LED light bar with uniform heat dissipation structure

By employing a multi-layered thermal structure consisting of thermal pads, metal foil layers, and wave-shaped heat dissipation fins, combined with detachable installation components, the problem of uneven heat dissipation in LED light strips is solved, achieving uniform heat dissipation and flexible installation, extending the lifespan of the light strips and improving luminous efficacy stability.

CN224261654UActive Publication Date: 2026-05-19SHENZHEN BLUE MOON TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN BLUE MOON TECH CO LTD
Filing Date
2025-08-01
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

Uneven heat dissipation in existing LED light strips leads to localized overheating of the LED chips, affecting the lifespan and luminous efficacy stability of the lamps.

Method used

It adopts a multi-layer thermally conductive structure, including thermal pads, metal foil layers and wave-shaped heat dissipation fins, combined with detachable mounting components, which enable flexible installation of the heat dissipation components through pins and clips, and optimize the airflow path.

Benefits of technology

It achieves uniform heat dissipation of LED light strips, extends service life, improves luminous efficiency stability, and allows for flexible adjustment of the installation of heat dissipation components according to needs, saving materials and space.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of LED lamps, and discloses an LED lamp strip with a uniform heat dissipation structure, which comprises a frame, wavy heat dissipation fins are fixedly connected in the frame, a metal foil layer is fixedly connected on the top side of the wavy heat dissipation fins, a heat conduction pad is arranged on the top side of the metal foil layer, and a heat conduction layer is arranged on the top side of the heat conduction pad. The top side of the heat conduction pad is connected with a lamp strip substrate through an installation assembly, a plurality of LED chips are installed on the top side of the lamp strip substrate, and the two ends of the top side of the lamp strip substrate are each provided with a series connection interface. According to the LED lamp strip, the multi-layer heat conduction structure of the heat conduction pad, the metal foil and the wave heat dissipation fins can effectively guide and disperse heat generated when the LED lamp strip works, the problem of uneven heat dissipation is solved, the service life of the lamp strip is greatly prolonged, the extrusion block fixed through the plug pin can be matched with the installation column to freely install or detach the heat dissipation assembly, and the heat dissipation efficiency is improved. A user can flexibly select whether to install the heat dissipation assembly according to an actual application scene.
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Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, and in particular to an LED light strip with a uniform heat dissipation structure. Background Technology

[0002] Light-emitting diodes, or LEDs for short, are a common type of light-emitting device. They emit light by releasing energy through the recombination of electrons and holes. They are widely used in the lighting field. LEDs can efficiently convert electrical energy into light energy and have a wide range of applications in modern society, such as lighting, flat panel displays, and medical devices. However, the current photoelectric conversion efficiency is relatively low, and a large proportion is converted into heat energy. Therefore, the power density on LED chips is very high. The high power density also places higher demands on the heat dissipation of the device. The heat dissipation problem in LEDs has become a major issue affecting their industrialization.

[0003] In existing heat dissipation designs, heat sinks are generally used to dissipate heat. However, most LED chips are arranged in an array, and the heat of LED chips in the middle part is not easily conducted away, resulting in uneven heat dissipation and greatly affecting the lifespan of the lamp. In order to address this technical problem, this application proposes an LED light strip with a uniform heat dissipation structure. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an LED light strip with a uniform heat dissipation structure. The uniformly distributed heat dissipation components ensure even heat dissipation, and the detachable heat dissipation components can be selected for installation based on actual usage requirements.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] An LED light strip with a uniform heat dissipation structure includes a frame, a wave-shaped heat dissipation fin fixedly connected inside the frame, a metal foil layer fixedly connected to the top side of the wave-shaped heat dissipation fin, a thermal pad disposed on the top side of the metal foil layer, a light strip substrate connected to the top side of the thermal pad via a mounting assembly, a plurality of LED chips mounted on the top side of the light strip substrate, and series interfaces disposed at both ends of the top side of the light strip substrate.

[0007] Furthermore, the mounting assembly includes mounting posts fixedly connected to the four corners of the frame, with pressing blocks rotatably connected to the top of each of the four mounting posts, and pin seats fixedly connected to the adjacent ends of the mounting posts and the pressing blocks, with a insertion hole in the middle of the pin seat, and a pin inserted into the insertion hole.

[0008] Furthermore, each of the four mounting posts has a locking tooth fixedly connected inside its top end. The locking tooth and the side of the pressing block are engaged with a locking block. The two locking blocks on the left and right sides are fixedly connected with an L-shaped pressure plate. The bottom end of the L-shaped pressure plate abuts against the top end of the light strip substrate.

[0009] Furthermore, there are multiple frames and LED strip substrates, and each serial interface is provided with a serial connector inside. The two serial connectors are connected by wires on the side away from the serial interface.

