Electronic device

Abstract

The utility model provides electronic equipment. The electronic equipment comprises a shell, a circuit board assembly and a first camera, the shell comprises a rear cover, the circuit board assembly is installed in the shell and comprises a first sub-circuit board and a supporting piece fixed to the first sub-circuit board, the supporting piece is provided with a first face and a second face which are opposite in the thickness direction of the electronic device, and the first face of the supporting piece abuts against the surface, facing the side of the rear cover, of the first sub-circuit board. The first camera is installed in the shell, the first camera and the supporting piece are stacked in the thickness direction of the electronic equipment, the first camera is provided with a supported face, and the supported face abuts against the second face of the supporting piece; an accommodating space is formed between the supported surface of the first camera and the first sub-circuit board, a shielding piece is arranged in the accommodating space, and a gap is formed between the supported surface of the first camera and the shielding piece. According to the electronic equipment provided by the embodiment of the invention, the camera does not easily extrude the shielding cover and the circuit board, so that the risk of failure of the whole machine is reduced, and the electronic equipment has relatively high reliability.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to an electronic device. Background Technology

[0002] Current mainstream electronic devices typically employ multiple cameras in their camera setups. Some cameras, such as the main camera, are relatively tall, while others, like the wide-angle camera, are relatively short. The height of a camera can be understood as its dimension along the thickness of the electronic device. As consumers demand higher image quality, the main camera is becoming larger and taller. Due to optical design limitations, the main camera is usually significantly taller than the other cameras, while the wide-angle camera is generally the shortest.

[0003] When designing electronic devices, architects often employ a broken-board design at the height of cameras to maximize internal space utilization. This means the camera passes through the circuit board, meeting industrial design (ID) requirements and preventing excessive protrusions from the camera onto the device's casing. The height of the main camera determines the height of the camera deco (DECO). Therefore, the side of other cameras facing the camera deco is usually flush with the main camera. However, some shorter cameras, such as wide-angle cameras, need to be stacked on the circuit to raise their height, ensuring their side facing the camera deco is flush with the main camera.

[0004] To maximize space utilization, electronic components can be placed at the bottom of the raised camera. Therefore, traditional manufacturers place the relatively short camera on the shielding of the electronic components on the circuit board (such as a shielding cover), using the shielding to elevate the camera. However, the shielding has low structural strength, with a thickness of only 0.1mm to 0.2mm, making it prone to deformation under stress. Assembling the camera onto the shielding causes it to be compressed and easily deformed. When the entire device is impacted, the camera will strike the shielding, causing deformation and electronic component failure. Furthermore, the small contact area between the shielding and the circuit board leads to stress concentration, so the shielding pressing against the circuit board can also cause circuit board failure, resulting in low overall reliability.

[0005] Therefore, in existing electronic devices, cameras can squeeze shielding components and circuit boards, resulting in a high risk of overall device failure and poor reliability. Utility Model Content

[0006] The electronic device provided in this application embodiment solves the problem in the prior art where the camera squeezes the shielding component and circuit board when the electronic device is impacted, resulting in a high risk of overall failure and poor reliability.

[0007] This application provides an electronic device including a housing, a circuit board assembly, and a first camera. The housing includes a back cover, the circuit board assembly is mounted inside the housing and includes a first sub-circuit board and a support member fixed to the first sub-circuit board. The support member has a first surface and a second surface opposite to each other in the thickness direction of the electronic device, and the first surface of the support member abuts against the surface of the first sub-circuit board facing the back cover.

[0008] The first camera is installed inside the housing and stacked with the support member in the thickness direction of the electronic device. The first camera has a supported surface that abuts against the second surface of the support member. There is a receiving space between the supported surface of the first camera and the first sub-circuit board. A shielding member is provided in the receiving space. There is a gap between the supported surface of the first camera and the shielding member.

[0009] In the electronic device provided in this application embodiment, the first camera can be a low-profile camera such as a wide-angle camera. The circuit board assembly includes a first sub-circuit board, on which a support member is provided. The first camera is superimposed on the support member, which provides support for the first camera and raises its height.

[0010] The first surface of the support abuts against the surface of the first sub-circuit board, meaning there is a surface-to-surface fit between the support and the first sub-circuit board. Forces on the support can be transmitted to the first sub-circuit board through the first surface. The second surface of the support abuts against the supported surface of the camera, supporting and elevating the first camera. When the entire device is subjected to impact, the first camera presses against the support under the impact force, and the support then transmits the impact force to the first sub-circuit board through the first surface. The first surface of the support can be designed to be larger, meaning a larger contact area between the support and the first sub-circuit board, to reduce stress concentration and lower the risk of the first sub-circuit board being damaged.

[0011] Furthermore, there is a gap between the supported surface of the first camera and the shielding component, meaning the first camera does not contact the shielding component and therefore will not squeeze it. The gap also prevents deformation of the first camera. When the entire device is impacted, the deformation of the first camera towards the shielding component is absorbed within the gap, thus preventing the first camera from colliding with the shielding component and reducing the risk of damage to the shielding component. It also reduces the risk of the shielding component squeezing the first sub-circuit board, causing it to fail. This prevents the electronic components and the first sub-circuit board inside the shielding cover from failing, thereby improving the overall reliability of the device.

[0012] Therefore, the camera in the electronic device provided in this application embodiment is less likely to squeeze the shielding cover and circuit board, reducing the risk of overall device failure and having high reliability.

[0013] In one possible implementation, the support is configured as a frame structure, which forms an accommodating space, and the supported surface of the first camera abuts against the portion of the second surface of the support surrounding the accommodating space.

[0014] By adopting the above solution and designing the support component as a frame structure, the support component can be in contact with the support component on all four sides of the supported surface of the first camera. This not only increases the contact area between the first camera and the support component, but also balances the force on the first camera, making the support component more stable.

[0015] In one possible implementation, the shielding component is a shielding cover, which is set independently of the frame structure. The shielding cover is a cover structure that can protect the internal electronic components from electromagnetic interference in all directions.

[0016] In one possible implementation, the contact area between the first surface of the support member and the first sub-circuit board is larger than the contact area between the shield and the first sub-circuit board. The larger the contact area between the first surface and the first sub-circuit board, the lower the pressure, the more dispersed the pressure, and the less damage to the first sub-circuit board.

[0017] In one possible implementation, the shielding component is a plate-like structure, with at least a portion of its outer peripheral surface in contact with the inner wall of the frame structure, and the two are integrated into one piece, resulting in a simple structure that simplifies the processing and assembly process.

