Protective film cutting device for wafer

Abstract

The utility model relates to the field of protective film cutting devices, in particular to a wafer protective film cutting device which comprises a bottom plate, supporting frames are connected to the two sides of the top of the bottom plate in a bolting mode, a rectangular shell is connected to the upper portions of the inner sides of the supporting frames in a bolting mode, and a rotating disc is rotationally connected to the front face of the rectangular shell through a bearing. The front face of the rotating disc is rotationally connected with a driving rod through a bearing. Through the rectangular shell, the driving motor, the rotating disc, the driving cone pulley, the driven cone pulley and other assemblies, the driving motor drives the rotating shaft to rotate, then the driving cone pulley drives the rotating disc to rotate, the driving rod drives the moving rod to vertically move in a reciprocating mode, and after the film cutting blade is heated through the ceramic heating piece, the film cutting efficiency is improved. The electric cylinder pushes the film cutting blade to move vertically in a reciprocating mode, the wafer protection film on the upper portion of the bottom plate is rapidly cut, manual participation is not needed in the mode, and the problem that workers are scratched by the blade in the protection film cutting process can be effectively solved.

Description

Technical Field

[0001] This utility model relates to the field of protective film cutting devices, specifically to a protective film cutting device for wafers. Background Technology

[0002] When wafers come out of the wafer manufacturing plant, they are relatively thick. Due to the packaging size requirements or heat dissipation requirements of the wafer, the back side of the wafer needs to be ground to a thinner thickness before packaging. Therefore, the grinding process can also be called "back grinding" or "thinning". During the grinding process, it is necessary to ensure that the debris and grinding fluid do not contaminate or scratch the wafer. Therefore, a protective film needs to be attached to the front side of the wafer, i.e. the circuit surface, before grinding.

[0003] A search revealed a protective film cutting device with publication number CN202123116180.4, which specifically discloses a base, a housing, a power unit, a support beam, and a cutting blade. The inner bottom surface of the housing is a cutting platform, and a pressure bar is provided above the cutting platform. The power unit is located on the top surface of the housing, and its output shaft passes through the housing and connects to the pressure plate. The support beam is located below the pressure plate, and fixed plates are provided on both sides of the support beam. The technical problem solved by this utility model is that the existing device causes high manual labor intensity and low cutting efficiency, which indirectly affects production efficiency. At the same time, it cannot adjust the cutting size, making the overall device applicable to a narrow cutting size range.

[0004] However, the aforementioned device still has certain drawbacks. For example, because the wafer edge has a chamfer, the dicing blade cannot completely adhere to the wafer edge during cutting, resulting in curling edges of the protective film, which affects the subsequent packaging quality. Additionally, the dicing blade is sharp, and workers are easily cut by it.

[0005] Therefore, it is necessary to invent a wafer protective film cutting device to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a wafer protective film cutting device that can effectively solve the above-mentioned technical problems.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wafer protective film cutting device, comprising a base plate, support frames bolted to both sides of the top of the base plate, a rectangular shell bolted to the upper inner side of the support frames, a rotating disk rotatably connected to the front of the rectangular shell via a bearing, a drive rod rotatably connected to the front of the rotating disk via a bearing, a moving rod rotatably connected to the other end of the drive rod, a housing bolted to the bottom of the moving rod, a horizontal plate bolted to the bottom of the housing, a servo motor bolted to the center of the top of the housing, a gear bolted to the output end of the servo motor, limit rails bolted to both sides of the housing, a driven rack slidably connected to the inner side of the limit rail, and the inner side of the driven rack meshing with the surface of the gear, a connecting plate bolted to the bottom of the driven rack, and an abutment strip bolted to the bottom of the connecting plate.

[0008] Preferably, both sides of the inner cavity of the rectangular shell are rotatably connected to a rotating shaft via bearings, a drive motor is bolted to the left side of the rectangular shell, and the left side of the rotating shaft is bolted to the output end of the drive motor.

[0009] Preferably, the surface of the rotating shaft is bolted with a driving conical wheel, and the back of the rotating disk is bolted with a driven conical wheel through the rectangular shell.

[0010] Preferably, the bottom of the rectangular shell is bolted with vertical plates, and the front of the vertical plates is bolted with limiting grooves.

[0011] Preferably, electric cylinders are bolted to both the front and rear sides of the connecting plate.

[0012] Preferably, a ceramic heating element is bolted to the bottom of the electric cylinder, and a cutting blade is bolted to the bottom of each ceramic heating element.

[0013] Preferably, limit plates are bolted to both the front and rear sides of the connecting plate, and a limit rod is slidably connected to the inner side of the limit plate.

[0014] Preferably, through grooves are provided on both sides of the bottom of the horizontal plate.

