Temperature control electric heating sheet with patch lamp beads

By integrating LED chips and a flexible substrate layer onto the heating element, the problems of limited functionality and inefficient space utilization of the heating element are solved, achieving a combination of heating and lighting, expanding application scenarios, and optimizing product design.

CN224265132UActive Publication Date: 2026-05-19SHENZHEN DATANG DINGSHENG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN DATANG DINGSHENG TECH CO LTD
Filing Date
2025-06-04
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

Existing electric heating elements have limited functionality and application scenarios, and the independent setting of the light source and electric heating element leads to unreasonable utilization of the internal space of the product.

Method used

Design a temperature-controlled heating element with surface-mount LED beads, combining LED chips and a flexible substrate layer to achieve integrated heating and lighting functions. The LED chip and heating area are connected by metal lines on both sides of the flexible substrate layer, and electrical energy is transmitted using wires and terminals. The connection points are sealed with UV glue.

Benefits of technology

This invention enables the heating element to provide lighting while heating, expanding the application scenarios of the heating element, reducing product size, and improving space utilization efficiency.

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Abstract

The utility model discloses a temperature control electric heating sheet with paster lamp beads, and relates to the technical field of electric heating sheets, the electric heating sheet comprises a plurality of LED chips, a flexible base material layer, metal circuits and an insulating film, the metal circuits are arranged on the front side and the back side of the flexible base material layer, the metal circuits on the front side of the flexible base material layer form paster areas, and the paster areas are arranged on the back side of the flexible base material layer. The plurality of LED chips are mounted on the surface of the patch area and are mutually connected and conducted through a metal circuit, the metal circuit on the back surface of the flexible substrate layer forms a heating area, a connecting part is reserved in the heating area, a wire led out of the electric heating sheet is welded on the connecting part, the connecting part is respectively connected with the patch area and the heating area, and insulating films are arranged outside the patch area and the heating area. The front surface of the electric heating sheet can be subjected to LED surface mounting operation, so that the electric heating sheet can meet the heating and temperature rise requirements and can provide the heating effect of red light and blue light through the light emission of the LED, and thus a product equipped with the electric heating sheet has the heating and far infrared functions.
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Description

Technical Field

[0001] This utility model relates to the field of electric heating element technology, specifically a temperature-controlled electric heating element with surface-mount LED beads. Background Technology

[0002] Electric heating elements are a new type of electric heating product. Compared with traditional metal electric heating products, they can fit more closely to the surface of the object being heated. They are mainly used in fields such as providing a thermal environment for outdoor communication equipment, outdoor insulation and antifreeze, heating of chemical equipment, and pipeline antifreeze.

[0003] However, existing electric heating elements primarily function to provide heat to the product by generating their own heat, resulting in a single function and limited application scenarios. Furthermore, their methods for addressing the frost prevention issue in lighting devices mostly involve placing them near the light source, with both elements being independently installed within the product's design. This leads to an inefficient use of internal space, requiring the product to reserve space for both the electric heating element and the light source. Utility Model Content

[0004] To address the technical deficiencies in the background technology, this utility model proposes a temperature-controlled heating element with surface-mount LEDs, which solves the aforementioned technical problems and meets practical needs. The specific technical solution is as follows:

[0005] This utility model provides a temperature-controlled heating element with surface-mount LED chips. The heating element includes several LED chips, a flexible substrate layer, metal circuits, and an insulating film. Metal circuits are provided on both the front and back sides of the flexible substrate layer. The metal circuits on the front side of the flexible substrate layer form a surface-mount area. Several LED chips are mounted on the surface of the surface-mount area and interconnected by the metal circuits. The metal circuits on the back side of the flexible substrate layer form a heating area. The heating area has a pre-reserved connection part. A wire is welded to the connection part and leads out to the outside of the heating element. The connection part connects the surface-mount area and the heating area respectively. An insulating film is provided outside both the surface-mount area and the heating area.

