PCB aluminum plate base material

Abstract

The utility model provides a PCB aluminum plate base material, relates to the PCB technical field, and comprises an aluminum plate base layer, a transition combination layer and an insulation layer which are successively arranged from bottom to top, the transition combination layer is arranged between the aluminum plate base layer and the insulation layer, the aluminum plate base layer comprises an aluminum plate main body, a phenolic aldehyde plate and a heat radiation channel, the phenolic aldehyde plate is arranged above the aluminum plate main body, and the heat radiation channel is arranged above the phenolic aldehyde plate. The aluminum plate main body is internally provided with crisscrossed heat dissipation channels, the unique transition bonding layer is designed, the phenolic aldehyde plate is additionally arranged above the aluminum plate base layer, the PCB detection passing rate is increased, the unique transition bonding layer is designed, metal particles and a polymer binder are mixed, and a special columnar protrusion structure is adopted, so that the PCB detection passing rate is increased, and the PCB detection efficiency is improved. The bonding force between the aluminum plate base layer and the insulating layer is enhanced, the heat conduction fibers distributed in the net shape are arranged in the insulating layer and make contact with the circuit layer, the heat conduction efficiency is improved, the criss-cross heat dissipation channels in the aluminum plate base layer form a complete heat dissipation network, and heat dissipation is accelerated.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, and in particular to a PCB aluminum board substrate. Background Technology

[0002] Currently, printed circuit boards are key components in various electronic devices, and aluminum-based PCBs are widely used due to their advantages such as light weight and good heat dissipation.

[0003] Existing PCB aluminum substrates have structural design deficiencies. For example, the bonding structure between the aluminum plate and the insulating layer and transition bonding layer is not stable enough. Under long-term use or external force, delamination and peeling are prone to occur, which will affect the performance and stability of the PCB. In addition, the existing heat dissipation structure design is not reasonable enough, and it is difficult to dissipate the heat generated by electronic components efficiently, which will cause the operating temperature of electronic components to rise, affecting their service life and performance. Furthermore, the yield of aluminum substrates produced by current testing equipment is low. Therefore, a new PCB aluminum substrate is needed. Utility Model Content

[0004] The purpose of this invention is to provide a PCB aluminum substrate that solves the problems of slow adjustment using tools and loose casters in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a PCB aluminum substrate, comprising an aluminum substrate, a transition bonding layer and an insulating layer arranged sequentially from bottom to top, wherein the transition bonding layer is disposed between the aluminum substrate and the insulating layer, the aluminum substrate comprising an aluminum body, a phenolic board and heat dissipation channels, the phenolic board being disposed above the aluminum body, and the aluminum body having crisscrossing heat dissipation channels inside.

[0006] Preferably, the thickness of the phenolic board is 0.8 mm.

[0007] Preferably, the phenolic resin board is evenly distributed on the upper surface of the aluminum plate body.

[0008] Preferably, the transition bonding layer includes a transition plate body and columnar protrusions. The upper surface of the transition plate body is provided with columnar protrusions, which are equidistantly arranged on both sides of the upper surface of the transition plate body.

[0009] Preferably, the insulating layer includes an insulating board body and a wiring mounting groove, wherein the upper surface of the insulating board body has a wiring mounting groove extending along the axial direction for placing wires.

[0010] Preferably, the interior of the insulating plate body is provided with thermally conductive fiber filaments distributed in a mesh pattern.

[0011] Preferably, mounting holes are provided at the four corners of the aluminum plate base layer, transition bonding layer and insulating layer.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] By adding a phenolic board layer on top of the aluminum substrate, the PCB board inspection pass rate is improved. A unique transition bonding layer is designed, which enhances the bonding force between the aluminum substrate and the insulation layer through the mixing of metal particles and polymer adhesive and a special columnar protrusion structure. The insulation layer is set with a mesh-distributed heat-conducting fiber filament that contacts the circuit layer, improving the heat conduction efficiency. The crisscrossing heat dissipation channels inside the aluminum substrate form a complete heat dissipation network, accelerating heat dissipation. Attached Figure Description

[0014] Figure 1 This is a top view of the overall structure of the product of this utility model;

[0015] Figure 2 This is a schematic diagram of the overall front view of the product of this utility model;

[0016] Figure 3 This is a schematic diagram of the overall exploded structure of the product of this utility model;

[0017] Figure 4 This is a schematic diagram of the aluminum plate base structure of the product of this utility model;

[0018] Figure 5 This is an enlarged structural diagram of section A of the product of this utility model;

[0019] Figure 6 This is a schematic diagram of the transition bonding layer structure of the product of this utility model;

[0020] Figure 7 This is a schematic diagram of the insulation layer structure of the product of this utility model.

