Circulating water-cooled rapid cooling container based on multiple semiconductor chilling plates

Abstract

The utility model discloses a circulating water-cooled rapid cooling container based on a plurality of semiconductor chilling plates, which comprises an aluminum radiating substrate welded on the lower wall of the container, and the cold ends of the plurality of chilling plates are coated with heat-conducting silica gel and are fixed on the aluminum radiating substrate; the copper pipe heat exchanger is tightly attached to and fixed to the hot ends of the refrigerating pieces, and a water storage tank, a submersible pump and a cooling fan are sequentially connected to a pipeline between an outlet and an inlet of a circulating water pipeline of the copper pipe heat exchanger. A temperature sensor is arranged in the container, the signal input end of the PID controller is connected with the signal output end of the temperature sensor, and the signal output end of the PID controller is connected with the signal input ends of the refrigeration pieces, the signal input end of the submersible pump and the signal input end of the cooling fan. By adopting the device, the temperature of 5L of water can be reduced from 25 DEG C to 5 DEG C in only 25-30 minutes; the power consumption of the circulating water cooling system is less than or equal to 80W, and energy is saved by 60% compared with a compressor scheme.

Description

Technical Field

[0001] This utility model relates to cooling containers, and more particularly to a circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips. Background Technology

[0002] Traditional semiconductor cooling devices often suffer from slow cooling speeds and limited temperature ranges due to insufficient power and low heat dissipation efficiency of individual cooling chips. Existing circulating water cooling systems mostly rely on compressors or high-power heat sinks, resulting in complex structures and high energy consumption. For cooling needs of small to medium-sized liquids (around 5L), a solution that balances high-efficiency cooling, compact structure, and energy saving is urgently needed. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips that can achieve efficient and rapid cooling of 5L of water, while solving the problem of heat accumulation at the hot end of the semiconductor cooling chip and extending its service life.

[0004] This utility model discloses a circulating water-cooled rapid cooling container based on multiple semiconductor refrigeration chips, comprising an aluminum heat dissipation substrate welded to the lower wall of the container, thermally conductive silicone coated on the cold ends of the multiple refrigeration chips and fixed to the aluminum heat dissipation substrate; a copper tube heat exchanger tightly fixed to the hot ends of the multiple refrigeration chips; a water storage tank, a submersible pump, and a cooling fan are sequentially connected to the circulating water pipeline from the outlet to the inlet of the copper tube heat exchanger; a temperature sensor is installed inside the container, the signal input terminal of a PID controller is connected to the signal output terminal of the temperature sensor, and the signal output terminal of the PID controller is connected to the signal input terminals of the multiple refrigeration chips, the submersible pump, and the cooling fan.

[0005] Advantages of this utility model:

[0006] It only takes 25-30 minutes to cool 1.5L of water from 25℃ to 5℃, which is 50% faster than a standalone cooling solution;

[0007] 2. The circulating water cooling system consumes ≤80W, saving 60% more energy than the compressor solution;

[0008] 3. The modular design facilitates disassembly and maintenance, with an overall volume of ≤300×200×200mm, making it suitable for space-constrained scenarios. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of the circulating water-cooled rapid cooling container based on multiple semiconductor refrigeration chips of this utility model. Detailed Implementation

[0010] The present invention will now be described in detail with reference to the accompanying drawings and specific examples.

