Semiconductor wafer edge deburring and grinding equipment

Abstract

The utility model relates to the field of deburring and grinding equipment, in particular to semiconductor wafer edge deburring and grinding equipment. Comprising a bottom plate and a connecting structure, a sliding column is fixedly connected to the upper surface of the bottom plate, a fixing rod is fixedly connected to the upper end of the sliding column, a servo motor is fixedly connected to the end, away from the sliding column, of the fixing rod, a screw rod is fixedly connected to the output end of the servo motor, and a sliding piece is slidably connected to the surface of the sliding column; the sliding piece is in threaded connection with the screw rod, the screw rod is rotationally connected with the bottom plate, a servo motor is arranged on the side, away from the screw rod, of the sliding piece, the servo motor is connected with the sliding piece through a connecting structure, and an adjusting structure is arranged at the output end of the servo motor. The semiconductor wafer edge deburring and grinding equipment provided by the utility model has the advantages that semiconductor wafers of different models can be conveniently ground, the processing efficiency of wafer grinding is greatly improved, and the process of replacing different grinding tools is avoided.

Description

Technical Field

[0001] This utility model relates to the field of deburring and grinding equipment, and in particular to a semiconductor wafer edge deburring and grinding equipment. Background Technology

[0002] Semiconductor wafer edge deburring and polishing equipment is a high-precision device used to remove burrs and irregular surface treatments from wafer edges. During semiconductor manufacturing, wafers generate edge burrs during cutting, processing, or handling. If these burrs are not removed, they may affect subsequent wafer processes (such as packaging and testing) and the stability of the equipment.

[0003] Existing technologies, such as the utility model patent with publication number CN219562456U, disclose a deburring device for semiconductor processing. This patent employs two longitudinally arranged, parallel mounting plates. Slide rails are installed on the inner walls of the two plates, and each slide rail has two sliders arranged as a group. A spring is installed between each group of sliders, and connecting rods connect different groups of sliders. Clamping plates are installed inside the connecting rods, and semiconductors are placed between the clamping plates. A pair of grinding rollers are also installed between the mounting plates, located on the upper and lower sides of the semiconductor. The grinding rollers are driven by a motor. An eccentric wheel is installed on either side of the mounting plate, also driven by a motor, and is hinged to the connecting rod by a drive arm. In this utility model, the rotating eccentric wheel drives the drive arm to reciprocate left and right, thereby causing the semiconductor to reciprocate left and right. Combined with the upper and lower grinding rollers, this allows for vertical deburring of the semiconductor, thus improving processing efficiency.

[0004] The inventors discovered in daily use that existing semiconductor wafers have different sizes, thicknesses, and materials, thus requiring different grinding parameters and equipment settings for each type of wafer. For example, the wafer's diameter, thickness, material properties, and surface condition all affect the grinding effect. The equipment needs frequent adjustments, such as changing grinding wheels, adjusting grinding speed, and changing pressure, making the operation complex and time-consuming. Because different wafer types have different processing requirements, the equipment needs frequent debugging and parameter settings. This leads to decreased production efficiency, especially when handling batch production of different wafer types. Each change in type causes equipment downtime or adjustment time, affecting the overall production rhythm.

[0005] This application provides another technical solution to this technical problem, aiming to provide those skilled in the art with multiple options for solving the problem. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies.

[0007] To solve the above technical problems, this utility model provides a semiconductor wafer edge deburring and polishing device, comprising: a base plate and a connecting structure. A sliding column is fixedly connected to the upper surface of the base plate. A fixing rod is fixedly connected to the upper end of the sliding column. A servo motor is fixedly connected to the end of the fixing rod away from the sliding column. A screw is fixedly connected to the output end of the servo motor. A sliding component is slidably connected to the surface of the sliding column. The sliding component is threadedly connected to the screw. The screw rotates and connects with the base plate. A servo motor is provided on the side of the sliding component away from the screw. The servo motor is connected to the sliding component via the connecting structure. An adjustment structure is provided at the output end of the servo motor. The adjustment structure includes a turntable. The turntable is fixedly connected to the servo motor. A plurality of slide rails are fixedly connected to the arc surface of the turntable. A lead screw is slidably connected to the inner wall of the slide rail. A threaded ring is threadedly connected to the arc surface of the lead screw. The threaded ring abuts against the slide rail. An arc plate is fixedly connected to the lower end of the screw. A polishing pad is fixedly connected to the side of each of the plurality of arc plates that are close to each other.

