusion 310 of decorative ring 300. In other words, electronic component 500 and decorative ring 300 share flexible conductive carrier 400 for connection to circuit board 200. This arrangement, compared to connecting electronic component 500 and decorative ring 300 to circuit board 200 via different conductive carriers, reduces the number of grounding points, saves the area of ​​circuit board 200 that mates with it, and reduces product manufacturing costs. For example, circuit board 200 has a signal section and a ground section, connection structure 600 connects the signal section and ground section, electronic component 500 connects to the signal section and ground section of circuit board 200 via flexible conductive carrier 400 and connection structure 600, and decorative ring 300 connects to the ground section of circuit board 200 via flexible conductive carrier 400 and connection structure 600.

[0042] Alternatively, electronic component 500 can be electrically connected to circuit board 200 via connection structure 600; that is, electronic component 500 and circuit board 200 are electrically connected via connection structure 600. Specifically, electronic component 500 is connected to the ground and signal sections of circuit board 200 via connection structure 600.

[0043] Furthermore, the protrusion 310 is electrically connected to the circuit board 200 via the flexible conductive carrier 400 and the connection structure 600. Alternatively, the protrusion 310 is electrically connected to the connection structure 600 via the flexible conductive carrier 400, and the connection structure 600 is electrically connected to the circuit board 200. Specifically, the protrusion 310 is grounded to the circuit board 200 via the flexible conductive carrier 400 and the connection structure 600.

[0044] In some embodiments, the protrusion 310 is electrically connected to the portion of the flexible conductive carrier 400 facing the decorative ring 300.

[0045] In this embodiment, the mating structure of the protrusion 310 and the flexible conductive carrier 400 is further defined.

[0046] The protrusion 310 is electrically connected to the portion of the flexible conductive carrier 400 facing the decorative ring 300. The flexible conductive carrier 400 has a conductive portion 410 on the decorative side, and the protrusion 310 of the decorative ring 300 is electrically connected to the conductive portion 410. This configuration provides structural support for the protrusion 310 to be electrically connected to the circuit board 200 via the flexible conductive carrier 400. Exemplarily, the conductive portion 410 is an exposed copper portion.

[0047] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, the connection structure 600 has a first connection portion 610, and the protrusion 310 is electrically connected to the first connection portion 610 through a flexible conductive carrier 400, and is electrically connected to the circuit board 200 through the first connection portion 610.

[0048] In this embodiment, the cooperation relationship between the decorative ring 300, the flexible conductive carrier 400, and the connecting structure 600 is refined.

[0049] The connection structure 600 has a first connection portion 610, and the protrusion 310 is electrically connected to the first connection portion 610 via a flexible conductive carrier 400, and is also electrically connected to the circuit board 200 via the first connection portion 610. That is, the electrical connection method between the protrusion 310 and the circuit board 200 is defined.

[0050] For example, the connection structure 600 further includes a second connection portion 620. When the electronic component 500 is electrically connected to the circuit board 200 via the flexible conductive carrier 400 and the connection structure 600, the electronic component 500 is electrically connected to the first connection portion 610 and the second connection portion 620 via the flexible conductive carrier 400, and is also electrically connected to the circuit board 200 via the first connection portion 610 and the second connection portion 620.

[0051] The first connection part 610 is used to connect to the ground of the circuit board 200, and the second connection part 620 is used to connect to the signal part of the circuit board 200.

[0052] In some embodiments, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 10 As shown, electronic component 500 includes a flash 500a or a camera 500b.

[0053] In this embodiment, the types of electronic components 500 are defined.

[0054] Electronic component 500 includes a flash 500a or a camera 500b. That is, electronic component 500 includes a flash 500a, or electronic component 500 includes a camera 500b.

[0055] In some embodiments, such as Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 , Figure 8 and Figure 10As shown, the connection structure 600 includes a connector 600a or a spring 600b.

[0056] In this embodiment, the types of connection structures 600 are further defined.

[0057] The connection structure 600 includes a connector 600a or a spring 600b.

[0058] When the connection structure 600 includes connectors 600a, there are two connectors 600a. One connector 600a is electrically connected to the circuit board 200, and the other connector 600a is electrically connected to the flexible conductive carrier 400. Each connector 600a has a first connecting portion 610 and a second connecting portion 620. The first connecting portions 610 of the two connectors 600a are connected, and the second connecting portions 620 of the two connectors 600a are connected.

