Multifunctional integrated optical chip packaging structure with tail fiber

Abstract

The utility model relates to a multifunctional integrated optical chip packaging structure with a tail fiber, which comprises a base, a limit seat, a Y-shaped waveguide, a single-channel optical fiber amplifier, a double-channel optical fiber amplifier, an input optical fiber, an output optical fiber and an electrode plate, the limit seat is embedded on the base, the Y-shaped waveguide is embedded on the limit seat, and the single-channel optical fiber amplifier is embedded on the output optical fiber. The input end of the Y-shaped waveguide is coupled with the input optical fiber through the single-channel optical fiber amplifier, the output end of the Y-shaped waveguide is coupled with the output optical fiber through the double-channel optical fiber amplifier, the electrode plate is arranged on the base, and an electrode on the electrode plate is electrically connected with an electrode of the Y-shaped waveguide. The utility model has the advantages that the limiting seat groove, the through groove, the electrode plate groove and the optical fiber groove are arranged, so that each part is convenient to assemble, and the assembly precision is effectively improved; and a highly integrated design is adopted, so that the size of the multifunctional integrated optical chip is greatly reduced, and the multifunctional integrated optical chip is more suitable for application requirements of miniaturization and light weight.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronics, and in particular to a multifunctional integrated optical chip packaging structure with a pigtail. Background Technology

[0002] Fiber optic gyroscopes, as inertial sensors based on the Sagnac effect, have a wide range of applications, covering navigation, aerospace, unmanned systems, and many other fields. In these fields, fiber optic gyroscopes play a crucial role due to their high precision, high reliability, and strong anti-interference capabilities. The multi-functional integrated optical chip is a key component of the fiber optic gyroscope, and its performance directly affects the overall performance of the gyroscope.

[0003] However, existing multifunctional integrated optical chips generally suffer from cumbersome assembly and large size. This is mainly due to the complex design of multifunctional integrated optical chips, which require integrating multiple optical components together, resulting in a cumbersome assembly process and a large size. This not only increases the manufacturing cost of fiber optic gyroscopes but also limits their use in certain application scenarios. Summary of the Invention

[0004] This invention mainly solves the above-mentioned problems by providing a multi-functional integrated optical chip packaging structure with a pigtail, which has high integration, can reduce the size of the multi-functional integrated optical chip and is easy to assemble.

[0005] The technical solution adopted by this utility model to solve its technical problem is a multifunctional integrated optical chip packaging structure with a pigtail, including a base, a limiting seat, a Y-shaped waveguide, a single-channel fiber amplifier, a dual-channel fiber amplifier, an input fiber, an output fiber, and an electrode plate. The limiting seat is embedded in the base, the Y-shaped waveguide is embedded in the limiting seat, the input end of the Y-shaped waveguide is coupled to the input fiber through the single-channel fiber amplifier, the output end of the Y-shaped waveguide is coupled to the output fiber through the dual-channel fiber amplifier, and the electrode plate is disposed on the base, with the electrodes on the electrode plate electrically connected to the electrodes of the Y-shaped waveguide.

[0006] As a preferred embodiment of the above solution, the base has a limiting seat groove in the middle for placing the limiting seat, and limiting baffles and limiting blocks are respectively provided on both sides of the limiting seat groove, and the limiting baffles and limiting blocks abut against the two sides of the limiting seat.

[0007] As a preferred embodiment of the above solution, the limiting block is provided with mounting holes that penetrate the base at both ends.

[0008] As a preferred embodiment of the above solution, the upper end face of the limiting block is provided with an electrode plate groove for placing the electrode plate.

[0009] As a preferred embodiment of the above solution, the electrode sheet includes a ceramic sheet and a conductive electrode, the ceramic sheet is provided with a plurality of electrode grooves, and the conductive electrode is disposed in the electrode grooves.

[0010] As a preferred embodiment of the above scheme, the upper surface of the limiting seat is provided with a through slot that runs through both ends of the limiting seat, and the Y-shaped waveguide is disposed in the through slot. The two ends of the Y-shaped waveguide extend outside the limiting seat and are coupled to a single-channel fiber amplifier and a dual-channel fiber amplifier, respectively.