[0008] The effect achieved by the above components is as follows: when it is necessary to polish the edge of the semiconductor wafer, first rotate the threaded ring to move it, loosening the threaded ring from the slide rail, then pull the screw to move it, the screw slides on the inner wall of the slide rail, the screw drives the arc plate to move, the arc plate drives the polishing pad to move, then the polishing pad is brought into contact with the semiconductor wafer, then the threaded ring is tightened to fix it, then the servo motor is started to rotate, the servo motor drives the turntable to rotate, the turntable drives the slide rail and the lead screw to rotate, the lead screw drives the arc plate to move, and the arc plate drives the polishing pad to polish the semiconductor wafer.

[0009] Preferably, an anti-slip pad, which is a rubber pad, is fixedly connected to the lower surface of the threaded ring.

[0010] The effect achieved by the above components is that the anti-slip pad can increase the friction between the threaded ring and the slide rail, preventing slippage when the threaded ring and the slide rail are squeezed and fixed.

[0011] Preferably, the arc surface of the threaded ring is provided with a plurality of slots, and the plurality of slots are evenly distributed on the threaded ring.

[0012] The effect achieved by the above components is that the groove can increase the friction between the hand and the threaded ring, preventing slippage when rotating the threaded ring.

[0013] Preferably, a limiting rod is fixedly connected inside the slide rail, and the limiting rod is slidably connected to the lead screw.

[0014] The effect achieved by the above components is that the limiting rod can limit the lead screw, prevent the lead screw from deviating during use, and improve the stability of the lead screw sliding.

[0015] Preferably, the slider has a connecting structure on the side near the servo motor. The connecting structure includes a connecting rod, which is fixedly connected to the slider. A connecting frame is slidably connected to the end of the connecting rod away from the slider. The connecting frame is fixedly connected to the servo motor. An insert rod is slidably connected to one side of the connecting frame. A spring is fitted on the arc surface of the insert rod, and both ends of the spring are fixedly connected to the insert rod and the connecting frame, respectively.

[0016] The effect achieved by the above components is as follows: when it is necessary to connect the servo motor and the slider, the servo motor is pulled to move, the servo motor drives the connecting frame to move, the plug rod is pulled to move, the plug rod drives the spring to stretch, then the connecting frame is inserted into the connecting rod for connection, then the plug rod is aligned with the connecting frame and the connecting rod, and then the plug rod spring is released to retract and drive the plug rod to insert and fix it.

[0017] Preferably, an anti-slip sleeve is fixedly connected to the inner wall of the connecting frame, and the anti-slip sleeve is a rubber sleeve.

[0018] The effect achieved by the above components is that the anti-slip sleeve can increase the friction between the connecting frame and the connecting rod, and prevent the connecting rod from slipping when it is connected to the connecting frame.

[0019] Preferably, a plurality of handles are fixedly connected to the arc surface of the insertion rod, and the plurality of handles are evenly distributed on the insertion rod.

[0020] The effect achieved by the above components is that when it is necessary to pull the plug rod, the handle can be pulled directly, and the handle will drive the plug rod to move, making it more convenient to pull the plug rod.

