Horizontal electroplating synchronous follow-up equipment

Abstract

The utility model provides horizontal electroplating synchronous follow-up equipment, which relates to the technical field of electroplating, can solve the problems of misalignment and instability of contact between a cathode conductive mechanism and a silicon wafer, and comprises an electroplating bath, a transmission mechanism, a conductive mechanism and a follow-up mechanism. Wherein the electroplating bath comprises a feeding end and a discharging end, and the direction from the feeding end to the discharging end is a first direction; an electroplating area is arranged between the feeding end and the discharging end. The transmission mechanism is arranged in the electroplating bath in the first direction and used for conveying a workpiece to be electroplated. A conductive brush is arranged at the bottom of the conductive mechanism and used for making contact with the upper surface of the workpiece to be electroplated and achieving electroplating. The follow-up mechanism is connected with the conductive mechanism and used for controlling the conductive mechanism to reciprocate in the electroplating area in the first direction. When the to-be-plated workpiece enters the electroplating bath, under the control of the follow-up mechanism, the conductive mechanism makes contact with the upper surface of the to-be-plated workpiece when the to-be-plated workpiece enters the electroplating area, and the conductive mechanism synchronously moves in the first direction till the to-be-plated workpiece leaves the electroplating area.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to a horizontal electroplating synchronous follow-up device. Background Technology

[0002] Horizontal electroplating is a method of electroplating in which the workpiece to be electroplated is placed parallel to the surface of the electroplating solution. It includes a cathode and an anode. Generally, the cathode contacts the workpiece, while the anode introduces electricity into the electroplating solution. During electroplating, the silicon wafer serves as the workpiece, and the conductive mechanism on the horizontal electroplating tank acts as the cathode, making rigid contact with the silicon wafer. Existing electroplating equipment typically has electroplating zones arranged sequentially within the horizontal electroplating tank. The cathode conductive mechanism is fixedly located within each electroplating zone, so that when the silicon wafer enters the electroplating zone of the tank, the cathode conductive mechanism performs the electroplating.

[0003] However, during the electroplating process, because the cathode conductive mechanism is fixed, the silicon wafer moves relative to the cathode conductive mechanism to the electroplating area, which can cause misalignment when the cathode conductive mechanism contacts the silicon wafer. In addition, the fixed setting of the cathode conductive mechanism can easily cause rigid contact with the silicon wafer to be electroplated. Excessive pressure on the silicon wafer can cause the conductive mechanism to be submerged in the electroplating solution, thereby affecting the stability of conductivity and the electroplating effect. Utility Model Content

[0004] This invention aims to at least partially solve one of the aforementioned technical problems. To this end, this invention provides a horizontal electroplating synchronous follow-up device to solve the problems of misalignment and instability in the contact between the cathode conductive mechanism and the silicon wafer.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] This utility model embodiment provides a horizontal electroplating synchronous follow-up device, including:

[0007] An electroplating tank, comprising a loading end and a unloading end, wherein the direction from the loading end to the unloading end is a first direction; an electroplating zone is provided between the loading end and the unloading end;

[0008] A transmission mechanism is disposed in the electroplating tank along the first direction, and the transmission mechanism is used to convey the workpiece to be plated.

[0009] A conductive mechanism, wherein a conductive brush is provided at the bottom of the conductive mechanism for contacting the upper surface of the workpiece to be plated and realizing electroplating;

[0010] A follower mechanism, connected to the conductive mechanism, is used to control the conductive mechanism to reciprocate along a first direction within the electroplating area;

[0011] When the workpiece to be plated enters the electroplating tank, under the control of the follow-up mechanism, the conductive mechanism contacts the upper surface of the workpiece to be plated when it enters the electroplating area, and moves synchronously along the first direction until the workpiece to be plated leaves the electroplating area.

[0012] Furthermore, the workpiece to be plated includes at least one silicon wafer floating on the surface of the electroplating tank.

[0013] Furthermore, the follower mechanism includes:

[0014] A frame, which is mounted above the electroplating tank;

[0015] A horizontal moving module is disposed on the frame along the first direction and is located above the electroplating tank;

[0016] The conductive mechanism reciprocates horizontally along the first direction under the drive of the horizontal moving module.