[0011] As a preferred embodiment of the above scheme, the through-slot sidewall protrudes inward to form a protrusion that abuts against the side of the Y-shaped waveguide.

[0012] As a preferred embodiment of the above scheme, the single-channel fiber amplifier and the dual-channel fiber amplifier are respectively disposed at both ends of the groove of the limiting seat.

[0013] As a preferred embodiment of the above solution, the base is provided with vertical plates at both ends, and the upper end of the vertical plates is provided with fiber optic slots for placing input and output optical fibers.

[0014] As a preferred embodiment of the above scheme, the input optical fiber and the output optical fiber are provided with FC / APC connectors at the ends away from the base.

[0015] The advantages of this utility model are: it is equipped with a limiting seat groove, a through groove, an electrode plate groove and an optical fiber groove, which makes the assembly of each component convenient and effectively improves the assembly accuracy; it adopts a highly integrated design, which greatly reduces the size of the multifunctional integrated optical chip and is more suitable for miniaturized and lightweight application requirements. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a multifunctional integrated optical chip packaging structure.

[0017] Figure 2 This is an exploded view of a multifunctional integrated optical chip packaging structure.

[0018] 1-Base 2-Limiting seat 3-Y-shaped waveguide 4-Single-channel fiber optic amplifier 5-Dual-channel fiber optic amplifier 6-Electrode plate 7-Input fiber optic 8-Output fiber optic 8-Mounting hole 10-Vertical plate 11-Fiber optic groove 12-Limiting block 13-Electrode plate groove 14-Limiting seat groove 15-Limiting baffle 16-Through groove. Detailed Implementation

[0019] The technical solution of this utility model will be further described below through embodiments and in conjunction with the accompanying drawings.

[0020] Example:

[0021] This embodiment presents a multifunctional integrated optical chip packaging structure with a pigtail, such as... Figure 1 and Figure 2 As shown, the device includes a base 1, a limiting seat 2, a Y-shaped waveguide 3, a single-channel fiber amplifier 4, a dual-channel fiber amplifier 5, an input fiber 7, an output fiber 8, and an electrode plate 6. The limiting seat 2 is embedded in the base 1, and the Y-shaped waveguide 3 is embedded in the limiting seat 2. The input end of the Y-shaped waveguide 3 is coupled to the input fiber 7 through the single-channel fiber amplifier 4, and the two output ends of the Y-shaped waveguide 3 are coupled to the output fiber 8 through the dual-channel fiber amplifier 5, respectively. The electrode plate 6 is disposed on the base 1, and the electrodes on the electrode plate 6 are electrically connected to the electrodes of the Y-shaped waveguide 3.

[0022] Specifically, the base 1 has a limiting seat groove 14 in the middle for placing the limiting seat 2. The limiting seat groove 14 is oval-shaped. The limiting seat 2 is located in the middle of the limiting seat groove 14. The bottom surface of the limiting seat 2 is fixed to the bottom surface of the limiting seat groove 14 with silver paste. Limiting baffles 15 and limiting blocks 12 are respectively provided on both sides of the limiting seat groove 14. The limiting baffles 15 and limiting blocks 12 abut against the sides of the limiting seat 2. The limiting blocks 13 have mounting holes 8 through the base 1 at both ends. The upper surface of the limiting blocks 12 has an electrode plate groove 13 for placing the electrode plate. The electrode plate 13 is fixed in the electrode plate groove with silver paste. The electrode plate 13 includes a ceramic plate and a conductive electrode. The ceramic plate has several electrode slots. The conductive electrode is placed in the electrode slots. The electrode on the Y-shaped waveguide 3 is electrically connected to the conductive electrode through gold wire.

