Semiconductor chip processing and slitting device

Abstract

The utility model discloses a semiconductor chip processing and slitting device which comprises a bearing table, a cutting mechanism is fixedly installed on the right side face of the bearing table, two guide rails are fixedly connected to the upper surface of the bearing table, the outer surfaces of the two guide rails are jointly connected with two sliding plates in a sliding mode, and the two sliding plates are arranged on the upper surface of the bearing table. A clamping plate is fixedly connected to the outer surface of each sliding plate, square supports are fixedly connected to the front face and the back face of the bearing table, and a main electric push rod is installed in each square support. According to the device, a main electric push rod drives a sliding plate and a clamping plate to achieve rapid positioning and clamping of a chip, an auxiliary electric push rod and a pressing plate of an auxiliary pressing assembly further apply uniform pressure from the top to adapt to fixing of workpieces of different sizes, chip damage is avoided, the chip fixing stability is greatly improved, the chip can be rapidly positioned, and the working efficiency is improved. And meanwhile, the chip is prevented from shifting in the slitting process, and the processing yield is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip processing technology, and in particular to a semiconductor chip processing and slitting device. Background Technology

[0002] A semiconductor chip is an electronic device manufactured on semiconductor materials, typically using silicon as the primary material. Semiconductor chips achieve specific functions by etching and wiring on a semiconductor wafer. Besides silicon, common semiconductor materials include gallium arsenide and germanium.

[0003] The slitting process in semiconductor chip manufacturing is a crucial step. Slitting is an important step in the chip manufacturing process and belongs to the downstream process. Its main purpose is to divide the completed wafer into individual chips according to their size. In the field of semiconductor chip processing, traditional slitting equipment has many problems, such as unstable chip fixation, difficulty in accurately clamping workpieces of different sizes using traditional clamping methods, and the tendency for chips to break due to excessive clamping force or shift during slitting due to insufficient clamping force. It is also difficult to adapt to the slitting of chips of different sizes and shapes, resulting in low chip yield. To address these issues, we propose a semiconductor chip processing slitting device. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor chip processing and slitting device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor chip processing and slitting apparatus includes a support platform. A cutting mechanism is fixedly installed on the right side of the support platform. Two guide rails are fixedly connected to the upper surface of the support platform. Two sliding plates are slidably connected to the outer surfaces of the two guide rails. A clamping plate is fixedly connected to the outer surface of each sliding plate. Square supports are fixedly connected to the front and back of the support platform. A main electric push rod is installed inside each square support. The output ends of the two main electric push rods are fixedly connected to the outer surfaces of the two sliding plates respectively. A secondary pressure assembly is installed on the outer surface of each clamping plate.

[0007] In a further embodiment, each of the secondary pressure components includes an outer frame fixedly connected to the outer surface of the sliding plate, an auxiliary electric push rod is mounted on the upper surface of each outer frame, and a pressure plate is fixedly connected to the output end of each auxiliary electric push rod.

[0008] In a further embodiment, two sliding columns are fixedly connected to the inner wall of each outer frame, and each sliding column is slidably connected to the pressure plate.

[0009] In a further embodiment, a shelf is fixedly connected to the upper surface of the support platform, and a support frame is fixedly connected to the bottom surface of the support platform.

[0010] In a further embodiment, the cutting mechanism includes a side bracket fixedly connected to the outer surface of the support platform, an electric cylinder fixedly connected inside the side bracket, a transmission frame fixedly connected to the output end of the electric cylinder, an outer shell fixedly connected to the outer surface of the transmission frame, a cutting disc rotatably connected inside the outer shell via a rotating shaft, and a drive motor for driving the cutting disc mounted on the outer surface of the outer shell.

