Ceramic tube shell packaging structure

Abstract

The utility model discloses a ceramic tube shell packaging structure, which comprises a ceramic substrate, a ceramic cover, a bare chip and a plurality of bonding wires, the ceramic substrate is provided with a bare chip fixing area and a connecting area surrounding the bare chip fixing area, the connecting area is provided with a plurality of PINs, and a bonding part and an electric connecting part higher than the bonding part are formed at the top of each PIN; the bare chip is fixedly matched with the bare chip fixing area, the bare chip is connected with the PINs through the bonding wires, one end of each bonding wire is connected with the bare chip, and the other end of each bonding wire is connected with the top end of the electric connecting part of the corresponding PIN; the ceramic cover is bonded with the connecting area of the ceramic substrate through glue, a cavity for accommodating the bare chip and the bonding wires is formed between the ceramic cover and the ceramic substrate, the glue covers the bonding parts of the PINs, and the glue does not cover the top ends of the electric connecting parts of the PINs. According to the utility model, glue can be effectively prevented from overflowing to the bonding wire, and the product yield is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor devices, and in particular to a ceramic tube-shell packaging structure. Background Technology

[0002] Ceramic housings are the mounting carriers for bare chips in ceramic packaging. They allow the die pins to be led out to the pins on the ceramic substrate, and also protect the die.

[0003] Currently, the method for packaging bare chips onto ceramic packages is as follows:

[0004] First, the bare chip die is fixed onto the ceramic substrate;

[0005] Then, bonding wires are used to connect the pins of the bare chip to the pins of the ceramic substrate.

[0006] Finally, the ceramic cap is bonded to the ceramic substrate with adhesive, so that the ceramic cap and the ceramic substrate form a cavity to accommodate the bonding wires and the die.

[0007] Currently, the bonding point between the ceramic cap and the ceramic substrate is located at the pin. If too much glue is used during bonding, it will overflow onto the bonding wires, affecting their performance. Furthermore, since the bonding wires are located inside the cavity, it is impossible to remove the glue that has overflowed onto the bonding wires, which greatly affects the product yield.

[0008] In view of the above problems, it is necessary to study a ceramic tube-shell encapsulation structure that can effectively prevent glue from overflowing onto the bonding wires. Utility Model Content

[0009] The purpose of this invention is to provide a ceramic tube shell packaging structure that can effectively prevent glue from overflowing onto the bonding wires.

[0010] To achieve the above objectives, the solution of this utility model is:

[0011] A ceramic housing package structure includes a ceramic substrate, a ceramic cap, a die, and multiple bonding wires. The ceramic substrate has a die fixing area and a connection area surrounding the die fixing area. The connection area has multiple pins, each pin having an adhesive portion and an electrical connection portion above the adhesive portion at its top. The electrical connection portion of the pin is close to the die fixing area. The die is fixedly fitted to the die fixing area and connected to each pin via bonding wires. One end of each bonding wire is connected to the die, and the other end is connected to the top of the electrical connection portion of the pin. The ceramic cap is bonded to the connection area of ​​the ceramic substrate with adhesive, forming a cavity between the ceramic cap and the ceramic substrate to accommodate the die and bonding wires. The adhesive covers the adhesive portion of each pin but does not cover the top of the electrical connection portion of each pin.

[0012] The height difference between the electrical connection part and the adhesive part of the PIN is greater than 1mm.

[0013] The pin is made of copper.

[0014] The periphery of the ceramic cap is aligned vertically with the adhesive portion of each pin.

[0015] Each pin also has a limiting portion at the top that is higher than the adhesive portion. The adhesive portion of the pin is located between the limiting portion and the electrical connection portion. The periphery of the ceramic cap is inserted between the limiting portion and the electrical connection portion of the pin.

[0016] The connection area has a rectangular structure, and each side of the connection area has multiple pins.

[0017] After adopting the above solution, each pin of the ceramic substrate connection area of ​​this utility model forms an adhesive portion and an electrical connection portion above the adhesive portion at the top. In this way, when the ceramic cover is bonded to the connection area of ​​the ceramic substrate with glue, the electrical connection portion has a blocking effect on the glue, so that the glue does not cover the top of the electrical connection portion of the pin, thereby preventing the glue from overflowing to the bonding wire connected to the top of the electrical connection portion of the pin, thus ensuring the performance of the bonding wire. Attached Figure Description

[0018] Figure 1 This is a cross-sectional view of Embodiment 1 of the present invention.

[0019] Figure 2 for Figure 1 Enlarged view of point a.

[0020] Figure 3 This is a top view of the ceramic substrate of Embodiment 1 of this utility model.

[0021] Figure 4 This is a cross-sectional view of Embodiment 2 of the present invention.

[0022] Figure 5 for Figure 4 Enlarged view of point b.

[0023] Label Explanation:

[0024] Ceramic substrate 1, bare die fixing area 101, connection area 102, pin 11, adhesive part 111, electrical connection part 112, limiting part 113

[0025] Ceramic lid 2,

[0026] Chip die 3,

[0027] Bond line 4,

[0028] Glue 5. Detailed Implementation

[0029] To further explain the technical solution of this utility model, the following detailed description is provided through specific embodiments.