[0059] When the connection structure 600 includes a spring 600b, there are two springs 600b. One spring 600b forms the first connection portion 610, and the other spring 600b forms the second connection portion 620. One spring 600b is connected to the ground of the circuit board 200, and the other spring 600b is connected to the signal portion of the circuit board 200. The electronic component 500 is connected to the two springs 600b via a flexible conductive carrier 400. The first spring 600b is electrically connected to the signal portion of the circuit board 200, and the second spring 600b is connected to the ground of the circuit board 200. The decorative ring 300 is connected to the second spring 600b via the flexible conductive carrier 400. This arrangement can meet the data transmission requirements between the electronic component 500 and the circuit board 200, and also meet the grounding requirements of the decorative ring 300.

[0060] For example, the first connecting part 610 is soldered to the circuit board 200, and the second connecting part 620 is soldered to the circuit board 200.

[0061] For example, the flexible conductive carrier 400 is welded to the first connecting portion 610, and the flexible conductive carrier 400 is welded to the second connecting portion 620.

[0062] In some embodiments, when the connection structure 600 includes a connector 600a, the first connection portion 610 is the ground pin of the connector 600a.

[0063] In this embodiment, when the connection structure 600 includes a connector 600a, the first connection portion 610 is the grounding pin of the connector 600a, and the grounding pin is connected to the ground of the circuit board 200. When the decorative ring 300 is electrically connected to the ground of the circuit board 200, the induced current flows into the ground of the circuit board 200 through the grounding path, and will not be coupled to the antenna at the edge of the electronic device 10 through spatial radiation. In this way, the noise caused by the decorative ring 300 being close to the antenna of the electronic device 10 can be reduced, and the efficiency of the antenna can be guaranteed.

[0064] In some embodiments, such as Figure 2 and Figure 6 As shown, a conductive element 700 is provided between the protrusion 310 and the flexible conductive carrier 400.

[0065] In this embodiment, the structure of the electronic device 10 is further defined such that the electronic device 10 also includes a conductive element 700.

[0066] The conductive element 700 is electrically connected to the protrusion 310, and the conductive element 700 is also electrically connected to the flexible conductive carrier 400. That is, the decorative ring 300 and the flexible conductive carrier 400 are electrically connected through the conductive element 700.

[0067] It is understandable that the conductive element 700 abuts against the protrusion 310, which can meet the usage requirements of the decorative ring 300 and the circuit board 200 for electrical connection, and also has the function of buffering the external force acting on the circuit board 200. This setting has the function of protecting the circuit board 200 and the flexible conductive carrier 400.

[0068] For example, the conductive element 700 includes any one or a combination of the following: conductive foam, conductive spring, and conductive rubber. This arrangement not only meets the usage requirements for electrical connection between the decorative ring 300 and the circuit board 200, but also buffers external forces acting on the circuit board 200.

[0069] In some embodiments, such as Figure 6 , Figure 8 and Figure 10 As shown, the flexible conductive carrier 400 is folded along the edge of the motherboard bracket 100 to the side of the motherboard bracket 100 facing the decorative ring 300.

[0070] In this embodiment, the mating structure of the flexible conductive carrier 400, the main board bracket 100, and the decorative ring 300 is defined.

[0071] The motherboard bracket 100 has a first end face and a second end face. The first end face is located between the second end face and the decorative ring 300. The circuit board 200 is disposed on the second end face of the motherboard bracket 100.

[0072] A portion of the flexible conductive carrier 400 extends from the second end face, bending around the side of the motherboard bracket 100, to the first end face. The portion of the flexible conductive carrier 400 located on the first end face is provided with a conductive portion 410. The portion of the flexible conductive carrier 400 located on the second end face is connected to the signal portion and ground.

[0073] This arrangement allows a portion of the flexible conductive carrier 400 to be bent to meet the electrical connection requirements between the decorative ring 300 and the circuit board 200. Simultaneously, this arrangement also meets the electrical connection requirements between the electronic component 500 and the circuit board 200, and facilitates data exchange between them.

