Aerosol-liquid three-phase etching device
By designing five etching zones in a three-phase aerosol etching device, the problem of uneven etching on circuit boards was solved, achieving higher etching uniformity and improved electrical performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN TENGMING ELECTRONICS EQUIP
- Filing Date
- 2025-06-20
- Publication Date
- 2026-05-19
AI Technical Summary
Existing PCB etching equipment has shortcomings in etching uniformity, which leads to the overall performance degradation of the produced PCBs, especially the large difference in etching depth at different locations.
A three-phase etching device using aerosol liquid is employed, comprising five etching zones: a compensation etching zone, a swing etching zone, and a three-phase etching zone. By combining different sprayers and swing devices, uniform etching of the circuit board is achieved.
It improves the uniformity of PCB etching, enhances the overall electrical performance of the PCB, reduces the difference in etching factors, and forms a smoother and more even circuit.
Smart Images
Figure CN224258793U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board etching, and more particularly to a three-phase etching device for aerosol and liquid. Background Technology
[0002] In recent years, with the development of electronic devices towards higher density and miniaturization, circuit board etching processes face higher precision requirements and efficiency challenges. In existing technologies, etching processes mainly remove the copper layer in non-circuit areas of copper-clad laminates using chemical or physical methods, but the following technical bottlenecks still exist in practical applications:
[0003] The uniformity of etching is still not ideal. As a result, the etching depth varies greatly at different locations on the same plane. Traditional etching equipment usually uses 2-3 etching zones to etch the circuit board. The limited number of etching zones and the lack of corresponding means to improve the uniformity of etching lead to the overall performance degradation of the produced circuit boards. Utility Model Content
[0004] To address the aforementioned problems, this invention provides a three-phase etching device that can improve the uniformity of etching and solve the problem of overall performance degradation in the produced circuit boards.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A three-phase etching apparatus for aerosol and liquid processes, characterized in that it comprises at least the following etching zones, and drive wheels for transporting circuit boards within each zone:
[0007] Etching Zone 1: It contains a first fan-shaped sprayer that sprays etching solution onto the surface and bottom of the circuit board. There are multiple first fan-shaped sprayers, and each first fan-shaped sprayer is connected to a pipe. The pipe is equipped with a switch valve (not shown in the figure). (In this embodiment, the fan-shaped sprayers in the same column are connected to the same pipe and controlled by the same switch valve. Of course, this is only one implementation method. There are other implementation methods, such as each row, or each first fan-shaped sprayer is connected to a separate pipe and controlled by a switch valve.)
[0008] Etching Zone 2: It contains a first axial rocking device and a first conical sprayer. The first axial rocking device has a mounting frame that moves along the reciprocating direction X. The first conical sprayer is mounted on the mounting frame and forms a linear first spray zone on the circuit board following the mounting frame.
[0009] Etching three zones: The zone contains a second fan-shaped sprayer and a second axial swing device with the same structure as the first axial swing device but in the opposite direction. The second fan-shaped sprayer is mounted on the mounting bracket of the second axial swing device.
[0010] Etching Zone 4: It contains a third axial swing device and a third fan-shaped sprayer. The third axial swing device has multiple connectors that swing along the reciprocating direction Y. The third fan-shaped sprayer is set on the connectors and forms a linear second spray zone on the circuit board following the connectors. The second spray zone is perpendicular to the first spray zone.
[0011] Etching Zone 5: It contains a three-phase sprayer and a fourth axial swing device with the same structure as the first axial swing device but in the opposite direction. The three-phase sprayer is mounted on the mounting frame of the fourth axial swing device. The three-phase sprayer is a spray sprayer and has multiple pipes that allow air and etching liquid to pass through it respectively.