[0006] As a further embodiment of this utility model, the connecting part includes connection point one, connection point two, connection point three, and connection point four. The wires include a ground wire, an LED positive wire, an NTC wire, and a heating area positive wire. The ground wire and the heating area positive wire are respectively soldered to connection point one and connection point four. The LED positive wire and the NTC wire are respectively soldered to connection point two and connection point three. Connection point five and connection point six are reserved in the patch area. The NTC wire passes through the front side of the flexible substrate layer from connection point three and is connected to connection point five through the metal line on the front side of the flexible substrate layer. The LED positive wire passes through the front side of the flexible substrate layer from connection point two and is connected to connection point six through the metal line on the front side of the flexible substrate layer.

[0007] As a further embodiment of this utility model, the wire also includes a terminal, and one end of each of the ground wire, LED positive wire, NTC wire and heating area positive wire is connected to the terminal.

[0008] As a further embodiment of this utility model, the connection positions of the ground wire, LED positive wire, NTC wire and heating area positive wire are sealed with UV glue.

[0009] As a further embodiment of the present invention, the surface of the patch area is provided with at least three sets of LED light strings, each set of LED light strings including multiple LED chips connected in series by metal lines, and any two sets of LED light strings are connected in parallel and connected in series with a conductive line composed of LED positive line and NTC line.

[0010] As a further embodiment of this utility model, the resistance value of the metal circuit in the heating zone is 10-12 ohms.

[0011] As a further embodiment of this utility model, the light emission wavelength of the LED chip is ≥630nm.

[0012] The beneficial effects of this utility model are as follows: LED chips can be mounted on the front side of the heating element, so that the heating element can meet the heating and temperature rise requirements while providing illumination through the light emitted by the LED chips. Different lighting effects can be formed on the light-emitting side of the front side of the heating element. The heating element can provide red and blue light heating effects through the light emitted by the LEDs, thereby enabling products equipped with this heating element to have heating and far-infrared functions, further expanding the function of the heating element, solving the problem of the heating element having only one function, and having a small size. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the front of the heating element.

[0014] Figure 2 This is a schematic diagram of the metal circuit layout on the front of the heating element.

[0015] Figure 3 This is a schematic diagram of the metal wiring layout on the back of the heating element.

[0016] Figure 4 This is a schematic diagram of the conductor structure.

[0017] Figure 5 This is a schematic diagram of the structure when the wires are connected to the back of the heating element.

[0018] In the diagram, 1. LED chip; 2. Flexible substrate layer; 3. Insulating film; 4. Patch area; 41. Connection point five; 42. Connection point six; 5. Heating area; 51. Connection part; 511. Connection point one; 512. Connection point two; 513. Connection point three; 514. Connection point four; 6. Wire; 61. Ground wire; 62. LED positive wire; 63. NTC wire; 64. Heating area positive wire; 65. Terminal; 7. Conductive circuit; 8. LED string. Detailed Implementation

[0019] This utility model provides a temperature-controlled heating element with surface-mount LED beads, such as... Figures 1-5 As shown, the heating element includes several LED chips 1, a flexible substrate layer 2, metal circuits, and an insulating film 3. Metal circuits are provided on both the front and back sides of the flexible substrate layer 2. The metal circuits on the front side of the flexible substrate layer 2 form a mounting area 4. Several LED chips 1 are mounted on the surface of the mounting area 4 and interconnected through the metal circuits. The metal circuits on the back side of the flexible substrate layer 2 form a heating area 5. The heating area 5 has a pre-reserved connecting portion 51. A wire 6 is welded to the connecting portion 51 and leads out of the heating element. The connecting portion 51 connects the mounting area 4 and the heating area 5 respectively. An insulating film 3 is provided on the outside of both the mounting area 4 and the heating area 5.

