Polishing device for gold bonding wire production

Abstract

The utility model discloses a polishing device for gold bonding wire production, which is applied to the technical field of processing equipment and comprises a bottom plate, a supporting plate is bolted to the bottom of the bottom plate, a power motor is bolted to the left side of the top of the supporting plate, and the output end of the power motor is fixedly connected with a power column through a coupler. The surface of the top of the power column is sleeved with a storage roller, a connecting plate is bolted to the top of the bottom plate, a sliding rail is welded to the right side of the top of the connecting plate, and a sliding table is slidably connected to the surface of the sliding rail. A conveying belt is driven by a power column to conveniently store polished gold wires, a welding sliding rail is arranged at the top of a connecting plate, a sliding table is slidably connected to the surface, the gold wires penetrate through the middle of a first grinding barrel and a second grinding barrel and penetrate through the interior of a clamping plate set to be polished, and products of different sizes can be conveniently polished.

Description

Technical Field

[0001] This utility model belongs to the field of processing equipment technology, and specifically relates to a polishing device for producing bonding wire. Background Technology

[0002] Wire bonding, a key material for connecting internal and external circuits in chip packaging, is widely used in the wire bonding processes of electronic components such as LEDs, ICs, and power modules. Its surface quality directly affects bonding strength, conductivity, and long-term stability. Therefore, effectively removing surface oxide layers, micro-burrs, and processing marks, and improving surface smoothness and flatness, is a crucial aspect affecting product quality during the production of wire bonding.

[0003] A search of the China Patent Website revealed publication number CN210476537U, which describes a polishing device for producing bonding wires. However, this device lacks comprehensive product applicability, cannot polish products of different sizes, and lacks storage and replacement facilities for the polished products. Therefore, we propose a polishing device for producing bonding wires to address these problems. Utility Model Content

[0004] The purpose of this utility model is to provide a polishing device for the production of bonding alloy wires. Its advantage is that it is easy to polish products of different sizes and to store and replace polished products through adjustment.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a polishing device for producing bonding wire, comprising a base plate, a support plate bolted to the bottom of the base plate, a power motor bolted to the top left side of the support plate, a power column fixedly connected to the output end of the power motor via a coupling, a receiving roller sleeved on the top surface of the power column, a connecting plate bolted to the top of the base plate, a slide rail welded to the top right side of the connecting plate, and a slide table slidably connected to the surface of the slide rail.

[0006] The above technical solution is adopted as follows: the bolted support plate provides support for the bolted power motor. The power motor is started, which makes the power column start to run. The running of the power column causes the roller to run, sending the gold wire to the surface of the assist column. The conveyor belt is driven by the power column, which makes the assist column run together and collect the polished gold wire. By bolting a connecting plate to the top of the base plate and welding a slide rail to the top of the connecting plate, the slide table is slidably connected to the surface, and the gold wire is passed through the middle of the first grinding cylinder and the second grinding cylinder, and through the inside of the clamping plate assembly for polishing.

[0007] The present invention is further configured such that a conveyor belt is sleeved on the bottom surface of the power column.

[0008] The above technical solution is adopted: by setting up a conveyor belt, it is convenient for the power column to drive the auxiliary column.

[0009] The present invention is further configured such that a booster column is sleeved on the right side of the conveyor belt, and the booster column penetrates the bottom plate and is rotatably connected to the support plate located on the right side.

[0010] The above technical solution is adopted: when the power column is running, the auxiliary column is connected by a conveyor belt to provide power to the auxiliary column.

[0011] The present invention is further configured such that a clamping plate assembly is bolted to the top left side of the connecting plate.

[0012] The above technical solution involves setting up a clamping plate assembly, which polishes both the top and bottom surfaces of the gold wire as it passes through the clamping plate assembly.

[0013] The present invention is further configured such that a bottom clamping plate is slidably connected to the inner wall of the clamping plate assembly.

[0014] The above technical solution is adopted: by setting a bottom clamping plate, after the gold wire passes through the clamping plate assembly, the bottom clamping plate is adjusted to facilitate the grinding of gold wires of different sizes.