[0011] In a further embodiment, a guide rail is fixedly connected to the upper surface of the side bracket, and a long slide bar is slidably connected inside the guide rail, with one end of the long slide bar fixedly connected to the outer surface of the transmission frame.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This device achieves rapid positioning and clamping of chips by driving the sliding plate and clamping plate with the main electric push rod. Furthermore, the auxiliary electric push rod and clamping plate of the auxiliary pressure assembly apply uniform pressure from the top to accommodate the fixing of workpieces of different sizes, avoid chip damage, and greatly improve the chip fixing stability. It can quickly position chips and prevent chip displacement during the slitting process, thereby improving the processing yield. In addition, the electric cylinder and guide rail of the cutting mechanism ensure that the cutting disc moves smoothly and accurately, meeting the high-precision slitting processing requirements of semiconductor chips. Attached Figure Description

[0014] Figure 1 A schematic diagram of the overall main structure of a semiconductor chip processing and slitting device;

[0015] Figure 2 This is a schematic diagram of the cutting mechanism in a semiconductor chip processing and slitting device.

[0016] Figure 3 A side cross-sectional schematic diagram of a semiconductor chip processing and slitting device;

[0017] Figure 4 This is a schematic diagram of the sub-pressure component in a semiconductor chip processing and slitting device.

[0018] In the diagram: 1. Support platform; 2. Support frame; 3. Cutting mechanism; 301. Side bracket; 302. Electric cylinder; 303. Transmission frame; 304. Drive motor; 305. Cutting disc; 306. Guide rail; 307. Long slide bar; 308. Outer shell; 4. Shelf; 5. Guide rail; 6. Sliding plate; 7. Clamping plate; 8. Secondary pressure assembly; 81. Outer frame; 82. Secondary electric push rod; 83. Pressure plate; 84. Round sliding column; 9. Square support; 10. Main electric push rod. Detailed Implementation

[0019] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4In this utility model, a semiconductor chip processing and slitting device includes a support platform 1. A cutting mechanism 3 is fixedly installed on the right side of the support platform 1. Two guide rails 5 are fixedly connected to the upper surface of the support platform 1. Two sliding plates 6 are slidably connected to the outer surfaces of the two guide rails 5. A clamping plate 7 is fixedly connected to the outer surface of each sliding plate 6. Square supports 9 are fixedly connected to the front and back of the support platform 1. A main electric push rod 10 is installed inside each square support 9. The output ends of the two main electric push rods 10 are fixedly connected to the outer surfaces of the two sliding plates 6 respectively. A secondary pressure component 8 is installed on the outer surface of each clamping plate 7. The support platform 1 provides a stable processing platform. The guide rails 5 and sliding plates 6 realize the precise movement and positioning of the clamping plate 7. The main electric push rods 10 provide power. The secondary pressure component 8 further enhances the chip fixing effect. The cutting mechanism 3 completes the slitting work. All parts work together to ensure the stability and accuracy of chip slitting.

[0023] Each secondary pressure assembly 8 includes an outer frame 81 fixedly connected to the outer surface of the sliding plate 6. An auxiliary electric push rod 82 is mounted on the upper surface of each outer frame 81. A pressure plate 83 is fixedly connected to the output end of each auxiliary electric push rod 82. The structure composed of the outer frame 81, auxiliary electric push rod 82, and pressure plate 83 of the secondary pressure assembly 8 allows for precise adjustment of the clamping force according to the different materials and thicknesses of the chip. This ensures the chip is firmly fixed while preventing damage due to excessive pressure, thus improving the yield rate of chip processing. Two sliding pillars 84 are fixedly connected to the inner wall of each outer frame 81. Each sliding pillar 84 is slidably connected to the pressure plate 83. This slidable connection provides guidance and support for the movement of the pressure plate 83, ensuring stability during its up-and-down movement and applying the clamping force evenly to the chip. This prevents damage caused by uneven force on the chip due to the tilt of the pressure plate 83.

