Wafer purging assembly and photoetching machine

Abstract

The utility model provides a wafer purging assembly and a photoetching machine, and relates to the technical field of wafer purging, the wafer purging assembly comprises an alignment edge searching mechanism and a purging mechanism; the alignment edge searching mechanism comprises a suction cup, and the suction cup is used for adsorbing a wafer; the blowing mechanism is arranged on the outer side of the suction cup, the blowing mechanism is located below the wafer, and the blowing mechanism can blow the back face of the wafer. The alignment edge searching mechanism arranged in the photoetching machine is matched with the purging mechanism to purge the back surface of the wafer, and after the photoetching machine gives a vacuum alarm, the wafer does not need to be taken out of the photoetching machine and can be conveyed to the alignment edge searching mechanism to be purged, so that the processing time for taking out the wafer can be shortened, the working efficiency of the photoetching machine is improved, the wafer rework rate is reduced, and the production cost is reduced. The production cost is reduced, the alignment edge-searching mechanism originally arranged on the photoetching machine is used as a cleaning carrier of the wafer, and an additional complex cleaning platform does not need to be arranged.

Description

Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer cleaning assembly and a photolithography machine. Background Technology

[0002] When the lithography machine transfers the wafer to the carrier stage for exposure, if there is contamination on the back of the wafer, it will cause abnormal vacuum adsorption on the carrier stage and trigger a vacuum alarm.

[0003] After a vacuum alarm is triggered, the wafer can only be transferred to the temporary storage area and then removed from the lithography machine. The removed wafer then undergoes backside cleaning and adhesive removal for rework. This not only increases the processing time of the vacuum alarm but also increases the material cost of secondary adhesive coating, reduces the working efficiency of the equipment, and increases production costs. Utility Model Content

[0004] The purpose of this invention is to provide a wafer purging assembly to solve the technical problem in the prior art that after a vacuum alarm, the wafer can only be transferred to a temporary storage area and then removed from the lithography machine.

[0005] The wafer purging assembly provided by this utility model includes an alignment and edge-finding mechanism and a purging mechanism;

[0006] The alignment and edge-finding mechanism includes a suction cup, which is used to adsorb the wafer;

[0007] The purging mechanism is located outside the suction cup and below the wafer, and is capable of purging the back side of the wafer.

[0008] Furthermore, there are multiple purging mechanisms, which are arranged at intervals along the circumference of the suction cup.

[0009] Furthermore, the purging mechanism includes a housing;

[0010] The housing includes a first top wall and a second top wall, the first top wall and the second top wall being inclined and symmetrically arranged;

[0011] Both the first top wall and the second top wall are provided with air outlets.

[0012] Furthermore, the shell is strip-shaped.

[0013] Furthermore, the purging mechanism also includes a connecting member;

[0014] One end of the connector is connected to the housing, and the other end of the connector is used to connect to the gas supply line.

[0015] Furthermore, one end of the connector is threadedly connected to the housing.

[0016] Furthermore, the other end of the connector is used for insertion into the gas supply line.

[0017] Furthermore, the wafer purging assembly also includes a PLC, an intermediate relay, and a solenoid valve;

[0018] The purging mechanism is connected to the air supply pipeline, and the solenoid valve is installed inside the air supply pipeline;

[0019] The PLC, the intermediate relay, and the solenoid valve are connected in sequence; after the chuck picks up the wafer, the PLC can control the intermediate relay to engage and drive the solenoid valve to open.

[0020] Furthermore, the gas supply line is also equipped with a regulating valve.

[0021] The purpose of this utility model is also to provide a lithography machine, including a support stage, a temporary storage area, and a wafer cleaning assembly provided by this utility model;

[0022] The support platform, the temporary storage area, and the alignment and edge-finding mechanism are arranged at intervals, and a robotic arm is provided between the support platform, the temporary storage area, and the alignment and edge-finding mechanism;

[0023] After the lithography machine alarms, the robotic arm can transport the wafer on the carrier stage to the temporary storage area; and the robotic arm can transport the wafer in the temporary storage area to the suction cup; after the suction cup picks up the wafer, the blowing mechanism can blow the back side of the wafer.