[0017] Furthermore, the follower mechanism also includes:

[0018] A lifting module is provided on the moving end of the horizontal moving module, and the moving end of the lifting module is connected to the conductive mechanism;

[0019] The lifting module drives the conductive mechanism to move up and down to approach or move away from the upper surface of the workpiece to be plated.

[0020] Furthermore, the conductive mechanism includes:

[0021] At least one conductive component, all of which are connected to the moving end of the follower mechanism; the conductive brush is provided at the bottom of the conductive component;

[0022] The distribution of the conductive components corresponds one-to-one with the distribution of silicon wafers within the workpiece to be plated.

[0023] Furthermore, the conductive mechanism includes:

[0024] Mounting plate, the mounting plate being connected to the moving end of the follower mechanism;

[0025] At least one conductive component, all of which are connected to the moving end of the follower mechanism; the conductive brush is provided at the bottom of the conductive component;

[0026] A light source is disposed in the space between the mounting plate and the conductive component, and is used to irradiate the silicon wafer through the conductive component to achieve photo-induced electroplating.

[0027] Furthermore, the conductive component has multiple mounting holes along its thickness direction, and the conductive brush is detachably connected to the mounting holes.

[0028] Furthermore, the conductive component is made of a transparent material.

[0029] Furthermore, the light source is located at the bottom of the mounting plate, and the light source does not contact the conductive component.

[0030] Furthermore, it also includes a first detection device and a second detection device;

[0031] The first detection device and the second detection device are respectively located at the loading end and the unloading end, and are used to detect the workpiece to be plated on the transmission mechanism.

[0032] The technical solution of this utility model has at least the following beneficial effects:

[0033] The conductive mechanism of the horizontal electroplating synchronous follow-up device in this embodiment can move horizontally with the silicon wafer in the electroplating tank and perform electroplating under the drive of the follow-up mechanism. It can ensure accurate positioning when the conductive mechanism contacts the silicon wafer during electroplating and maintain a long electroplating cycle. Compared with the electroplating time using the roller brush method in the prior art, the time is greatly increased, and the electroplating efficiency can be greatly improved.

[0034] In addition, in the embodiments of this application, the conductive mechanism of the horizontal electroplating synchronous follow-up device is adjusted by the follow-up mechanism to lower its height, thereby ensuring that the conductive mechanism flexibly contacts the silicon wafer to be electroplated, avoiding the situation where the conductive mechanism excessively presses down on the silicon wafer to immerse the conductive mechanism in the electroplating solution, ensuring that the conductive mechanism remains dry, and effectively improving the stability of conductivity and the electroplating effect.

[0035] The conductive mechanism of the horizontal electroplating synchronous follow-up device of this application can move back and forth in the horizontal direction in the electroplating tank, thereby continuously performing electroplating processes on multiple batches of silicon wafers, effectively improving production efficiency and equipment space utilization.

[0036] In addition, the bottom of the conductive mechanism of the horizontal electroplating synchronous follow-up device of this application is detachably equipped with multiple conductive brushes, which can improve the replacement efficiency of abnormal conductive brushes, thereby further ensuring the electroplating efficiency of the conductive mechanism and the silicon wafer to be electroplated.

[0037] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0038] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale.

[0039] In the attached image:

[0040] Figure 1 This is a schematic diagram of the structure of the horizontal electroplating synchronous follow-up device according to an embodiment of the present utility model;

[0041] Figure 2 for Figure 1 Enlarged schematic diagram of region a in the middle;

[0042] Figure 3 This is a schematic diagram of the follower mechanism in the horizontal electroplating synchronous follower equipment according to an embodiment of the present utility model;

[0043] Figure 4 for Figure 3 Enlarged schematic diagram of region b in the middle;

[0044] Figure 5 This is a schematic diagram of the conductive mechanism in the horizontal electroplating synchronous follow-up device according to an embodiment of the present utility model;

[0045] Figure 6 This is a schematic diagram of a conductive component in a horizontal electroplating synchronous follow-up device according to an embodiment of the present invention;

[0046] Figure 7 This is another structural schematic diagram of the conductive component in the horizontal electroplating synchronous follow-up device according to an embodiment of the present utility model.