[0074] Meanwhile, the portion where the flexible conductive carrier 400 connects to the decorative ring 300 is connected to the motherboard bracket 100, which supports and fixes the flexible conductive carrier 400. Therefore, the motherboard bracket 100 not only supports and fixes the circuit board 200, but also supports and fixes the flexible conductive carrier 400. In other words, by reusing the structure of the motherboard bracket 100, while ensuring the dimensional fit between the circuit board 200, decorative ring 300, electronic components 500, and flexible conductive carrier 400, the material input for installing and fixing the flexible conductive carrier 400 is reduced, which helps to lower the product's production cost.

[0075] For example, the flexible conductive carrier 400 is bonded to the motherboard bracket 100.

[0076] In some embodiments, such as Figure 2 As shown, a portion of the flexible conductive carrier 400 is disposed on the side of the motherboard bracket 100 facing the decorative ring 300, and another portion of the flexible conductive carrier 400 passes through the motherboard bracket 100 and is disposed on the side of the motherboard bracket 100 facing the circuit board 200.

[0077] In this embodiment, the mating structure of the flexible conductive carrier 400, the main board bracket 100, and the decorative ring 300 is defined.

[0078] A portion of the flexible conductive carrier 400 is disposed on the side of the motherboard bracket 100 facing the decorative ring 300, and another portion of the flexible conductive carrier 400 passes through the motherboard bracket 100 and is disposed on the side of the motherboard bracket 100 facing the circuit board 200.

[0079] This arrangement allows a portion of the flexible conductive carrier 400 to be bent to meet the electrical connection requirements between the decorative ring 300 and the circuit board 200. Simultaneously, this arrangement also meets the electrical connection requirements between the electronic component 500 and the circuit board 200, and facilitates data exchange between them.

[0080] Meanwhile, the portion where the flexible conductive carrier 400 connects to the decorative ring 300 is connected to the motherboard bracket 100, which supports and fixes the flexible conductive carrier 400. Therefore, the motherboard bracket 100 not only supports and fixes the circuit board 200, but also supports and fixes the flexible conductive carrier 400. In other words, by reusing the structure of the motherboard bracket 100, while ensuring the dimensional fit between the circuit board 200, decorative ring 300, electronic components 500, and flexible conductive carrier 400, the material input for installing and fixing the flexible conductive carrier 400 is reduced, which helps to lower the product's production cost.

[0081] For example, the flexible conductive carrier 400 is bonded to the motherboard bracket 100.

[0082] In some embodiments, such as Figure 2 As shown, electronic component 500 is located on the side of motherboard bracket 100 facing decorative ring 300. Alternatively, as... Figure 8 As shown, the motherboard bracket 100 has a first through hole 110, through which electronic components 500 pass toward the decorative ring 300; or, as Figure 6 and Figure 10 As shown, the motherboard bracket 100 has a second through hole 120, and the circuit board 200 has a third through hole 210. The second through hole 120 and the third through hole 210 are arranged opposite to each other. Electronic components 500 pass through the second through hole 120 and the third through hole 210 and are arranged towards the decorative ring 300.

[0083] In this embodiment, the placement position of the electronic component 500 is defined.

[0084] Specifically, the electronic component 500 is located on the side of the motherboard bracket 100 facing the decorative ring 300. That is, the motherboard bracket 100 has the function of supporting the electronic component 500. The structure of the motherboard bracket 100 is reused, reducing the material input for installing and fixing the electronic component 500, which helps to reduce the production cost of the product.

[0085] Specifically, the motherboard bracket 100 has a first through hole 110 through which electronic components 500 pass and are positioned towards the decorative ring 300. The first through hole 110 serves to avoid obstructing the electronic components 500. In other words, by making reasonable use of the existing structure of the motherboard bracket 100, it is beneficial to reduce the overall size of the electronic device 10.

[0086] Specifically, the motherboard bracket 100 has a second through hole 120, and the circuit board 200 has a third through hole 210. The second through hole 120 and the third through hole 210 are arranged opposite to each other and are connected. Electronic components 500 pass through the second through hole 120 and the third through hole 210 and are positioned towards the decorative ring 300. The second through hole 120 and the third through hole 210 serve to avoid obstructing the electronic components 500. That is, by making reasonable use of the existing structure of the motherboard bracket 100 and the circuit board 200, it is beneficial to reduce the overall size of the electronic device 10.

