Adjustable fixing device for double-tabletop wafer welding

Abstract

The utility model relates to the technical field of wafer fixing devices, and provides an adjustable fixing device for double-table wafer welding, which comprises a base, adjusting structures are arranged on two sides of the top of the base, welding seats are fixed at the top ends of the adjusting structures, adsorption structures are arranged in the welding seats, and the adsorption structures are arranged on the two sides of the top of the base. The adsorption structure comprises a through groove formed in the welding base. According to the utility model, the adsorption structure is arranged, the air suction pipe is externally connected with the negative pressure fan, air in the through groove can be pumped away through the communicating pipe and the corrugated pipe, the bottom of the wafer body is adsorbed through the suction hole, the wafer body can be pre-fixed, the wafer body is prevented from being damaged due to the fact that the clamping force is not easy to control when the wafer body is fixed, and the service life of the wafer body is prolonged. According to the adjustable fixing device for double-table-board wafer welding, the function of conveniently adsorbing and fixing a wafer body is achieved, and the use convenience and the work efficiency of the adjustable fixing device for double-table-board wafer welding are improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer fixing device technology, and in particular to an adjustable fixing device for double-platform wafer welding. Background Technology

[0002] As semiconductor manufacturing technology advances towards higher integration, smaller linewidths, and 3D stacking, wafer-level bonding has become a key process for achieving high-performance chips. However, traditional single-mesa fixing methods face severe challenges in terms of alignment accuracy, thermal stress control, and process adaptability. Therefore, there is a need to design an adjustable fixing device for dual-mesa wafer bonding.

[0003] To address this, patent CN213816110U discloses a wafer bonding and fixing device, including a bonding base, a placement tray above the bonding base, a rotating shaft fixedly connected to the bottom of the placement tray, a transmission cavity inside the bonding base, the bottom of the rotating shaft extending into the transmission cavity and fixedly connected to a vertical bevel gear, the vertical bevel gear being connected to a transmission gear plate via a transmission assembly, an L-shaped support plate fixedly connected to the top of the bonding base, a lead screw column connected to the support plate via a lead screw nut, a movable column connected to the lead screw column via a universal ball joint, and an arc-shaped clamping component connected to the movable column via a buffer device. This invention utilizes the movement of the lead screw column, which, under the action of the movable column, rack, transmission gear plate, ratchet assembly, rotating bevel gear, and transmission bevel gear, causes the vertical bevel gear to drive the rotating shaft to rotate. This allows the continuous movement of the lead screw column after the clamping is released to rotate the wafer on the placement tray, thereby quickly adjusting the wafer's bonding position.

[0004] While the aforementioned wafer bonding and fixing device allows for quick and easy adjustment of the wafer bonding position during use, the clamping force is difficult to control when fixing the wafer, which can easily damage the wafer. Therefore, it is necessary to design an adjustable fixing device for double-platform wafer bonding. Utility Model Content

[0005] The purpose of this invention is to provide an adjustable fixing device for double-platform wafer bonding, which solves the problem that existing adjustable fixing devices for wafer bonding have the defect that the clamping force of the clamping block is not easy to control when fixing the wafer, and the wafer is easily damaged.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an adjustable fixing device for double-platform wafer bonding, including a base;

[0007] The base has adjustment structures on both sides of its top, and welding seats are fixed to the top of each adjustment structure.

[0008] The welding seat is provided with an adsorption structure inside. The adsorption structure includes a through groove opened inside the welding seat. At the top of the through groove, suction holes are evenly opened inside the welding seat. The adsorption structure also includes a connecting pipe on one side inside the welding seat. A corrugated pipe is fixed to one end of the connecting pipe, and a suction pipe is fixed to one end of the corrugated pipe.

[0009] Both sides of the top of the welding base are fixed with fixing structures, and the top of the welding base is provided with a wafer body.