[0018] In one possible implementation, the shielding component is made of a non-metallic material and includes multiple metal vias; alternatively, the shielding component is made of a metallic material. Both metallic materials and metal vias can effectively shield electromagnetic waves and prevent interference to the electronic components within the shielding component.

[0019] In one possible implementation, the height of the gap is greater than or equal to 0.15mm. Designing the gap height to be 0.15mm or greater can accommodate design and manufacturing tolerances while also covering the deformation of the first camera, thereby effectively preventing the first camera from impacting the shielding component.

[0020] In one possible implementation, the circuit board assembly further includes a second sub-circuit board and a frame board. In the thickness direction of the electronic device, the first sub-circuit board, the frame board, and the second sub-circuit board are stacked sequentially, with the second sub-circuit board located on the side of the frame board closer to the rear cover. The support member is disposed on the outside of the frame board.

[0021] By adopting the above scheme, the multi-layered sub-circuit boards can increase the layout area of ​​the electronic device and effectively utilize its internal space. By placing the support components outside the frame board, the first camera is also positioned outside the frame board, making reasonable use of the layout area on the first sub-circuit board.

[0022] In one possible implementation, the support member is connected to the outer wall of the frame panel and is integrated with the frame panel as a single structure. The support member and the frame panel can be integrally molded, with no gaps between them, which avoids the formation of stress bands and reduces the risk of damage to the support member and the frame panel.

[0023] In one possible implementation, in the thickness direction of the electronic device, the side of the frame plate facing the first sub-circuit board is on the same plane as the first side of the support, and the side of the frame plate facing the second sub-circuit board is on the side of the second side of the support away from the first sub-circuit board.

[0024] With the above solution, the height of the support component is lower than that of the frame plate, so more installation space can be reserved above the support component for the first camera.

[0025] In one possible implementation, both the first and second sub-circuit boards are printed circuit boards; and the frame board is also a printed circuit board. Alternatively, the frame board may be made of a non-metallic material and include multiple metal vias.

[0026] In one possible implementation, the support components and the frame plate are set independently. This allows for greater flexibility in the design and fabrication of the support components, and reduces the difficulty of fabrication.

[0027] In one possible implementation, the support component is made of metal, and its first surface is welded to the first sub-circuit board. Welding not only provides a strong connection but also allows the support component to be installed alongside other components on the first sub-circuit board in the same process, simplifying the assembly workflow.

[0028] In one possible implementation, the electronic device also includes a second camera and a third camera, with the second camera passing through the first sub-circuit board.

[0029] The electronic device also includes camera trim pieces, with the same distance between the first camera and the camera trim piece, the same distance between the second camera and the camera trim piece, and the same distance between the third camera and the camera trim piece.

[0030] The above solution employs a split-plate design at the second camera location, thereby improving space utilization and avoiding increasing the thickness of the electronic equipment. The lenses of all cameras are located on the same horizontal plane, ensuring that all cameras can receive light normally and maintain a consistent appearance.

[0031] In one possible implementation, the housing further includes a mid-frame, which includes a base plate and an outer frame surrounding the base plate. The base plate and the back cover are spaced apart in the thickness direction of the circuit. A first sub-circuit board of the circuit board is fixedly connected to the base plate, and a second camera is fixedly connected to the base plate.

[0032] In one possible implementation, the first camera is a wide-angle camera, the second camera is a main camera, and the third camera is a telephoto camera. Simultaneously configuring multiple cameras in an electronic device, each performing different shooting functions, can meet the diverse shooting needs of users in different scenarios, providing a more comprehensive and higher-quality shooting experience. Attached Figure Description

[0033] Figure 1 This is a schematic diagram showing the installation position of the first camera in the electronic device in the reference design;

[0034] Figure 2a This is a schematic diagram of the rear structure of the electronic device according to an embodiment of this application;

[0035] Figure 2b This is a schematic diagram of the back structure of the electronic device according to an embodiment of this application without the back cover;

[0036] Figure 3 for Figure 2a A schematic diagram of the cross-sectional structure at position AA in the middle;

[0037] Figure 4a This is a schematic diagram showing the heights of the first camera, second camera, and third camera in the electronic device of this application embodiment;

[0038] Figure 4b This is a schematic diagram showing the installation height of the first camera, second camera, and third camera in the electronic device of this application embodiment;

[0039] Figure 5a This is a schematic diagram of a first structure of a support member in an electronic device according to an embodiment of this application;

[0040] Figure 5b This is a three-dimensional structural diagram of the frame plate and support member in the electronic device of this application embodiment;

[0041] Figure 6a This is a top view schematic diagram showing the installation position of the first camera in the electronic device of this application embodiment;

[0042] Figure 6b This is a schematic diagram illustrating the interaction between the first camera and the support member in an electronic device according to an embodiment of this application.

[0043] Figure 7 This is a schematic diagram of a second structure of a support member in an electronic device according to an embodiment of this application;

[0044] Figures 8a to 8c This is a schematic diagram illustrating the cooperation relationship between the support member and the first shielding member in the electronic device of the application embodiment;

[0045] Figure 9This is a schematic diagram of a third structure of the support member in the electronic device according to an embodiment of this application;

[0046] Figure 10 This is a schematic diagram of a third three-dimensional structure of a support member in an electronic device according to an embodiment of this application.

[0047] Explanation of reference numerals in the attached figures:

[0048] Reference Design:

[0049] 100', Electronic device; 51', First camera; 52', Second camera;

[0050] 31', Circuit board; 61', Shielding component; 63', Electronic component; 8', Camera decorative component; Z', Thickness direction of electronic device.

[0051] This application:

[0052] 100. Electronic devices;

[0053] 1. Housing; 11. Back cover; 12. Mid-frame; 121. Base plate; 122. Outer frame; 2. Display screen;

[0054] 3. Circuit board assembly; 31. First sub-circuit board; 32. Second sub-circuit board; 33. Frame board; 330. First metal via;

[0055] 4. Support component; 41. First side; 42. Second side;

[0056] 51. First camera; 510. Supported surface; 52. Second camera; 53. Third camera;

[0057] 61. First shielding component; 610. Second metal via; 62. Second shielding component; 63. Electronic component;

[0058] 71. Battery module; 711. Wireless charging module; 72. Speaker module; 721. Cavity; 722. Speaker;

[0059] 73. Charging port; 74. Motor; 75. Card slot;

[0060] 8. Camera decorative parts; 81. Lens; 82. Frame;

[0061] T, storage space; s, gap; Z, thickness direction of electronic equipment. Detailed Implementation

[0062] Please see Figure 1 , Figure 1 This is a schematic diagram showing the installation position of the first camera in the electronic device for reference design.