[0087] For example, the flexible conductive carrier 400 includes a first flexible circuit board. Electronic components 500 are connected to a first connecting portion 610 and a second connecting portion 620 through a first portion of the first flexible circuit board. A decorative ring 300 is connected to the first connecting portion 610 through a second portion of the first flexible circuit board. The first flexible circuit board is provided with conductive portions 410, that is, the first flexible circuit board serves as a mounting carrier for conductive portions 410, and has the function of mounting and fixing conductive portions 410.

[0088] The first flexible circuit board has a first portion and a second portion. Electronic component 500 is connected to a first connecting portion 610 and a second connecting portion 620 via the first portion of the first flexible circuit board, and decorative ring 300 is connected to the first connecting portion 610 via the second portion of the first flexible circuit board. That is, the first portion of the first flexible circuit board serves to connect the electronic component 500, the first connecting portion 610, and the second connecting portion 620. The second portion of the first flexible circuit board serves to connect the decorative ring 300 and the second connecting portion 620.

[0089] The first portion and the second portion of the first flexible circuit board are two relatively independent parts of the first flexible circuit board. That is, the portion of the first flexible circuit board used to connect with the decorative ring 300 and the first connecting portion 610 is different from the portion used to connect with the electronic component 500, the first connecting portion 610, and the second connecting portion 620. The first flexible circuit board connects the decorative ring 300 and the first connecting portion 610 through an independent routing area (i.e., the second portion of the first flexible circuit board), thereby enabling an independent connection between the decorative ring 300 and the ground of the circuit board 200. This arrangement facilitates the connection of the decorative ring 300 to ground nearby, shortening the return path, ensuring the reliability of the grounding of the decorative ring 300, and simultaneously reducing mutual interference between signals.

[0090] Furthermore, the electronic component 500 is connected to the first connecting portion 610 and the second connecting portion 620 via the first part of the first flexible circuit board, and the decorative ring 300 is connected to the first connecting portion 610 via the second part of the first flexible circuit board. That is, the electronic component 500 and the decorative ring 300 share the first connecting portion 610 with the ground connection of the circuit board 200. Compared to having two first connecting portions 610, where the electronic component 500 is connected to one of the first connecting portions 610 via the first part of the first flexible circuit board, and the decorative ring 300 is connected to the other first connecting portion 610 via the second part of the first flexible circuit board, this arrangement allows the decorative ring 300 to reuse the first connecting portion 610 of the electronic component 500, saving one first connecting portion 610 and reducing the connection area between the circuit board 200 and the connecting structure 600. This helps reduce the processing difficulty and production cost of the product.

[0091] For example, such as Figure 10 As shown, the flexible conductive carrier 400 includes: a second flexible circuit board 430, through which electronic components 500 are connected to a first connecting portion 610 and a second connecting portion 620; and a conductive cloth 420, which has conductive portions 410, through which a decorative ring 300 is connected to the first connecting portion 610. The second flexible circuit board 430 and the conductive cloth 420 are two relatively independent structures. The decorative ring 300 is connected to the first connecting portion 610 through an independent conductive cloth 420, thereby enabling an independent connection between the decorative ring 300 and the ground of the circuit board 200. This arrangement facilitates the connection of the decorative ring 300 to the ground nearby, shortening the return path, ensuring the reliability of the grounding of the decorative ring 300, and reducing mutual interference between signals.

[0092] Furthermore, the electronic component 500 is connected to the first connecting part 610 and the second connecting part 620 via the second flexible circuit board 430, and the decorative ring 300 is connected to the first connecting part 610 via the conductive cloth 420. That is, the electronic component 500 and the decorative ring 300 share the first connecting part 610 with the ground connection of the circuit board 200. Compared to having two first connecting parts 610, where the electronic component 500 is connected to one of the first connecting parts 610 via the second flexible circuit board 430 and the decorative ring 300 is connected to the other first connecting part 610 via the conductive cloth 420, this arrangement allows the decorative ring 300 to reuse the first connecting part 610 of the electronic component 500, saving one first connecting part 610 and reducing the connection area between the circuit board 200 and the connecting structure 600. This helps reduce the processing difficulty and production cost of the product.

[0093] For example, such as Figure 2As shown, the electronic device 10 further includes an isolation section 800, which is located between the first connecting section 610 and the second connecting section 620. The isolation section 800 serves to isolate the first connecting section 610 and the second connecting section 620, providing structural support to meet the safety requirements for the use of the electronic device 10. Exemplarily, the isolation section 800 includes a plastic isolation section 800.