[0030] Example 1:

[0031] Cooperate Figures 1 to 3 As shown, in Embodiment 1 of this utility model, a ceramic casing packaging structure includes a ceramic component 1, a ceramic cap 2, a die 3, and multiple bonding wires 4. The ceramic component 1 has a die fixing area 101 and a connecting area 102 surrounding the die fixing area 101. The connecting area 102 has multiple pins 11, each pin 11 having an adhesive portion 111 and an electrical connection portion 112 above the adhesive portion 111 at its top. The electrical connection portion 112 of the pin 11 is close to the die fixing area 101. The die 3 is fixedly fitted. In the die fixing area 101, the die 3 is connected to each pin 11 via bonding wires 4. One end of the bonding wire 4 is connected to the die 3, and the other end of the bonding wire 4 is connected to the top of the electrical connection portion 112 of the pin 11. The ceramic cover 2 is bonded to the connection area 102 of the ceramic component 1 with adhesive 5, and a cavity for accommodating the die 3 and each bonding wire 4 is formed between the ceramic cover 2 and the ceramic component 1. The adhesive 5 covers the bonding portion 111 of each pin 11, but does not cover the top of the electrical connection portion 112 of each pin 11.

[0032] In a ceramic tube shell packaging structure of this utility model, since each pin 11 of the connection area 102 has an adhesive portion 111 and an electrical connection portion 112 above the adhesive portion 111, when the ceramic cover 2 is bonded to the connection area 102 of the ceramic part 1 by adhesive 5, the electrical connection portion 112 has a blocking effect on the adhesive 5, so that the adhesive 5 does not cover the top of the electrical connection portion 112 of the pin 11, thereby preventing the adhesive 5 from overflowing to the bonding wire 4 connected to the top of the electrical connection portion 112 of the pin 11, thus ensuring the performance of the bonding wire 4.

[0033] In Embodiment 1 of this utility model, during the assembly of a ceramic tube shell packaging structure, firstly, the bare chip 3 is fixedly fitted to the bare chip fixing area 101 of the ceramic component 1; then, the bare chip 3 is connected to each pin 11 through each bonding wire 4, one end of the bonding wire 4 is connected to the bare chip 3, and the other end of the bonding wire 4 is connected to the top end of the electrical connection portion 112 of the pin 11; next, adhesive 5 is applied to the periphery of the ceramic cover 2; then, the ceramic cover 2 is placed on the ceramic component 1, so that the ceramic cover 2 is bonded to the connection area 102 of the ceramic component 1 through the adhesive 5, and a cavity for accommodating the bare chip 3 and each bonding wire 4 is formed between the ceramic cover 2 and the ceramic component 1; thereafter, after the adhesive 5 has cured, the overflowing adhesive 5 can be removed.

[0034] In the first embodiment of this utility model, the connection area 102 has a rectangular structure, and each side of the connection area 102 has a plurality of pins 11; the pins 11 are made of copper, which makes the pins 11 have good conductivity.

[0035] In Embodiment 1 of this utility model, the height difference between the electrical connection portion 112 and the adhesive portion 111 of the PIN 11 is greater than 1mm, which effectively prevents the glue 5 from overflowing to the top of the electrical connection portion 112 of the PIN 11. In addition, the electrical connection portion 112 plays a positioning role for the ceramic cover 2, so that the periphery of the ceramic cover 2 is vertically aligned with the adhesive portion 111 of each PIN 11.

[0036] Example 2:

[0037] Cooperate Figures 4 to 5 As shown, the difference between Embodiment 2 and Embodiment 1 of this utility model is that: in Embodiment 2 of this utility model, a limiting part 113 higher than the adhesive part 111 is formed on the top of each PIN 11. The adhesive part 111 of the PIN 11 is located between the limiting part 113 and the electrical connection part 112. The periphery of the ceramic cover 2 is inserted between the limiting part 113 and the electrical connection part 112 of the PIN 11. In this way, the limiting part 113 and the electrical connection part 112 can better position the ceramic cover 2, so that the periphery of the ceramic cover 2 is accurately aligned vertically with the adhesive part 111 of each PIN 11.

[0038] The above embodiments and figures are not intended to limit the product form and style of this utility model. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of this utility model.

Claims

1. A ceramic tube-shell packaging structure, characterized in that: This includes a ceramic substrate, a ceramic cap, a bare chip die, and multiple bonding wires; The ceramic substrate has a die fixing area and a connection area surrounding the die fixing area. The connection area has multiple pins. Each pin has an adhesive portion and an electrical connection portion above the adhesive portion on its top. The electrical connection portion of the pin is close to the die fixing area. The die is fixedly mounted in the die fixing area. The die is connected to each pin through each bonding wire. One end of the bonding wire is connected to the die, and the other end of the bonding wire is connected to the top of the electrical connection part of the pin. The ceramic cap is bonded to the ceramic substrate via adhesive, and a cavity is formed between the ceramic cap and the ceramic substrate to accommodate the chip die and each bonding wire. The adhesive covers the bonding portion of each pin, but does not cover the top of the electrical connection portion of each pin.

2. The ceramic tube shell packaging structure as described in claim 1, characterized in that: The height difference between the electrical connection part and the adhesive part of the PIN is greater than 1mm.

3. The ceramic tube-shell packaging structure as described in claim 1, characterized in that: The pin is made of copper.

4. The ceramic tube shell packaging structure as described in claim 1, characterized in that: The periphery of the ceramic cap is aligned vertically with the adhesive portion of each pin.

5. A ceramic tube-shell packaging structure as described in claim 1 or 4, characterized in that: Each pin also has a limiting portion at the top that is higher than the adhesive portion. The adhesive portion of the pin is located between the limiting portion and the electrical connection portion. The periphery of the ceramic cap is inserted between the limiting portion and the electrical connection portion of the pin.

6. The ceramic tube shell packaging structure as described in claim 1, characterized in that: The connection area has a rectangular structure, and each side of the connection area has multiple pins.

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