[0012] The beneficial effects of this utility model are:
[0013] The above-mentioned etching areas can be functionally divided into compensation etching areas (etching area 1), swing etching areas (etching areas 2, 3, and 4), and three-phase etching areas (etching area 5). Some circuit boards have already undergone electroplating before etching. The copper thickness of the circuit board is affected by the precise value of the electroplating process. In order to solve the above problems, the compensation etching area can selectively spray etching liquid onto local copper surfaces by switching valves. This compensation etching liquid area, which aims to reduce copper content, makes the copper surface smoother and the lines etched in the later stage more uniform.
[0014] The etching swing zone is where the basic circuitry is etched out. This involves spraying etchant onto the circuit board in the same back-and-forth direction at different spray speeds. First, the copper surface is etched quickly to form the initial circuitry with a strong vertical copper-biting ability. Then, the circuitry is sprayed at a slower spray speed to reduce lateral etching on the circuitry. The fourth etching zone compensates for the etching ability on the circuitry in another direction. For example, if the second and third etching zones spray the etchant onto the circuitry vertically, then the fourth etching zone sprays the etchant onto the circuitry horizontally. The combination of the two different spraying directions mainly solves the problem of insufficient local etching. This effect of eliminating directional etching differences makes the formed basic circuitry flatter and smoother.
[0015] For etching zone five, a three-phase sprayer was chosen. During the mixing of compressed air and etching solution, chlorine gas is generated. With the full mixing of compressed air and etching solution, the chlorine gas remaining in the etching solution is fully activated, thereby finishing the edges of the circuit board.
[0016] After passing through the above five zones, the wiring is more uniform than before, thereby improving the overall electrical performance.
[0017] The performance difference of the circuit can be judged by the etching factor. In other words, the circuit prepared by this invention has a better etching factor.
[0018] To make this solution easier to understand, the etching factor will now be explained in detail, and the etching factor of existing technologies will be further elaborated, such as... Figure 1 As shown:
[0019] This is a cross-sectional view of a single line. The etching factor of the line needs to be good, which means reducing the difference between the two values of b and c.
[0020] During the etching process, the copper without photoresist film will be etched away by the etching solution. The etching solution is pushed onto the copper surface through a nozzle core under certain pressure. The direction of etching copper is shown by the arrows in the figure. Arrow S2 is called lateral etching, and arrow S1 is called longitudinal etching.
[0021] The etching solution, when applied to the copper surface, enhances the vertical etching ability, leaving little time for horizontal etching.
[0022] Fan-shaped etching is used to perform preliminary modification of the circuitry within the etched area, forming the basic circuitry.
[0023] Three-phase sprayers contain atomized particles that mix gas and liquid. While their etching ability is relatively weak after atomization, they can effectively smooth out burrs (I) at the bottom of circuit lines without affecting the main body of the circuit. This significantly improves the etching factor. (Burrs on the circuit lines need to be smoothed out, as they are one of the main factors affecting the etching factor.)
[0024] Etching zones two, three, and four are all within the swing etching zone, and their length ratios are 50:25:25 respectively. Based on this pattern, we can conclude that the etching time in etch zone two is longer than that in etch zones three and four. Circuits produced in this way are more uniform.
[0025] The three-phase sprayer includes a main body, which contains flow channels and a gas-liquid mixing zone that are respectively connected to the aforementioned pipes. The flow channels are all connected to the gas-liquid mixing zone. The gas-liquid mixing zone has a contraction section with a gradually decreasing flow area. The first flow channel corresponding to the liquid inlet penetrates into the contraction section. Under this design, the air pressure in the contraction section is very high. At the moment the etching liquid flows out, the etching liquid is instantly dispersed. This method forms a uniform atomized particle shape, and the mixing effect is better than that of traditional fan-shaped sprayers. In traditional spray sprayers, the gas-liquid mixing is at the front end of the gas-liquid mixing zone.