[0063] like Figure 1 As shown, in one reference design, electronic device 100' includes a circuit board 31' and a first camera 51', which is, for example, a wide-angle camera. Electronic device 100' also includes other cameras, such as a second camera 52' shown by dashed lines in the figure, which is, for example, a main camera. Those skilled in the art will understand that the main camera is fundamental to mobile phone photography, used for capturing various scenes in daily life, such as people, landscapes, and still life, and undertakes most of the shooting tasks. Therefore, the main camera is generally large in size, and its height is generally the tallest. The height of the camera can be understood as its dimension in the thickness direction Z' of the electronic device. The wide-angle camera (first camera 51') has a shorter focal length, and its height is generally the smallest.

[0064] like Figure 1 As shown, to maximize the use of internal space in the electronic device 100', a broken board design is implemented at the main camera location, meaning the main camera passes through the circuit board 31' to meet industrial design (ID) requirements. The figure also shows a camera decoration 8'. The height of the main camera (second camera 52') determines the height of the camera decoration 8', and the side of the first camera 51' facing the camera decoration 8' is typically flush with the main camera. Because the first camera 51' is relatively short, it needs to be stacked on the circuit to increase its height.

[0065] Furthermore, a shielding member 61' is provided on the circuit board 31'. The first camera 51' is placed on the shielding member 61', which raises the first camera 51', thus saving some space. Those skilled in the art will understand that the shielding member 61' has low structural strength, with a thickness d' of only 0.1mm to 0.2mm, making it prone to deformation under stress. Assembling the first camera 51' onto the shielding member 61' will compress the shielding member 61', causing it to deform. When the entire device is subjected to impact, the first camera 51' will also impact the shielding member 61', causing it to deform and the electronic components 63' inside the shielding member 61' to fail. Moreover, the contact area between the shielding member 61' and the circuit board 31' is small, resulting in stress concentration. Therefore, the shielding member 61' compressing the circuit board 31' can also easily cause the circuit board 31' to fail, leading to low overall reliability. Therefore, in the prior art, the camera in the electronic device compresses the shielding member 61' and the circuit board, resulting in a high risk of overall device failure and poor reliability.

[0066] To address the aforementioned issues, this application provides an electronic device that uses a support structure other than a shielding component to elevate the camera, thereby preventing contact between the camera and the shielding component and ensuring the overall reliability of the device. The electronic device provided in this application is not limited to common terminals such as mobile phones, computers, and tablets; the structure of the electronic device will be described below using a mobile phone as an example.

[0067] Please see Figures 2a to 4b , Figure 2a This is a schematic diagram of the rear structure of the electronic device according to an embodiment of this application; Figure 2b This is a schematic diagram of the back structure of the electronic device according to an embodiment of this application without the back cover; Figure 3 for Figure 2a A schematic diagram of the cross-sectional structure at position AA in the middle; Figure 4a This is a schematic diagram showing the heights of the first camera, second camera, and third camera in the electronic device of this application embodiment; Figure 4b This is a schematic diagram showing the installation height of the first camera, second camera, and third camera in the electronic device of this application embodiment.

[0068] like Figures 2a to 3 As shown, the electronic device 100 includes a housing 1 and a circuit board assembly 3, with the circuit board assembly 3 mounted within the housing 1. In one possible implementation, the electronic device 100 further includes a display screen 2, with the housing 1 and the display screen 2 forming a mounting cavity around each other, and the circuit board mounted within the mounting cavity. The housing 1 serves as the exterior and frame of the electronic device 100, supporting, protecting, and mounting components such as the display screen 2 and the circuit board assembly 3. The display screen 2 is used for image display and human-computer interaction. The display screen 2 can be, but is not limited to, an organic light-emitting diode (OLED) display screen 2, an active-matrix organic light-emitting diode (AMOLED) display screen 2, or a quantum dot light-emitting diode (QLED) display screen 2, etc. This application does not limit the type or specific structure of the display screen 2.

[0069] It should be noted that the structure of shell 1 is not limited. For example... Figure 3As shown, in one possible implementation, the housing 1 includes a middle frame 12 and a back cover 11. The middle frame 12 includes a base plate 121 and an outer frame 122 surrounding the base plate 121. The base plate 121 and the back cover 11 are spaced apart in the thickness direction of the electronic device. The display screen 2 and the back cover 11 are respectively disposed on both sides of the outer frame 122, and the base plate 121 is located between the display screen 2 and the back cover 11. In an alternative implementation, the housing 1 may also include only the middle frame 12, with the base plate 121 of the middle frame 12 disposed on one end face of the outer frame 122 in the thickness direction Z of the electronic device, and reused as the back cover 11 of the electronic device 100. The housing 1 may also be configured with other structures, which will not be listed in this application.

[0070] Circuit board assembly 3 is the core component of electronic device 100, used to integrate functional devices such as CPU (Central Processing Unit) and MCU (Microcontroller Unit). The specific type of circuit board assembly 3 is not limited. Functionally, circuit board assembly 3 can be either the main circuit board assembly or a secondary circuit board assembly of electronic device 100. The main circuit board assembly is used to implement the core control of electronic device 100, performing various complex computational tasks, such as running applications, processing images and videos, etc. For example, the main circuit board assembly can integrate a CPU, a graphics processing unit (GPU), random access memory (RAM), a read-only memory (ROM) chip, a communication module (such as a baseband chip, an RF chip), and various interfaces (such as a camera interface, a display interface, a button interface, etc.). Various antenna modules, such as Bluetooth and cellular networks, can also be installed on the main circuit board assembly to ensure that the mobile phone can transmit data. The secondary circuit board assembly is used to expand various auxiliary functions; for example, it can integrate components such as a charging interface, a headphone jack, a microphone, and a speaker. The secondary circuit board assembly can be connected to the main circuit board assembly via a ribbon cable (such as an FPC, Flexible Printed Circuit) to achieve data transmission and power connection. The electronic device 100 may only have a main circuit board assembly, or it may simultaneously have a main circuit board assembly and one or more secondary circuit board assemblies. This application embodiment does not impose any limitations on this.