[0020] It should be noted that: the electric heating element is connected to an external power source via wire 6 to provide power for its operation. After the electric heating element is powered on, the metal circuits in the patch area 4 on the front side of the flexible substrate layer 2 are energized, causing the LED chip 1 to be powered on and emit light, thus emitting light from the front side of the electric heating element. The metal circuits in the heating area 5 on the back side of the flexible substrate layer 2 are also energized, causing the entire heating area 5 to heat up. In addition, the power supply of the circuit composed of several LED chips 1 and the metal circuits in the patch area 4 can be controlled via wire 6, thereby controlling the operation of the LED chips 1 in the patch area 4 and realizing the control of the lighting effect of the electric heating element.

[0021] LEDs can be mounted on the front of the heating element, allowing it to meet heating requirements while providing illumination through LEDs. This enables lighting devices equipped with the heating element to have defogging and defrosting functions. Furthermore, the heating element is small in size and easy to assemble.

[0022] It needs to be further explained that, such as Figures 1-3As shown, the connection part 51 includes connection point 1 511, connection point 2 512, connection point 3 513, and connection point 4 514. The conductor 6 includes a ground wire 61, an LED positive electrode wire 62, an NTC wire 63, and a heating area positive electrode wire 64. The ground wire 61 and the heating area positive electrode wire 64 are respectively soldered to connection point 1 511 and connection point 4 514. The LED positive electrode wire 62 and the NTC wire 63 are respectively soldered to connection point 2 512 and connection point 3 513. The patch area 4 has reserved connection point 5 41 and connection point 6 42. The NTC wire 63 passes through connection point 3 513 to the front side of the flexible substrate layer 2 and is connected to connection point 5 41 through the metal line on the front side of the flexible substrate layer 2. The LED positive electrode wire 62 passes through connection point 2 512 to the front side of the flexible substrate layer 2 and is connected to connection point 6 42 through the metal line on the front side of the flexible substrate layer 2.

[0023] In this configuration, after the conductor 6 is connected to the external power supply, the positive electrode line 64 of the heating area is the positive electrode connection line of the metal circuit in the heating area 5, and the ground wire 61 is the negative electrode connection line of the metal circuit in the heating area 5 to achieve grounding. The LED positive electrode line 62 and the NTC line 63 are both introduced from the back of the flexible substrate layer 2 and pass through to the front of the flexible substrate layer 2, thereby realizing the power supply to the metal circuit on the front of the flexible substrate layer 2. The LED positive electrode line 62 is the positive electrode connection line of the metal circuit in the patch area 4, and the NTC line 63 is the negative electrode connection line of the metal circuit in the patch area 4 to achieve grounding.

[0024] Specifically, such as Figure 4 and Figure 5 As shown, the wire 6 also includes a terminal 65, and one end of each of the four wires, namely the ground wire 61, the LED positive wire 62, the NTC wire 63 and the heating area positive wire 64, is connected to the terminal 65.

[0025] The end of the wire 6 leading out of the heating element is connected via a terminal 65. The terminal 65 has a spacing of 1.25 mm and four conductive contacts, thereby connecting the ends of the ground wire 61, LED positive wire 62, NTC wire 63 and heating area positive wire 64 into one unit, so as to facilitate connection with an external power source and enable the wire 6 to transmit electrical energy to the heating element.

[0026] Specifically, such as Figure 5 As shown, the ground wire 61, LED positive wire 62, NTC wire 63 and heating area positive wire 64 are sealed at the connection position of the connection part 51 with UV glue.

[0027] UV adhesive is applied to the connection part 51 to seal the connection positions of the ground wire 61, LED positive wire 62, NTC wire 63, and heating area positive wire 64 at the connection part 51. This can fix the positions of the ground wire 61, LED positive wire 62, NTC wire 63, and heating area positive wire 64 on the heating element, and also seal the connection part 51 of the ground wire 61, LED positive wire 62, NTC wire 63, and heating area positive wire 64 to prevent foreign objects from damaging the connection parts of the ground wire 61, LED positive wire 62, NTC wire 63, and heating area positive wire 64 on the heating element.

