Carrying and conveying equipment for wafer semiconductors

Abstract

The utility model discloses carrying and conveying equipment for wafer semiconductors, which belongs to the technical field of wafer semiconductor carrying and comprises a conveyor and a clamping mechanism, an industrial robot is arranged at the rear end of the conveyor, and the clamping mechanism comprises a placing frame fixedly connected to the upper end of the surface of the industrial robot. And the inner bottom wall of the placing frame is fixedly connected with a first servo motor. Through the mode, the placing frame, the first servo motor, the driving wheel and the driving block are matched with each other, then the two clamping frames are driven to get close to each other, the two abutting blocks abut against the surface of a wafer semiconductor, the bottom end of the wafer semiconductor is supported through the clamping frames, and the stability of wafer semiconductor carrying is guaranteed; thus, the two abutting blocks flexibly clamp the wafer semiconductor, damage to the wafer semiconductor in the clamping and carrying process is avoided, and the carrying and conveying effect of the wafer semiconductor is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wafer semiconductor handling technology, and specifically to a handling and conveying device for wafer semiconductors. Background Technology

[0002] Semiconductor wafers are the core basic material for semiconductor manufacturing. They refer to circular thin films made of high-purity semiconductor materials such as silicon, used to manufacture integrated circuits (ICs) and other microelectronic devices. After manufacturing, semiconductor wafers are usually transported to testing equipment using handling and conveying equipment for testing.

[0003] According to the search, the Chinese patent "A robotic arm for easy transfer of workpieces" authorized announcement number "CN221391108U" uses a rotating arm, a limiting shaft, a limiting cylinder and a limiting groove to work together to press a pneumatic suction cup down onto the center of the top of the wafer semiconductor and vacuum adsorb it, thereby facilitating the transfer of the wafer semiconductor to the warp test equipment for testing.

[0004] In the aforementioned application, due to the limited contact area between the pneumatic chuck and the wafer semiconductor, the vacuum adsorption of the pneumatic chuck at the center of the top of the wafer semiconductor can easily lead to local stress concentration, which in turn can easily cause deformation of the wafer semiconductor surface, thereby affecting the handling and transport effect of the wafer semiconductor.

[0005] Based on this, the present invention designs a handling and conveying device for wafer semiconductors to solve the above problems. Utility Model Content

[0006] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a handling and conveying device for wafer semiconductors.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A wafer semiconductor handling and conveying device includes a conveyor with an industrial robot at its rear end and a gripping mechanism. The gripping mechanism includes a placement frame fixedly connected to the upper surface of the industrial robot. A first servo motor is fixedly connected to the inner bottom wall of the placement frame. A drive wheel is fixedly connected to the output shaft of the first servo motor. Two drive blocks are hinged to the top of the drive wheel. A clamp is hinged to the inner wall of the drive blocks. A storage frame is fixedly connected to one side of the clamp. The storage frame stores gas. A one-way gas outlet pipe is connected to one side of the storage frame. A stop block is slidably connected to the inner wall of the storage frame. A pressure sensor is fixedly connected to one side of the inner wall of the storage frame.

[0009] Furthermore, a spring is fixedly connected to one side of the abutment block, and the other end of the spring is fixedly connected to one side of the inner wall of the storage frame. A one-way air inlet pipe is connected to one side of the storage frame.

[0010] Furthermore, the surface of the placement frame is fixedly connected with three guide rods, which are arranged in a ring.

[0011] Furthermore, two ball bearings are tumblingly connected to the lower end of the guide rod surface.

[0012] Furthermore, one side of the abutment is recessed in an arc shape, the bottom end of the drive wheel is rotatably connected to the top of the placement frame, and the upper surface of the clamp is slidably connected to the inner wall of the placement frame.

[0013] Furthermore, a guardrail is fixedly connected to the top of the conveyor, and the surface of the placement frame contacts the upper surface of the guardrail.

[0014] Furthermore, a filter screen is snapped into the inner wall of the storage frame.

[0015] Furthermore, an anti-deviation frame is slidably connected to the inner wall of the storage frame, and the surface of the anti-deviation frame is snapped into the inner wall of the filter screen. Beneficial effects

[0016] 1. The placement frame, the first servo motor, the drive wheel and the drive block work together to drive the two clamps to move closer to each other, so that the two abutments touch the surface of the wafer semiconductor. The clamps support the bottom of the wafer semiconductor to ensure the stability of the wafer semiconductor during transport. The storage frame works together with the one-way air outlet to allow the two abutments to flexibly clamp the wafer semiconductor, thereby avoiding damage to the wafer semiconductor during handling and ensuring the effective transport of the wafer semiconductor.