[0071] Based on structural classification, circuit board assembly 3 can be a single board consisting of only one circuit board, or it can be an integrated module combining multiple sub-circuit boards, such as a sandwich board. Figure 3As shown, in one possible implementation, the circuit board assembly 3 is a sandwich board, specifically including a first sub-circuit board 31, a second sub-circuit board 32, and a frame board 33. In the thickness direction Z of the electronic device, the first sub-circuit board 31, the frame board 33, and the second sub-circuit board 32 are stacked sequentially, with the second sub-circuit board 32 located on the side of the frame board 33 closest to the rear cover 11. The frame board 33 is a hollow frame structure, forming a receiving cavity between the first sub-circuit board 31, the second sub-circuit board 32, and the frame board 33. Alternatively, it can be understood that the first sub-circuit board 31, the frame board 33, and the second sub-circuit board 32 form a sandwich structure, and the receiving cavity is a sandwich cavity; therefore, this circuit board assembly 3 is also called a sandwich board. The multi-layered sub-circuit board arrangement can increase the layout area of ​​electronic components and effectively utilize the internal space of the electronic device 100. It should be noted that the number of sub-circuit boards in the circuit board assembly 3 is not limited; it can be 2, 3, 4, or more. The number of frame boards 33 in the circuit board assembly 3 is also not limited and can be determined according to the number of sub-circuit boards. In one example, the circuit board assembly 3 may include three sub-circuit boards stacked along its thickness direction, with a frame board 33 disposed between each pair of adjacent sub-circuit boards.

[0072] The first sub-circuit board 31 and the second sub-circuit board 32 are used to mount electronic components 63 and set up wiring. The specific type of each sub-circuit board is not limited. In one possible implementation, both the first sub-circuit board 31 and the second sub-circuit board 32 are PCBs (Printed Circuit Boards). Electronic components 63 can be mounted on the surface of the first sub-circuit board 31 facing the rear cover 11 and the surface of the second sub-circuit board 32 facing the rear cover 11 and the surface of the second sub-circuit board 32 facing the rear cover 11 and the surface of the second sub-circuit board 32 away from the rear cover 11. This application embodiment does not limit the specific number or position of electronic components 63 in the circuit board assembly 3; the accompanying drawings are for illustrative purposes only. Any electronic component 63 in the circuit board assembly 3 can be a charging module, memory, control module, etc. This application embodiment does not limit the specific type of each electronic component 63. The connection method between each electronic component 63 and the sub-circuit board is not limited; for example, it can be mounted to the sub-circuit board using SMT (Surface Mount Technology).

[0073] Those skilled in the art will understand that different sub-circuit boards can perform different functions. Depending on the type of electronic component 63 on the sub-circuit board, any sub-circuit board can be a radio frequency (RF) board or an application processor (AP) board. The RF board is equipped with radio frequency components such as a radio frequency integrated circuit (RF IC) and a radio frequency power amplifier (RFPA). The AP board is equipped with components such as a system-on-chip (SOC), double data rate (DDR) memory, and a power management unit (PMU). In one possible implementation, the first sub-circuit board 31 is an AP board, and the second sub-circuit board 32 is an RF board. In other alternative implementations, the first sub-circuit board 31 can also be an RF board or a board with other functions, and the second sub-circuit board 32 can also be an AP board or a board with other functions; this application does not impose any limitations on this.

[0074] Furthermore, the frame plate 33 is disposed between the first sub-circuit board 31 and the second sub-circuit board 32. On the one hand, it supports the first and second sub-circuit boards 31 and 32, forming a closed containment space T between them to shield external signals. On the other hand, the first and second sub-circuit boards 31 and 32 can be electrically connected through the frame plate 33. Those skilled in the art will understand that the method of electrical connection between the first and second sub-circuit boards 31 and 32 is not limited. In one possible implementation, the frame plate 33 can also be a PCB board, and the first and second sub-circuit boards 31 and 32 can be electrically connected through traces inside the frame plate 33. In an alternative implementation, the frame plate 33 can also be made entirely of non-metallic material, and multiple metal vias (such as...) can be provided inside it. Figure 7 The first metal via 330 in the frame plate 33) and the first sub-circuit board 31 and the second sub-circuit board 32 are electrically connected through the metal via on the frame plate 33.

[0075] like Figure 3As shown, in one possible implementation, the circuit board assembly 3 is provided with shielding components, such as the first shielding component 61 and the second shielding component 62 in the figure. The shielding components can protect the internal electronic components 63 and reduce the impact of electromagnetic interference on the electronic components 63 within the shielding components. The shielding components can be, for example, shielding covers, and the material of the shielding components can be conductive materials such as conductive ceramics or metals to achieve electromagnetic shielding. In some possible implementations, the shielding components can also be made of non-conductive materials, and electromagnetic shielding can be achieved by setting conductive structures such as metal vias inside them; this application embodiment does not limit this. The specific number and location of the shielding components in the circuit board assembly 3 are not limited, such as... Figure 3 As shown, in one possible implementation, a first shielding member 61 is provided on the surface of the first sub-circuit board 31 facing the rear cover 11. The electronic components 63 within the first shielding member 61 can be chips, resistors, capacitors, inductors, etc. This application embodiment does not limit the specific number and type of electronic components 63 within the first shielding member 61; the figures are for illustrative purposes only. In another possible implementation, a second shielding member 62 is provided on the surface of the first sub-circuit board 31 facing the display screen 2. The electronic components 63 within the second shielding member 62 are, for example, SOC (System on Chip). This application embodiment does not limit the specific number and type of electronic components 63 within the second shielding member 62; the figures are for illustrative purposes only.

[0076] It should be noted that the installation of circuit board assembly 3 in electronic device 100 is not limited. For example... Figure 3 As shown, in one possible implementation, the circuit board module is mounted inside the housing 1 via a first sub-circuit board 31. Specifically, the first sub-circuit board 31 can be fixedly connected to the base plate 121 of the middle frame 12. The fixed connection method can be welding, bolting, screwing, etc., and this embodiment does not limit this.