[0023] Furthermore, the upper surface of the limiting seat 2 is provided with a through groove 16 penetrating both ends of the limiting seat, and the two ends of the Y-shaped waveguide extend outside the limiting seat and are coupled to the single-channel fiber amplifier and the dual-channel fiber amplifier, respectively. In this embodiment, the Y-shaped waveguide 3 is fixedly installed in the through groove 16 by silver paste, and the sidewall of the through groove 16 protrudes inward to form a protrusion that abuts against the side of the Y-shaped waveguide.

[0024] Furthermore, the single-channel fiber amplifier 4 and the dual-channel fiber amplifier 5 are respectively disposed at both ends of the limiting seat groove 14. In this embodiment, the input waveguide of the Y-shaped waveguide is connected to the fiber core of the single-channel fiber amplifier using UV adhesive, and the output waveguide of the Y-shaped waveguide is connected to the dual-channel fiber amplifier using UV adhesive.

[0025] Furthermore, the base 1 has vertical plates 10 at both ends, and the upper end of the vertical plates 10 has an optical fiber groove 11 for placing the input optical fiber 7 and the output optical fiber 8. The input optical fiber 7 and the output optical fiber 8 are fixed in the optical fiber groove 11 with UV glue. The ends of the input optical fiber 7 and the output optical fiber 8 away from the base are provided with FC / APC connectors.

[0026] In this embodiment, the placement of the limiting seat groove 14, limiting baffle 15, limiting block 12, through groove 16 with protrusions, and electrode plate groove 13 enables portable and accurate installation of the limiting seat, Y-shaped waveguide, and electrode plate, improving assembly efficiency. Simultaneously, this packaging structure, through its highly integrated design, significantly reduces the size of the multifunctional integrated optical chip, making it more suitable for miniaturized and lightweight applications. Furthermore, the use of UV adhesive and silver paste for fixing ensures stable connections between components, improving the reliability and durability of the entire packaging structure.

[0027] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A multifunctional integrated optical chip packaging structure with a pigtail, characterized in that: The device includes a base, a limiting seat, a Y-shaped waveguide, a single-channel fiber amplifier, a dual-channel fiber amplifier, an input fiber, an output fiber, and electrode plates. The limiting seat is embedded in the base, and the Y-shaped waveguide is embedded in the limiting seat. The input end of the Y-shaped waveguide is coupled to the input fiber through the single-channel fiber amplifier, and the output end of the Y-shaped waveguide is coupled to the output fiber through the dual-channel fiber amplifier. The electrode plates are disposed on the base, and the electrodes on the electrode plates are electrically connected to the electrodes of the Y-shaped waveguide.

2. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 1, characterized in that: The base has a groove in the middle for placing the limiting seat. Limiting baffles and limiting blocks are respectively provided on both sides of the groove, and the limiting baffles and limiting blocks abut against the sides of the limiting seat.

3. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 2, characterized in that: The limiting block has mounting holes at both ends that penetrate the base.

4. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 2, characterized in that: The upper end face of the limiting block is provided with an electrode plate groove for placing the electrode plate.

5. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 1 or 4, characterized in that: The electrode sheet includes a ceramic sheet and a conductive electrode. The ceramic sheet has a plurality of electrode grooves, and the conductive electrode is disposed in the electrode grooves.

6. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 1 or 2, characterized in that: The upper surface of the limiting seat is provided with a through slot that runs through both ends of the limiting seat. The Y-shaped waveguide is disposed in the through slot, and both ends of the Y-shaped waveguide extend outside the limiting seat and are coupled to a single-channel fiber amplifier and a dual-channel fiber amplifier, respectively.

7. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 6, characterized in that: The inward protrusion of the channel sidewall forms a protrusion that abuts against the side of the Y-shaped waveguide.

8. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 2, characterized in that: The single-channel fiber amplifier and the dual-channel fiber amplifier are respectively located at both ends of the groove of the limiting seat.

9. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 1, characterized in that: The base has vertical plates at both ends, and the upper part of the vertical plates has fiber optic slots for placing input and output optical fibers.

10. The multifunctional integrated optical chip packaging structure with a pigtail according to claim 1, characterized in that: The input and output optical fibers are equipped with FC / APC connectors at the ends furthest from the base.

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