[0017] 2. The placement of the storage frame is limited by the guardrail to ensure that the clamp accurately supports the semiconductor wafer. The spring and the one-way air inlet pipe work together to realize the automatic reset of the block and allow outside air to enter the storage frame, thereby ensuring that a certain amount of air is stored in the storage frame. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A three-dimensional view of the main structure of a wafer semiconductor handling and conveying device;

[0020] Figure 2 A perspective view of a clamping mechanism in a wafer semiconductor handling and conveying device;

[0021] Figure 3 A cross-sectional view of the placement frame of a wafer semiconductor handling and conveying device;

[0022] Figure 4 This is a cross-sectional view of a storage frame in a wafer semiconductor handling and conveying device.

[0023] The labels in the diagram represent:

[0024] 1. Conveyor; 2. Industrial robot; 3. Gripping mechanism; 31. Placement frame; 32. Drive wheel; 33. Drive block; 34. Clamping frame; 35. Storage frame; 36. Abutment block; 37. One-way air outlet pipe; 38. First servo motor; 39. One-way air inlet pipe; 310. Spring; 311. Filter screen; 312. Anti-deviation frame; 313. Pressure sensor; 314. Guide rod; 315. Ball bearing; 316. Barrier. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] The present invention will be further described below with reference to the embodiments.

[0027] In some embodiments, please refer to the appendix to the instruction manual. Figure 1-4 A wafer semiconductor handling and conveying device includes a conveyor 1, an industrial robot 2 at the rear end of the conveyor 1, and a gripping mechanism 3. The gripping mechanism 3 includes a placement frame 31 fixedly connected to the upper surface of the industrial robot 2. A first servo motor 38 is fixedly connected to the inner bottom wall of the placement frame 31. A drive wheel 32 is fixedly connected to the output shaft of the first servo motor 38. Two drive blocks 33 are hinged to the top of the drive wheel 32. A clamp 34 is hinged to the inner wall of the drive block 33. A storage frame 35 is fixedly connected to one side of the clamp 34. The storage frame 35 stores gas inside. A one-way gas outlet pipe 37 is connected to one side of the storage frame 35. A stop block 36 is slidably connected to the inner wall of the storage frame 35. A pressure sensor 313 is fixedly connected to one side of the inner wall of the storage frame 35.

[0028] The conveyor 1 includes a conveyor frame, two pulleys, two belts and a second servo motor. The surfaces of the pulleys are rotatably connected to the inner wall of the conveyor frame. The surfaces of the two pulleys are drive-connected to the inner surface of the belt. The surface of the second servo motor is fixedly connected to the front end of the conveyor frame. The output shaft of the second servo motor is fixedly connected to one end of one of the pulleys. A warpage testing machine is provided at the rear end of the conveyor 1.

[0029] An industrial robot typically consists of a body, arm, wrist, hand, drive system, control system, and sensor system. Industrial robots are multi-joint manipulators or multi-degree-of-freedom machines widely used in the industrial field. They can automatically perform tasks and are machines that achieve various functions through their own power and control capabilities.

[0030] In this embodiment of the invention, when the wafer semiconductor needs to be inspected, the wafer semiconductor is placed in an orderly manner on the conveyor 1. The CNC system in the CNC screen automatically starts the conveyor 1 and the industrial robot 2, and automatically controls the conveying speed of the belt on the conveyor 1. After the belt on the conveyor 1 conveys the wafer semiconductor to the area directly below the placement frame 31, the conveyor 1 is automatically shut off. After the industrial robot 2 moves the placement frame 31 down to a suitable height, the first servo motor 38 is automatically started. The output shaft of the first servo motor 38 rotates, driving the drive wheel 32 to rotate clockwise. The rotating drive wheel 32 pulls the drive block 33 to move, and the moving drive block 33 pulls the clamping frame. The clamp 34 moves, causing one side of the abutment 36 to contact the surface of the wafer semiconductor. At this time, the clamp 34 moves, driving the storage frame 35 and pressure sensor 313 to continue moving, causing the abutment 36 to push the gas stored inside the storage frame 35 out through the one-way vent pipe 37. The pressure sensor 313 moves and presses against one side of the abutment 36. The pressure sensor 313 receives the pressure information and transmits it to the controller on the first servo motor 38, which then automatically shuts off the first servo motor 38, allowing the two abutments 36 to flexibly clamp the wafer semiconductor. At this time, the industrial robot 2 drives the placement frame 31 to move to the warpage tester, and then transports the clamped wafer semiconductor to the warpage tester.