[0047] Explanation of reference numerals in the attached figures:

[0048] Electroplating tank - 100; Loading end - 110; Unloading end - 120; Electroplating area - 130; Transmission mechanism - 200; Transmission roller - 210; Driven gear - 211; Drive shaft - 220; Driving gear - 221; Conductive mechanism - 300; Conductive component - 310; Conductive brush - 311; Mounting plate - 320; Connecting rod - 330; Light source - 340; Follow-up mechanism - 400; Frame - 410; Horizontal moving module - 420; Lifting module - 430; First detection device - 500; Second detection device - 600. Detailed Implementation

[0049] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0050] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0051] As a specific embodiment of this utility model, such as Figure 1 and Figure 3 As shown, this utility model embodiment provides a horizontal electroplating synchronous follow-up device, which may include: an electroplating tank 100, a transmission mechanism 200, a conductive mechanism 300, and a follow-up mechanism 400. The electroplating tank 100 includes a loading end 110 and a unloading end 120, with the direction from the loading end 110 to the unloading end 120 being a first direction. An electroplating zone 130 is provided between the loading end and the unloading end. The transmission mechanism 200 is disposed within the electroplating tank 100 along the first direction and is used to transport the workpiece to be electroplated. A conductive brush 311 is provided at the bottom of the conductive mechanism 300 for contacting the upper surface of the workpiece to be electroplated and achieving electroplating. The follow-up mechanism 300 is disposed above the electroplating tank 100 and is connected to the conductive mechanism 300, used to control the conductive mechanism 300 to reciprocate along the first direction within the electroplating zone 130. When the workpiece to be plated enters the electroplating tank, under the control of the follower mechanism 400, the conductive mechanism 300 contacts the upper surface of the workpiece to be plated when the workpiece enters the electroplating zone 130, and moves synchronously along the first direction until the workpiece leaves the electroplating zone.

[0052] Specifically, the horizontal electroplating synchronous follow-up equipment of this application is provided with an electroplating tank 100. One end of the electroplating tank 100 is formed as a loading end 110, which is used to transport the workpiece to be plated into the electroplating tank 100 from there. The other end opposite the loading end is formed as a unloading end 120, which is used to unload the electroplated workpiece from the electroplating tank 100 from there. The direction from the loading end 110 to the unloading end 120 is formed as a first direction, which is the conveying direction of the workpiece to be plated. A transmission mechanism 200 is provided in the electroplating tank 100 along the first direction to transport the workpiece to be plated from the loading end 110 to the unloading end 120. A follower mechanism 400 is installed above the electroplating tank 100. During electroplating, the conductive mechanism 300 descends under the drive of the follower mechanism 400, and its conductive brush 311 contacts the workpiece to be plated on the transmission mechanism 200 to perform electroplating. The conductive brush 311 moves horizontally synchronously along the first direction on the transmission mechanism 200 along with the workpiece to be plated until the workpiece leaves the electroplating area 130. After electroplating is completed, the conductive mechanism 300 is reset under the drive of the follower mechanism 400.

[0053] In other words, the conductive mechanism 300 of the horizontal electroplating synchronous follow-up device in this embodiment of the application can move horizontally along the first direction and perform electroplating under the drive of the follow-up mechanism 400, accompanying the workpiece to be plated in the electroplating tank 100. This ensures accurate positioning of the conductive mechanism 300 when it contacts the silicon wafer during electroplating. In addition, the conductive mechanism 300 of the horizontal electroplating synchronous follow-up device in this embodiment of the application has its descent height precisely adjusted by the follow-up mechanism 400, thereby ensuring that the conductive brush 311 of the conductive mechanism 300 flexibly contacts the workpiece to be plated, preventing the conductive mechanism 300 from applying excessive pressure and immersing the workpiece below the surface of the electroplating liquid, ensuring that the conductive mechanism 300 remains dry, and effectively improving the stability of conductivity and the electroplating effect.

[0054] It should be noted that the workpiece to be plated includes at least one silicon wafer floating on the surface of the electroplating tank.