[0015] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0016] 1. The system consists of a rectangular shell, a drive motor, a rotating disk, a drive cone wheel, and a driven cone wheel. The drive motor rotates the rotating shaft, which in turn rotates the rotating disk via the drive cone wheel. The drive rod then moves the moving rod vertically back and forth. After the ceramic heating element heats the cutting blade, the electric cylinder pushes the cutting blade to move vertically back and forth, quickly cutting the wafer protective film on the upper part of the base plate. This method requires no manual intervention and can effectively reduce the problem of workers being scratched by the blade during the cutting of the protective film.

[0017] 2. The lower leveling mechanism moves downwards through components such as the housing, servo motor, gears, limit slide rails, and driven rack to press and flatten the lower protective film, allowing the cutting blade to cut along the edge of the wafer. The cut protective film fits perfectly with the wafer, preventing the protective film from lifting and causing insufficient adhesion between the protective film and the wafer, which would affect the quality. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a front view of the overall structure of this utility model;

[0020] Figure 2 This is a partial structural cross-sectional view of the present invention;

[0021] Figure 3 This is a partial side sectional view of the structure of this utility model;

[0022] Figure 4 This is a top view of the overall structure of this utility model;

[0023] Figure 5 For the present utility model Figure 4 Enlarged view of the structure at point A in the middle.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Base plate; 2. Support frame; 3. Rectangular shell; 4. Rotating disk; 5. Drive rod; 6. Moving rod; 7. Housing; 8. Horizontal plate; 9. Servo motor; 10. Gear; 11. Limiting slide rail; 12. Driven rack; 13. Connecting plate; 14. Abutting strip; 15. Rotating shaft; 16. Drive motor; 17. Drive cone wheel; 18. Driven cone wheel; 19. Vertical plate; 20. Limiting groove; 21. Electric cylinder; 22. Ceramic heating element; 23. Film cutting blade; 24. Limiting plate; 25. Limiting rod; 26. Through groove. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0027] This utility model provides, for example Figure 1-5The wafer protective film cutting device shown includes a base plate 1. Support frames 2 are bolted to both sides of the top of the base plate 1. A rectangular shell 3 is bolted to the upper part of the inner side of the support frame 2. A rotating disk 4 is rotatably connected to the front of the rectangular shell 3 via a bearing. A drive rod 5 is rotatably connected to the front of the rotating disk 4 via a bearing. A moving rod 6 is rotatably connected to the other end of the drive rod 5. A housing 7 is bolted to the bottom of the moving rod 6. A horizontal plate 8 is bolted to the bottom of the housing 7. A servo motor 9 is bolted to the center of the top of the housing 7. A gear 10 is bolted to the output end of the servo motor 9. Limiting slide rails 11 are bolted to both sides of the housing 7. A driven rack 12 is slidably connected to the inner side of the limiting slide rail 11, and the inner side of the driven rack 12 meshes with the surface of the gear 10. A connecting plate 13 is bolted to the bottom of the driven rack 12, and an abutment strip 14 is bolted to the bottom of the connecting plate 13.

[0028] Both sides of the inner cavity of the rectangular shell 3 are rotatably connected to the rotating shaft 15 via bearings. The left side of the rectangular shell 3 is bolted with the drive motor 16, and the left side of the rotating shaft 15 is bolted to the output end of the drive motor 16, so that the drive motor 16 serves as the drive source, driving the rectangular shell 3 to rotate at a constant speed. The drive motor 16 is actually a stepper motor. The number of rotations of the rotating shaft 15 is controlled by setting the basic pulse number and step angle of the motor, thereby controlling the rotation angle of the rotating shaft 15.

[0029] A drive cone wheel 17 is bolted to the surface of the rotating shaft 15, and a driven cone wheel 18 is bolted to the back of the rotating disk 4 through the rectangular shell 3. Both the drive cone wheel 17 and the driven cone wheel 18 are bevel gears 10 and mesh with each other. In actual operation, the drive cone wheel 17 can transmit the rotational power of the drive motor 16 to the rotating disk 4 through the driven cone wheel 18, so that the rotating handle of the rotating disk 4 drives one end of the drive rod 5 to rotate synchronously, thereby controlling the vertical movement of the lower cutting assembly.

[0030] Vertical plates 19 are bolted to the bottom of the rectangular shell 3, and limiting grooves 20 are bolted to the front of the vertical plates 19. The limiting grooves 20 can fix the vertical movement path of the moving rod 6 and keep the moving rod 6 vertically moving inside the limiting grooves 20, thereby improving the stability of the device operation.

[0031] Electric cylinders 21 are bolted to both the front and rear sides of the connecting plate 13, so that the electric cylinders 21 act as a driving source to drive the film cutting blade 23 at its bottom to perform vertical cutting operations.