[0028] Specifically, such as Figure 1 and Figure 5 As shown, the surface of the patch area 4 is provided with at least three sets of LED light strings 8. Each set of LED light strings 8 includes multiple LED chips 1 connected in series by metal lines. Any two sets of LED light strings 8 are connected in parallel and connected in series with the conductive line 7 composed of LED positive line 62 and NTC line.

[0029] Multiple LED strings 8 and conductive lines 7 are set on the flexible substrate layer 2. The brightness of the LEDs can be controlled by controlling the input current. The color of the light can also be adjusted by setting different fluorescent adhesives on the LED strings 8 with different resistance values. The conductive lines 7 can be completed simultaneously in the wiring process of the flexible substrate layer 2. There is no need to attach resistors on the flexible substrate layer 2, which saves component costs and process costs of attaching components.

[0030] It needs to be further explained that, such as Figure 2 As shown, the resistance of the metal circuit in the heating zone 5 is 10-12 ohms.

[0031] Among them, the metal circuit in the heating zone 5 is a heating wire, which can transfer heat energy to the surrounding area of ​​the heating element through its own heating after being powered on, so that the part of the product where the heating element is set will be heated.

[0032] It needs to be further explained that, such as Figure 1 As shown, the light emission wavelength of the LED chip 1 is ≥630nm.

[0033] The light wavelength of LED chip 1 falls within the visible light range, enabling the light emitted by the heating element equipped with LED chip 1 to provide illumination for people.

[0034] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A temperature-controlled heating element with surface-mount LED chips, the heating element comprising a plurality of LED chips, a flexible substrate layer, metal circuitry, and an insulating film, characterized in that, Metal lines are provided on both the front and back sides of the flexible substrate layer. The metal lines on the front side of the flexible substrate layer form a patch area, on which several LED chips are mounted and interconnected through the metal lines. The metal lines on the back side of the flexible substrate layer form a heating area. The heating area has a reserved connection part, and the connection part is welded with a wire leading out to the outside of the heating element. The connection part connects the patch area and the heating area respectively. An insulating film is provided outside both the patch area and the heating area.

2. The heating element according to claim 1, characterized in that, The connection part includes connection point 1, connection point 2, connection point 3, and connection point 4. The conductors include a ground wire, an LED positive electrode wire, an NTC wire, and a heating area positive electrode wire. The ground wire and the heating area positive electrode wire are respectively soldered to connection point 1 and connection point 4. The LED positive electrode wire and the NTC wire are respectively soldered to connection point 2 and connection point 3. The patch area has reserved connection point 5 and connection point 6. The NTC wire passes through the front side of the flexible substrate layer from connection point 3 and is connected to connection point 5 through the metal line on the front side of the flexible substrate layer. The LED positive electrode wire passes through the front side of the flexible substrate layer from connection point 2 and is connected to connection point 6 through the metal line on the front side of the flexible substrate layer.

3. The heating element according to claim 2, characterized in that, The wire also includes a terminal, and one end of each of the four wires—the ground wire, the LED positive wire, the NTC wire, and the heating zone positive wire—is connected to the terminal.

4. The heating element according to claim 2, characterized in that, The ground wire, LED positive wire, NTC wire, and heating area positive wire are sealed at the connection points using UV adhesive.

5. The heating element according to claim 2, characterized in that, The surface of the patch area is provided with at least three sets of LED light strings. Each set of LED light strings includes multiple LED chips connected in series by metal lines. Any two sets of LED light strings are connected in parallel and connected in series with a conductive line composed of LED positive line and NTC line.

6. The heating element according to claim 1, characterized in that, The resistance of the metal circuitry within the heating zone is 10-12 ohms.

7. The heating element according to claim 1, characterized in that, The LED chip emits light at a wavelength of ≥630nm.