[0026] The third-axis oscillating mechanism used in the fourth etching zone has a larger oscillation amplitude, mainly due to the requirements of the etching process, which necessitates the sprayer to oscillate back and forth at a 15° arc angle. Specifically, the third-axis oscillating mechanism includes a first motor, a first cam plate, a first main tie rod, a secondary tie rod, and a first nozzle. Multiple first nozzles are provided, and each nozzle is rotatably connected to the inner wall of the fourth etching zone. Each nozzle is fitted with a connecting plate for driving, and these connecting plates are connected by secondary tie rods. One end of a first rocker arm is rotatably connected to a connecting plate, and the other end is rotatably connected to the main tie rod. After the rotation point (first nozzle) is confirmed, the dragging of the connecting plate by the first rocker arm causes both the connecting plate and the first nozzle to rotate. Since the connecting plates are connected by secondary tie rods, the secondary tie rod... Under the action of the motor, all connecting plates move in the same way, driving the first nozzle to move back and forth in the same direction. The first cam plate is provided with a horizontal cam groove, and the motor shaft is provided with a second rocker arm. Under the action of the motor, the outer end of the second rocker arm has a circular movement trajectory. The first cam plate is perpendicular to the horizontal plane. The first cam plate is fitted onto the outer end of the second rocker arm through the cam groove. When the second rocker arm moves, the entire first cam plate moves up and down. The first main pull rod connected to the second rocker arm also moves up and down with the first cam plate. This structure makes it easier to achieve a 15° arc swing back and forth, which allows the water jet from the fan-shaped nozzle to hit the circuit at different angles, thereby better penetrating the bottom of the circuit and accelerating the etching of the residual copper at the bottom of the circuit, resulting in a better etching factor.
[0027] The above description only refers to the spray section above the circuit board. In this specific embodiment, a spray section with the same structure is also included below the circuit board.
[0028] The rocker arm mechanism used in etching zones two, three, and five includes the following structure:
[0029] The system comprises a second motor, a second main pull rod, a rotating rod, a second cam disc, and a second nozzle. Multiple second nozzles are provided and mounted on a mounting frame. Rollers are located on both sides of the mounting frame, and these rollers are slidably connected to a slide rail within the etching area. The second motor is located outside the etching area, and its motor shaft is coaxially connected to the rotating rod. The second cam disc is fitted onto the surface of the rotating rod. One end of the second main pull rod is rotatably connected to the surface of the mounting frame, while the other end is embedded in the second cam disc. Under the action of the second motor, the rotating rod is driven to rotate. The cam disc is connected to the second main pull rod, allowing the entire second cam disc to perform circular motion while maintaining a constant orientation. This implementation achieves the effect of moving sprayers left and right in batches.
[0030] Each sprinkler in each zone is connected to its respective second spray pipe.
[0031] In this specific embodiment, the above-mentioned rocker arm mechanism is provided in two parts, which spray etching liquid onto the front and back sides of the circuit board in etching zones two, three and five respectively.
[0032] In etching zones two, three, four, and five, each section is equipped with a negative pressure device to address the pooling effect on the circuit board surface during the spraying process. This device draws out excess etching solution from the board surface, increasing suction for better results, ensuring the spray effectively reaches the circuit board and facilitating uniform copper etching. Below the negative pressure device, a roller that rotates at a constant speed effectively propels the circuit board, preventing it from being stuck and jammed at the negative pressure point.
[0033] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model. Attached Figure Description
[0034] Figure 1 This is a schematic diagram used to explain the etching factor.
[0035] Figure 2 This is a schematic diagram of the present invention in cross-section.
[0036] Figure 3 This is a schematic diagram of the etched area 2.
[0037] Figure 4 This is a cross-sectional view of the etched four regions from another direction of this utility model.
[0038] Figure 5 yes Figure 4 Usage status diagram.
[0039] Figure 6 yes Figure 4 Enlarged diagram of point A.
[0040] Figure 7 This is a cross-sectional view of a three-phase sprayer.
[0041] Figure 8 yes Figure 7 Enlarged diagram of point B.