[0031] At this time, the first servo motor 38 is automatically activated. The output shaft of the first servo motor 38 rotates, driving the drive wheel 32 to rotate counterclockwise. The rotation of the drive wheel 32 moves the drive block 33 and the clamp 34, thereby releasing the clamp on the wafer semiconductor and allowing the wafer semiconductor to fall onto the stage of the warp tester. The warp tester emits a laser beam onto the wafer surface. After the laser is reflected on the wafer surface, it is received by the detector. Due to the warping of the wafer surface, the angle of the reflected light will change. By measuring the change in the angle of the reflected light, the height information of each point on the wafer surface can be calculated. The warp tester usually scans the wafer surface along a certain path, collecting height data point by point, thereby obtaining the height distribution of the entire wafer surface. By analyzing the image of the interference fringes, the minute height changes on the wafer surface can be accurately measured, thereby obtaining the wafer warp information.

[0032] Semiconductor wafers that pass inspection are transported to conveyor 1 by industrial robot 2 and gripping mechanism 3. Conveyor 1 then transports the semiconductor wafers to a designated area. Semiconductor wafers that fail inspection are transported to a designated area for storage by industrial robot 2 and gripping mechanism 3.

[0033] In this embodiment of the invention, the placement frame 31, the first servo motor 38, the drive wheel 32 and the drive block 33 cooperate with each other to drive the two clamps 34 to move closer to each other, so that the two abutments 36 abut against the surface of the wafer semiconductor. The clamps 34 support the bottom of the wafer semiconductor to ensure the stability of the wafer semiconductor during transport. The storage frame 35 cooperates with the one-way air outlet 37 to allow the two abutments 36 to flexibly clamp the wafer semiconductor, thereby avoiding damage to the wafer semiconductor during clamping and transport, and ensuring the transport effect of the wafer semiconductor.

[0034] In some embodiments, such as Figure 4 As shown, in a preferred embodiment of the present invention, a spring 310 is fixedly connected to one side of the abutment block 36, and the other end of the spring 310 is fixedly connected to one side of the inner wall of the storage frame 35. A one-way air inlet pipe 39 is connected to one side of the storage frame 35. One side of the abutment block 36 is concave and arc-shaped. The bottom end of the drive wheel 32 is rotatably connected to the top end of the placement frame 31. The upper surface of the clamp 34 is slidably connected to the inner wall of the placement frame 31. A barrier 316 is fixedly connected to the top of the conveyor 1. The surface of the placement frame 31 contacts the upper surface of the barrier 316. A filter screen 311 is snapped into the inner wall of the storage frame 35. An anti-deviation frame 312 is slidably connected to the inner wall of the storage frame 35. The surface of the anti-deviation frame 312 is snapped into the inner wall of the filter screen 311.

[0035] The one-way vent pipe 37 includes a first one-way valve and a vent pipe. The surface of the first one-way valve is embedded in the surface of the vent pipe. The first one-way valve is used to prevent external gas from flowing into the storage frame 35 through the vent pipe. The one-way inlet pipe 39 includes a second one-way valve and an inlet pipe. The surface of the second one-way valve is embedded in the surface of the inlet pipe. The second one-way valve is used to prevent gas inside the storage frame 35 from being discharged through the inlet pipe. One end of the vent pipe and the inlet pipe are connected to one side of the storage frame 35.

[0036] In this embodiment of the utility model, the abutment 36 is away from the surface of the wafer semiconductor. The elastic force of the spring 310 pushes the abutment 36 to move automatically within the storage frame 35, so that suction is generated inside the storage frame 35. Outside air is filtered through the filter screen 311 and flows into the storage frame 35 through the one-way air inlet pipe 39.