[0055] As a specific embodiment of this utility model, such as Figure 1 and Figure 3 As shown, the electroplating tank 100 includes an electroplating area 130, which is located below the follower mechanism 400. A first predetermined position is formed on the side of the electroplating area 130 near the loading end 110, and a second predetermined position is formed on the side of the electroplating area 130 near the unloading end 120. The first predetermined position is the position the silicon wafer needs to reach when electroplating begins, and the second predetermined position is the position the silicon wafer needs to reach when electroplating ends. When the silicon wafer is conveyed to the first predetermined position by the transmission mechanism 200, the follower mechanism 400 controls the conductive mechanism 300 to descend and contact the silicon wafer for electroplating, and drives the conductive mechanism 300 to move synchronously with the silicon wafer on the transmission mechanism 200 to the second predetermined position. At this point, electroplating is complete, and the conductive mechanism 300 is controlled to return to its initial position, repeating this process.

[0056] Specifically, after the silicon wafer is placed in from the loading end 110, it enters the electroplating tank 100 by the transmission mechanism 200. The follower mechanism 400 is controlled by the software program to position and track the silicon wafer entering the electroplating tank 100. Based on the speed of the transmission mechanism 200, the position of the silicon wafer can be tracked. When the silicon wafer is about to move to the first predetermined position (that is, the area of ​​the electroplating zone 130 below the position of the conductive mechanism 300 on the follower mechanism 400 that is closest to the loading end 110), the follower mechanism 400 drives the conductive mechanism 300 to descend. When the silicon wafer is in the first predetermined position, the conductive brush 311 can press on the upper surface of the silicon wafer. At this time, the conductive brush 311 applies a negative charge to the upper surface of the silicon wafer, and then the electroplating begins. Then, the follower mechanism 400 drives the conductive mechanism 300 to move horizontally along the first direction to perform electroplating in the electroplating area 130 of the electroplating tank 100 until the silicon wafer reaches the second predetermined position (i.e., the area of ​​the electroplating area 130 below the position of the conductive mechanism 300 on the follower mechanism 400 closest to the unloading end 120), completing the electroplating. Throughout this process, the conductive brush remains in contact with the silicon wafer, enabling long-term continuous electroplating and thus significantly improving the final electroplating efficiency. The silicon wafer is transferred to the unloading end 120 by the transmission mechanism 200 for the next process, while the conductive mechanism 300, driven by the follower mechanism 400, rises and moves horizontally back to the origin to perform electroplating on the next group of silicon wafers. This process is repeated continuously, allowing for multiple batches of electroplating without interruption.

[0057] Furthermore, the conductive mechanism 300 of the horizontal electroplating synchronous follow-up equipment in this application embodiment can reciprocate in the horizontal direction within the electroplating tank 100, thereby enabling uninterrupted electroplating of multiple batches of silicon wafers, effectively improving production efficiency and equipment space utilization.

[0058] As a specific embodiment of this utility model, such as Figure 1 and Figure 2 As shown, the transmission mechanism 200 may include a plurality of transmission rollers 210 and a drive shaft 220. The plurality of transmission rollers 210 are spaced apart along a first direction at the opening of the electroplating tank 100, forming a conveyor line to transport silicon wafers. The drive shaft 220 is located on one side of the opening of the electroplating tank 100, and connects to the plurality of transmission rollers 210 to drive them to rotate synchronously.

[0059] Specifically, in this embodiment, the transmission mechanism 200 has multiple transmission rollers 210 spaced apart along a first direction at the opening of the electroplating tank 100. Each transmission roller 210 is positioned perpendicular to the first direction, thus forming a conveyor line to facilitate the placement and transport of silicon wafers on its upper surface. A drive shaft 220 is also provided on one side of the opening of the electroplating tank 100, connecting to the input ends of each transmission roller 210 to drive them to rotate synchronously, thereby achieving stability in the silicon wafer transport.

[0060] As a specific embodiment of this utility model, such as Figure 2 As shown, the drive shaft 220 is located on one side of the opening of the electroplating tank 100 along the first direction. A plurality of drive gears 221 are spaced apart on the drive shaft 220. One end of each transmission roller 210 is provided with a driven gear 211, and each driven gear 211 meshes with a drive gear 221.