[0024] A shelf 4 is fixedly connected to the upper surface of the support platform 1, and a support frame 2 is fixedly connected to the bottom surface of the support platform 1. The shelf 4 provides a temporary placement area for the chips, facilitating loading and arrangement by operators. The support frame 2 enhances the stability of the support platform 1, providing a stable working environment for chip dicing. The dicing mechanism 3 includes a side bracket 301 fixedly connected to the outer surface of the support platform 1. An electric cylinder 302 is fixedly connected inside the side bracket 301. A transmission frame 303 is fixedly connected to the output end of the electric cylinder 302. A housing 308 is fixedly connected to the outer surface of the transmission frame 303. A dicing disc 305 is rotatably connected inside the housing 308 via a rotating shaft. A drive motor for driving the dicing disc 305 is installed on the outer surface of the housing 308. The upper surface of the side support 301 of the machine 304 is fixedly connected to the guide rail 306, and the inside of the guide rail 306 is slidably connected to the long slide bar 307. One end of the long slide bar 307 is fixedly connected to the outer surface of the transmission frame 303. The movement of the cutting disc 305 is precisely controlled by the electric cylinder 302, and at the same time, the drive motor 304 drives the cutting disc 305 to rotate at a speed of 3000 rpm to cut the chip. Moreover, when it moves, the cooperation between the guide rail 306 and the long slide bar 307 provides stable guidance for the horizontal movement of the transmission frame 303 and the cutting disc 305, reducing the shaking and offset during the movement, so that the cutting disc 305 can accurately cut along the predetermined trajectory, further improving the positional accuracy of chip cutting and the flatness of the cutting surface.

[0025] The working principle of this utility model is as follows:

[0026] When slitting semiconductor chips, the chip is placed in a suitable position on the placement plate 4. The main electric push rod 10 is activated, which pushes the sliding plate 6 to move and drives the clamping plate 7 to move, so that the two clamping plates 7 clamp the two sides of the chip. At this time, the auxiliary pressure component 8 is activated, which drives the auxiliary electric push rod 82 to push the pressure plate 83 to slide up and down along the sliding column 84, so that the pressure plate 83 moves up and down to press the clamped chip again, further stabilizing the chip. Then the cutting mechanism 3 can slit the chip, so that there is no displacement of the chip during the slitting process and the dimensional accuracy of the slit chip meets the requirements.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor chip processing and slitting apparatus, characterized in that: The system includes a support platform (1), a cutting mechanism (3) is fixedly installed on the right side of the support platform (1), two guide rails (5) are fixedly connected to the upper surface of the support platform (1), two sliding plates (6) are slidably connected to the outer surfaces of the two guide rails (5), a clamping plate (7) is fixedly connected to the outer surface of each sliding plate (6), a square support (9) is fixedly connected to the front and back of the support platform (1), a main electric push rod (10) is installed inside each square support (9), the output ends of the two main electric push rods (10) are fixedly connected to the outer surfaces of the two sliding plates (6) respectively, and a secondary pressure component (8) is installed on the outer surface of each clamping plate (7).

2. The semiconductor chip processing and slitting apparatus according to claim 1, characterized in that: Each of the secondary pressure components (8) includes an outer frame (81) fixedly connected to the outer surface of the sliding plate (6), and an auxiliary electric push rod (82) is mounted on the upper surface of each outer frame (81). A pressure plate (83) is fixedly connected to the output end of each auxiliary electric push rod (82).

3. The semiconductor chip processing and slitting apparatus according to claim 2, characterized in that: Two sliding columns (84) are fixedly connected to the inner wall of each of the outer frames (81), and each of the sliding columns (84) is slidably connected to the pressure plate (83).

4. The semiconductor chip processing and slitting apparatus according to claim 1, characterized in that: The upper surface of the support platform (1) is fixedly connected to a shelf (4), and the bottom surface of the support platform (1) is fixedly connected to a support frame (2).

5. The semiconductor chip processing and slitting apparatus according to claim 1, characterized in that: The cutting mechanism (3) includes a side bracket (301) fixedly connected to the outer surface of the support platform (1). An electric cylinder (302) is fixedly connected inside the side bracket (301). A transmission frame (303) is fixedly connected to the output end of the electric cylinder (302). An outer shell (308) is fixedly connected to the outer surface of the transmission frame (303). A cutting disc (305) is rotatably connected inside the outer shell (308) via a rotating shaft. A drive motor (304) for driving the cutting disc (305) is installed on the outer surface of the outer shell (308).

6. The semiconductor chip processing and slitting apparatus according to claim 5, characterized in that: The upper surface of the side bracket (301) is fixedly connected to a guide rail (306), and a long slide bar (307) is slidably connected inside the guide rail (306). One end of the long slide bar (307) is fixedly connected to the outer surface of the transmission frame (303).

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