[0024] The wafer cleaning assembly provided by this utility model includes an alignment and edge-finding mechanism and a cleaning mechanism. The alignment and edge-finding mechanism includes a suction cup for adsorbing the wafer. The cleaning mechanism is located outside the suction cup and below the wafer, and can clean the back side of the wafer. By using the alignment and edge-finding mechanism in the lithography machine in conjunction with the cleaning mechanism, the back side of the wafer is cleaned. After the lithography machine vacuum alarm, the wafer does not need to be removed from the lithography machine; it can be transported to the alignment and edge-finding mechanism for cleaning. This reduces the wafer removal processing time, improves the working efficiency of the lithography machine, reduces the wafer rework rate, and reduces production costs. By using the alignment and edge-finding mechanism already present in the lithography machine as the wafer cleaning carrier, no additional complex cleaning platform is required. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 This is a front view of the wafer purging assembly provided in this embodiment of the present invention;

[0027] Figure 2 This is a perspective view of the wafer purging assembly provided in an embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the structure of the wafer purging assembly provided in this embodiment of the present invention;

[0029] Figure 4 This is a front view of the blowing mechanism of the wafer blowing assembly provided in this embodiment of the present invention;

[0030] Figure 5 This is a top view of the blowing mechanism of the wafer blowing assembly provided in this embodiment of the present invention;

[0031] Figure 6 This is a side view of the blowing mechanism of the wafer blowing assembly provided in this embodiment of the present invention;

[0032] Figure 7 This is a control logic diagram of the wafer purging assembly provided in this embodiment of the utility model.

[0033] Icons: 1-Alignment and edge finding mechanism; 11-Suction cup; 2-Blowing mechanism; 21-First top wall; 22-Second top wall; 23-Air outlet; 24-Connector; 25-Bottom shell; 3-PLC; 4-Intermediate relay; 5-Solenoid valve; 6-Regulating valve; 7-24V DC power supply; 8-Wafer; 9-Air supply pipeline. Detailed Implementation

[0034] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0035] This invention provides a wafer blowing assembly and a lithography machine. Several embodiments are given below to describe the wafer blowing assembly and lithography machine provided by this invention in detail.

[0036] Example 1

[0037] The wafer purging assembly provided in this embodiment, such as Figures 1 to 7As shown, it includes an alignment and edge-finding mechanism 1 and a cleaning mechanism 2; the alignment and edge-finding mechanism 1 includes a suction cup 11, which is used to adsorb the wafer 8; the cleaning mechanism 2 is located outside the suction cup 11 and below the wafer 8, and the cleaning mechanism 2 can clean the back side of the wafer 8.

[0038] The purging mechanism 2 is connected to the gas supply line 9, and nitrogen is supplied in the gas supply line 9.

[0039] PLC3 stands for Programmable Logic Controller, a digital computing and operating electronic system specifically designed for industrial applications.

[0040] After the lithography machine alarms, wafer 8 is automatically transported to the temporary storage area within the machine. From there, wafer 8 is automatically transported to the alignment and edge-finding mechanism 1. Once the suction cup 11 of the alignment and edge-finding mechanism 1 picks up wafer 8, a signal is sent to PLC 3. PLC 3 controls the air supply line 9 to supply air to the cleaning mechanism 2, causing the cleaning mechanism 2 to blow air onto the back of wafer 8 to remove contaminants. After cleaning by the cleaning mechanism 2, wafer 8 is transferred to the carrier stage for vacuum adsorption testing. If it passes the test, exposure is performed; otherwise, it can be transferred back to the alignment and edge-finding mechanism 1 for a second cleaning.

[0041] The wafer cleaning assembly provided in this embodiment utilizes the alignment and edge-finding mechanism 1 already installed in the lithography machine to adsorb the wafer, and works in conjunction with the cleaning mechanism 2 to clean the back side of the wafer 8. After the vacuum alarm of the lithography machine, it is not necessary to remove the wafer 8 from the lithography machine. The wafer 8 can be transported to the alignment and edge-finding mechanism 1 for cleaning, which can reduce the processing time for removing the wafer 8, improve the working efficiency of the lithography machine, reduce the rework rate of the wafer 8, and reduce the production cost. By using the alignment and edge-finding mechanism 1 already installed in the lithography machine as the cleaning carrier of the wafer 8, there is no need to set up an additional complex cleaning platform.

[0042] In this process, after the wafer 8 is adsorbed by the suction cup 11, the bottom surface of the wafer 8 is the back surface of the wafer 8. The purging mechanism 2 is located below the back surface of the wafer 8, and when the purging mechanism 2 blows out nitrogen gas, it can blow the back surface of the wafer 8.

[0043] The number of purging mechanisms 2 can be one or more. After the suction cup 11 adsorbs the wafer 8, the suction cup 11 can rotate around the axis of the suction cup 11, thereby driving the wafer 8 to rotate around the axis of the suction cup 11.

[0044] Furthermore, there are multiple purging mechanisms 2, which are arranged at intervals along the circumference of the suction cup 11.

