Single-sided double-layer aluminum substrate

Abstract

The utility model discloses a single-sided double-layer aluminum substrate which comprises a finished product plate, and the finished product plate is provided with contacts and comprises an aluminum plate; the insulating heat conduction layer is arranged on one side of the aluminum plate; the two layers of copper foils are arranged on the side, away from the aluminum plate, of the insulating heat conduction layer, circuit structures are arranged on the two layers of copper foils, the two layers of copper foils are electrically connected, and the contacts are electrically connected with the copper foils; and the PI layer is arranged between the two layers of copper foils. Complicated and fine circuit structures can be arranged on the two layers of copper foils, and pins of electronic components are connected with contacts, so that connection with the circuit structures is realized, and the requirement of the display electronic and electric appliance industry on complex wiring on a circuit board is met. The PI layer is a polyimide layer, and the PI layer has insulativity and excellent mechanical performance, so that the finished board can be effectively prevented from being bent, the flatness of the finished board is ensured, and the requirements of the display electronic and electrical appliance industry on the circuit board are met.

Description

Technical Field

[0001] This application relates to the field of aluminum substrate technology, and in particular to a single-sided double-layer aluminum substrate. Background Technology

[0002] With the rapid development of the electronics industry, especially the display electronics industry, such as televisions and tablets, the performance requirements of circuit boards are becoming increasingly higher, and the routing of circuit boards needs to be more and more complex.

[0003] In the existing technology, the circuit board structure used in the display electronics industry generally includes an aluminum plate, an insulating layer, and a copper foil layer. The copper foil layer is used to support the circuit structure, and the aluminum plate is used for heat dissipation. However, the above circuit board structure is difficult to meet the increasingly complex routing needs on the circuit board. Furthermore, since the circuit boards in the display electronics industry are generally very long, the warpage of the aluminum-based circuit board is seriously excessive and uneven, which seriously affects the normal use of the customer's surface mount technology.

[0004] Therefore, it is necessary to propose a single-sided double-layer aluminum substrate that can set up complex circuit structures and reduce the warpage of the circuit board through double-layer copper foil, which has become an important technical problem that needs to be solved. Utility Model Content

[0005] This application provides a single-sided double-layer aluminum substrate, which aims to solve the problem that the existing circuit board structure in the prior art is difficult to meet the increasingly complex routing needs on the circuit board, and that the circuit boards in the display electronics industry are generally very long, resulting in serious excessive warpage and unevenness of the aluminum-based circuit board, which seriously affects the normal use of the customer's surface mount technology.

[0006] To achieve the above objectives, this application proposes a single-sided double-layer aluminum substrate, comprising a finished board with contacts. The finished board includes: an aluminum plate; an insulating and thermally conductive layer disposed on one side of the aluminum plate; two copper foils disposed on the side of the insulating and thermally conductive layer away from the aluminum plate, with circuit structures disposed on the two copper foils, the two copper foils being electrically connected, and contacts electrically connecting the copper foils; and a PI layer disposed between the two copper foils.

[0007] In some embodiments, the device further includes: a connecting hole, wherein a connecting hole is provided between two copper foils, the connecting hole is formed in one copper foil and extends into the other copper foil; and an electroplating layer, wherein the electroplating layer is disposed on the inner wall surface of the connecting hole and the electroplating layer is respectively connected to the two copper foils.

[0008] In some embodiments, the invention further includes an ink layer disposed on the side of the outermost copper foil away from the aluminum plate.

[0009] In some embodiments, the interface between the aluminum plate and the insulating thermally conductive layer is a rough surface.

[0010] In some embodiments, the system further includes a side panel, which connects to a plurality of finished panels.

[0011] In some embodiments, it further includes: a snap fastener disposed on the finished plate.

[0012] This application proposes a single-sided double-layer aluminum substrate, including a finished board with contacts. The finished board comprises: an aluminum plate, an insulating and thermally conductive layer, two copper foil layers, and a PI layer. The insulating and thermally conductive layer is disposed on one side of the aluminum plate; the two copper foil layers are disposed on the side of the insulating and thermally conductive layer away from the aluminum plate, and circuit structures are disposed on the two copper foil layers. The two copper foil layers are electrically connected, and contacts are electrically connected to the copper foil layers; the PI layer is disposed between the two copper foil layers. Complex and intricate circuit structures can be disposed on the two copper foil layers, and the pins of electronic components are connected to the contacts, thereby achieving connection with the circuit structure to meet the complex wiring requirements of the display electronics industry. The two copper foil layers are disposed on the side of the insulating and thermally conductive layer away from the aluminum plate. The copper foil not only carries the circuit structure but also acts as a bridge in heat conduction. The circuits on the two copper foil layers ultimately conduct heat to the aluminum plate through the thermal conductivity of the insulating and thermally conductive layer. The PI layer is a polyimide layer located between two copper foil layers. As an insulating layer, the PI layer possesses insulation properties and excellent mechanical properties, primarily serving as electrical isolation and mechanical protection. Furthermore, its excellent mechanical properties effectively prevent the entire finished board from bending or deforming due to factors such as thermal expansion. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0014] Figure 1 This is a front view of the finished plate in one embodiment of this application;

[0015] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0016] Figure 3 This is a cross-sectional view of a finished plate in one embodiment of this application;

[0017] Figure 4 This is another cross-sectional view of the finished plate in one embodiment of this application;

[0018] Figure 5 for Figure 4 A magnified view of part B in the middle.