[0077] Those skilled in the art will understand that, in addition to the circuit board assembly 3, other various functional devices can be installed inside the electronic device 100, and the embodiments of this application do not limit this. Figures 2a to 2b As shown, in one possible implementation, the electronic device 100 further includes a battery module 71, a speaker module 72, a charging interface 73, a motor 74, etc. The battery module 71 stores electrical energy to provide power to other devices. The battery module 71 may include a battery, a battery management system (BMS), etc., but this embodiment does not limit this. In one possible implementation, the battery module 71 includes a wireless charging module 711 to support wireless charging technology for the electronic device 100. For example, it can be... Figure 2aThe area indicated by the dashed line is placed on the wireless charging base to charge the electronic device 100. The motor 74 is used to vibrate the electronic device 100. When the device is set to vibration mode, it can alert the user to incoming calls, text messages, notifications, etc. The motor 74 can also provide haptic feedback to enhance the interactive experience. The speaker module 72 is used to play sound. Specifically, the speaker module 72 may include a cavity 721 and a speaker 722 installed within the cavity 721. The diaphragm of the speaker 722 vibrates under the action of current to produce sound. The cavity 721 can communicate with the outside through the sound channel on the housing 1 of the electronic device 100, propagating the sound outside the electronic device 100. The charging interface 73 is used to connect the battery module 71 to external transmission lines, chargers, etc., to support the charging and data transmission functions of the electronic device 100. The charging interface 73 can be, for example, a USB (Universal Serial Bus) interface; the specific type is not limited in this embodiment. Figures 2a to 2b As shown, in one possible implementation, the electronic device 100 is further provided with a card holder 75. The card holder 75 can be understood as a structural component or base of various shapes, used to fix and install different devices. The embodiments of this application do not limit the specific position, shape, or number of card holders 75 in the electronic device 100. The accompanying drawings are for illustration only.

[0078] like Figures 2a to 2b As shown, in one possible implementation, the electronic device 100 is further provided with a camera module, which may include one or more cameras. Different cameras perform different shooting functions. This application embodiment does not limit the number or specific type of cameras. In one implementation, the electronic device 100 includes a first camera 51, a second camera 52, and a third camera 53. The first camera 51 can be a wide-angle camera, the second camera 52 can be a main camera, and the third camera 53 can be a telephoto camera. The main camera (second camera 52) is the foundation of mobile phone photography, used for shooting various scenes such as people, landscapes, and still life. It undertakes most of the shooting tasks and can provide high-quality imaging effects. The main camera is usually equipped with a larger image sensor to capture more light; therefore, the main camera is generally large, and its height is generally the tallest. The height of the camera can be understood as its dimension in the thickness direction Z of the electronic device, such as... Figure 4a As shown, the height of the main camera (second camera 52) is H1. The telephoto camera (third camera 53) is mainly used to capture distant objects, bringing them closer through its longer focal length. The lens of a telephoto camera is typically longer, but its height is usually less than that of the main camera. Figure 4aAs shown, the height of the telephoto camera is H2, where H2 < H1. The wide-angle camera (first camera 51) is mainly used to capture wide scenes. Wide-angle cameras have a wide shooting angle, a shorter focal length, and a wider shooting angle; their height is generally also the smallest. For example... Figure 4a As shown, the height of the wide-angle camera (first camera 51) is H3, and in one possible implementation, H3 < H2 < H1.

[0079] The electronic device 100 is equipped with multiple cameras, each with a different shooting function, which can meet the diverse shooting needs of users in different scenarios and provide a more comprehensive and higher-quality shooting experience. It should be noted that the electronic device 100 can have only one, two, or more than three cameras; there is no specific limitation. In addition to the wide-angle camera, main camera, and telephoto camera mentioned above, the electronic device 100 can also be equipped with macro cameras, depth-of-field cameras, infrared cameras, etc., and this embodiment does not impose any limitations on this.

[0080] like Figure 3 As shown, in one possible implementation, the electronic device 100 also includes a camera decorative element 8, also called a DECO. The camera decorative element 8 is mounted on the rear cover 11 to protect, secure, and seal the camera, and serves as part of the appearance of the electronic device 100. Each camera has a lens for capturing light, the lens being close to the camera, and the camera decorative element 8 needs to be configured to be partially translucent, allowing light to enter the camera lens. For example... Figure 3 As shown, in one possible implementation, the camera trim 8 may include a lens 81 (commonly referred to as "lens 81" or "lens group") and a frame 82, wherein the lens 81 is a light-transmitting structure that covers the top of each camera. Figure 3 (View angle) The frame 82 is fixedly connected to the back cover 11 of the electronic device 100 and is used to fix the lens 81. In some possible implementations, the camera decorative part 8 may not include the lens 81, but instead directly hollow out the positions corresponding to the lenses of each camera, and use the frame 82 to hold the lenses of each camera in the hollowed-out area. The specific structure of the camera decorative part 8 is not limited in this application embodiment. For example Figure 3 As shown, in one possible implementation, the camera trim 8 can protrude from the back cover 11 of the electronic device 100, thereby preventing the back cover 11 from blocking light and increasing the light intake of each camera. In some possible implementations, the camera trim 8 can be flush with the back cover 11 or slightly recessed relative to the back cover 11, and this application embodiment does not limit this.

[0081] like Figure 2bAs shown, in one possible implementation, the camera decorative element 8 can be circular. In some possible implementations, the camera decorative element 8 can also be hexagonal, rectangular, octagonal, etc., and this application embodiment does not impose any limitations on this. The electronic device 100 may have only one camera decorative element 8, or it may have multiple camera decorative elements 8, and this application embodiment does not impose any limitations on this.

[0082] Those skilled in the art will understand that the various cameras in the electronic device 100 have different heights. To ensure that all cameras can receive light normally and to maintain visual consistency, it is generally required that the lenses of all cameras be flush. Specifically, such as... Figure 3 , Figure 4b As shown, in one possible implementation, the distances between the first camera 51 and the camera decoration 8, the distances between the second camera 52 and the camera decoration 8, and the distances between the third camera 53 and the camera decoration 8 are the same. For Figure 3 In terms of the structure, the distance between each camera and the camera decorative piece 8 can be understood as the distance between each camera and the lens 81. If the camera decorative piece 8 does not contain a lens 81, for example, if the lens positions of each camera are directly hollowed out, then the distance between each camera and the camera decorative piece 8 can be understood as 0. Figure 4b As shown, the above scheme can also be understood as the lenses of each camera being located on the same horizontal plane M. It should be noted that the distances between each camera and the camera decorative piece 8 can also be different, or in other words, the lenses of each camera can not be flush. The difference in distance between each camera and the camera decorative piece 8 can be reasonably set according to actual needs. Generally speaking, the smaller the difference, the better the consistency of the electronic device's appearance. In one example, the difference in distance between each camera and the camera decorative piece 8 can be 0.1mm, 0.3mm, etc., with no specific limitation, but the deviation should be as small as possible to avoid affecting the appearance of the electronic device 100.