[0061] In other words, in this embodiment, the drive shaft 220 is arranged along the direction from the loading end 110 to the unloading end 120, that is, the drive shaft 220 is arranged perpendicularly to each transmission roller 210. Multiple drive gears 221 are spaced apart on the drive shaft 220 along a first direction, and each transmission roller 210 has a driven gear 211 at its input end near the drive shaft 220. Thus, the driven gears 211 on each transmission roller 210 mesh with the drive gears 221 on the drive shaft 220. Therefore, the rotation of the drive shaft 220 drives the drive gears 221 on the drive shaft 220 to rotate synchronously, and each drive gear 221 transmits power to each driven gear 211 to drive the transmission rollers 210 to rotate synchronously, ensuring the stability of the silicon wafer transmission mechanism 200.

[0062] As a specific embodiment of this utility model, such as Figure 1 and Figure 3 As shown, the follower mechanism 400 may include a frame 410 and a horizontal movement module 420. The frame 410 is mounted above the electroplating tank 100; the horizontal movement module 420 is disposed on the frame 410 along a first direction, and is located above the electroplating tank 100. Driven by the horizontal movement module 420, the conductive mechanism 300 reciprocates horizontally along the first direction.

[0063] Specifically, in this embodiment, the follower mechanism 400 is mounted above the electroplating tank 100 via a frame 410, and a horizontal moving module 420 is arranged on the frame 410 along the first direction (i.e., the transport direction of the silicon wafer) to drive the conductive mechanism 300 to move horizontally in the horizontal direction. Thus, the horizontal moving module 420 drives the conductive mechanism 300 to move horizontally along with the silicon wafer to be plated in the first direction.

[0064] As a specific embodiment of this utility model, such as Figure 1 and Figure 3 As shown, the follower mechanism 400 may further include a lifting module 430. The lifting module 430 is disposed on the moving end of the horizontal moving module 420, and the moving end of the lifting module 430 is connected to the conductive mechanism 300. The lifting module 430 drives the conductive mechanism 300 to move up and down to approach or move away from the upper surface of the workpiece to be plated.

[0065] Specifically, in this embodiment, the follower mechanism 400 is connected to a lifting module 430 on the moving end of the horizontal moving module 420. The moving end of the lifting module 430 is connected to a conductive mechanism 300, which is used to realize the vertical displacement of the conductive mechanism 300 to accurately match the height of the upper surface of the silicon wafer to be contacted. Thus, the horizontal moving module 420 in the follower mechanism 400 drives the conductive mechanism 300 to move horizontally reciprocally in the first direction, thereby realizing electroplating along with the movement of the silicon wafer; while the lifting module 430 drives the conductive mechanism 300 to descend to contact the silicon wafer for conductive electroplating. After the silicon wafer electroplating is completed, the conductive mechanism 300 is driven to rise away from the silicon wafer for the next batch of electroplating.

[0066] In other words, the follower mechanism 400 in this embodiment controls the conductive mechanism 300 to perform horizontal reciprocating motion and lifting, enabling the conductive mechanism 300 to perform electroplating along with the movement of the silicon wafer, effectively ensuring the stability of the electroplated conductive contact. Furthermore, the combined design of the horizontal movement module 420 and the lifting module 430 allows for the driving of the conductive mechanism 300 in both horizontal linear and lifting directions within a limited space, greatly improving the space utilization of the equipment.

[0067] As a specific embodiment, if the conductive brush under the conductive mechanism 300 can be precisely controlled to prevent it from contacting the electroplating solution, the lifting module 430 can be eliminated to simplify the control of the follow-up mechanism 400, thereby improving the movement accuracy.

[0068] As a specific embodiment of this utility model, such as Figure 3 , Figure 4 and Figure 5 As shown, the conductive mechanism 300 may include at least one conductive component 310. Each conductive component 310 is connected to the moving end of the follower mechanism 400; a conductive brush 311 is provided at the bottom of each conductive component 310. The distribution of the conductive components 310 corresponds one-to-one with the distribution of silicon wafers within the workpiece to be plated.

[0069] In this embodiment, the distribution of conductive components 310 corresponds one-to-one with the distribution of silicon wafers in the workpiece to be plated. Specifically, a single conductive component 310 can be provided, with the distribution of its bottom conductive brushes 311 corresponding one-to-one with the distribution of silicon wafers in the workpiece to be plated. Alternatively, multiple conductive components 310 can be provided, with their distribution corresponding one-to-one with the distribution of silicon wafers in the workpiece to be plated. The conductive mechanism 310 can be connected to the moving end of the follower mechanism 300 via connecting rods 330.