[0045] Multiple blowing mechanisms 2 are arranged around the outside of the suction cup 11, and the multiple blowing mechanisms 2 are arranged at intervals along the circumference of the suction cup 11. The multiple blowing mechanisms 2 can improve the blowing capacity and blowing speed.

[0046] In this embodiment, as Figure 2 As shown, along the first direction, a blowing mechanism 2 is provided on both sides of the suction cup 11. Along the second direction, a blowing mechanism 2 is provided on one side of the suction cup 11, while no blowing mechanism 2 is provided on the other side of the suction cup 11 to avoid other parts inside the lithography machine. The first direction is perpendicular to the second direction, and both the first direction and the second direction are set in the horizontal direction.

[0047] Furthermore, the purging mechanism 2 includes a housing; the housing includes a first top wall 21 and a second top wall 22, the first top wall 21 and the second top wall 22 are inclined and symmetrically arranged; both the first top wall 21 and the second top wall 22 are provided with air outlets 23.

[0048] The shell is a hollow shell, and nitrogen can be delivered into the shell and blown out of the shell through the air outlet 23.

[0049] The first top wall 21 is provided with multiple air outlets 23, which are spaced apart along the extension direction of the first top wall 21.

[0050] The second top wall 22 is provided with multiple air outlets 23, which are spaced apart along the extension direction of the second top wall 22.

[0051] Furthermore, the shell is strip-shaped.

[0052] The shell includes a bottom shell 25, a first top wall 21 and a second top wall 22, the first top wall 21 and the second top wall 22 being connected to the top of the bottom shell 25 so that the bottom shell 25, the first top wall 21 and the second top wall 22 form a shell.

[0053] The outer contour of the bottom shell 25 is cubic, so that the outer contour of the shell is strip-shaped, and the first top wall 21 and the second top wall 22 are inclined, so that the shape of the shell fits the alignment and edge finding mechanism 1 better, and prevents the shell from interfering with the transfer of the wafer 8.

[0054] Furthermore, the purging mechanism 2 also includes a connector 24; one end of the connector 24 is connected to the housing, and the other end of the connector 24 is used to connect to the air supply line 9.

[0055] The housing of the purging mechanism 2 is connected to the gas supply line 9 via the connector 24. Nitrogen gas in the gas supply line 9 is delivered to the inside of the housing via the connector 24 and blown out of the housing through the air outlet 23.

[0056] The connector 24 can be fixedly connected to the housing or detachably connected.

[0057] Furthermore, one end of the connector 24 is threaded to the housing, which facilitates the assembly and disassembly of the connector 24 from the housing.

[0058] Furthermore, the other end of the connector 24 is used to connect to the gas supply line 9. The other end of the connector 24 is formed as a quick-connect plug, which connects to the gas supply line 9, facilitating quick connection of the connector 24 to the gas supply line 9.

[0059] Furthermore, the wafer purging assembly also includes a PLC3, an intermediate relay 4, and a solenoid valve 5; the purging mechanism 2 is connected to the air supply line 9, and the solenoid valve 5 is installed inside the air supply line 9; the PLC3, the intermediate relay 4, and the solenoid valve 5 are connected in sequence; after the suction cup 11 adsorbs the wafer 8, the PLC3 can control the intermediate relay 4 to engage and drive the solenoid valve 5 to open.

[0060] Among them, the intermediate relay 4 is connected to the 24V DC power supply 7.

[0061] After the lithography machine's vacuum alarm is triggered, wafer 8 is automatically transported to the temporary storage area within the lithography machine. From there, wafer 8 is automatically transported to the alignment and edge-finding mechanism 1. Once the suction cup 11 of the alignment and edge-finding mechanism 1 picks up wafer 8, a signal indicating successful pickup is sent to PLC 3. PLC 3 then sends a 1-second delay pulse to the 24V intermediate relay 4. The intermediate relay 4 engages, driving the 24V solenoid valve 5 to open. Nitrogen gas from the gas supply line 9 is then blown out through the air outlet 23 to remove contaminants from the back of wafer 8. By utilizing the lithography machine's vacuum alarm signal and the signal indicating successful pickup of wafer 8 by the suction cup 11, PLC 3 controls the automatic initiation of nitrogen purging.

[0062] Furthermore, the gas supply line 9 is also equipped with a regulating valve 6.

[0063] The regulating valve 6 is located on the side of the solenoid valve 5 away from the connector 24. The regulating valve 6 can adjust the nitrogen pressure in the gas supply line 9 to regulate the nitrogen pressure blown out by the purging mechanism 2. The nitrogen pressure can be adjusted according to the purging effect.