[0021] In the diagram: 1. Aluminum plate base layer; 101. Aluminum plate body; 102. Phenolic board; 103. Heat dissipation channel; 2. Transition bonding layer; 201. Transition plate body; 202. Columnar protrusion; 3. Insulation layer; 301. Insulation plate body; 302. Circuit mounting groove; 4. Mounting hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] This utility model relates to a PCB aluminum substrate, such as Figure 1-7 As shown, it includes an aluminum plate base 1, an insulating layer 3 on top of the aluminum plate base 1, and a transition bonding layer 2 between the aluminum plate base 1 and the insulating layer 3. The aluminum plate base 1 serves as the basic support structure of the entire substrate and is made of high-purity aluminum alloy material. The insulating layer 3 is made of high-performance insulating resin material, such as polyimide resin. Mounting holes 4 are provided at the four corners of the aluminum plate base 1, the transition bonding layer 2, and the insulating layer 3 to facilitate docking and installation.

[0024] Among them, such as Figure 5 As shown, the aluminum plate base 1 includes an aluminum plate body 101, a phenolic board 102, and heat dissipation channels 103. The phenolic board 102 is uniformly fixed on the upper surface of the aluminum plate body 101. Three different thicknesses and materials of 102 were used to test the PCB board pass rate. When the thickness was 0.4mm, slight burrs appeared, indicating good quality (without electroplating). When the thickness was 0.8mm, the quality was the best, achieving a 100% pass rate. When using a 0.25mm medium steel aluminum plate, the effect was the worst. The optimal thickness of 102 was determined to be 0.8mm. The aluminum plate base 1 has crisscrossing heat dissipation channels 103 inside, which are interconnected to form a complete heat dissipation network.

[0025] Among them, such as Figure 6 As shown, the transition bonding layer 2 includes a transition plate body 201 and columnar protrusions 202. The columnar protrusions 202 are fixedly connected to the upper part of the transition plate body 201. The columnar protrusions 202 are disposed on both sides of the upper surface of the transition plate body 201. Copper particles and adhesive are mixed evenly and coated on the upper surface of the aluminum plate base layer 1. The columnar protrusions 202 are formed on the transition bonding layer 2 by means of mold pressing.

[0026] Among them, such as Figure 7 As shown, the insulating layer 3 includes an insulating board body 301 and a wiring mounting groove 302. The wiring mounting groove 302 is provided inside the insulating board body 301. The wiring mounting groove 302 extends along the axial direction of the upper surface of the insulating board body 301. Five sets of wiring mounting grooves 302 are provided, and the five sets of wiring mounting grooves 302 are arranged in parallel on the upper surface of the insulating board body 301. The lower surface of the insulating board body 301 is provided with a groove that matches the columnar protrusion 202. The interior of the insulating board body 301 is provided with heat-conducting fiber filaments (not shown in the figure) made by injection molding process. The heat-conducting fiber filaments are distributed in a mesh pattern inside the insulating board body 301.

[0027] Working principle: When the PCB board is in operation, the heat generated by the electronic components is first transferred to the insulating layer 3. The insulating layer 3 conducts the heat to the thermally conductive fibers in contact with it. The thermally conductive fibers rapidly diffuse the heat to the insulating layer 3, and then conduct it to the aluminum substrate 1 through the transition bonding layer 2. The heat dissipation channel 103 in the aluminum substrate 1 accelerates the dissipation of heat, thereby effectively reducing the temperature of the PCB board. At the same time, the special structural design of the transition bonding layer 2 and the tight fit between the insulating layer 3 and the other layers ensure the stability of the entire substrate structure.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A PCB aluminum substrate, characterized in that: The aluminum plate base (1), transition bonding layer (2) and insulation layer (3) are arranged sequentially from bottom to top. The transition bonding layer (2) is disposed between the aluminum plate base (1) and the insulation layer (3). The aluminum plate base (1) includes an aluminum plate body (101), a phenolic board (102) and heat dissipation channels (103). The phenolic board (102) is disposed above the aluminum plate body (101), and the interior of the aluminum plate body (101) is provided with crisscrossing heat dissipation channels (103).

2. The PCB aluminum substrate according to claim 1, characterized in that: The thickness of the phenolic board (102) is 0.8 mm.

3. The PCB aluminum substrate according to claim 1, characterized in that: The phenolic board (102) is evenly distributed on the upper surface of the aluminum plate body (101).

4. The PCB aluminum substrate according to claim 1, characterized in that: The transition bonding layer (2) includes a transition plate body (201) and columnar protrusions (202). The upper surface of the transition plate body (201) is provided with columnar protrusions (202), and the columnar protrusions (202) are equidistantly arranged on both sides of the upper surface of the transition plate body (201).

5. The PCB aluminum substrate according to claim 1, characterized in that: The insulation layer (3) includes an insulation board body (301) and a wiring mounting groove (302). The upper surface of the insulation board body (301) is provided with a wiring mounting groove (302) extending along the axial direction for placing wires.

6. The PCB aluminum substrate according to claim 5, characterized in that: The interior of the insulating plate body (301) is provided with heat-conducting fiber filaments distributed in a mesh pattern.

7. The PCB aluminum substrate according to claim 1, characterized in that: Mounting holes (4) are provided at the four corners of the aluminum plate base layer (1), transition bonding layer (2) and insulation layer (3).

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