[0042] Figure 9 This is a schematic diagram of the relationship between the circuit board and the roller. Detailed Implementation
[0043] Please see Figure 1-9As shown, a three-phase etching apparatus for aerosol and liquid processes is characterized by comprising at least the following etching zones, and drive wheels 1 for transporting circuit boards 3 within each zone:
[0044] Etching Zone 100: It contains a first fan-shaped sprayer 101 that sprays etching liquid onto the surface and bottom of the circuit board 3. There are multiple first fan-shaped sprayers 101, and each first fan-shaped sprayer 101 is connected to a pipe. A switch valve (not shown in the figure) is provided on the pipe. (In this embodiment, the fan-shaped sprayers 101 in the same column are connected to the same pipe and controlled by the same switch valve. Of course, this is only one implementation method. There are other implementation methods, such as each row, or each first fan-shaped sprayer 101 is connected to a separate pipe and controlled by a switch valve.)
[0045] Etching Zone 200: It contains a first axial rocking device 202 and a first conical sprayer 201. The first axial rocking device 202 has a mounting frame 202-a that moves along the reciprocating direction X. The first conical sprayer 201 is mounted on the mounting frame 202-a and forms a linear first spraying zone on the circuit board 3 following the mounting frame 202-a.
[0046] Etching three zones 300: It contains a second fan-shaped sprayer 301 and a second axial swing device 302 with the same structure as the first axial swing device 202 but in the opposite direction. The second fan-shaped sprayer 301 is mounted on the mounting bracket of the second axial swing device 302.
[0047] Etching Zone 400: It contains a third axial swing device 402 and a third fan-shaped sprayer 401. The third axial swing device 402 has multiple connectors 402g that swing along the reciprocating direction Y. The third fan-shaped sprayer 401 is disposed on the connectors 402g and forms a linear second spray zone on the circuit board 3 following the connectors 402g. The second spray zone is perpendicular to the first spray zone.
[0048] Etching Zone 500: It contains a three-phase sprayer 501 and a fourth axial swing device 502 with the same structure as the first axial swing device 202 but in the opposite direction. The three-phase sprayer 501 is mounted on the mounting bracket of the fourth axial swing device 502. The three-phase sprayer 501 is a spray sprayer and has multiple pipes that respectively introduce air and etching liquid.
[0049] The beneficial effects of this utility model are:
[0050] The above-mentioned etching areas can be functionally divided into compensation etching areas (etching area 1, 100), swing etching areas (etching area 2, 200, 300, and 400), and three-phase etching areas (etching area 5, 500). Before etching, some circuit boards 3 have undergone electroplating. The copper thickness of circuit board 3 is affected by the precise value of the electroplating process. In order to solve the above problems, the compensation etching area can selectively spray etching liquid onto local copper surfaces through a switch valve. This compensation etching liquid area, which aims to reduce copper content, makes the copper surface smoother and the etched lines more uniform in the later stage.
[0051] The etching swing zone is where the basic circuit is etched out. This involves spraying etchant onto the circuit board 3 in the same back-and-forth direction at different spray speeds. First, the copper surface is etched quickly to form the initial circuit with a strong vertical copper biting ability. Then, the circuit is sprayed at a slower spray speed to reduce lateral etching on the circuit. Etching zone 400 compensates for the etching ability on the circuit in another direction. For example, if etching zone 200 and zone 300 spray the etchant vertically onto the circuit, then etching zone 400 sprays the etchant horizontally onto the circuit. The combination of the two different spraying directions mainly solves the problem of insufficient local etching. This effect of eliminating directional etching differences makes the formed basic circuit flatter and smoother.
[0052] For etching zone 500, a three-phase sprayer 501 was selected. During the mixing of compressed air and etching solution, chlorine gas is generated. With the thorough mixing of compressed air and etching solution, the chlorine gas remaining in the etching solution is fully released, thereby finishing the edges of the circuit board 3.
