Cutting device for chip manufacturing and production

Abstract

The utility model relates to the field of chip manufacturing and production, and particularly discloses a cutting device for chip manufacturing and production, which comprises a bottom plate and a laser cutting head, a flat plate is arranged above the bottom plate, a placing table is arranged above the flat plate, a first screw rod is rotatably connected between the placing table and the flat plate, and a positioning cylinder matched with the placing table is sleeved on the outer wall of the placing table; a lifting plate which is in threaded connection with the outer wall of the first screw rod is fixedly connected into the positioning cylinder, and a first driving mechanism is arranged on the lower side of the first screw rod; the wafer is horizontally placed in the positioning cylinder, the inner wall of the positioning cylinder is matched with the wafer to limit displacement, meanwhile, the clamping force effect is avoided through non-contact fixing, so that edge damage or internal stress damage of the wafer is prevented, and the first driving mechanism drives the lifting plate to move downwards until the upper end of the positioning cylinder is flush with the upper end face of the placing table. The wafer is separated from the positioning cylinder and exposed on the surface of the placing table, the wafer can be rapidly taken without overcoming friction force, and operation is simple and convenient.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing, and specifically discloses a cutting device for chip manufacturing. Background Technology

[0002] Chips (also known as integrated circuits) are the core components of electronic systems. Radio frequency (RF) chips often employ system-in-package (SIP) technology, typically integrating RF amplifier circuits, matching circuits, and other functional devices. Wafer processing is a crucial step in semiconductor chip manufacturing. Laser stealth dicing is an advanced dicing technology for semiconductor wafers. Its core principle involves focusing a high-precision laser (such as an ultraviolet picosecond / femtosecond laser) inside the wafer to form a continuous modification layer (such as microcracks or a material phase transition layer). External mechanical stress (such as stretching by a film expander or applying force by a dicing machine) then separates the wafer along the modification layer into individual chips.

[0003] In existing technologies, wafers need to be fixed before laser stealth dicing to prevent displacement. Currently, two main methods are used: mechanical clamping and positioning groove positioning. Mechanical clamping fixes the wafer by clamping the edge of the wafer with a fixture, while positioning groove positioning embeds the wafer into a positioning groove that matches its size, using the groove to restrict its movement.

[0004] However, when fixing wafers using mechanical clamping, the clamping force is difficult to control, which may lead to edge damage or internal stress damage. When positioning wafers using positioning slots, the wafer is embedded inside the positioning slot, making it difficult to remove the wafer after cutting. A cutting device for chip manufacturing is needed to solve this problem. Utility Model Content

[0005] This invention proposes a cutting device for chip manufacturing, which prevents wafer edge damage or internal stress damage, and facilitates quick removal of the wafer.

[0006] This utility model is implemented as follows: a cutting device for chip manufacturing includes a base plate and a laser cutting head. A flat plate is provided above the base plate, and a placement platform is provided above the flat plate. A first lead screw is rotatably connected between the placement platform and the flat plate. A positioning cylinder adapted to the placement platform is sleeved on the outer wall of the placement platform. A lifting plate threaded to the outer wall of the first lead screw is fixedly connected inside the positioning cylinder. A first driving mechanism is provided on the lower side of the first lead screw.

[0007] The upper end of the base plate is slidably connected to a first moving block via a slider and a groove. A connecting frame is fixedly connected between the first moving block and the plate. A second driving mechanism is provided below the connecting frame.

[0008] A U-shaped frame is installed on the upper end of the base plate. A second moving block is slidably connected to the top of the inner wall of the U-shaped frame through a slider and a groove. The laser cutting head is installed at the lower end of the second moving block. A third driving mechanism is provided above the laser cutting head.

[0009] As a preferred embodiment of the chip manufacturing cutting device of this utility model, the first driving mechanism includes a driving frame fixedly connected to the lower end of the plate, a worm gear rotatably connected inside the driving frame, a worm wheel meshing with the outer wall of the worm gear, a transmission shaft passing through the plate fixedly connected between the worm wheel and the first lead screw, and a first servo motor whose output end is fixedly connected to the worm gear installed on the outer wall of the driving frame.

[0010] As a preferred embodiment of the chip manufacturing cutting device of this utility model, the second driving mechanism includes two end plates mounted on the upper part of the base plate and distributed to the left and right. A second lead screw is rotatably connected between the two end plates, passing through the first moving block and threadedly connected to the first moving block. A second servo motor with its output end fixedly connected to the second lead screw is installed on the outer wall of one of the end plates.