[0010] Furthermore, the adjustment structure includes a servo motor, an adjustment groove, a slider, a lead screw, and a guide rod. The servo motors are all fixedly installed on the outer walls at both ends of the base. The adjustment grooves are all opened on both sides of the top of the base. Sliders are provided on both sides inside the adjustment grooves. The sliders are threadedly connected to the lead screws inside. Guide rods are provided on both sides of the lead screws.

[0011] Furthermore, one end of each lead screw extends to the outside of the base and is fixedly connected to the output end of the servo motor, while the other end of each lead screw extends to the inside of the base and is rotatably connected to the base.

[0012] Furthermore, both ends of the guide rod are fixedly connected to the inner wall of the base, and the guide rod and the slider are slidably connected.

[0013] Furthermore, the adsorption structure also includes mounting plates fixed to both sides of the top of the base.

[0014] Furthermore, the suction holes are evenly distributed on the top of the welding seat, and one end of the suction pipe is connected to a negative pressure fan.

[0015] Furthermore, the fixing structure includes a support plate, a balance bar, a clamping plate, a rotating shaft, and a handle. The support plates are all fixed to both sides of the top of the welding seat. The rotating shaft is threadedly connected inside the support plates. A balance bar is provided on both sides of the rotating shaft. A clamping plate is provided at the end of the rotating shaft near the wafer body. A handle is fixed at the end of the rotating shaft away from the wafer body.

[0016] Furthermore, the balance bars are symmetrically distributed on both sides of the clamping plate, one end of each balance bar is fixedly connected to the outer wall of the clamping plate, and the other end of each balance bar extends to the outside of the support plate and is slidably connected to the support plate.

[0017] Furthermore, the clamping plates are symmetrically distributed on both sides of the wafer body, and one end of the rotating shaft extends into the interior of the clamping plates and is rotatably connected to the clamping plates.

[0018] The adjustable fixing device for double-platform wafer bonding provided by this utility model has the following advantages:

[0019] By incorporating an adsorption structure and connecting a negative pressure fan to the suction pipe, air inside the channel can be drawn away through the connecting pipe and corrugated pipe. The bottom of the wafer body is then adsorbed through the suction holes, which can pre-fix the wafer body and prevent damage due to uncontrollable clamping force during fixing. This device enables easy adsorption and fixing of the wafer body, improving the convenience and efficiency of the adjustable fixing device for double-platform wafer welding.

[0020] With an adjustable structure, the slider moves inside the adjustment groove via a lead screw under the drive of a servo motor, which can move the welding seat and adjust the welding position of the wafer body. This achieves the function of easily adjusting the welding position of the wafer body, improving the convenience of using the adjustable fixing device for dual-platform wafer welding.

[0021] With a fixed structure, the clamping plate can be pushed close to the wafer body by manually rotating the handle. Under the clamping action of the clamping plate, the wafer body can be fixed a second time. The manual adjustment makes it easy to control the force and avoids damaging the wafer body. This realizes that the device has the function of facilitating the secondary fixation of the wafer body and improves the stability of the adjustable fixing device for double-platform wafer welding during use. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0023] Figure 2 This is a three-dimensional structural schematic diagram of the main cross-section of this utility model;

[0024] Figure 3 This is a top view of the structure of this utility model;

[0025] Figure 4 This is a side view cross-sectional three-dimensional structural schematic diagram of the present invention;

[0026] Figure 5 This is a top-view cross-sectional three-dimensional structural diagram of the present invention.

[0027] The following are the annotations in the figure: 1. Base; 2. Adjustment structure; 21. Servo motor; 22. Adjustment groove; 23. Slider; 24. Lead screw; 25. Guide rod; 3. Welding seat; 4. Adsorption structure; 41. Through slot; 42. Suction hole; 43. Connecting pipe; 44. Corrugated pipe; 45. Suction pipe; 46. Mounting plate; 5. Fixing structure; 51. Support plate; 52. Balance bar; 53. Clamping plate; 54. Rotating shaft; 55. Rotating handle; 6. Wafer body. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1-5 The present invention provides an adjustable fixing device for double-platform wafer welding, including a base 1.