[0094] For example, the decorative ring 300 is a metal ring. The flexible conductive carrier 400 is provided with a conductive part 410, which is a copper structure, or the conductive cloth 420 is provided with a conductive part 410. The decorative ring 300 contacts the conductive part 410, which can reduce the number of grounding springs on the circuit board 200 and / or reduce the number of spot welding springs 600b, thereby shortening the return current path and improving the grounding effect.

[0095] For example, such as Figures 1 to 3 As shown, by merging the ground of the first flexible circuit board with the grounding point of the decorative ring 300 on the circuit board 200, the design of one grounding point is reduced, saving the design area of ​​the circuit board 200.

[0096] For example, the decorative ring 300 is provided with a protrusion 310, which contacts the conductive part 410 of the flexible conductive carrier 400 on the motherboard bracket 100 to achieve grounding.

[0097] For example, the flexible conductive carrier 400 is provided with a conductive portion 410, such as an exposed copper area, that is, an independent exposed copper area on the flexible conductive carrier 400. Conductive foam or a spring piece 600b can be attached to the conductive portion 410 and then connected to the protrusion 310 of the decorative ring 300. The decorative ring 300 is the decorative ring 300 of the camera 500b.

[0098] For example, the flexible conductive carrier 400 includes a first flexible circuit board. Electronic components 500 are connected to a first connecting portion 610 and a second connecting portion 620 through a first portion of the first flexible circuit board. A decorative ring 300 is connected to the first connecting portion 610 through a second portion of the first flexible circuit board. That is, the second portion of the first flexible circuit board separately connects the first connecting portion 610 and the conductive portion 410, thereby achieving an independent connection between the conductive portion 410 and the circuit board 200.

[0099] For example, the electronic device 10 also includes an isolation portion 800, which is a plastic part. The isolation portion 800 serves to isolate the connection between the first connection portion 610 and the second connection portion 620.

[0100] For example, a conductive element 700 is provided between the conductive portion 410 and the protrusion 310 of the decorative ring 300 to achieve electrical connection. The conductive element 700 includes conductive foam or a spring 600b, which can be soldered to the conductive portion 410.

[0101] For example, the conductive part 410 is connected to the first connection part 610 via a separate trace of the flexible conductive carrier 400, and the first connection part 610 is connected to the ground of the circuit board 200. Figure 2 As shown, the dashed arrows indicate the grounding path. Grounding path: protrusion 310 of decorative ring 300 → conductive part 410 (conductive part 410 includes conductive foam and / or spring 600b) → second part of the first flexible circuit board → first connection part 610 of the first connector → ground of circuit board 200. This arrangement reuses the first connection part 610 of the first connector of flash lamp 500a, saves the grounding area of ​​a grounding spring, has low grounding cost, allows for nearby grounding on flexible conductive carrier 400, has a short return path, and ensures reliable grounding. A portion of flexible conductive carrier 400 is disposed on the side of motherboard bracket 100 facing decorative ring 300, and another portion of flexible conductive carrier 400 passes through motherboard bracket 100 and is disposed on the side of motherboard bracket 100 facing circuit board 200. The connection structure 600 includes a connector 600a, which includes a first connecting portion 610 and a second connecting portion 620. The first connecting portion 610 is used for ground connection with the circuit board 200, and the second connecting portion 620 is used for connection with the signal section of the circuit board 200. The connector 600a is located between the flexible conductive carrier 400 and the circuit board 200. The flexible conductive carrier 400 is located between the flash lamp 500a and the motherboard bracket 100, and a decorative ring 300 is disposed around the flash lamp 500a. The flash lamp 500a is electrically connected to the circuit board 200 through the flexible conductive carrier 400 and the connection structure 600. A conductive portion 410 is provided on the portion of the flexible conductive carrier 400 on the side of the motherboard bracket 100 facing the decorative ring 300, and the protrusion 310 of the decorative ring 300 is electrically connected to the conductive portion 410.