[0037] In this embodiment of the utility model, the placement position of the placement frame 31 is limited by the guard 316 to ensure that the clamp 34 accurately supports the wafer semiconductor. The spring 310 and the one-way air inlet pipe 39 cooperate to realize the automatic reset of the stop block 36 and allow outside air to enter the storage frame 35, thereby ensuring that a certain amount of air is stored in the storage frame 35. The filter screen 311 blocks impurities from entering the one-way air inlet pipe 39 and the one-way air outlet pipe 37, ensuring that the inside of the one-way air inlet pipe 39 and the one-way air outlet pipe 37 is clean. The anti-deviation bracket 312 is moved away from the filter screen 311, so that the filter screen 311 can be disassembled and cleaned.

[0038] In some embodiments, such as Figure 3 As shown, in a preferred embodiment of this utility model, three guide rods 314 are fixedly connected to the surface of the placement frame 31. The three guide rods 314 are arranged in a ring, and two ball bearings 315 are tumbling connected to the lower end of the surface of the guide rods 314. The guide rods 314, ball bearings 315, clamps 34, and abutments 36 are all static dissipative rubber components. The ball bearings 315, clamps 34, and abutments 36 have a good buffering effect, thereby reducing the impact force on the wafer semiconductor. At the same time, their antistatic properties can protect the wafer semiconductor from static damage.

[0039] In this embodiment of the utility model, the guide rod 314 and the ball 315 cooperate to achieve the centering and limiting of the wafer semiconductor, thereby ensuring that the arc-shaped abutment 36 with one side is accurately abutted against the arc surface of the wafer semiconductor.

[0040] It should be noted that the conveyor 1, industrial robot 2, first servo motor 38, pressure sensor 313, warpage tester, first check valve and second check valve mentioned above are all devices with relatively mature existing technology. The specific models can be selected according to actual needs. At the same time, the power supply of conveyor 1, industrial robot 2, first servo motor 38, pressure sensor 313 and warpage tester can be powered by built-in power supply or mains power. The specific power supply method is selected according to the situation and will not be elaborated here.

[0041] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer semiconductor handling and conveying device, comprising a conveyor (1), wherein an industrial robot (2) is provided at the rear end of the conveyor (1), characterized in that: It also includes a gripping mechanism (3), which includes a placement frame (31) fixedly connected to the upper surface of the industrial robot (2). A first servo motor (38) is fixedly connected to the inner bottom wall of the placement frame (31). A drive wheel (32) is fixedly connected to the output shaft of the first servo motor (38). Two drive blocks (33) are hinged to the top of the drive wheel (32). A clamp (34) is hinged to the inner wall of the drive block (33). A storage frame (35) is fixedly connected to one side of the clamp (34). Gas is stored inside the storage frame (35). A one-way gas outlet pipe (37) is connected to one side of the storage frame (35). A stop block (36) is slidably connected to the inner wall of the storage frame (35). A pressure sensor (313) is fixedly connected to one side of the inner wall of the storage frame (35).

2. The wafer semiconductor handling and conveying equipment according to claim 1, characterized in that, A spring (310) is fixedly connected to one side of the abutment (36), and the other end of the spring (310) is fixedly connected to one side of the inner wall of the storage frame (35). A one-way air inlet pipe (39) is connected to one side of the storage frame (35).

3. The wafer semiconductor handling and conveying equipment according to claim 1, characterized in that, The surface of the placement frame (31) is fixedly connected with three guide rods (314), which are arranged in a ring.

4. The wafer semiconductor handling and conveying equipment according to claim 3, characterized in that, The lower end of the surface of the guide rod (314) is rolled with two ball bearings (315).

5. The wafer semiconductor handling and conveying equipment according to claim 1, characterized in that, The abutment (36) has an arc-shaped indentation on one side, the bottom end of the drive wheel (32) is rotatably connected to the top end of the placement frame (31), and the upper surface of the clamp (34) is slidably connected to the inner wall of the placement frame (31).

6. The wafer semiconductor handling and conveying equipment according to claim 1, characterized in that, The top of the conveyor (1) is fixedly connected to a guardrail (316), and the surface of the placement frame (31) contacts the upper surface of the guardrail (316).

7. The wafer semiconductor handling and conveying equipment according to claim 1, characterized in that, The inner wall of the storage frame (35) is fitted with a filter screen (311).

8. The wafer semiconductor handling and conveying equipment according to claim 7, characterized in that, The inner wall of the storage frame (35) is slidably connected to an anti-deviation frame (312), and the surface of the anti-deviation frame (312) is snapped into the inner wall of the filter screen (311).

Images