[0021] Compared with related technologies, the semiconductor wafer edge deburring and polishing equipment provided by this utility model has the following beneficial effects:

[0022] This invention provides a semiconductor wafer edge deburring and polishing device. By incorporating an adjustable structure, it addresses the issue that existing semiconductor wafers vary in size, thickness, and material, requiring different polishing parameters and equipment settings for each type. For example, the wafer's diameter, thickness, material properties (such as silicon, gallium arsenide, etc.), and surface condition all affect the polishing effect. Previously, equipment required frequent adjustments, such as changing polishing wheels, adjusting polishing speed, and changing pressure, leading to a complex and time-consuming operation. Because different wafer types have different processing requirements, the equipment needs frequent debugging and parameter settings. This results in decreased production efficiency, especially during batch production of different wafer types. Each change in type causes equipment downtime or adjustment time, affecting the overall production rhythm. This device allows for convenient polishing of different types of semiconductor wafers, significantly improving wafer polishing efficiency and eliminating the need to change polishing tools.

[0023] By setting up a connection structure, the servo motor and the slider can be easily installed and disassembled quickly, and the servo motor can be easily disassembled for replacement or maintenance. Attached Figure Description

[0024] Figure 1 A schematic diagram of the structure of a semiconductor wafer edge deburring and polishing device provided by this utility model;

[0025] Figure 2 for Figure 1 The diagram shows the adjustment structure.

[0026] Figure 3 for Figure 2 The enlarged view of point A shown;

[0027] Figure 4 for Figure 1 The diagram shows the connection structure.

[0028] The following are the labels in the diagram: 1. Base plate; 2. Sliding column; 3. Servo motor; 4. Servo motor; 5. Screw; 6. Sliding component; 7. Fixing rod; 8. Adjustment structure; 81. Turntable; 82. Slide rail; 83. Arc plate; 84. Lead screw; 85. Threaded ring; 86. Limiting rod; 87. Groove; 88. Anti-slip pad; 89. Grinding pad; 9. Connecting structure; 91. Connecting frame; 92. Connecting rod; 93. Anti-slip sleeve; 94. Insert rod; 95. Handle rod; 96. Spring. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0030] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0031] Please see Figures 1 to 4 This utility model provides a semiconductor wafer edge deburring and polishing device, including: a base plate 1 and a connecting structure 9. A sliding column 2 is fixedly connected to the upper surface of the base plate 1. A fixing rod 7 is fixedly connected to the upper end of the sliding column 2. A servo motor 3 is fixedly connected to the end of the fixing rod 7 away from the sliding column 2. A screw 5 is fixedly connected to the output end of the servo motor 3. A sliding member 6 is slidably connected to the surface of the sliding column 2. The sliding member 6 is threadedly connected to the screw 5. The screw 5 rotates and connects with the base plate 1. A servo motor 4 is provided on the side of the sliding member 6 away from the screw 5. The servo motor 4 is connected to the sliding member 6 through the connecting structure 9. An adjustment structure 8 is provided at the output end of the servo motor 4. The connecting structure 9 is provided on the side of the sliding member 6 near the servo motor 4.

[0032] In the embodiments of this utility model, please refer to Figure 2 and Figure 3 The adjustment structure 8 includes a turntable 81, which is fixedly connected to the servo motor 4. Several slide rails 82 are fixedly connected to the arc surface of the turntable 81. A lead screw 84 is slidably connected to the inner wall of the slide rail 82. A threaded ring 85 is threadedly connected to the arc surface of the lead screw 84. The threaded ring 85 abuts against the slide rail 82. An arc plate 83 is fixedly connected to the lower end of the screw 5. A polishing pad 89 is fixedly connected to the side of the several arc plates 83 that are close to each other. When it is necessary to polish the edge of the semiconductor wafer, first rotate the threaded ring 85 to move it, loosening the threaded ring 85 from the slide rail 82. Then pull the screw 5 to move it, sliding the screw 5 on the inner wall of the slide rail 82. The screw 5 drives the arc plate 83 to move, and the arc plate 83 drives the polishing pad 89 to move. Then, the polishing pad 89 is brought into contact with the semiconductor wafer, and the threaded ring 85 is tightened to fix it. Then, the servo motor 4 is started to rotate, driving the turntable 81 to rotate. The turntable 81 drives the slide rail 82 and the lead screw 84 to rotate, and the lead screw 84 drives the arc plate 83 to move. The arc plate 83 drives the polishing pad 89 to polish the semiconductor wafer. An anti-slip pad 88, which is a rubber pad, is fixedly connected to the lower surface of the threaded ring 85. The anti-slip pad 88 increases the friction between the threaded ring 85 and the slide rail 82, preventing slippage when the threaded ring 85 is pressed and fixed to the slide rail 82. The threaded ring 85 has several grooves 87 evenly distributed on its arc surface. These grooves 87 increase the friction between the hand and the threaded ring 85, preventing slippage when rotating it. A limit rod 86 is fixedly connected inside the slide rail 82, and the limit rod 86 is slidably connected to the lead screw 84. The limit rod 86 limits the lead screw 84, preventing it from deviating during use and improving the stability of its sliding motion.