[0015] The present invention is further configured such that a first support column and a second support column are bolted to the top of the front and back sides of the slide table.

[0016] The above technical solution is adopted: by setting up a first support column and a second support column, the first grinding cylinder and the second grinding cylinder are provided with support force, which facilitates the installation of the first grinding cylinder and the second grinding cylinder.

[0017] The present invention is further configured such that a first grinding cylinder and a second grinding cylinder are sleeved on the top of the first pillar and the second pillar.

[0018] The above technical solution is adopted: by setting up a first grinding cylinder and a second grinding cylinder, the gold wire is placed in the first grinding cylinder and the second grinding cylinder, and the left and right sides of the gold wire are ground and polished.

[0019] The present invention is further provided that a support leg is welded around the bottom of the base plate.

[0020] The above technical solution is adopted: by setting up support legs, the base plate is provided with support force, which facilitates placement and transportation.

[0021] In summary, this utility model has the following beneficial effects:

[0022] 1. The bolted support plate provides support for the bolted power motor. When the power motor is started, the power column begins to run. The running of the power column causes the roller to run, sending the gold wire to the surface of the assist column. The conveyor belt is driven by the power column, causing the assist column to run together, which facilitates the collection of the polished gold wire.

[0023] 2. By bolting a connecting plate to the top of the base plate, welding a slide rail to the top of the connecting plate, and sliding the slide table to the surface, the gold wire is passed through the middle of the first and second grinding cylinders and through the inside of the clamping plate assembly for grinding and polishing, which facilitates grinding of products of different sizes. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a partial side view of the structure of this utility model;

[0026] Figure 3 This is a partial side view of the structure of this utility model;

[0027] Figure 4 This is a partial front view of the structure of this utility model.

[0028] Reference numerals: 1. Base plate; 2. Support plate; 3. Power motor; 4. Power column; 5. Roller; 6. Connecting plate; 7. Slide rail; 8. Slide table; 9. Conveyor belt; 10. Assist column; 11. Clamping plate assembly; 12. Bottom clamping plate; 13. First support column; 14. Second support column; 15. First grinding cylinder; 16. Second grinding cylinder; 17. Support leg. Detailed Implementation

[0029] The present invention will be further described in detail below with reference to the accompanying drawings.

[0030] Example 1:

[0031] refer to Figure 1 , Figure 2 , Figure 3 A polishing device for producing bonding gold wire includes a base plate 1, a support plate 2 bolted to the bottom of the base plate 1, a power motor 3 bolted to the top left side of the support plate 2, a power column 4 fixedly connected to the output end of the power motor 3 via a coupling, a roller 5 sleeved on the top surface of the power column 4, the support plate 2 providing support for the bolted power motor 3, starting the power motor 3, causing the power column 4 to start running, the running of the power column 4 causing the roller 5 to run accordingly, sending the gold wire to the surface of the assist column 10, the conveyor belt 9 being driven by the power column 4, causing the assist column 10 to run together, collecting the polished gold wire.

[0032] refer to Figure 1 , Figure 2 A conveyor belt 9 is fitted onto the bottom surface of the power column 4. The conveyor belt 9 is provided to facilitate the power column 4 to drive the auxiliary column 10.

[0033] refer to Figure 2A booster column 10 is sleeved on the right side of the conveyor belt 9, and the booster column 10 passes through the base plate 1 and is rotatably connected to the support plate 2 located on the right side. When the power column 4 is running, the booster column 10 is sleeved on the conveyor belt 9 to provide power to the booster column 10.

[0034] refer to Figure 1 Support legs 17 are welded around the bottom of the base plate 1. The support legs 17 provide support for the base plate 1, making it easy to place and move.

[0035] Brief description of the usage process: The support plate 2 provides support for the bolted power motor 3. When the power motor 3 is started, the power column 4 starts to run. The operation of the power column 4 causes the roller 5 to run accordingly, sending the gold wire to the surface of the assist column 10. The conveyor belt 9 is driven by the power column 4, causing the assist column 10 to run together, which facilitates the collection of the polished gold wire.