[0011] As a preferred embodiment of the chip manufacturing cutting device of this utility model, the third driving mechanism includes a third lead screw rotatably connected inside the U-shaped frame, the third lead screw passing through the second moving block and threadedly connected thereto, and a third servo motor with its output end fixedly connected to the third lead screw is installed at the rear end of the U-shaped frame.

[0012] In a preferred embodiment of the chip manufacturing cutting device of this utility model, a plurality of supporting optical axes are fixedly connected between the placement stage and the flat plate, and the plurality of supporting optical axes all pass through the lifting plate and are slidably connected thereto.

[0013] As a preferred embodiment of the chip manufacturing cutting device of this utility model, the upper edge of the inner wall of the positioning cylinder is chamfered.

[0014] As a preferred embodiment of the chip manufacturing cutting device of this utility model, the left and right ends of the base plate are fixedly connected to mounting plates with multiple mounting holes.

[0015] The beneficial effects of this utility model are:

[0016] 1. Place the wafer horizontally inside the positioning cylinder. Its inner wall is adapted to the wafer to limit displacement. At the same time, non-contact fixing avoids clamping force, thereby preventing wafer edge damage or internal stress damage.

[0017] 2. After the cutting is completed, the first drive mechanism drives the lifting plate to move down until the upper end of the positioning cylinder is flush with the upper surface of the placement stage. The wafer is removed from the positioning cylinder and exposed on the surface of the placement stage. The wafer can be quickly picked up without overcoming friction, and the operation is simple. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0019] Figure 1 This is a front cross-sectional view of the chip manufacturing cutting device of this utility model;

[0020] Figure 2 For the present utility model Figure 1 Enlarged view of point A in the middle;

[0021] Figure 3 This is a partial structural diagram of the present invention;

[0022] Figure 4 This is a partial structural diagram of the present invention;

[0023] Figure 5 This is a partial left-side cross-sectional view of the present invention.

[0024] The markings in the diagram are: 1. Base plate; 2. Laser cutting head; 3. Flat plate; 4. Placement stage; 5. First lead screw; 6. Positioning cylinder; 7. Lifting plate; 8. Support optical axis; 9. First moving block; 10. Connecting frame; 11. End plate; 12. Second lead screw; 13. Second servo motor; 14. Drive frame; 15. Worm gear; 16. First servo motor; 17. Worm wheel; 18. U-shaped frame; 19. Second moving block; 20. Third lead screw; 21. Third servo motor. Detailed Implementation

[0025] The present invention will be further described below with reference to the accompanying drawings and specific embodiments to aid in understanding its content. Unless otherwise specified, the methods used in this invention are conventional methods; the raw materials and apparatus used, unless otherwise specified, are conventional commercially available products.

[0026] Please see Figure 1-5 A chip manufacturing cutting device includes a base plate 1 and a laser cutting head 2. A flat plate 3 is arranged above the base plate 1, and a placement platform 4 is arranged above the flat plate 3. A first lead screw 5 is rotatably connected between the placement platform 4 and the flat plate 3. A positioning cylinder 6 adapted to the placement platform 4 is sleeved on the outer wall of the placement platform 4. A lifting plate 7 threaded to the outer wall of the first lead screw 5 is fixedly connected inside the positioning cylinder 6. A first drive mechanism is arranged on the lower side of the first lead screw 5.

[0027] The upper end of the base plate 1 is slidably connected to the first moving block 9 via a slider and a slide groove. The first moving block 9 is fixedly connected to the plate 3 via a connecting frame 10. A second driving mechanism is provided below the connecting frame 10.

[0028] A U-shaped frame 18 is installed on the upper end of the base plate 1. The top of the inner wall of the U-shaped frame 18 is slidably connected to a second moving block 19 through a slider and a groove. The laser cutting head 2 is installed on the lower end of the second moving block 19. A third driving mechanism is provided above the laser cutting head 2.

[0029] In this embodiment: When in use, the wafer is placed horizontally in the positioning cylinder 6 until the wafer is in contact with the upper end of the placement stage 4. Since the positioning cylinder 6 is adapted to the wafer, the wafer can be positioned to prevent the wafer from shifting. In this way, the purpose of preventing the wafer edge from being damaged or the interior from being damaged by stress is achieved.

[0030] The second drive mechanism drives the connecting frame 10 and the plate 3 to move as a whole, while simultaneously driving the first lead screw 5, the lifting plate 7, the positioning cylinder 6 and the wafer to move left and right, thereby enabling the wafer to be positioned in the X-axis direction. The third drive mechanism drives the second moving block 19 to move back and forth along the slide groove at the top of the U-shaped frame 18, controlling the cutting trajectory of the laser cutting head 2 in the Y-axis direction. Through X / Y axis linkage, the laser cutting head 2 can perform high-precision cutting of the wafer along a preset path.

