Thermal resistance test structure for semiconductor device

Abstract

The utility model discloses a thermal resistance test structure for a semiconductor device, which comprises a test board, linear chutes are transversely and oppositely arranged on the upper surface of the test board, a heating module is arranged between the two linear chutes, the linear chutes are respectively in sliding fit with clamping mechanisms, and a bidirectional motor is arranged on the upper surface of the test board. A driving shaft of the bidirectional motor is connected with a threaded rod, and the clamping mechanism is provided with a threaded hole matched with the threaded rod; the clamping mechanism comprises moving plates, the sides, close to each other, of the two moving plates are slidably connected with first circular-arc-shaped sliding blocks, the first circular-arc-shaped sliding blocks are slidably connected with two second circular-arc-shaped sliding blocks, and the second circular-arc-shaped sliding blocks are slidably connected with two circular-arc-shaped clamping pieces. Through mutual sliding fit among the arc-shaped sliding block I, the arc-shaped sliding block II and the arc-shaped clamping piece, the purpose that the semiconductor device in an irregular shape can be clamped in an attached mode is achieved.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor device testing equipment, and in particular relates to a thermal resistance testing structure that can fix irregularly shaped semiconductor devices. Background Technology

[0002] Thermal resistance testing of semiconductor devices is an important step in evaluating their heat dissipation performance. Thermal resistance is the resistance encountered by heat during conduction, and its magnitude directly determines whether a semiconductor device can effectively dissipate heat during operation. In the test, a certain amount of heat is applied to the semiconductor device, and its temperature change is measured. By comparing the relationship between the applied heat and the temperature change, we can obtain the thermal resistance value of the semiconductor device. The smaller the thermal resistance, the better the heat dissipation performance of the semiconductor device, and the faster the heat generated during operation can be dissipated.

[0003] The hot plate method is a common method for testing the thermal resistance of semiconductor devices. During the test, the semiconductor device is placed on a constant-temperature hot plate, and the thermal resistance value of the semiconductor device is calculated by measuring and recording the temperature distribution on the hot plate. In order to prevent the semiconductor device from shaking on the hot plate and affecting the test efficiency and the accuracy of the test data, a clamp is usually used to hold and fix the semiconductor device on the hot plate. However, for some irregularly shaped semiconductor devices, it is not easy to clamp them properly. Therefore, a thermal resistance test structure that can clamp irregularly shaped semiconductor devices is needed. Utility Model Content

[0004] The purpose of this invention is to solve the problem in the prior art of needing to fit and hold irregularly shaped semiconductor devices by using a layered arrangement and slidingly engaging arc-shaped slider one, arc-shaped slider two, and arc-shaped clamping member.

[0005] The specific technical solution of this utility model is as follows:

[0006] A structure for testing the thermal resistance of semiconductor devices includes a test platform. The upper surface of the test platform has horizontally opposite linear grooves. A heating module is provided between two of the linear grooves. Clamping mechanisms are slidably engaged with each linear groove. A bidirectional motor is provided on the upper surface of the test platform. The drive shaft of the bidirectional motor is connected to a threaded rod. The clamping mechanism has a threaded hole that mates with the threaded rod. The clamping mechanism includes a movable plate. Two arc-shaped sliders are slidably connected to one side of the two movable plates. Two arc-shaped sliders are slidably connected to the arc-shaped sliders, and two arc-shaped clamping members are slidably connected to the arc-shaped sliders.

[0007] Furthermore, the front surface of the movable plate is provided with an arc-shaped notch that is adapted to the arc-shaped slider, the front surface of the arc-shaped notch is provided with a groove, and the back surface of the arc-shaped slider is provided with a limiting slide bar that is matched with the groove.

[0008] Furthermore, the front face of the arc-shaped slider one is provided with two arc-shaped notches two that are adapted to the arc-shaped slider two, the front face of the arc-shaped notches two is provided with a sliding groove two, and the back face of the arc-shaped slider two is provided with a limiting slide bar two that is matched with the sliding groove two.

[0009] Furthermore, the front surface of the arc-shaped slider 2 is provided with two arc-shaped notches 3 that are adapted to the arc-shaped clamping member, the front surface of the arc-shaped notches 3 is provided with a sliding groove 3, and the back surface of the arc-shaped clamping member is provided with a limiting slide bar 3 that is matched with the sliding groove 3.

[0010] Furthermore, a limiting slider is provided on the lower surface of the movable plate on the side away from the arc-shaped notch, and the limiting slider is adapted to the linear groove.

[0011] Furthermore, a connector is provided on the rear side of the movable plate away from the heating module, and the connector is provided with a threaded hole adapted to the threaded rod.