[0030] Reference Figures 1-5 An adjustment structure 2 is provided on both sides of the top of the base 1. The adjustment structure 2 includes a servo motor 21, an adjustment groove 22, a slider 23, a lead screw 24, and a guide rod 25. The servo motor 21 is fixedly installed on the outer wall at both ends of the base 1. The adjustment groove 22 is opened on both sides of the top of the base 1. A slider 23 is provided on both sides inside the adjustment groove 22. The lead screw 24 is threadedly connected inside the slider 23. Guide rods 25 are provided on both sides of the lead screw 24. One end of the lead screw 24 extends to the outside of the base 1 and is fixedly connected to the output end of the servo motor 21. The other end of the lead screw 24 extends to the inside of the base 1 and is rotatably connected to the base 1. Both ends of the guide rod 25 are fixedly connected to the inner wall of the base 1. The guide rod 25 and the slider 23 are slidably connected. A welding seat 3 is fixed at the top of the adjustment structure 2.

[0031] When an external power source is connected, the servo motor 21 is started. The servo motor 21 drives the lead screw 24 to rotate. The rotation of the lead screw 24 causes the slider 23 to move along the guide rod 25, thereby adjusting the position of the welding seat 3.

[0032] Reference Figures 1-5 The welding base 3 is equipped with an adsorption structure 4. The adsorption structure 4 includes a through groove 41 inside the welding base 3. At the top of the through groove 41, suction holes 42 are evenly distributed inside the welding base 3. The adsorption structure 4 also includes a connecting pipe 43 on one side inside the welding base 3. A corrugated pipe 44 is fixed to one end of the connecting pipe 43. A suction pipe 45 is fixed to one end of the corrugated pipe 44. The adsorption structure 4 also includes mounting plates 46 fixed to both sides of the top of the base 1. The suction holes 42 are evenly distributed on the top of the welding base 3. One end of the suction pipe 45 is connected to a negative pressure fan.

[0033] When an external power supply is connected, the negative pressure fan at one end of the suction pipe 45 is started. The negative pressure fan draws air out of the through slot 41 through the suction pipe 45, the corrugated pipe 44 and the connecting pipe 43, so that a negative pressure space is formed inside the suction hole 42. The wafer body 6 is placed on the top of the soldering base 3. Under the connection of the suction hole 42, the wafer body 6 is adsorbed, so that the wafer body 6 can be initially stabilized on the top of the soldering base 3. During the soldering process, if the soldering base 3 moves, the corrugated pipe 44 has the flexibility to compensate for the displacement of the soldering base 3 and maintain the adsorption stability.

[0034] Reference Figures 1-4 The welding base 3 has a fixing structure 5 fixed on both sides of its top end. The fixing structure 5 includes a support plate 51, a balance bar 52, a clamping plate 53, a rotating shaft 54, and a rotating handle 55. The support plates 51 are fixed on both sides of the top end of the welding base 3. The rotating shaft 54 ​​is threadedly connected to the inside of the support plates 51. The balance bar 52 is provided on both sides of the rotating shaft 54. The clamping plate 53 is provided at the end of the rotating shaft 54 ​​near the wafer body 6. The rotating handle 55 is fixed at the end of the rotating shaft 54 ​​away from the wafer body 6. The balance bar 52 is symmetrically distributed on both sides of the clamping plate 53. One end of the balance bar 52 is fixedly connected to the outer wall of the clamping plate 53. The other end of the balance bar 52 extends to the outside of the support plate 51 and is slidably connected to the support plate 51. The clamping plate 53 is symmetrically distributed on both sides of the wafer body 6. One end of the rotating shaft 54 ​​extends to the inside of the clamping plate 53 and is rotatably connected to the clamping plate 53. The wafer body 6 is provided at the top end of the welding base 3.