[0031] After the cutting is completed, the positioning cylinder 6 is returned to its initial position (the initial position of the positioning cylinder 6 is outside the U-shaped frame 18). Then, the first drive mechanism drives the first lead screw 5 to rotate, and the lifting plate 7 drives the positioning cylinder 6 to move downward until the upper end of the positioning cylinder 6 is flush with the upper surface of the placement stage 4. At this time, the wafer is removed from the inside of the positioning cylinder 6, so that the wafer on the upper end of the placement stage 4 can be easily and quickly removed, which is convenient to use.

[0032] It should be noted that the model of laser cutting head 2 is: ProCutter FD 3D.

[0033] As a technical optimization of this utility model, the first drive mechanism is fixedly connected to the drive frame 14 at the lower end of the plate 3. The drive frame 14 is rotatably connected to the inside of the drive frame 14. The outer wall of the worm 15 is meshed with the worm wheel 17. The worm wheel 17 and the first lead screw 5 are fixedly connected to a transmission shaft that passes through the plate 3. The outer wall of the drive frame 14 is equipped with a first servo motor 16 whose output end is fixedly connected to the worm 15.

[0034] In this embodiment: the first servo motor 16 drives the worm gear 15 to rotate, which in turn drives the worm wheel 17 and the transmission shaft to rotate. The transmission shaft is coaxially connected to the first lead screw 5, which in turn drives the plate 3 to rise and fall through the first lead screw 5. The worm gear 15 and the worm wheel 17 have self-locking characteristics, which improves the stability of the first lead screw 5 in the non-drive state and improves the stability of the plate 3.

[0035] As a technical optimization of this utility model, the second drive mechanism includes two end plates 11 installed on the upper end of the base plate 1, which are distributed left and right. A second lead screw 12 is rotatably connected between the two end plates 11, passing through the first moving block 9 and threadedly connected to the first moving block 9. A second servo motor 13 with its output end fixedly connected to the second lead screw 12 is installed on the outer wall of one of the end plates 11.

[0036] In this embodiment: the second servo motor 13 drives the second lead screw 12 to rotate, and the first moving block 9 moves left and right along the slide groove of the base plate 1.

[0037] As a technical optimization of this utility model, the third drive mechanism includes a third lead screw 20 rotatably connected inside the U-shaped frame 18, the third lead screw 20 passing through the second moving block 19 and threadedly connected thereto, and a third servo motor 21 with its output end fixedly connected to the third lead screw 20 is installed at the rear end of the U-shaped frame 18.

[0038] In this embodiment: the third servo motor 21 drives the third lead screw 20 to rotate, and the second moving block 19 moves back and forth along the slide groove of the U-shaped frame 18.

[0039] As a technical optimization of this utility model, multiple supporting optical axes 8 are fixedly connected between the placement platform 4 and the flat plate 3, and the multiple supporting optical axes 8 all pass through the lifting plate 7 and are slidably connected to it.

[0040] In this embodiment: the supporting optical axis 8 passes through the lifting plate 7, restricting it to slide only in the vertical direction, preventing the lifting plate 7 from deflecting when the first lead screw 5 rotates, and at the same time providing stable support for the placement platform 4.

[0041] As a technical optimization of this utility model, the upper edge of the inner wall of the positioning cylinder 6 is chamfered.

[0042] In this embodiment: the chamfer design on the upper edge of the inner wall of the positioning cylinder 6 guides the smooth embedding of the wafer.

[0043] As a technical optimization of this utility model, the left and right ends of the base plate 1 are fixedly connected with mounting plates having multiple mounting holes.

[0044] In this embodiment, the mounting plates at both ends of the base plate 1 are fixed to the external frame or workbench by bolts to ensure the overall stability of the device.

[0045] The working principle and usage process of this utility model are as follows: When in use, the wafer is first placed horizontally in the positioning cylinder 6. The chamfer design of the inner wall of the positioning cylinder 6 guides the wafer to be embedded in the center until the wafer is in contact with the upper end of the placement stage 4. Since the positioning cylinder 6 is adapted to the wafer, the wafer can be positioned to prevent the wafer from shifting. In this way, the purpose of preventing the wafer edge from being damaged or the internal stress damage is achieved.