[0019] In the diagram: 1. Finished board; 11. Buckle; 12. Ink layer; 13. Copper foil; 14. PI layer; 15. Insulating and heat-conducting layer; 16. Aluminum plate; 2. Side plate; 3. Connecting hole; 4. Electroplating layer. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0022] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0023] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0024] See Figure 1 , Figure 2 and Figure 3 As shown, this application proposes a single-sided double-layer aluminum substrate, including a finished board 1, the finished board 1 being provided with contacts, the finished board 1 including: an aluminum plate 16; an insulating and thermally conductive layer 15, the insulating and thermally conductive layer 15 being disposed on one side of the aluminum plate 16; two layers of copper foil 13, the two layers of copper foil 13 being disposed on the side of the insulating and thermally conductive layer 15 away from the aluminum plate 16, the two layers of copper foil 13 being provided with circuit structures, the two layers of copper foil 13 being electrically connected, the contacts being electrically connected to the copper foil 13; and a PI layer 14, the PI layer 14 being disposed between the two layers of copper foil 13.

[0025] The aluminum plate 16 forms the structural basis of the single-sided double-layer aluminum substrate, and its main function is to dissipate the heat generated during circuit operation in a timely manner. Aluminum has high thermal conductivity, which can quickly and effectively diffuse heat to the entire surface of the aluminum substrate. Other structures on the single-sided double-layer aluminum substrate are directly or indirectly connected to the aluminum plate 16. First, a layer of copper foil 13 and a PI layer 14 are pressed onto another layer of copper foil 13 to form a flexible board. Then, the flexible board and the insulating and thermally conductive layer 15 are pressed onto the aluminum plate 16. Finally, the aluminum plate 16 and the panel are pressed together. After solder resist, text, shaping, surface treatment, inspection, and packaging, the structure of the finished board 1 is formed. Circuit structures are set on both layers of copper foil 13 to integrate complex and intricate circuit structures. The two layers of copper foil 13 are electrically connected to ensure circuit continuity, and the contacts are the connection points of the circuit structures.

[0026] Specifically, complex and intricate circuit structures can be set on the two layers of copper foil 13, with the pins and contacts of electronic components connected to achieve connection with the circuit structure, thus meeting the complex routing requirements of the display electronics industry on circuit boards. The two layers of copper foil 13 are located on the side of the insulating and thermally conductive layer 15 away from the aluminum plate 16. The copper foil 13 not only carries the circuit structure but also acts as a bridge in heat conduction. The circuit on the two layers of copper foil 13 ultimately conducts heat to the aluminum plate 16 through the thermal conductivity of the insulating and thermally conductive layer 15.

[0027] The PI layer 14 is a polyimide layer located between two copper foil layers 13. As an insulating layer, the PI layer 14 possesses insulation and excellent mechanical properties, primarily serving as electrical isolation and mechanical protection. Furthermore, its excellent mechanical properties effectively prevent the entire finished board 1 from bending or deforming due to factors such as thermal expansion. The thickness and hardness of the PI layer, along with the bonding method with the copper foil (e.g., a glue-free PI layer directly bonded to the copper foil via hot pressing or other processes), play a crucial role in the overall rigidity of the circuit board. More specifically, the PI layer 14 can be divided into adhesive-coated and glue-free PI layers. The adhesive-coated PI layer 14 consists of a polyimide (PI) film, an adhesive (such as epoxy resin), and copper foil 13, with the adhesive responsible for bonding the copper foil 13 to the PI film. The glue-free PI layer 14 contains no adhesive; the copper foil 13 is directly bonded to the PI film via hot pressing or other special processes. In this embodiment, a glue-free PI layer 14 is preferably used. The hot-pressing method ensures a tight bond between the PI layer and the copper foil, preventing circuit traces from breaking due to high temperature or stress.

[0028] The insulating and thermally conductive layer 15 is preferably made of curable thermally conductive silicone. Curable thermally conductive silicone possesses excellent electrical insulation properties, and its good thermal conductivity allows for rapid heat transfer to the aluminum plate 16, thus effectively meeting the performance requirements of the insulating and thermally conductive layer 15. (See reference...) Figure 4 and Figure 5As shown, in some embodiments, the system further includes: a connecting hole 3, which is provided between two copper foils 13. The connecting hole 3 is formed in one copper foil 13 and extends into the other copper foil 13. The connecting hole 3 is formed by drilling. An electroplated layer 4 is disposed on the inner wall surface of the connecting hole 3 and connects the two copper foils 13 respectively. The electroplated layer 4 is formed by copper plating, and the formation of the electroplated layer 4 enables electrical connection between the two copper foils 13.