[0083] To ensure that the lenses of all cameras are located on the same horizontal plane M, different installation methods can be adopted. For example... Figure 4bAs shown, in one possible implementation, each camera is mounted on the first sub-circuit board 31. The second camera 52 passes through the first sub-circuit board 31. This can be understood as a "broken plate" design at the location of the second camera 52, where a cutout or groove is made in the first sub-circuit board 31 corresponding to the position of the second camera 52, reserving space to embed the second camera 52, thereby improving space utilization and avoiding increasing the thickness of the electronic device 100. The position of the second camera 52 determines the height of the camera decorative piece 8 (or, in other words, the position of the lens of the second camera 52 determines the position of the horizontal plane M). Since the first camera 51 is relatively short, it is stacked on the first sub-circuit board 31 and raised using the support member 4, so that the lenses of the first camera 51 and the second camera 52 are at the same height. For the third camera 53, which has a suitable height, its location can be designed with a broken plate, or the third camera 53 can be directly mounted on the surface of the first sub-circuit board 31. Alternatively, if the height of the third camera 53 cannot meet the requirements, the support member 4 can be used to raise the third camera 53. This embodiment does not limit this; the accompanying drawings are for illustrative purposes only.

[0084] It should be noted that the embodiments of this application do not limit the fixed position and fixing method of each camera. For example... Figure 3 As shown, in one possible implementation, the first camera 51 is fixedly connected to the support member 4, the second camera 52 is fixedly connected to the base plate 121, and the third camera 53 is fixedly connected to the surface of the first sub-circuit board 31. The second camera 52 can be directly fixedly connected to the base plate 121 by welding or other methods, or a mounting bracket can be provided on the base plate 121 to indirectly fix the second camera 52 to the base plate 121. This embodiment does not limit this. The third camera 53 can be directly fixedly connected to the first sub-circuit board 31 by welding or other methods, or a mounting bracket can be provided on the first sub-circuit board 31 to indirectly fix the third camera 53 to the base plate 121. In some possible implementations, the third camera 53 can also be fixedly connected to the base plate 121 or the outer frame 122 of the middle frame 12. This embodiment does not limit this.

[0085] It is understandable that the first camera 51 is mounted on the support member 4 to elevate it, ensuring that the distance between the first camera 51 and the camera decorative member 8 is consistent with that of the other cameras. This design is not limited to wide-angle cameras; it can be used for any camera whose height cannot meet the requirements. Therefore, the first camera 51 can also be a telephoto camera, etc. In some possible implementations, the first camera 51 can also be the main camera. For example, in scenarios where the thickness is relatively high and the distance between the first sub-circuit board 31 and the back cover 11 is relatively far, the main camera and other cameras can be raised using the support member 4 to ensure normal low-light performance. This application embodiment does not limit this. The structure of the support member 4 will be described below with reference to the accompanying drawings.

[0086] Please see Figures 5a to 6b , Figure 5a This is a schematic diagram of a first structure of a support member in an electronic device according to an embodiment of this application; Figure 5b This is a three-dimensional structural diagram of the frame plate and support member in the electronic device of this application embodiment; Figure 6a This is a top view schematic diagram showing the installation position of the first camera in the electronic device of this application embodiment; Figure 6b This is a schematic diagram showing the cooperation between the first camera and the support member in the electronic device of this application embodiment.

[0087] like Figure 5a As shown, the support member 4 is fixed to the first sub-circuit board 31. The support member 4 has a first surface 41 and a second surface 42 that are opposite to each other in the thickness direction Z of the electronic device. The first surface 41 of the support member 4 abuts against the surface of the first sub-circuit board 31 facing the rear cover 11. The first camera 51 is installed inside the housing 1 and is stacked with the support member 4 in the thickness direction Z of the electronic device. The first camera 51 has a supported surface 510 that abuts against the second surface 42 of the support member 4. There is a receiving space T between the supported surface 510 of the first camera 51 and the first sub-circuit board 31. A shielding member (i.e., the first shielding member 61) is provided in the receiving space T, and there is a gap s between the supported surface 510 of the first camera 51 and the shielding member.

[0088] In the electronic device 100 provided in this application embodiment, the first camera 51 can be a wide-angle camera or a camera with a relatively low height. The circuit board assembly 3 includes a first sub-circuit board 31, on which a support member 4 is provided. The first camera 51 is superimposed on the support member 4, and the support member 4 provides support for the first camera 51 and raises its height.

[0089] The first surface 41 of the support member 4 abuts against the surface of the first sub-circuit board 31, meaning that the support member 4 and the first sub-circuit board 31 have a surface-to-surface fit, and the force on the support member 4 can be transmitted to the first sub-circuit board 31 through the first surface 41. The second surface 42 of the support member 4 abuts against the supported surface 510 of the camera, used to support the first camera 51 and raise the first camera 51. When the whole device is impacted, the first camera 51 presses against the support member 4 under the impact force, and the support member 4 then transmits the impact force to the first sub-circuit board 31 through the first surface 41. The first surface 41 of the support member 4 can be designed to be larger, that is, the contact area between the support member 4 and the first sub-circuit board 31 can be larger, in order to reduce stress concentration and reduce the risk of the first sub-circuit board 31 being crushed.

[0090] Furthermore, there is a gap s between the supported surface 510 of the first camera 51 and the shielding component, meaning that the first camera 51 does not contact the shielding component and therefore will not squeeze the shielding component. Moreover, the gap s can prevent deformation of the first camera 51. When the entire device is impacted, the deformation of the first camera 51 toward the shielding component is absorbed within the gap s, thus preventing the first camera 51 from colliding with the shielding component, reducing the risk of damage to the shielding component, and also reducing the risk of the shielding component squeezing the first sub-circuit board 31, causing the first sub-circuit board 31 to fail. This prevents the electronic components inside the shielding cover and the first sub-circuit board 31 from failing, thereby improving the overall reliability of the device.

[0091] Therefore, the camera in the electronic device 100 provided in this application embodiment is less likely to squeeze the shielding cover and circuit board, reducing the risk of overall failure and having high reliability.

[0092] It should be noted that the accommodating space T between the supported surface 510 of the first camera 51 and the first sub-circuit board 31 can accommodate one or more shielding components. Only one first shielding component 61 is shown in the figure for illustration. In addition to the shielding component, the accommodating space T can also accommodate other electronic components 63, making the layout of the circuit board assembly 3 more compact and saving space. This application embodiment does not limit this.