[0046] When the second servo motor 13 drives the second lead screw 12 to rotate, the second lead screw 12 pushes the first moving block 9 to move left and right along the slide groove of the base plate 1, causing the connecting frame 10 and the plate 3 to move as a whole, and at the same time driving the first lead screw 5, the lifting plate 7, the positioning cylinder 6 and the wafer to move left and right, thereby realizing the position adjustment of the wafer in the X-axis direction. When the third servo motor 21 drives the third lead screw 20 to rotate, the third lead screw 20 drives the second moving block 19 to move back and forth along the slide groove at the top of the U-shaped frame 18, controlling the cutting trajectory of the laser cutting head 2 in the Y-axis direction. Through X / Y axis linkage, the laser cutting head 2 can perform high-precision cutting of the wafer along the preset path.

[0047] After the cutting is completed, the positioning cylinder 6 is returned to its initial position (the initial position of the positioning cylinder 6 is outside the U-shaped frame 18). Then, the first servo motor 16 is started, which drives the worm gear 17 through the worm 15, and drives the first lead screw 5 to rotate through the transmission shaft. The lifting plate 7 moves the positioning cylinder 6 downward. Multiple support optical shafts 8 improve the stability of the movement of the lifting plate 7 until the upper end of the positioning cylinder 6 is flush with the upper surface of the placement stage 4. At this time, the wafer is removed from the inside of the positioning cylinder 6, so that the wafer on the upper end of the placement stage 4 can be easily and quickly removed, which is convenient to use.

[0048] In the description of this utility model, it should be understood that the terms "left", "right", "up", "down", "top", "bottom", "front", "back", "inner", "outer", "back", "middle", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0049] However, the above description is only a specific embodiment of this utility model and should not be construed as limiting the scope of implementation of this utility model. Therefore, any substitution of equivalent components or equivalent changes and modifications made in accordance with the scope of protection of this utility model should still fall within the scope of the claims of this utility model.

Claims

1. A cutting device for chip manufacturing, comprising a base plate (1) and a laser cutting head (2), characterized in that: A flat plate (3) is provided above the base plate (1), and a placement platform (4) is provided above the flat plate (3). A first lead screw (5) is rotatably connected between the placement platform (4) and the flat plate (3). A positioning cylinder (6) that is adapted to the placement platform (4) is sleeved on the outer wall of the placement platform (4). A lifting plate (7) that is threaded to the outer wall of the first lead screw (5) is fixedly connected inside the positioning cylinder (6). A first driving mechanism is provided on the lower side of the first lead screw (5). The upper end of the base plate (1) is slidably connected to a first moving block (9) via a slider and a slide groove. A connecting frame (10) is fixedly connected between the first moving block (9) and the plate (3). A second driving mechanism is provided below the connecting frame (10). A U-shaped frame (18) is installed on the upper end of the base plate (1). The top of the inner wall of the U-shaped frame (18) is slidably connected to a second moving block (19) through a slider and a groove. The laser cutting head (2) is installed on the lower end of the second moving block (19). A third driving mechanism is provided above the laser cutting head (2).

2. The chip manufacturing dicing apparatus according to claim 1, characterized in that: The first driving mechanism includes a driving frame (14) fixedly connected to the lower end of the plate (3). A worm (15) is rotatably connected inside the driving frame (14). A worm wheel (17) is meshed with the outer wall of the worm (15). A transmission shaft passing through the plate (3) is fixedly connected between the worm wheel (17) and the first lead screw (5). A first servo motor (16) with its output end fixedly connected to the worm (15) is installed on the outer wall of the driving frame (14).

3. The chip manufacturing dicing apparatus according to claim 1, characterized in that: The second drive mechanism includes two end plates (11) mounted on the upper end of the base plate (1) and distributed on the left and right. A second lead screw (12) is rotatably connected between the two end plates (11), passing through the first moving block (9) and threadedly connected to the first moving block (9). A second servo motor (13) with its output end fixedly connected to the second lead screw (12) is installed on the outer wall of one of the end plates (11).

4. The chip manufacturing dicing apparatus according to claim 1, characterized in that: The third drive mechanism includes a third lead screw (20) rotatably connected inside the U-shaped frame (18), the third lead screw (20) passes through the second moving block (19) and is threadedly connected to it, and a third servo motor (21) with its output end fixedly connected to the third lead screw (20) is installed at the rear end of the U-shaped frame (18).

5. The chip manufacturing dicing apparatus according to claim 1, characterized in that: Multiple supporting optical axes (8) are fixedly connected between the placement platform (4) and the flat plate (3), and the multiple supporting optical axes (8) all pass through the lifting plate (7) and are slidably connected to it.

6. The chip manufacturing dicing apparatus according to claim 1, characterized in that: The upper edge of the inner wall of the positioning cylinder (6) is chamfered.

7. The chip manufacturing dicing apparatus according to claim 1, characterized in that: The base plate (1) is fixedly connected to mounting plates with multiple mounting holes at both its left and right ends.

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