[0102] For example, this application electrically connects the protrusion 310 of the decorative ring 300 to the exposed copper area (i.e., conductive portion 410) of the folded flexible conductive carrier 400 by folding the flexible conductive carrier 400. The grounding spring of the protrusion 310 of the decorative ring 300 on the circuit board 200 is merged with the first connection portion 610 of the first connector of the camera 500b, saving the grounding area of ​​one spring 600b. Figures 4 to 6As shown, camera 500b is connected to a first connection portion 610 and a second connection portion 620 of connector 600a via a flexible conductive carrier 400. This connector 600a is referred to as the first connector. The first connector is responsible for connecting the camera 500b circuit module on the circuit board 200. The first connector is connected to the flexible conductive carrier 400 by soldering. Electronic device 10 also includes a conductive component 700, which is adhered to the flexible conductive carrier 400 by double-sided adhesive. The flexible conductive carrier 400 includes a first flexible circuit board, which has a two-layer circuit board 200 structure. The first flexible circuit board has signal traces for camera 500b and ground, etc. The first connector is soldered onto the first flexible circuit board. A portion of the first flexible circuit board is folded over, and a conductive portion 410 is provided on the folded portion (i.e., the second portion of the first flexible circuit board). This second portion of the first flexible circuit board is connected to the first connection portion 610 of the first connector. The first connection portion 610 of the first connector is then connected to the ground of the circuit board 200, thereby achieving independent connection between the conductive portion 410 and the ground of the circuit board 200. Conductive foam is provided between the conductive part 410 and the protrusion 310 of the decorative ring 300 to achieve electrical connection. Alternatively, the conductive foam can be replaced with a spring 600b, which is soldered to the conductive part 410. The second part of the first flexible circuit board extends in the opposite direction and folds over the main board bracket 100. The exposed copper area on the first flexible circuit board (i.e., the conductive part 410) is connected separately to the first connection part 610 of the first connector. Grounding path: protrusion 310 of the decorative ring 300 → conductive part 410 (conductive part 410 includes conductive foam and / or spring 600b) → second part of the first flexible circuit board → first connection part 610 of the first connector → ground of the circuit board 200. The first connection part 610 of the first connector of the camera 500b is reused, saving the design area of ​​one spring 600b. Grounding is carried out nearby on the first flexible circuit board, the return path is short, and the grounding is reliable. The motherboard bracket 100 has a second through hole 120, and the circuit board 200 has a third through hole 210. The second through hole 120 and the third through hole 210 are arranged opposite to each other. The camera 500b passes through the second through hole 120 and the third through hole 210 and is positioned towards the decorative ring 300. The connector 600a is located between the circuit board 200 and the flexible conductive carrier 400.

[0103] For example, such as Figures 7 to 9As shown, the connection structure 600 is located between the flexible conductive carrier 400 and the circuit board 200. The connection structure 600 has a first connection portion 610 and a second connection portion 620, both of which are spring contacts. The first connection portion 610 is used for ground connection with the circuit board 200, and the second connection portion 620 is used for connection with the signal section of the circuit board 200. The flexible conductive carrier 400 includes a first flexible circuit board. The flash lamp 500a is connected to the first connection portion 610 and the second connection portion 620 through a first portion of the first flexible circuit board. The decorative ring 300 is connected to the first connection portion 610 through a second portion of the first flexible circuit board. A conductive portion 410 is provided on the portion of the flexible conductive carrier 400 located on the side of the motherboard bracket 100 facing the decorative ring 300. The protrusion 310 of the decorative ring 300 is electrically connected to the conductive portion 410. The motherboard bracket 100 has a first through hole 110, through which the flash lamp 500a passes towards the decorative ring 300. Specifically, the second part of the first flexible circuit board is folded from the side of the main board bracket 100, passes through the main board bracket 100, and exposes copper (i.e., conductive part 410) on the side facing the decorative ring 300, contacting the protrusion 310 of the decorative ring 300. A separate ground wire is designed on the first flexible circuit board, contacting the grounding spring (i.e., the first connecting part 610). This grounding spring is used for grounding the decorative ring 300, separating it from other grounds on the first flexible circuit board, thus achieving the goal of minimizing the grounding path for the decorative ring 300. The conductive element 700 is a spring, with a spring force guaranteed to be above 100g. The upward spring force of the spring 600b is sufficient to ensure that the exposed copper of the first flexible circuit board makes full contact with the protrusion 310 of the decorative ring 300, forming a reliable grounding point. This application shortens the ground return path, reuses the spring contact 600b of the flash lamp 500a (i.e., the first connecting part 610), reduces the space occupied on the circuit board 200, and allows for closer grounding on the first flexible circuit board. The short return path also reuses the mechanism of the motherboard bracket 100, using the motherboard bracket 100 to support the second part of the first flexible circuit board. Among these features, Figure 8 The dashed arrow in the diagram indicates the grounding path.