[0093] In one possible implementation, the height of the gap s is greater than or equal to 0.15 mm, specifically 0.15 mm, 0.16 mm, 0.17 mm, etc., and this application embodiment does not limit this. Those skilled in the art will understand that the design tolerance of the first sub-circuit board 31 is generally ±0.07 mm, and the processing tolerance of the shielding component is generally ±0.06 mm. Simulations show that in impact scenarios, the deformation of the first camera 51 towards the shielding component is within 0.03 mm. Designing the height of the gap s to be 0.15 mm or greater can accommodate design and manufacturing tolerances while also covering the deformation of the first camera 51, thereby effectively preventing the first camera 51 from impacting the shielding component. In some possible implementations, the height of the gap s can also be less than 0.15 mm, and this application embodiment does not limit this.

[0094] It should be noted that the specific structure of the support member 4 is not limited in the embodiments of this application. For example... Figures 5a to 6b As shown, in one possible implementation, the support member 4 is configured as a frame structure 82, which forms a receiving space T. The supported surface 510 of the first camera 51 abuts against the portion of the second surface 42 of the support member 4 surrounding the receiving space T.

[0095] Designing the support member 4 as a frame structure 82 allows all four sides of the supported surface 510 of the first camera 51 to contact the support member 4. This not only increases the contact area between the first camera 51 and the support member but also balances the force on the first camera 51, making the support member 4 provide more stable support. Figure 6a , Figure 6b As shown, in one possible implementation, the supported surface 510 of the first camera 51 is rectangular in shape and has four sides, all of which can be located on the second surface 42 of the support member 4. In some possible implementations, the supported surface 510 may have only three or two sides located on the second surface 42 of the support member 4, and this application embodiment does not impose any restrictions on this.

[0096] like Figure 5a As shown, in one possible implementation, the first shielding component 61 is a shielding cover, which is structurally independent of the frame 82. The shielding cover is a cover structure that can protect the internal electronic components 63 from electromagnetic interference in all directions. The shielding cover can be made of metals such as copper, stainless steel, or iron, or it can be a non-metallic material with conductive structures such as metal through-holes inside. This application embodiment does not limit this.

[0097] In one possible implementation, the contact area between the first surface 41 of the support member 4 and the first sub-circuit board 31 is larger than the contact area between the shield and the first sub-circuit board 31. For example... Figure 6aAs shown, the contact area between the first surface 41 of the support member 4 and the first sub-circuit board 31, and the contact area between the shield and the first sub-circuit board 31 are represented by two shaded areas. It can be seen that the shield has a weak structure, and its contact area with the first sub-circuit board 31 is very small, while the contact area between the first surface 41 of the support member 4 and the first sub-circuit board 31 is relatively much larger. It is understandable that, under the same applied pressure, a larger contact area between the first surface 41 and the first sub-circuit board 31 results in lower pressure, more dispersed pressure, and less damage to the first sub-circuit board 31.

[0098] Please see Figures 7 to 8c , Figure 7 This is a schematic diagram of a second structure of a support member in an electronic device according to an embodiment of this application; Figures 8a to 8c This is a schematic diagram illustrating the cooperation relationship between the support member and the first shielding member in the electronic device of the application embodiment.

[0099] like Figure 7 As shown, in one possible implementation, the shielding component is a plate-like structure. At least a portion of the outer peripheral surface of the shielding component is in contact with the inner wall surface of the frame structure 82 (support member 4), and the frame structure 82 (support member 4) and support member 4 are integrated into one structure. The inner wall surface of the frame structure 82 can be understood as its inner surface near the accommodating space T. The shielding component and support member 4 can be integrally formed, resulting in a simple structure and simplified processing and assembly. In another possible implementation, the shielding component can be made of metal. In this case, the support member 4 is also made of metal, and the two are integrally formed. The metal material can effectively shield electromagnetic waves, preventing interference to the electronic components 63 inside the shielding component. Figure 7 As shown, in an alternative implementation, the support 4 and the shield can also be made of non-metallic materials. The shield includes multiple metal vias, namely the second metal via 610. The metal vias also serve to shield signals, preventing interference to the electronic components 63 inside the shield. The specific number of metal vias inside the shield is not limited; the attached figure is for illustrative purposes only.

[0100] like Figure 8a As shown, in one possible implementation, the outer peripheral surface of the shielding member can be entirely in contact with the inner wall surface of the frame 82 structure, or only a portion of the outer peripheral surface of the shielding member can be in contact with the inner wall surface of the frame 82 structure. For example, as... Figure 8b As shown, the outer peripheral surface of the shielding component may have two edges that connect with the inner wall surface of the frame structure 82, or, as... Figure 8c As shown, the outer peripheral surface of the shielding component may have three edges that connect with the inner wall surface of the frame 82 structure, but this embodiment does not impose any restrictions on this.

[0101] Please see Figures 9 to 10 , Figure 9This is a schematic diagram of a third structure of the support member in the electronic device according to an embodiment of this application; Figure 10 This is a schematic diagram of a third three-dimensional structure of a support member in an electronic device according to an embodiment of this application.

[0102] It should be noted that the embodiments of this application do not limit the specific location of the support member 4 or the relationship between the support member 4 and other components. For example... Figure 5a , Figure 7 , Figure 9 As shown, in one possible implementation, the circuit board assembly 3 is a sandwich board, including a first sub-circuit board 31, a frame board 33, and a second sub-circuit board 32 stacked together, with a support member 4 disposed on the outside of the frame board 33. By placing the support member 4 outside the frame board 33, the first camera 51 is also disposed outside the frame board 33, making reasonable use of the layout area on the first sub-circuit board 31.

[0103] like Figure 5a , Figure 7 , Figure 9 As shown, in one possible implementation, along the thickness direction Z of the electronic device, the side of the frame plate 33 facing the first sub-circuit board 31 is on the same plane as the first surface 41 of the support member 4, and the side of the frame plate 33 facing the second sub-circuit board 32 is located on the side of the second surface 42 of the support member 4 away from the first sub-circuit board 31. Alternatively, it can be understood that if the height of the support member 4 is shorter than that of the frame plate 33, more installation space can be reserved above the support member 4 for the first camera 51. In some possible implementations, when the height of the first camera 51 is insufficient, the support member 4 can also be the same height as or higher than the frame plate 33; this embodiment does not impose any limitations on this.