[0029] In this embodiment, the circuit structure is etched onto the copper foil 13. Drilling and electroplating are the key steps in forming the circuit connection between two adjacent copper foil layers 13. Besides achieving the circuit connection, the electroplated layer 4 also serves as a heat conductor, transferring heat from the outer copper foil 13 to the inner copper foil 13, and then through the insulating thermally conductive layer 15 to the aluminum plate 16, where the heat is dissipated. Preferably, the holes formed by the electroplated layer 4 are filled with an insulating thermally conductive material to better conduct heat to the aluminum plate 16 and dissipate it through the aluminum plate 16.

[0030] See Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, an ink layer 12 is further included, which is disposed on the side of the outermost copper foil 13 away from the aluminum plate 16. The ink layer 12 is the panel, used to form an isolation between the external environment and the outer copper foil 13.

[0031] See Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the interface between the aluminum plate 16 and the insulating thermally conductive layer 15 is a rough surface. The rough surface increases the surface area, thereby increasing the contact force between the aluminum plate 16 and the thermally conductive layer 15, thus enhancing heat conduction efficiency and preventing overheating caused by heat accumulation. Furthermore, the rough surface helps to strengthen the bond between the aluminum plate 16 and the insulating thermally conductive layer 15, improving its resistance to deformation. Additionally, the rough interface provides a larger contact area, resulting in a stronger physical bond between the aluminum plate and the thermally conductive layer, reducing warping problems caused by loosening at the interface, and thus enhancing the stability of the finished plate 1.

[0032] See Figure 1 and Figure 2 As shown, in some embodiments, it further includes: a side plate 2, which connects to multiple finished boards 1. After the circuit board is laminated, a router step is required to form multiple finished boards 1 and the side plate 2. The side plate 2 facilitates the transportation of the finished boards 1.

[0033] See Figure 1 and Figure 2As shown, in some embodiments, it further includes a buckle 11, which is disposed on the finished plate 1. The external component connected to the finished plate 1 is provided with a slot, and the initial positioning and installation of the finished plate 1 is achieved by the cooperation of the buckle 11 and the slot, which is beneficial to the installation of the finished plate 1.

[0034] In summary, this application employs a two-layer copper foil 13 structure. The copper foil 13 not only bears the circuit load but also, through its symmetrical layout, effectively balances the difference in thermal expansion between the aluminum plate 16 and the copper foil 13 caused by temperature changes. The double-layer copper foil 13 design effectively reduces localized stress concentration caused by a single-layer copper foil, thereby reducing warping. The PI layer 14, as a high-strength insulating layer, not only ensures electrical isolation but also provides additional mechanical support, preventing the circuit board from deforming or warping due to excessive stress. As a buffer layer, the PI layer 14 helps disperse stress under temperature changes or other external stresses, thereby reducing the overall warping of the circuit board.

[0035] The above description is only a part or preferred embodiment of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A single-sided double-layer aluminum substrate, characterized in that, Includes a finished board (1), the finished board (1) being provided with contacts, the finished board (1) comprising: Aluminum plate (16); An insulating and thermally conductive layer (15) is disposed on one side of the aluminum plate (16); Two layers of copper foil (13) are disposed on the side of the insulating and heat-conducting layer (15) away from the aluminum plate (16). A circuit structure is provided on the two layers of copper foil (13). The two layers of copper foil (13) are electrically connected, and the contacts are electrically connected to the copper foil (13). A PI layer (14) is disposed between the two copper foils (13).

2. The single-sided double-layer aluminum substrate according to claim 1, characterized in that, Also includes: Connection hole (3): The connection hole (3) is provided between the two layers of copper foil (13). The connection hole (3) is opened in one layer of copper foil (13) and extends into the other layer of copper foil (13). An electroplated layer (4) is disposed on the inner wall surface of the connecting hole (3), and the electroplated layer (4) is connected to two layers of copper foil (13).

3. The single-sided double-layer aluminum substrate according to claim 1, characterized in that, Also includes: An ink layer (12) is disposed on the side of the outermost copper foil (13) away from the aluminum plate (16).

4. A single-sided double-layer aluminum substrate according to claim 1, characterized in that, The connection surface between the aluminum plate (16) and the insulating and heat-conducting layer (15) is a rough surface.

5. A single-sided double-layer aluminum substrate according to claim 1, characterized in that, Also includes: Side plate (2), which connects to a plurality of finished plates (1).

6. A single-sided double-layer aluminum substrate according to claim 5, characterized in that, Also includes: Buckle (11), the buckle (11) is disposed on the finished plate (1).

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