[0036] Example 2:

[0037] refer to Figure 1 , Figure 3 A polishing device for producing bonding alloy wires includes a connecting plate 6 bolted to the top of a base plate 1, a slide rail 7 welded to the right side of the top of the connecting plate 6, and a slide table 8 slidably connected to the surface of the slide rail 7. The connecting plate 6 is bolted to the top of the base plate 1, the slide rail 7 is welded to the top of the connecting plate 6, and the slide table 8 is slidably connected to the surface. The gold wire is passed through the middle of the first grinding cylinder 15 and the second grinding cylinder 16, and through the inside of the clamping plate assembly 11 for grinding and polishing.

[0038] refer to Figure 1 , Figure 3 A clamping plate assembly 11 is bolted to the top left side of the connecting plate 6. The clamping plate assembly 11 is set so that the upper and lower surfaces of the gold wire are polished when the gold wire passes through the clamping plate assembly 11.

[0039] refer to Figure 4 The inner wall of the clamping plate assembly 11 is slidably connected to a bottom clamping plate 12. The bottom clamping plate 12 is set so that after the gold wire passes through the clamping plate assembly 11, the bottom clamping plate 12 can be adjusted to facilitate the polishing of different gold wire sizes.

[0040] refer to Figure 1 , Figure 3 The slide table 8 has a first support column 13 and a second support column 14 bolted to its front, back and top. The first support column 13 and the second support column 14 provide support for the first grinding cylinder 15 and the second grinding cylinder 16, and facilitate the installation of the first grinding cylinder 15 and the second grinding cylinder 16.

[0041] refer to Figure 3 The first pillar 13 and the second pillar 14 are fitted with the first grinding cylinder 15 and the second grinding cylinder 16. The first grinding cylinder 15 and the second grinding cylinder 16 are set up so that the gold wire is placed in the first grinding cylinder 15 and the second grinding cylinder 16 and the left and right sides of the gold wire are ground and polished.

[0042] Brief description of the usage process: A connecting plate 6 is bolted to the top of the base plate 1, and a slide rail 7 is welded to the top of the connecting plate 6. The slide table 8 is slidably connected to the surface. By sliding the slide table 8, the angle of the first support column 13 and the second support column 14 is adjusted, and the gold wire is passed through the middle of the first grinding cylinder 15 and the second grinding cylinder 16, and through the inside of the clamping plate group 11. At the same time, the up and down angle of the bottom clamping plate 12 is adjusted to polish the gold wires of different sizes.

[0043] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A polishing apparatus for producing bonding wire, comprising a base plate (1), characterized in that: A support plate (2) is bolted to the bottom of the base plate (1). A power motor (3) is bolted to the top left side of the support plate (2). The output end of the power motor (3) is fixedly connected to a power column (4) through a coupling. A roller (5) is sleeved on the top surface of the power column (4). A connecting plate (6) is bolted to the top of the base plate (1). A slide rail (7) is welded to the top right side of the connecting plate (6). A slide table (8) is slidably connected to the surface of the slide rail (7).

2. The polishing apparatus for producing bonding wire according to claim 1, characterized in that: The bottom surface of the power column (4) is fitted with a conveyor belt (9).

3. The polishing apparatus for producing bonding wire according to claim 2, characterized in that: The right side of the conveyor belt (9) is fitted with a booster column (10), which penetrates the bottom plate (1) and is rotatably connected to the support plate (2) located on the right side.

4. The polishing apparatus for producing bonding wire according to claim 1, characterized in that: A clamping plate assembly (11) is bolted to the top left side of the connecting plate (6).

5. A polishing apparatus for producing bonding wires according to claim 4, characterized in that: The inner wall of the clamping plate assembly (11) is slidably connected to the bottom clamping plate (12).

6. The polishing apparatus for producing bonding wire according to claim 1, characterized in that: The slide (8) has a first support (13) and a second support (14) bolted to its front, back and top.

7. A polishing apparatus for producing bonding wires according to claim 6, characterized in that: The first support (13) and the second support (14) are fitted with the first grinding cylinder (15) and the second grinding cylinder (16).

8. A polishing apparatus for producing bonding wires according to claim 1, characterized in that: The bottom of the base plate (1) is welded with support legs (17) around its circumference.

Images