[0053] After passing through the above five zones, the wiring is more uniform than before, thereby improving the overall electrical performance.
[0054] The performance difference of the circuit can be judged by the etching factor. In other words, the circuit prepared by this invention has a better etching factor.
[0055] To make this solution easier to understand, the etching factor will now be explained in detail, and the etching factor of existing technologies will be further elaborated, such as... Figure 1 As shown:
[0056] This is a cross-sectional view of a single line. The etching factor of the line needs to be good, which means reducing the difference between the two values of b and c.
[0057] During the etching process, the copper not covered by the photoresist film 5 will be etched away by the etching solution. The etching solution is applied to the copper surface through a nozzle core under certain pressure. The etching direction of the copper is shown in the figure above. Arrow S1 is called lateral etching, and arrow S2 is called longitudinal etching.
[0058] The etching solution, when applied to the copper surface, enhances the vertical etching ability, leaving little time for horizontal etching.
[0059] Fan-shaped etching is used to perform preliminary modification of the circuitry within the etched area, forming the basic circuitry.
[0060] The three-phase sprayer 501 contains atomized particles that mix gas and liquid. After atomization, its etching ability is relatively weak, but it can effectively smooth out burrs (I) at the bottom of the circuit without affecting the main body of the circuit. This significantly improves the etching factor. (Burrs on the circuit need to be smoothed out, as they are one of the main factors affecting the etching factor).
[0061] Etching zones 200, 300, and 400 are all within the swing etching zone, and their length ratios are 50:25:25 respectively. Under this pattern, we can know that the etching time of the circuit board 3 in etching zone 200 is longer than that in etching zones 300 and 400. The circuit produced in this way is more uniform.
[0062] The three-phase sprayer 501 includes a body, which contains a flow channel 501-a and a gas-liquid mixing zone 501-b that are respectively connected to the aforementioned pipes. The flow channel 501-a is connected to the gas-liquid mixing zone 501-b. The gas-liquid mixing zone 501-b has a contraction section 501-c with a gradually decreasing flow area. The first flow channel 501-a' corresponding to the liquid inlet penetrates into the contraction section 501-c. Under this design, the air pressure in the contraction section 501-c is very high. At the moment the etching liquid flows out, the etching liquid is instantly dispersed. This method forms a uniform atomized particle shape, and the mixing effect is better than that of the traditional fan-shaped sprayer. In the traditional sprayer, the gas-liquid mixing is at the front end of the gas-liquid mixing zone 501-b.
[0063] The third-axis oscillating mechanism 402 used in the etching zone 400 has a larger oscillation amplitude, mainly due to the requirements of the etching process, which necessitates the sprayer to oscillate back and forth at a 15° arc angle. Specifically, the third-axis oscillating mechanism 402 includes a first motor 402a, a first cam disk 402b, a first main pull rod 402c, a secondary pull rod 402d, and a first nozzle 402e. Multiple first nozzles 402e are provided, and the first nozzles 402e are rotatably connected to the inner wall of the etching zone 400. Each of the first nozzles 402e is fitted with a connecting plate 402g for driving. The connecting plates 402g are connected to each other via a secondary pull rod 402d. One end of the first rocker arm 402f is rotatably connected to the connecting plate 402g, and the other end of the first rocker arm 402f is rotatably connected to the main pull rod 402c. After the rotation point (first nozzle 402e) is confirmed, the dragging of the connecting plate 402g by the first rocker arm 402f will cause the connecting plate 402g and the first nozzle 402e to rotate. The connecting plates 402g are connected to each other via a secondary pull rod 402d. Connected by the tie rod 402d, under the action of the auxiliary tie rod 402d, all connecting plates 402g drive the first nozzle 402e to reciprocate in the same direction in the same manner. The first cam disc 402b is provided with a transverse cam groove 402b', and the motor shaft is provided with a second rocker arm 402h. Under the action of the motor, the outer end of the second rocker arm 402h has a circular movement trajectory. The first cam disc 402b is perpendicular to the horizontal plane, and the first cam disc 402b passes through the cam groove 402b'. The first cam disk 402b is mounted on the outer end of the second rocker arm 402h. When the second rocker arm 402h moves, the entire first cam disk 402b moves up and down. The first main pull rod 402c, which is connected to the second rocker arm 402h, also moves up and down with the first cam disk 402b. This structure makes it easier to achieve a 15° angled arc swing back and forth, which allows the water jet from the fan-shaped nozzle to hit the circuit at different angles, thereby better penetrating the bottom of the circuit and accelerating the etching of the residual copper at the bottom of the circuit, resulting in a better etching factor.