[0010] Furthermore, the side of the mounting post away from the pin seat is fixedly connected with an elastic buckle, and the wire is snapped into the inside of two elastic buckles on the adjacent side of the two mounting posts.

[0011] Furthermore, the card block has a toothed groove on the side away from the compression block for engaging with the card teeth.

[0012] Furthermore, airflow guide fins are fixedly connected to the bottom ends of both the front and rear sides of the frame to optimize airflow.

[0013] Furthermore, the thermal pad is made of high-resilience silicone sheet to reduce the weakening of thermal conductivity caused by compression deformation from repeated disassembly and assembly.

[0014] This utility model has the following beneficial effects:

[0015] 1. In this utility model, the multi-layer thermal conductive structure of thermal pad, metal foil and wave heat dissipation fins can effectively guide and disperse the heat generated by the LED light strip during operation, solve the problem of uneven heat dissipation, greatly extend the service life of the light strip, and improve the stability and consistency of luminous efficacy.

[0016] 2. In this utility model, the compression block fixed by the pin can be used with the mounting column to install or remove the heat dissipation component at will. Users can flexibly choose whether to install the heat dissipation component according to the actual application scenario. In cases with low heat dissipation requirements, the material cost and installation space of the heat dissipation component can be saved. When the heat dissipation requirements are high, it can be installed quickly. Attached Figure Description

[0017] Figure 1 This is a perspective view of an LED light strip with a uniform heat dissipation structure proposed in this utility model;

[0018] Figure 2 This is a schematic diagram of the frame structure of an LED light strip with a uniform heat dissipation structure proposed in this utility model;

[0019] Figure 3 This is a schematic diagram of a heat dissipation component for an LED light strip with a uniform heat dissipation structure proposed in this utility model.

[0020] Figure 4 This is a schematic diagram of the mounting assembly structure of an LED light strip with a uniform heat dissipation structure proposed in this utility model.

[0021] Figure 5 This is a schematic diagram of an L-shaped pressure plate structure for an LED light strip with a uniform heat dissipation structure proposed in this utility model.

[0022] Figure 6 This is a schematic diagram of a multi-strip series structure of an LED light strip with a uniform heat dissipation structure proposed in this utility model.

[0023] Legend:

[0024] 1. Frame; 2. LED strip substrate; 3. LED chip; 4. Series interface; 5. Airflow guide fin; 6. L-shaped pressure plate; 7. Mounting post; 8. Elastic buckle; 9. Wire; 10. Wave heat dissipation fin; 11. Metal foil layer; 12. Thermal pad; 13. Extrusion block; 14. Pin holder; 15. Pin; 16. Clamping tooth; 17. Clamping block; 18. Series connector. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Reference Figure 1-3This utility model provides an embodiment of an LED light strip with a uniform heat dissipation structure, including a frame 1. A wave-shaped heat dissipation fin 10 is fixedly connected inside the frame 1. A metal foil layer 11 is fixedly connected to the top side of the wave-shaped heat dissipation fin 10. A thermal pad 12 is disposed on the top side of the metal foil layer 11. The thermal pad 12 is made of high-resilience silicone, which can reduce the problem of weakened heat conduction caused by compression deformation of the pad due to repeated disassembly and assembly. A light strip substrate 2 is connected to the top side of the thermal pad 12 through a mounting assembly. Multiple LED chips 3 are mounted on the top side of the light strip substrate 2. When the LED chips 3 are working... The generated heat is first conducted to the LED strip substrate 2, and then evenly transferred to the metal foil layer 11 through the thermal pad 12. The metal foil layer 11 is tightly attached to the large-area wave heat dissipation fins 10 below, which diffuses the heat to the entire fin structure. The wave heat dissipation fins 10 significantly increase the heat dissipation surface area. Its undulating shape, combined with the airflow guide fins 5 set at the bottom of the frame 1, optimizes the airflow path, improves heat dissipation efficiency, and effectively avoids local overheating. The LED strip substrate 2 is provided with series interfaces 4 at both ends of the top side, and the airflow guide fins 5 are fixedly connected to the bottom of the front and rear sides of the frame 1 to optimize airflow.

[0027] Reference Figure 4 and Figure 5 Mounting posts 7 are fixedly connected at the four corners of the frame 1. Each of the four mounting posts 7 is rotatably connected to the top of a pressing block 13. A pin seat 14 is fixedly connected to the near end of each mounting post 7 and pressing block 13. A hole is opened in the middle of the pin seat 14, and a pin 15 is inserted into the hole to fix the position of the pressing block 13 after locking. A locking tooth 16 is fixedly connected inside the top of the mounting post 7. A locking block 17 is engaged with the near side of the locking tooth 16 and the pressing block 13. A toothed groove is opened on the side of the locking block 17 away from the pressing block 13, which engages with the locking tooth 16 to achieve reliable locking. An L-shaped pressure plate 6 is fixedly connected to the near side of the two left and right locking blocks 17 to abut against the top of the light strip substrate 2 when locking, providing stable downward pressure.