[0070] As a specific embodiment of this utility model, such as Figure 3 , Figure 4 and Figure 5 As shown, the conductive mechanism may include: a mounting plate 320, at least one conductive component 310, and a light source 340. The mounting plate 320 is connected to the moving end of the follower mechanism 400. All conductive components 310 are connected to the moving end of the follower mechanism 400. A conductive brush 311 is provided at the bottom of each conductive component 310. The light source 340 is located in the space between the mounting plate 320 and the conductive component 300, and is used to irradiate the silicon wafer through the conductive component 310 to achieve photo-induced electroplating.

[0071] Specifically, in this embodiment, the conductive component 310 is detachably connected to the moving end of the lifting module 430 in the follower mechanism 400 via the mounting plate 320. The lifting module 430 then drives its moving end to move up and down to adjust the height of the conductive mechanism 300 relative to the liquid level in the electroplating tank 100 and the height of the upper surface of the silicon wafer to be electroplated. The conductive component 310 is detachably mounted on the bottom of the mounting plate 320 to facilitate contact with the silicon wafer below for electroplating, and also allows for convenient replacement and maintenance. Furthermore, to achieve photo-induced electroplating, a light source 340 can be installed at the bottom of the mounting plate 320. When the conductive component 310 is energized, the light source 340 emits light that passes through the conductive component 310 and illuminates the upper surface of the silicon wafer to be plated, thus achieving photo-induced electroplating. Preferably, the light source 340 is located in the space between the mounting plate 320 and the conductive component 310, without contact between the light source 340 and the conductive component 310. The conductive component 310 is made of a transparent material, and the light source 340 is located at the bottom of the mounting plate 320.

[0072] It should be noted that the conductive components 310 at the bottom of the mounting plate 320 can be a single component, a pair arranged side-by-side, or multiple components arranged in a matrix (see attached diagram). Figure 1 The example shown is for a 2x2 matrix configuration, etc. Specific configurations can be tailored to actual production needs, and this application does not specify the configurations here. In other words, the horizontal electroplating synchronous follow-up equipment of this application is applicable to electroplating of silicon wafers in multiple scenarios and in various batches, effectively improving production efficiency and capacity.

[0073] Furthermore, the conductive component 310 in this embodiment can be one or multiple. Multiple conductive brushes 311 are installed on the bottom surface of the conductive component 310. Electroplating is performed by contacting the silicon wafer to be plated through the conductive brushes 311, which further ensures flexible contact with the silicon wafer. The multiple conductive brushes are detachably connected to the conductive component 310, facilitating replacement and maintenance, and resulting in lower maintenance costs compared to a single conductive brush.

[0074] As a specific embodiment of this utility model, such as Figure 6 and Figure 7 As shown, the conductive component 310 has multiple mounting holes (not shown) along the thickness direction, and the conductive brush 311 is detachably connected to the mounting holes.

[0075] In other words, the conductive component 310 of this embodiment has multiple mounting holes along its thickness direction on its surface. For example, the conductive brush 311 can be detachably connected to the mounting holes by bolts, rivets, etc., which is convenient and reliable. It should be noted that the arrangement of the mounting holes on the conductive component 310 can be set according to the actual conductivity requirements, for example, it can be a matrix layout, and this application does not make specific limitations here.

[0076] As a specific embodiment of this utility model, such as Figure 1 As shown, the horizontal electroplating synchronous follow-up equipment of this utility model embodiment may further include a first detection device 500 and a second detection device 600. The first detection device 500 and the second detection device 600 are respectively disposed at the loading end 110 and the unloading end 120, and are used to detect the workpiece to be plated on the transmission mechanism 200.