[0011] like Figure 1 The present invention discloses a circulating water-cooled rapid cooling container based on multiple semiconductor thermoelectric coolers, comprising an aluminum heat dissipation substrate 3 welded to the lower wall of a container 1; thermally conductive silicone is applied to the cold ends of multiple thermoelectric coolers 2, and the cold ends of the multiple thermoelectric coolers 2 are fixed to the aluminum heat dissipation substrate 3; a copper tube heat exchanger 4 is tightly fixed to the hot ends of the multiple thermoelectric coolers 2; a water storage tank 6, a submersible pump 5, and a cooling fan 7 are sequentially connected to the circulating water pipeline from the outlet to the inlet of the copper tube heat exchanger; a temperature sensor is installed inside the container 1; the signal input terminal of a PID controller 8 is connected to the signal output terminal of the temperature sensor; the signal output terminal of the PID controller 8 is connected to the signal input terminals of the multiple thermoelectric coolers, the submersible pump, and the cooling fan. The PID controller 8 outputs a control signal (PWM wave) to control the voltage of the thermoelectric coolers, the speed of the water pump, and the speed of the cooling fan.

[0012] Preferably, the copper tube heat exchanger is fixed to the back of the aluminum heat dissipation base plate by a snap fastener.

[0013] More preferably, the multiple cooling elements are three in number and arranged in a triangular pattern.

[0014] The back of the multiple cooling plates 2 is provided with serpentine grooves that match the shape of the circulating water pipes of the copper tube heat exchanger. The copper tube heat exchanger is fixed in the serpentine grooves by filling them with thermally conductive adhesive. The triangular distribution of the multiple cooling plates 2 increases the cooling coverage area and reduces the heat load at a single point. Combined with the design of fitting the bottom outer wall of the container, it improves the heat transfer efficiency (40% higher than the single-piece cooling efficiency).

[0015] Preferably, the cooling fan is positioned to direct airflow towards the copper tube heat exchanger.

[0016] The copper tube heat exchanger, submersible pump, and water tank in this device form a closed water circuit, with the cooling fan directing airflow towards the copper tube heat exchanger. A combined cooling system of "copper tube water cooling + forced air cooling" is employed. A PID controller dynamically adjusts the water pump flow rate and cooling fan speed. When the water temperature inside the container exceeds a set threshold, the cooling fan speed and water pump flow rate are increased to ensure that the hot-end temperature of the multiple cooling elements 2 is ≤45℃ (compared to ≥60℃ in conventional solutions). When the water temperature drops to the set threshold (e.g., 5℃), the temperature difference threshold judgment module built into the PID controller switches the multiple cooling elements 2 to intermittent operation mode, maintaining precise temperature control within a ±2℃ range inside the container, reducing power consumption by 30%.

[0017] This invention is applicable to rapid cooling and constant temperature control scenarios for 5L capacity liquids (such as laboratories, vehicle refrigeration, small beverage equipment, etc.).

[0018] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips, characterized in that: The system includes an aluminum heat dissipation substrate welded to the lower wall of the container; thermally conductive silicone is applied to the cold ends of multiple cooling fins, which are then fixed to the aluminum heat dissipation substrate; a copper tube heat exchanger is tightly fixed to the hot ends of the multiple cooling fins; a water storage tank, a submersible pump, and a cooling fan are sequentially connected to the pipeline from the outlet to the inlet of the circulating water pipeline of the copper tube heat exchanger; a temperature sensor is installed inside the container; the signal input terminal of a PID controller is connected to the signal output terminal of the temperature sensor; and the signal output terminal of the PID controller is connected to the signal input terminals of the multiple cooling fins, the submersible pump, and the cooling fan.

2. The circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips according to claim 1, characterized in that: The copper tube heat exchanger is fixed to the back of the aluminum heat dissipation base plate by clips.

3. The circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips according to claim 2, characterized in that: The multiple cooling elements consist of three elements arranged in a triangular pattern.

4. The circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips according to any one of claims 1-3, characterized in that: The back of the multiple cooling plates is provided with a serpentine groove that matches the shape of the circulating water pipeline of the copper tube heat exchanger. The copper tube heat exchanger is fixed in the serpentine groove by filling it with thermally conductive adhesive.

5. The circulating water-cooled rapid cooling container based on multiple semiconductor cooling chips according to claim 4, characterized in that: The cooling fan is positioned to direct airflow towards the copper tube heat exchanger.

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