[0064] It should be noted that etching zone 400 is used to compensate for the etching capability of the lines in one direction outside of circuit board 3. This avoids the problem of uneven line width caused by a single oscillation direction. At this stage, circuit board 3 has formed the basic lines; only the burrs at the bottom (I) need to be refined.
[0065] The above description only refers to the spray section above the circuit board 3. In this specific embodiment, a spray section with the same structure is also included below the circuit board 3.
[0066] The rocker arm mechanism used in etching zones two, three, and five includes the following structure:
[0067] The system comprises a second motor 203, a second main pull rod 204, a rotating rod 205, a second cam disc 206, and a second nozzle 207. Multiple second nozzles 207 are provided and mounted on a mounting frame 202-a. Rollers are located on both sides of the mounting frame 202-a, and these rollers are slidably connected to a slide rail within the etching area. The second motor 203 is located outside the etching area, and its motor shaft is coaxially connected to the rotating rod 205. The second cam disc 206 is fitted onto the surface of the rotating rod 205. One end of the second main pull rod 204 is rotatably connected to the surface of the mounting frame 202-a, and the other end is embedded in the second cam disc 206. Under the action of the second motor 203, the rotating rod 205 is driven to rotate. The cam disc is connected to the second main pull rod 204, allowing the entire second cam disc 206 to perform circular motion while maintaining its orientation. This implementation achieves the effect of moving sprayers left and right in batches.
[0068] Therefore, it can be understood that the sprayers in etching zones two, three, and five are moving laterally.
[0069] The sprayers corresponding to the second etched area: the movement range is within ±20mm, the distance between the sprayers and circuit board 3 is within ±50mm, and the spacing between the sprayers is within ±40mm.
[0070] The sprayers corresponding to the three etched areas: the movement range is within ±45mm, the distance between the sprayers and circuit board 3 is within ±110mm, and the spacing between the sprayers is within ±50mm.
[0071] Each sprayer in each zone is connected to its respective second spray pipe 207.
[0072] In this specific embodiment, there are two rocker arm mechanisms, which spray etching liquid onto both sides of the circuit board 3 in etching zones two, three, and five, respectively.
[0073] In etching zones two, three, four, and five, each section is equipped with a negative pressure device 2 to address the pooling effect on the surface of the circuit board 3 during the spraying process. This device draws out the chemical solution from the board surface, increasing suction to ensure effective spraying and uniform etching of the copper surface. Below the negative pressure device 2, a rotating roller 4 is installed. The roller 4 effectively propels the circuit board 3, preventing it from being stuck at the negative pressure device 2 and causing jamming.
[0074] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.