[0012] Furthermore, the drive shaft of the bidirectional motor is fixedly connected to a magnetic coupler, the other end of the magnetic coupler is fixedly connected to the threaded rod, the end of the threaded rod is provided with a limiting shaft, and the upper surface of the test platform is provided with a limiting block, the limiting block is provided with a limiting shaft hole that matches the limiting shaft.

[0013] Furthermore, the arc-shaped clamping member is made of rubber, and buffer strips are arranged in an array on the side of the arc-shaped clamping member that contacts the semiconductor device.

[0014] Furthermore, the test bench is equipped with a transparent protective cover, and the upper surface of the test bench is provided with a sink groove that is compatible with the transparent protective cover.

[0015] Furthermore, a mounting groove is provided on the upper surface of the test platform and between the two linear slides. The mounting groove is adapted to the heating module. A heating plate is provided on the top of the heating module, and the upper surface of the heating plate is aligned with the upper surface of the test platform.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. When thermal resistance testing of semiconductor devices is required, the semiconductor device is placed on a heating plate, and a bidirectional motor is started. Through the engagement of the threaded rod and threaded hole, the two moving plates are brought closer together. The moving plates are equipped with three levels: an arc-shaped slider one, an arc-shaped slider two, and an arc-shaped clamping component. Each level can be adjusted to a suitable angle according to the shape of the semiconductor device through sliding engagement. This allows the arc-shaped clamping component of the last level to adapt to the irregular shape of the semiconductor device, so that it can fit the semiconductor device well and hold it firmly. This gives the clamping mechanism a good self-adaptive clamping function, which improves the practicality of the semiconductor device thermal resistance testing structure and also improves the stability and accuracy of the test results during the thermal resistance testing process of some irregularly shaped semiconductor devices.

[0018] 2. A magnetic coupler is installed between the drive shaft of the bidirectional motor and the threaded rod. The magnetic coupler transmits power through a magnetic field and there is no direct mechanical connection. When the clamping mechanism clamps the semiconductor device, if the bidirectional motor is not stopped in time, the magnetic coupler will decouple under overload conditions. The drive shaft of the bidirectional motor will then stop applying driving force to the threaded rod. This avoids the semiconductor device being damaged by the clamping mechanism under continuous driving force due to the bidirectional motor not stopping in time, thus improving the reliability of the semiconductor device thermal resistance test structure. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0020] Figure 2 This is a three-dimensional structural view of the present invention after the transparent protective cover has been removed;

[0021] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle;

[0022] Figure 4 This is a schematic diagram of the bottom three-dimensional structure of the movable plate in an embodiment of this utility model;

[0023] Figure 5 This is an exploded view of the assembly of the movable plate, the first arc-shaped slider, the second arc-shaped slider, and the arc-shaped clamping component in this embodiment of the present invention.

[0024] Figure 6 for Figure 5 A magnified view of a portion of point B in the middle;

[0025] Figure 7 This is a three-dimensional structural diagram of the threaded rod 5 in an embodiment of the present invention;

[0026] Figure label:

[0027] 1. Test bench; 11. Linear slide; 12. Limit block; 13. Settling tank;

[0028] 2. Heating module; 21. Heating plate;

[0029] 3. Clamping mechanism; 31. Threaded hole; 32. Moving plate; 321. Arc-shaped notch one; 322. Slide groove one; 323. Limiting slider; 324. Connecting piece; 33. Arc-shaped slider one; 331. Limiting slide bar one; 332. Arc-shaped notch two; 333. Slide groove two; 34. Arc-shaped slider two; 341. Limiting slide bar two; 342. Arc-shaped notch three; 343. Slide groove three; 35. Arc-shaped clamping piece; 351. Limiting slide bar three; 352. Buffer bar;

[0030] 4. Bidirectional motor;

[0031] 5. Threaded rod; 51. Limiting shaft;

[0032] 6. Magnetic coupler;

[0033] 7. Transparent protective cover. Detailed implementation method:

[0034] To better understand the purpose, structure, and function of this utility model, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0035] See Figures 1 to 7This embodiment discloses a structure for testing the thermal resistance of semiconductor devices, including a test platform 1. The upper surface of the test platform 1 has two laterally opposite linear grooves 11. A heating module 2 is provided between the two linear grooves 11. The heating module 2 consists of a heating unit and a temperature control unit, used to provide a heat source for thermal resistance testing. Clamping mechanisms 3 are slidably fitted onto the linear grooves 11. A bidirectional motor 4 is provided on the upper surface of the test platform 1. The drive shaft of the bidirectional motor 4 is connected to a threaded rod 5. The clamping mechanism 3 has a threaded hole 31 that matches the threaded rod 5. The two drive shafts of the bidirectional motor 4 rotate in opposite directions, enabling the two clamping mechanisms 3 to move towards or relative to each other. The clamping mechanism 3 includes a moving... The two movable plates 32 are slidably connected to each other on one side by an arc-shaped slider 33. The arc-shaped slider 33 is slidably connected to two arc-shaped sliders 34. The arc-shaped sliders 34 are slidably connected to two arc-shaped clamping members 35. Through the three levels of arc-shaped sliders 33, arc-shaped sliders 34 and arc-shaped clamping members 35 set on the movable plates 32, and the sliding cooperation between each level, the angle can be adjusted to a suitable angle according to the shape of the semiconductor device. Thus, the arc-shaped clamping member 35 of the last level can adapt to the irregular shape of the semiconductor device, so that it can fit the semiconductor device well and clamp it firmly, so that the clamping mechanism 3 has a good self-adaptive clamping function.