[0077] Specifically, a first detection device 500 and a second detection device 600 are respectively installed at the loading end 110 and unloading end 120 of the electroplating tank 100 to detect silicon wafers at corresponding positions at the loading end 110 and unloading end 120. For example, after the first detection device 500 at the loading end 110 detects the silicon wafer, it controls the follow-up mechanism 400 to position and track the silicon wafer about to enter the electroplating tank 100 through a software program. When the silicon wafer reaches the first predetermined position, the conductive mechanism 300 is pressed against the upper surface of the silicon wafer. The conductive mechanism 300 will then follow the silicon wafer into the electroplating area 130 of the electroplating tank 100 for electroplating until the silicon wafer reaches the second predetermined position, thus completing the electroplating process. After electroplating is completed, the electroplated silicon wafers will be transferred by the transmission mechanism 200 to the unloading end 120 for the next process. When the second detection device 600 located at the unloading end 120 detects the silicon wafer, it will feed back the information to the follow-up mechanism 400, thereby controlling the conductive mechanism 300 to quickly return to the origin and perform follow-up electroplating on the next group of silicon wafers.

[0078] As a specific embodiment, the first detection device 500 and the second detection device 600 can use photoelectric sensors to detect silicon wafers and perform safety monitoring of loading and unloading.

[0079] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A horizontal electroplating synchronous follow-up device, characterized in that, include: An electroplating tank, the electroplating tank including a loading end and a unloading end, the direction from the loading end to the unloading end being a first direction; An electroplating zone is provided between the loading end and the unloading end; A transmission mechanism is disposed in the electroplating tank along the first direction, and the transmission mechanism is used to convey the workpiece to be plated. A conductive mechanism, wherein a conductive brush is provided at the bottom of the conductive mechanism for contacting the upper surface of the workpiece to be plated and realizing electroplating; A follower mechanism, connected to the conductive mechanism, is used to control the conductive mechanism to reciprocate along a first direction within the electroplating area; When the workpiece to be plated enters the electroplating tank, under the control of the follow-up mechanism, the conductive mechanism contacts the upper surface of the workpiece to be plated when it enters the electroplating area, and moves synchronously along the first direction until the workpiece to be plated leaves the electroplating area.

2. The horizontal electroplating synchronous follow-up equipment according to claim 1, characterized in that, The workpiece to be plated includes at least one silicon wafer floating on the surface of the electroplating tank.

3. The horizontal electroplating synchronous follow-up equipment according to claim 1, characterized in that, The follower mechanism includes: A frame, which is mounted above the electroplating tank; A horizontal moving module is disposed on the frame along the first direction and is located above the electroplating tank; The conductive mechanism reciprocates horizontally along the first direction under the drive of the horizontal moving module.

4. The horizontal electroplating synchronous follow-up equipment according to claim 3, characterized in that, The follower mechanism also includes: A lifting module is provided on the moving end of the horizontal moving module, and the moving end of the lifting module is connected to the conductive mechanism; The lifting module drives the conductive mechanism to move up and down to approach or move away from the upper surface of the workpiece to be plated.

5. The horizontal electroplating synchronous follow-up equipment according to claim 2, characterized in that, The conductive mechanism includes: At least one conductive component, all of which are connected to the moving end of the follower mechanism; the conductive brush is provided at the bottom of the conductive component; The distribution of the conductive components corresponds one-to-one with the distribution of silicon wafers within the workpiece to be plated.

6. The horizontal electroplating synchronous follow-up equipment according to claim 2, characterized in that, The conductive mechanism includes: Mounting plate, the mounting plate being connected to the moving end of the follower mechanism; At least one conductive component, all of which are connected to the moving end of the follower mechanism; the conductive brush is provided at the bottom of the conductive component; A light source is disposed in the space between the mounting plate and the conductive component, and is used to irradiate the silicon wafer through the conductive component to achieve photo-induced electroplating.

7. The horizontal electroplating synchronous follow-up equipment according to claim 5 or 6, characterized in that, The conductive component has multiple mounting holes along its thickness direction, and the conductive brush is detachably connected to the mounting holes.

8. The horizontal electroplating synchronous follow-up equipment according to claim 6, characterized in that, The conductive component is made of a transparent material.

9. The horizontal electroplating synchronous follow-up equipment according to claim 6, characterized in that, The light source is located at the bottom of the mounting plate, and the light source does not contact the conductive component.

10. The horizontal electroplating synchronous follow-up device according to claim 1, characterized in that, It also includes a first detection device and a second detection device; The first detection device and the second detection device are respectively located at the loading end and the unloading end, and are used to detect the workpiece to be plated on the transmission mechanism.

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