Claims
1. A gas-liquid three-phase etching apparatus, characterized in that, It includes at least the following etched areas, and drive wheels for transporting circuit boards within each area: Etching Zone 1: It contains a first fan-shaped sprayer that sprays etching solution onto the surface and bottom of the circuit board. There are multiple first fan-shaped sprayers, and the first fan-shaped sprayers are connected to pipes with switch valves on the pipes. Etching Zone 2: It contains a first axial rocking device and a first conical sprayer. The first axial rocking device has a mounting frame that moves along the reciprocating direction X. The first conical sprayer is mounted on the mounting frame and forms a linear first spray zone on the circuit board following the mounting frame. Etching three zones: The zone contains a second fan-shaped sprayer and a second axial swing device with the same structure as the first axial swing device but in the opposite direction. The second fan-shaped sprayer is mounted on the mounting bracket of the second axial swing device. Etching Zone 4: It contains a third axial swing device and a third fan-shaped sprayer. The third axial swing device has multiple connectors that swing along the reciprocating direction Y. The third fan-shaped sprayer is set on the connectors and forms a linear second spray zone on the circuit board following the connectors. The second spray zone is perpendicular to the first spray zone. Etching Zone 5: It contains a three-phase sprayer and a fourth axial swing device with the same structure as the first axial swing device but in the opposite direction. The three-phase sprayer is mounted on the mounting bracket of the fourth axial swing device. The three-phase sprayer is a spray sprayer and has multiple pipes that allow air and etching liquid to pass through.
2. The aerosol-liquid three-phase etching apparatus according to claim 1, characterized in that, Etching zones two, three, and four are all located within the swing etching zone, and their length ratios are 50:25:25, respectively.
3. The aerosol-liquid three-phase etching apparatus according to claim 1, characterized in that, The three-phase sprayer includes a body, which contains flow channels and a gas-liquid mixing zone that are respectively connected to the aforementioned pipes. The flow channels are all connected to the gas-liquid mixing zone. The gas-liquid mixing zone has a contraction section with a gradually decreasing flow area. The first flow channel corresponding to the liquid inlet is inserted into the contraction section.
4. The aerosol-liquid three-phase etching apparatus according to claim 1, characterized in that, The third-axis rocking mechanism used in the fourth etching zone has a larger swing amplitude. The third-axis rocking mechanism includes a first motor, a first cam disk, a first main tie rod, a secondary tie rod, and a first nozzle. There are multiple first nozzles, which are rotatably connected to the inner wall of the fourth etching zone. Each first nozzle is fitted with a drive connecting plate, and the connecting plates are connected to each other by a secondary tie rod. One end of the first rocker arm is rotatably connected to the connecting plate, and the other end of the first rocker arm is rotatably connected to the main tie rod. The connecting plates are also connected to each other by a secondary tie rod. The first cam disk has a transverse cam groove, and the motor shaft has a second rocker arm. The outer end of the second rocker arm has a circular movement trajectory. The first cam disk is perpendicular to the horizontal plane. The first cam disk is fitted onto the outer end of the second rocker arm through the cam groove. When the second rocker arm moves, the entire first cam disk moves up and down. The first main tie rod connected to the second rocker arm also moves up and down with the first cam disk.
5. The aerosol-liquid three-phase etching apparatus according to claim 1, characterized in that, The rocker arm mechanism used in etching zones two, three, and five includes the following structure: The system comprises a second motor, a second main pull rod, a rotating rod, a second cam disc, and a second nozzle. Multiple second nozzles are provided and mounted on a mounting frame. Rollers are located on both sides of the mounting frame and are slidably connected to a slide rail within the etching area. The second motor is located outside the etching area, and its motor shaft is coaxially connected to the rotating rod. The second cam disc is fitted onto the surface of the rotating rod. One end of the second main pull rod is rotatably connected to the surface of the mounting frame, while the other end is embedded in the second cam disc. The cam disc is connected to the second main pull rod, allowing the entire second cam disc to perform circular motion while maintaining its orientation.
6. The aerosol-liquid three-phase etching apparatus according to claim 5, characterized in that, The aforementioned rocker arm mechanism has two parts, which spray etching liquid onto both sides of the circuit board in etching zones two, three, and five, respectively.
7. The aerosol-liquid three-phase etching apparatus according to claim 1, characterized in that, In the etching zones two, three, four, and five, each section is equipped with a negative pressure device, and below the negative pressure device is a rolling wheel that can rotate at a constant speed.