[0035] Rotating the handle 55 will cause the rotating shaft 54 ​​to rotate. Since the rotating shaft 54 ​​is threadedly connected to the support plate 51, the rotating shaft 54 ​​will move forward and push the clamping plate 53 forward to clamp the outer side of the wafer body 6 and fix the wafer body 6 again.

[0036] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An adjustable fixing device for double-platform wafer bonding, comprising a base (1); Its features are: The base (1) has adjustment structures (2) on both sides of its top, and welding seats (3) are fixed to the top of each adjustment structure (2). The welding seat (3) is provided with an adsorption structure (4) inside. The adsorption structure (4) includes a through groove (41) opened inside the welding seat (3). The welding seat (3) at the top of the through groove (41) is provided with suction holes (42) evenly opened inside. The adsorption structure (4) also includes a connecting pipe (43) on one side inside the welding seat (3). One end of the connecting pipe (43) is fixed with a corrugated pipe (44), and one end of the corrugated pipe (44) is fixed with a suction pipe (45). The welding base (3) has a fixing structure (5) on both sides of its top end, and a wafer body (6) is provided on the top end of the welding base (3).

2. The adjustable fixing device for double-platform wafer bonding according to claim 1, characterized in that: The adjustment structure (2) includes a servo motor (21), an adjustment groove (22), a slider (23), a lead screw (24), and a guide rod (25). The servo motor (21) is fixedly installed on the outer wall at both ends of the base (1). The adjustment groove (22) is opened on both sides of the top of the base (1). The slider (23) is provided on both sides inside the adjustment groove (22). The lead screw (24) is threaded inside the slider (23). The guide rod (25) is provided on both sides of the lead screw (24).

3. The adjustable fixing device for double-mesh wafer bonding according to claim 2, characterized in that: One end of each lead screw (24) extends to the outside of the base (1) and is fixedly connected to the output end of the servo motor (21). The other end of each lead screw (24) extends to the inside of the base (1) and is rotatably connected to the base (1).

4. The adjustable fixing device for double-platform wafer bonding according to claim 2, characterized in that: Both ends of the guide rod (25) are fixedly connected to the inner wall of the base (1), and the guide rod (25) and the slider (23) are slidably connected.

5. The adjustable fixing device for double-platform wafer bonding according to claim 1, characterized in that: The adsorption structure (4) also includes mounting plates (46) fixed to both sides of the top of the base (1).

6. The adjustable fixing device for double-platform wafer bonding according to claim 1, characterized in that: The suction holes (42) are evenly distributed on the top of the welding seat (3), and one end of the suction pipe (45) is connected to a negative pressure fan.

7. The adjustable fixing device for double-platform wafer bonding according to claim 1, characterized in that: The fixing structure (5) includes a support plate (51), a balance bar (52), a clamping plate (53), a rotating shaft (54), and a handle (55). The support plate (51) is fixed to both sides of the top of the welding seat (3). The rotating shaft (54) is threaded inside the support plate (51). The balance bar (52) is provided on both sides of the rotating shaft (54). The clamping plate (53) is provided at the end of the rotating shaft (54) close to the wafer body (6). The handle (55) is fixed at the end of the rotating shaft (54) away from the wafer body (6).

8. The adjustable fixing device for double-mesa wafer bonding according to claim 7, characterized in that: The balance bars (52) are symmetrically distributed on both sides of the clamping plate (53). One end of each balance bar (52) is fixedly connected to the outer wall of the clamping plate (53), and the other end of each balance bar (52) extends to the outside of the support plate (51) and is slidably connected to the support plate (51).

9. The adjustable fixing device for double-mesa wafer bonding according to claim 7, characterized in that: The clamping plates (53) are symmetrically distributed on both sides of the wafer body (6), and one end of the rotating shaft (54) extends into the interior of the clamping plates (53) and is rotatably connected to the clamping plates (53).

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