[0036] like Figure 5 As shown, the front surface of the movable plate 32 is provided with an arc-shaped notch 321 that matches the arc-shaped slider 33. The front surface of the arc-shaped notch 321 is provided with a groove 322. The back surface of the arc-shaped slider 33 is provided with a limiting slide bar 331 that matches the groove 322, making the sliding cooperation between the arc-shaped slider 33 and the movable plate 32 smoother. The front surface of the arc-shaped slider 33 is provided with two arc-shaped notches 332 that match the arc-shaped slider 34. The front surface of the arc-shaped notch 332 is provided with a groove 333. The back surface of the arc-shaped slider 34 is provided with a limiting slide bar 341 that matches the slide groove 333, making the sliding engagement between the arc-shaped slider 34 and the arc-shaped slider 33 smoother. The front surface of the arc-shaped slider 34 is provided with two arc-shaped notches 342 that match the arc-shaped clamping member 35. The front surface of the arc-shaped notches 342 is provided with a slide groove 343. The back surface of the arc-shaped clamping member 35 is provided with a limiting slide bar 351 that matches the slide groove 343, making the sliding engagement between the arc-shaped clamping member 35 and the arc-shaped slider 34 smoother.

[0037] like Figure 4As shown, a limiting slider 323 is provided on the lower surface of the movable plate 32 away from the arc-shaped notch 321. This allows the movable plate 32 to have a larger sliding stroke when sliding on the linear slide groove 11. The limiting slider 323 is adapted to the linear slide groove 11, which is a semi-circular shape to prevent the limiting slider 323 from slipping out of the linear slide groove 11.

[0038] like Figure 2 As shown, a connector 324 is provided on the rear side of the movable plate 32 away from the heating module 2. This allows the movable plate 32 to have a larger travel distance when moving, and can adapt to semiconductor devices of different sizes. The connector 324 is provided with a threaded hole 31 that is adapted to the threaded rod 5.

[0039] The drive shaft of the bidirectional motor 4 is fixedly connected to a magnetic coupler 6. The other end of the magnetic coupler 6 is fixedly connected to the threaded rod 5. The magnetic coupler 6 will decouple under overload conditions, so the drive shaft of the bidirectional motor 4 will no longer apply driving force to the threaded rod 5. This avoids the clamping mechanism 3 from damaging the semiconductor device under continuous driving force due to the failure of the bidirectional motor 4 to be turned off in time. The end of the threaded rod 5 is provided with a limiting shaft 51. The upper surface of the test platform 1 is provided with a limiting block 12. The limiting block 12 is provided with a limiting shaft hole that matches the limiting shaft 51. The limiting shaft 51 is restricted to the limiting block 12 through the limiting shaft hole, which prevents the threaded rod 5 from being unstable and shaking when rotating.

[0040] The arc-shaped clamping member 35 is made of rubber, preferably heat-resistant rubber in this embodiment. The side of the arc-shaped clamping member 35 that contacts the semiconductor device is provided with buffer strips 352 arranged in an array. The rubber arc-shaped clamping member 35 and the buffer strips 352 can disperse and reduce the pressure on the semiconductor device when it is clamped, and prevent the semiconductor device from being damaged.

[0041] The test bench 1 is equipped with a transparent protective cover 7. In this embodiment, transparent acrylic material is preferred, which has the advantages of being drop-proof and wear-resistant. The upper surface of the test bench 1 is provided with a groove 13 that is used in conjunction with the transparent protective cover 7. During testing, the transparent protective cover 7 is covered on the test bench 1 through the groove 13, which can prevent the test from being affected by external environmental factors and improve the accuracy of the test.

[0042] An installation groove is provided on the upper surface of the test bench 1 and between the two linear slides 11. The installation groove is adapted to the heating module 2. A heating plate 21 is provided on the top of the heating module 2. The upper surface of the heating plate 21 is aligned with the upper surface of the test bench 1, which can ensure that the clamping mechanism 3 moves smoothly and steadily without getting stuck.