[0104] like Figures 5a to 5b , Figure 7 As shown, in one possible implementation, the support member 4 is connected to the outer wall of the frame plate 33 and is integrally formed with the frame plate 33. Those skilled in the art will understand that if there is a gap between the mating surfaces of the two structures, a stress band will form at the gap, leading to stress concentration and potentially causing device failure. With this structure, the support member 4 and the frame plate 33 can be integrally formed, eliminating gaps between their outer walls and preventing the formation of stress bands, thus reducing the risk of damage to both the support member 4 and the frame plate 33.

[0105] like Figure 7As shown, in one possible implementation, the frame plate 33, the shielding component, and the support component 4 can all be a single integrated structure, consisting of a single non-metallic plate, and internally provided with multiple metal vias. Specifically, the first metal via 330 within the frame plate 33 is used to achieve electrical connection between the first sub-circuit board 31 and the second sub-circuit board 32; the second metal via 610 within the shielding component is used for signal shielding; the support component 4 may or may not have metal vias, and this embodiment does not impose any limitations on this. Figures 5a to 5b As shown, in one possible implementation, only the frame plate 33 and the support member 4 can be an integral structure, with the support member 4 being set independently. In this case, the frame plate 33 and the support member 4 can be a single PCB board, or they can be a non-metallic board with metal vias; this embodiment does not impose any limitations on this.

[0106] like Figures 9 to 10 As shown, in one possible implementation, the support member 4 and the frame plate 33 can also be set independently of each other, which makes the design and processing of the support member 4 more flexible and reduces the processing difficulty.

[0107] It should be noted that the material of the support member 4 and the connection method between it and the first sub-circuit board 31 are not limited. In one possible implementation, the support member 4 is made entirely of metal, and its first surface 41 is soldered to the first sub-circuit board 31. For example, the frame board 33 can be fixed to the first sub-circuit board 31 by SMT, which not only provides a firm connection but also allows it to be installed in the same process as other components on the first sub-circuit board 31, simplifying the assembly process. Specifically, the support member 4 can be made of stainless steel or copper and plated with solder such as nickel or tin. Pads can be set at corresponding positions on the first sub-circuit board 31, and a firm connection can be achieved by soldering the pads to the solder on the surface of the support member 4.

[0108] The above description illustrates the implementation of this application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0109] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0110] The following explains the terminology that may appear in the embodiments of this application.

[0111] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0112] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0113] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB).

[0114] Relative / Relative Setting: A relative setting with B can refer to A and B being face-to-face. For example, when two components are set relative to each other, these two components overlap in at least a portion of their area along a certain direction.

[0115] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0116] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, include: A housing, the housing including a rear cover; A circuit board assembly is mounted inside the housing and includes a first sub-circuit board and a support member fixed to the first sub-circuit board. The support member has a first surface and a second surface opposite to each other in the thickness direction of the electronic device, and the first surface of the support member abuts against the surface of the first sub-circuit board facing the rear cover. A first camera is installed inside the housing and stacked with the support member in the thickness direction of the electronic device. The first camera has a supported surface that abuts against the second surface of the support member. There is a receiving space between the supported surface of the first camera and the first sub-circuit board. A shielding member is provided in the receiving space. There is a gap between the supported surface of the first camera and the shielding member.

2. The electronic device as claimed in claim 1, characterized in that, The support member is configured as a frame structure, which surrounds to form the receiving space, and the supported surface of the first camera abuts against the portion of the second surface of the support member surrounding the receiving space.

3. The electronic device as described in claim 2, characterized in that, The shielding component is a shielding cover and is set independently from the frame structure.

4. The electronic device as claimed in claim 3, characterized in that, The contact area between the first surface of the support member and the first sub-circuit board is greater than the contact area between the shield and the first sub-circuit board.

5. The electronic device as claimed in claim 2, characterized in that, The shielding component is a plate-shaped structure, and at least a portion of the outer peripheral surface of the shielding component is in contact with the inner wall surface of the frame structure, and is integrated with the frame structure.

6. The electronic device as claimed in claim 5, characterized in that, The shielding component is made of a non-metallic material and includes multiple metal vias; or, the shielding component is made of a metallic material.

7. The electronic device as claimed in claim 1, characterized in that, The height of the gap is greater than or equal to 0.15 mm.

8. The electronic device according to any one of claims 1-7, characterized in that, The circuit board assembly further includes a second sub-circuit board and a frame board. In the thickness direction of the electronic device, the first sub-circuit board, the frame board and the second sub-circuit board are stacked sequentially, and the second sub-circuit board is located on the side of the frame board near the rear cover. The support member is disposed on the outside of the frame board.

9. The electronic device as claimed in claim 8, characterized in that, The support member is connected to the outer wall of the frame plate and is integrated with the frame plate.

10. The electronic device as claimed in claim 9, characterized in that, In the thickness direction of the electronic device, the side of the frame plate facing the first sub-circuit board is on the same plane as the first surface of the support member, and the side of the frame plate facing the second sub-circuit board is located on the side of the second surface of the support member away from the first sub-circuit board.

11. The electronic device as claimed in claim 9, characterized in that, Both the first sub-circuit board and the second sub-circuit board are printed circuit boards; and... The frame board is a printed circuit board; Alternatively, the frame plate may be made of a non-metallic material and include multiple metal through holes.

12. The electronic device as claimed in claim 8, characterized in that, The support member and the frame plate are set independently of each other.

13. The electronic device as claimed in claim 12, characterized in that, The support is made of metal, and the first surface of the support is welded to the first sub-circuit board.

14. The electronic device according to any one of claims 1-7, characterized in that, The electronic device also includes a second camera and a third camera, with the second camera passing through the first sub-circuit board; The electronic device also includes a camera decoration, wherein the distance between the first camera and the camera decoration, the distance between the second camera and the camera decoration, and the distance between the third camera and the camera decoration are the same.

15. The electronic device as claimed in claim 14, characterized in that, The housing also includes a middle frame, which includes a base plate and an outer frame surrounding the outer periphery of the base plate. The base plate and the rear cover are spaced apart in the thickness direction of the electron. The first sub-circuit board of the circuit board is fixedly connected to the base plate, and the second camera is fixedly connected to the base plate.

16. The electronic device as claimed in claim 14, characterized in that, The first camera is a wide-angle camera, the second camera is a main camera, and the third camera is a telephoto camera.

Images