[0028] Reference Figure 6 There are multiple frames 1 and light strip substrates 2. Each series interface 4 is equipped with a series connector 18. The two series connectors 18 are connected by wires 9 on the side away from the series interface 4. The side of the mounting post 7 away from the plug seat 14 is fixedly connected with elastic buckles 8. The wires 9 are snapped into the two elastic buckles 8 on the side of the two mounting posts 7 that are close to each other. This design facilitates the expansion and splicing of light strips to achieve the required lighting arrangement. The wires 9 connecting adjacent light strips can be conveniently fixed by using the elastic buckles 8 on the mounting posts 7 on both sides of the light strip, keeping the wiring of the wires 9 neat and orderly.

[0029] Working principle: The mounting posts 7 at the four corners of the frame 1 are connected to the pressing blocks 13 via rotating shafts. When the pressing blocks 13 are rotated and closed, the pin seats 14 on one side are aligned with the pin seats 14 of the mounting posts 7. The pins 15 pass through the holes of both to achieve locking. The LED strip substrate 2 is placed on the top side of the heat-conducting pad 12. The locking blocks 17 on both sides of the L-shaped pressure plate 6 are pressed into the slots formed by the mounting posts 7 and the pressing blocks 13. The locking teeth 16 engage with the toothed grooves on the sides of the locking blocks 17, providing stable downward pressure, so that the LED strip substrate 2 and the heat-conducting pad 12 are stable. When the LED chip 3 is working, the heat generated is first conducted to the LED strip substrate 2, and then to the thermal pad 12. The thermal pad 12 evenly distributes the heat to the metal foil layer 11, and then conducts it downwards from the metal foil layer 11 to the wave heat dissipation fins 10. Together with the airflow guide fins 5 at the bottom of the frame 1, the heat is dissipated to the external environment. When multiple LED strips are connected, adjacent LED strips are electrically connected through the series interface 4 and series connector 18 at the ends. The wires 9 are inserted into the elastic buckles 8 to ensure that the wiring of the wires 9 is neat and orderly.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED light strip with a uniform heat dissipation structure, comprising a frame (1), characterized in that: The frame (1) is fixedly connected to a wave heat dissipation fin (10). A metal foil layer (11) is fixedly connected to the top side of the wave heat dissipation fin (10). A thermal pad (12) is provided on the top side of the metal foil layer (11). A light strip substrate (2) is connected to the top side of the thermal pad (12) through an installation component. Multiple LED chips (3) are installed on the top side of the light strip substrate (2). A series interface (4) is provided at both ends of the top side of the light strip substrate (2).

2. The LED light strip with a uniform heat dissipation structure according to claim 1, characterized in that: The mounting assembly includes mounting posts (7) fixedly connected to the four corners of the frame (1). Each of the four mounting posts (7) is rotatably connected to a pressing block (13). Each mounting post (7) and the pressing block (13) is fixedly connected to a pin seat (14) at one end. The pin seat (14) has a socket at the middle end, and a pin (15) is inserted into the socket.

3. The LED light strip with a uniform heat dissipation structure according to claim 2, characterized in that: The top of each of the four mounting posts (7) is fixedly connected with a tooth (16). The tooth (16) and the pressing block (13) are engaged with a block (17) on the same side. The two blocks (17) on the left and right are fixedly connected with an L-shaped pressure plate (6) on the same side. The bottom of the L-shaped pressure plate (6) abuts against the top of the light strip substrate (2).

4. The LED light strip with a uniform heat dissipation structure according to claim 2, characterized in that: The number of the frame (1) and the light strip substrate (2) is multiple. Each of the serial interfaces (4) is provided with a serial connector (18). The two serial connectors (18) are connected by wires (9) on the side away from the serial interface (4).

5. An LED light strip with a uniform heat dissipation structure according to claim 4, characterized in that: The mounting post (7) is fixedly connected to an elastic buckle (8) on the side away from the pin seat (14), and the wire (9) is snapped into the inside of two elastic buckles (8) on the side of the two mounting posts (7) that are close to each other.

6. The LED light strip with a uniform heat dissipation structure according to claim 3, characterized in that: The card block (17) has a toothed groove on the side away from the compression block (13) for engaging with the card teeth (16).

7. An LED light strip with a uniform heat dissipation structure according to claim 1, characterized in that: Airflow guide fins (5) are fixedly connected to the bottom of both the front and rear sides of the frame (1) to optimize airflow.

8. An LED light strip with a uniform heat dissipation structure according to claim 1, characterized in that: The thermal pad (12) is made of high-resilience silicone sheet to reduce the problem of weakened thermal conductivity caused by compression deformation due to repeated disassembly and assembly.