[0032] A ceramic heating element 22 is attached to the bottom of the electric cylinder 21. A film cutting blade 23 is attached to the bottom of each ceramic heating element 22. The ceramic heating element 22 continuously heats the film cutting blade 23, thereby improving the cutting efficiency of the film cutting blade 23 through thermal cutting. This avoids the surface tension of the protective film being gradually destroyed during cutting due to mechanical cutting, which would lead to edge deformation.

[0033] Limiting plates 24 are bolted to both the front and rear sides of the connecting plate 13, and a limiting rod 25 is slidably connected to the inner side of the limiting plate 24.

[0034] Both sides of the bottom of the horizontal plate 8 are provided with through slots 26, so that the connecting plate 13 can pass through the through slots 26 and connect with the driven rack 12.

[0035] Refer to the instruction manual appendix Figure 1-5 Working principle: During the use of the device, the drive motor 16 drives the rotating shaft 15 to rotate. The rotating shaft 15, in turn, drives the drive cone wheel 17 on its surface to rotate, which in turn drives the driven cone wheel 18 to rotate the rotating disk 4. The rotating disk 4 drives one end of the drive rod 5 to rotate, allowing the moving rod 6 to move vertically inside the limiting groove 20. The extension distance of the electric cylinder 21 is set according to the actual dimensions of the protective film and the wafer. The ceramic heating element 22 continuously heats the cutting blade 23, thus repeatedly and downwardly cutting the protective film. Before starting the electric cylinder 21, the servo motor 9 can be turned on to drive the bottom gear 10. As the gear 10 rotates, it drives the driven racks 12 on both sides to move horizontally in the limiting groove 20. The movement of the driven racks 12 will also drive the connecting plate 13 at the bottom to move. With the cooperation of the bottom abutment strip 14, the connecting plate 13 pushes the lower protective film to both sides to make the surface of the protective film flat, so that the protective film will not be deformed or lifted during the cutting process, and the wafer and the protective film will fit perfectly after the cutting is completed.

[0036] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A wafer dicing apparatus for protective film cutting, comprising a base plate (1), characterized in that: Support frames (2) are bolted to both sides of the top of the base plate (1). A rectangular shell (3) is bolted to the upper part of the inner side of the support frame (2). A rotating disk (4) is rotatably connected to the front of the rectangular shell (3) via a bearing. A drive rod (5) is rotatably connected to the front of the rotating disk (4) via a bearing. A moving rod (6) is rotatably connected to the other end of the drive rod (5). A housing (7) is bolted to the bottom of the moving rod (6). A horizontal plate (8) is bolted to the bottom of the housing (7). A servo motor (9) is bolted to the center of the top of the housing (7). A gear (10) is bolted to the output end of the servo motor (9). Limiting slide rails (11) are bolted to both sides of the housing (7). A driven rack (12) is slidably connected to the inner side of the limiting slide rails (11). The inner side of the driven rack (12) meshes with the surface of the gear (10), and a connecting plate (13) is bolted to the bottom of the driven rack (12), and an abutment strip (14) is bolted to the bottom of the connecting plate (13).

2. The wafer protective film dicing apparatus according to claim 1, characterized in that: The inner cavity of the rectangular shell (3) is rotatably connected to a rotating shaft (15) via bearings on both sides. A drive motor (16) is bolted to the left side of the rectangular shell (3), and the left side of the rotating shaft (15) is bolted to the output end of the drive motor (16).

3. The wafer protective film cutting device according to claim 2, characterized in that: The surface of the rotating shaft (15) is bolted with a drive cone wheel (17), and the back of the rotating disk (4) is bolted with a driven cone wheel (18) through the rectangular shell (3).

4. The wafer protective film dicing apparatus according to claim 1, characterized in that: The bottom of the rectangular shell (3) is bolted with vertical plates (19), and the front of the vertical plates (19) is bolted with limiting grooves (20).

5. The wafer protective film dicing apparatus according to claim 1, characterized in that: Electric cylinders (21) are bolted to both the front and rear sides of the connecting plate (13).

6. The wafer protective film dicing apparatus according to claim 5, characterized in that: The bottom of the electric cylinder (21) is bolted with a ceramic heating element (22), and the bottom of the ceramic heating element (22) is bolted with a cutting blade (23).

7. The wafer protective film dicing apparatus according to claim 1, characterized in that: Limiting plates (24) are bolted to both the front and rear sides of the connecting plate (13), and a limiting rod (25) is slidably connected to the inner side of the limiting plate (24).

8. The wafer protective film dicing apparatus according to claim 1, characterized in that: The bottom of the horizontal plate (8) is provided with through grooves (26) on both sides.

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