[0033] In the embodiments of this utility model, please refer to Figure 1 and Figure 4The connecting structure 9 includes a connecting rod 92, which is fixedly connected to the slider 6. A connecting frame 91 is slidably connected to the end of the connecting rod 92 away from the slider 6. The connecting frame 91 is fixedly connected to the servo motor 4. A plug rod 94 is slidably connected to one side of the connecting frame 91. A spring 96 is fitted onto the arc surface of the plug rod 94, and both ends of the spring 96 are fixedly connected to the plug rod 94 and the connecting frame 91, respectively. When it is necessary to connect the servo motor 4 and the slider 6, the servo motor 4 is pulled to move, causing the connecting frame 91 to move. This pulls the plug rod 94, causing the spring 96 to stretch. Then, the connecting frame 91 is inserted into the connecting rod 92 for connection. The plug rod 94 is then aligned with the connecting frame 91 and the connecting rod 92. Finally, the spring 96 is released, causing the plug rod 94 to retract and insert for fixation. An anti-slip sleeve 93, which is a rubber sleeve, is fixedly connected to the inner wall of the connecting frame 91. The anti-slip sleeve 93 increases the friction between the connecting frame 91 and the connecting rod 92, preventing slippage when the connecting rod 92 is connected to the connecting frame 91. Several handles 95 are fixedly connected to the arc surface of the insertion rod 94, and these handles 95 are evenly distributed on the insertion rod 94. When it is necessary to pull the insertion rod 94, the handles 95 can be pulled directly, causing the insertion rod 94 to move. The handles 95 make pulling the insertion rod 94 more convenient.

[0034] The working principle of the semiconductor wafer edge deburring and polishing equipment provided by this utility model is as follows: When it is necessary to polish the edge of the semiconductor wafer, first rotate the threaded ring 85 to move it, loosening the threaded ring 85 from the slide rail 82. Then pull the screw 5 to move it, sliding it on the inner wall of the slide rail 82. The screw 5 drives the arc plate 83 to move, which in turn drives the polishing pad 89 to move. Then, the polishing pad 89 is placed against the semiconductor wafer, and the threaded ring 85 is tightened to fix it. Finally, the servo motor 4 is started to rotate, driving the turntable to rotate. The turntable 81 drives the slide rail 82 and the lead screw 84 to rotate. The lead screw 84 drives the arc plate 83 to move. The arc plate 83 drives the polishing pad 89 to polish the semiconductor wafer. The anti-slip pad 88 can increase the friction between the threaded ring 85 and the slide rail 82, preventing slippage when the threaded ring 85 is squeezed and fixed to the slide rail 82. The slot 87 can increase the friction between the hand and the threaded ring 85, preventing slippage when rotating the threaded ring 85. The limiting rod 86 can limit the lead screw 84, preventing the lead screw 84 from deviating during use and improving the stability of the sliding of the lead screw 84.