[0043] Working principle: When thermal resistance testing of a semiconductor device is required, the semiconductor device is placed on the heating plate 21, and the bidirectional motor 4 is started. Through the cooperation of the threaded rod 5 and the threaded hole 31, the two moving plates 32 are brought closer to each other. The moving plates 32 are equipped with three levels: the first arc-shaped slider 33, the second arc-shaped slider 34, and the arc-shaped clamping member 35. Each level can be adjusted to a suitable angle according to the shape of the semiconductor device through sliding cooperation. This allows the arc-shaped clamping member 35 of the last level to adapt to the irregular shape of the semiconductor device, so that it can fit the semiconductor device well and hold it firmly. Then, the heating unit heats the heating plate 21. The tester measures the temperature distribution and change of the semiconductor device and calculates the thermal resistance value of the semiconductor device.

[0044] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A structure for testing the thermal resistance of semiconductor devices, characterized in that: The test platform (1) is provided with linear grooves (11) on its upper surface facing each other. A heating module (2) is provided between the two linear grooves (11). The linear grooves (11) are respectively slidably fitted with clamping mechanisms (3). The test platform (1) is provided with a bidirectional motor (4). The drive shaft of the bidirectional motor (4) is connected to a threaded rod (5). The clamping mechanism (3) is provided with a threaded hole (31) that matches the threaded rod (5). The clamping mechanism (3) includes a moving plate (32). The two moving plates (32) are slidably connected to an arc-shaped slider (33) on one side close to each other. The arc-shaped slider (33) is slidably connected to two arc-shaped sliders (34). The arc-shaped sliders (34) are slidably connected to two arc-shaped clamping parts (35).

2. The semiconductor device thermal resistance testing structure according to claim 1, characterized in that, The front face of the movable plate (32) is provided with an arc-shaped notch (321) that is adapted to the arc-shaped slider (33), the front face of the arc-shaped notch (321) is provided with a groove (322), and the back face of the arc-shaped slider (33) is provided with a limiting slide bar (331) that is matched with the groove (322).

3. The semiconductor device thermal resistance testing structure according to claim 2, characterized in that, The front face of the arc-shaped slider one (33) is provided with two arc-shaped notches two (332) that are adapted to the arc-shaped slider two (34). The front face of the arc-shaped notches two (332) is provided with a groove two (333). The back face of the arc-shaped slider two (34) is provided with a limiting slide bar two (341) that is matched with the groove two (333).

4. The semiconductor device thermal resistance testing structure according to claim 3, characterized in that, The front surface of the arc-shaped slider 2 (34) is provided with two arc-shaped notches 3 (342) that are adapted to the arc-shaped clamping member (35). The front surface of the arc-shaped notches 3 (342) is provided with a sliding groove 3 (343). The back surface of the arc-shaped clamping member (35) is provided with a limiting slide bar 3 (351) that is matched with the sliding groove 3 (343).

5. The semiconductor device thermal resistance testing structure according to claim 2, characterized in that, A limiting slider (323) is provided on the lower surface of the movable plate (32) away from the arc-shaped notch (321), and the limiting slider (323) is adapted to the linear groove (11).

6. The semiconductor device thermal resistance testing structure according to claim 1, characterized in that, A connector (324) is provided on the rear side of the movable plate (32) away from the heating module (2), and the connector (324) is provided with a threaded hole (31) that is adapted to the threaded rod (5).

7. The semiconductor device thermal resistance testing structure according to claim 6, characterized in that, The drive shaft of the bidirectional motor (4) is fixedly connected to a magnetic coupler (6). The other end of the magnetic coupler (6) is fixedly connected to the threaded rod (5). The end of the threaded rod (5) is provided with a limiting shaft (51). The upper surface of the test bench (1) is provided with a limiting block (12). The limiting block (12) is provided with a limiting shaft hole that matches the limiting shaft (51).

8. The semiconductor device thermal resistance testing structure according to claim 1, characterized in that, The arc-shaped clamp (35) is made of rubber, and the side of the arc-shaped clamp (35) that contacts the semiconductor device is provided with buffer strips (352) arranged in an array.

9. The semiconductor device thermal resistance testing structure according to claim 1, characterized in that, The test bench (1) is equipped with a transparent protective cover (7), and the upper surface of the test bench (1) is provided with a sink (13) that is compatible with the transparent protective cover (7).

10. The semiconductor device thermal resistance testing structure according to claim 1, characterized in that, An installation groove is provided on the upper surface of the test bench (1) and between the two linear slides (11). The installation groove is adapted to the heating module (2). A heating plate (21) is provided on the top of the heating module (2). The upper surface of the heating plate (21) is aligned with the upper surface of the test bench (1).

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