[0064] Example 2

[0065] The lithography machine provided in this embodiment includes a carrier stage, a temporary storage area, and a wafer cleaning assembly provided in Embodiment 1; the carrier stage, the temporary storage area, and the alignment and edge-finding mechanism 1 are spaced apart, and a robot arm is provided between the carrier stage, the temporary storage area, and the alignment and edge-finding mechanism 1; after the lithography machine alarms, the robot arm can transport the wafer 8 on the carrier stage to the temporary storage area; and the robot arm can transport the wafer 8 in the temporary storage area to the suction cup 11; after the suction cup 11 adsorbs the wafer 8, the cleaning mechanism 2 can clean the back side of the wafer 8.

[0066] The support platform, temporary storage area and wafer purging assembly are all spaced apart, and the support platform, temporary storage area and alignment and edge finding mechanism 1 are arranged around the outside of the robot arm.

[0067] When the lithography machine transfers wafer 8 to the carrier stage for exposure, if there is contamination on the back of wafer 8, it will cause abnormal vacuum adsorption on the carrier stage and trigger a vacuum alarm.

[0068] After the lithography machine triggers a vacuum alarm, its control system directs a robotic arm to transport wafer 8 from the carrier stage to a temporary storage area. The robotic arm then transports wafer 8 from the temporary storage area to the alignment and edge-finding mechanism 1. Once the suction cup 11 of the alignment and edge-finding mechanism 1 picks up wafer 8, a signal indicating successful pickup is sent to PLC 3. PLC 3 sends a 1-second delay pulse to a 24V intermediate relay 4, which activates, opening a 24V solenoid valve 5. Nitrogen gas from the gas supply line 9 is then blown out through the outlet 23 to remove contaminants from the back of wafer 8. The lithography machine's vacuum alarm signal and the signal indicating successful pickup by the suction cup 11 enable PLC 3 to automatically initiate nitrogen purging. The nitrogen pressure can be adjusted based on the purging effect.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer blow-off assembly, characterized in that, It includes an alignment and edge-finding mechanism (1) and a purging mechanism (2); The alignment and edge-finding mechanism (1) includes a suction cup (11) for adsorbing the wafer (8); The blowing mechanism (2) is located outside the suction cup (11) and below the wafer (8). The blowing mechanism (2) can blow the back side of the wafer (8).

2. The wafer blow-off assembly according to claim 1, characterized in that, There are multiple blowing mechanisms (2), and the multiple blowing mechanisms (2) are arranged at intervals along the circumference of the suction cup (11).

3. The wafer blow-off assembly according to claim 1, characterized in that, The purging mechanism (2) includes a housing; The housing includes a first top wall (21) and a second top wall (22), the first top wall (21) and the second top wall (22) are inclined and symmetrically arranged; Both the first top wall (21) and the second top wall (22) are provided with air outlets (23).

4. The wafer blow-off assembly according to claim 3, characterized in that, The shell is strip-shaped.

5. The wafer blow-off assembly according to claim 3, characterized in that, The purging mechanism (2) also includes a connector (24); One end of the connector (24) is connected to the housing, and the other end of the connector (24) is used to connect to the gas supply line (9).

6. The wafer blow-off assembly according to claim 5, characterized in that, One end of the connector (24) is threadedly connected to the housing.

7. The wafer blow-off assembly according to claim 5, characterized in that, The other end of the connector (24) is used to connect to the gas supply line (9).

8. The wafer blow-off assembly according to claim 1, characterized in that, The wafer purging assembly also includes a PLC (3), an intermediate relay (4), and a solenoid valve (5); The purging mechanism (2) is connected to the air supply line (9), and the solenoid valve (5) is installed in the air supply line (9); The PLC (3), the intermediate relay (4), and the solenoid valve (5) are connected in sequence. After the suction cup (11) adsorbs the wafer (8), the PLC (3) can control the intermediate relay (4) to engage and drive the solenoid valve (5) to open.

9. The wafer blow-off assembly according to claim 8, characterized in that, The gas supply pipeline (9) is also equipped with a regulating valve (6).

10. A lithography machine, characterized in that, Includes a support stage, a temporary storage area, and a wafer purging assembly as described in any one of claims 1-9; The support platform, the temporary storage area and the alignment and edge finding mechanism (1) are arranged at intervals, and a robot arm is provided between the support platform, the temporary storage area and the alignment and edge finding mechanism (1); After the lithography machine alarms, the robotic arm can transport the wafer (8) on the carrier stage to the temporary storage area; and the robotic arm can transport the wafer (8) in the temporary storage area to the suction cup (11); after the suction cup (11) adsorbs the wafer (8), the blowing mechanism (2) can blow the back side of the wafer (8).

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