[0104] For example, such as Figure 10 and Figure 11As shown, the motherboard bracket 100 has a second through hole 120, and the circuit board 200 has a third through hole 210. The second through hole 120 and the third through hole 210 are arranged opposite to each other. The camera 500b passes through the second through hole 120 and the third through hole 210 and is positioned towards the decorative ring 300. The flexible conductive carrier 400 includes a second flexible circuit board 430 and a conductive cloth 420. The connection structure 600 includes a connector 600a, which includes a first connecting part 610 and a second connecting part 620. The first connecting part 610 is used for ground connection with the circuit board 200, and the second connecting part 620 is used for signal connection with the circuit board 200. The connector 600a is located between the circuit board 200 and the conductive cloth 420. The camera 500b is connected to the first connecting part 610 and the second connecting part 620 through the second flexible circuit board 430. The conductive cloth 420 has a conductive part 410, and the decorative ring 300 is connected to the first connecting part 610 through the conductive cloth 420. Specifically, the conductive cloth 420 is folded over, with one side connected to the steel sheet (i.e., conductive sheet 630) of connector 600a, and the other side folded over to the top of the motherboard bracket 100. The portion of the conductive cloth 420 above the motherboard bracket 100 has a conductive part 410, which contacts the protrusion 310 of the decorative ring 300, forming a nearby grounding point. This arrangement increases the contact area between the protrusion 310 of the decorative ring 300 and the conductive cloth 420, ensuring sufficient grounding. This application reuses the spring contact 600b (i.e., the first connecting part 610) of the camera 500b, without occupying space on the circuit board 200. It is grounded nearby on the flexible conductive carrier 400, resulting in a short return path. The motherboard bracket 100 is reused, and the conductive cloth 420 is supported by the motherboard bracket 100.

[0105] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0106] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: Motherboard bracket; Circuit board; A decorative ring having a protrusion, and a motherboard bracket located between the circuit board and the decorative ring; A flexible conductive carrier, wherein the protrusion is electrically connected to the circuit board via the flexible conductive carrier.

2. The electronic device according to claim 1, characterized in that, Also includes: Electronic components; A connection structure is provided on the side of the circuit board facing the motherboard bracket; The electronic components are electrically connected to the circuit board via the flexible conductive carrier and the connection structure, or the electronic components are electrically connected to the circuit board via the connection structure. The protrusion is electrically connected to the circuit board via the flexible conductive carrier and the connection structure.

3. The electronic device according to claim 2, characterized in that, The connection structure has a first connection portion, and the protrusion is electrically connected to the first connection portion through the flexible conductive carrier, and is also electrically connected to the circuit board through the first connection portion.

4. The electronic device according to claim 2, characterized in that, The electronic components include a flash or a camera.

5. The electronic device according to claim 3, characterized in that, The connection structure includes a connector or a spring.

6. The electronic device according to claim 5, characterized in that, When the connection structure includes the connector, the first connection portion is the ground pin of the connector.

7. The electronic device according to claim 1 or 2, characterized in that, A conductive element is present between the protrusion and the flexible conductive carrier.

8. The electronic device according to claim 1 or 2, characterized in that, The flexible conductive carrier is folded along the edge of the motherboard bracket to the side of the motherboard bracket facing the decorative ring; or A portion of the flexible conductive carrier is disposed on the side of the motherboard bracket facing the decorative ring, and another portion of the flexible conductive carrier passes through the motherboard bracket and is disposed on the side of the motherboard bracket facing the circuit board.

9. The electronic device according to claim 8, characterized in that, The protrusion is electrically connected to the portion of the flexible conductive carrier facing the decorative ring.

10. The electronic device according to claim 2, characterized in that, The electronic components are located on the side of the motherboard bracket facing the decorative ring; or The motherboard bracket has a first through hole, through which the electronic components are disposed facing the decorative ring; or The motherboard bracket has a second through hole, and the circuit board has a third through hole. The second through hole and the third through hole are arranged opposite to each other. The electronic components pass through the second through hole and the third through hole and are arranged towards the decorative ring.

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