[0035] When it is necessary to connect the servo motor 4 and the slider 6, pull the servo motor 4 to move it. The servo motor 4 drives the connecting frame 91 to move, and pull the plug rod 94 to move it. The plug rod 94 drives the spring 96 to stretch, and then the connecting frame 91 is inserted into the connecting rod 92 for connection. Then, the plug rod 94 is aligned with the connecting frame 91 and the connecting rod 92. Then, the spring 96 of the plug rod 94 is released, and the plug rod 94 is inserted and fixed. The anti-slip sleeve 93 can increase the friction between the connecting frame 91 and the connecting rod 92 to prevent the connecting rod 92 from slipping when it is connected to the connecting frame 91. When it is necessary to pull the plug rod 94, the handle 95 can be pulled directly. The handle 95 drives the plug rod 94 to move, and the handle 95 makes it easier to pull the plug rod 94.

[0036] The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0037] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A semiconductor wafer edge deburring and grinding device, characterized in that, include: The base plate (1) and the connecting structure (9) are provided. A sliding column (2) is fixedly connected to the upper surface of the base plate (1). A fixing rod (7) is fixedly connected to the upper end of the sliding column (2). A servo motor (3) is fixedly connected to the end of the fixing rod (7) away from the sliding column (2). A screw (5) is fixedly connected to the output end of the servo motor (3). A sliding piece (6) is slidably connected to the surface of the sliding column (2). The sliding piece (6) is threadedly connected to the screw (5). The screw (5) rotates and connects with the base plate (1). A servo motor (4) is provided on the side of the sliding piece (6) away from the screw (5). The servo motor (4) is connected to the sliding piece by means of the connecting structure (9). (6) Connect the servo motor (4) to the output end of which is an adjustment structure (8). The adjustment structure (8) includes a turntable (81). The turntable (81) is fixedly connected to the servo motor (4). Several slide rails (82) are fixedly connected to the arc surface of the turntable (81). A lead screw (84) is slidably connected to the inner wall of the slide rail (82). A threaded ring (85) is threadedly connected to the arc surface of the lead screw (84). The threaded ring (85) abuts against the slide rail (82). An arc plate (83) is fixedly connected to the lower end of the screw (5). A polishing pad (89) is fixedly connected to the side of several arc plates (83) that are close to each other.

2. The semiconductor wafer edge deburring and grinding equipment according to claim 1, characterized in that, The lower surface of the threaded ring (85) is fixedly connected to an anti-slip pad (88), which is a rubber pad.

3. The semiconductor wafer edge deburring and polishing equipment according to claim 1, characterized in that, The threaded ring (85) has a plurality of slots (87) on its arc surface, and the plurality of slots (87) are evenly distributed on the threaded ring (85).

4. The semiconductor wafer edge deburring and polishing equipment according to claim 1, characterized in that, The slide rail (82) is internally fixedly connected to a limiting rod (86), and the limiting rod (86) is slidably connected to the lead screw (84).

5. The semiconductor wafer edge deburring and grinding equipment according to claim 1, characterized in that, The slider (6) has a connecting structure (9) on the side near the servo motor (4). The connecting structure (9) includes a connecting rod (92), which is fixedly connected to the slider (6). A connecting frame (91) is slidably connected to the end of the connecting rod (92) away from the slider (6). The connecting frame (91) is fixedly connected to the servo motor (4). A plug rod (94) is slidably connected to one side of the connecting frame (91). A spring (96) is sleeved on the arc surface of the plug rod (94). The two ends of the spring (96) are fixedly connected to the plug rod (94) and the connecting frame (91) respectively.

6. The semiconductor wafer edge deburring and polishing equipment according to claim 5, characterized in that, The inner wall of the connecting frame (91) is fixedly connected with an anti-slip sleeve (93), which is a rubber sleeve.

7. The semiconductor wafer edge deburring and polishing equipment according to claim 5, characterized in that, The arc surface of the insertion rod (94) is fixedly connected to several handles (95), and the several handles (95) are evenly distributed on the insertion rod (94).

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