Circuit board mounting shell, power amplifier structure assembly and vehicle

Abstract

The utility model relates to the technical field of vehicles, in particular to a circuit board installation shell, a power amplifier structure assembly and a vehicle, the circuit board installation shell comprises a shell body, the shell body is of an integrally formed structure, an installation cavity is formed in the shell body, a placement opening is formed in the shell body and communicates with the installation cavity, and a sliding groove is formed in the cavity wall of the installation cavity; the shell body is provided with a placement opening, the two sliding grooves extend into the installation cavity from the placement opening, openings of the two sliding grooves are opposite, so that the two sides of the circuit board are correspondingly connected with the two sliding grooves in an inserted mode and move into the installation cavity along the sliding grooves, the shell body is further provided with first installation holes, and the first installation holes are used for being correspondingly connected with second installation holes of the circuit board. Therefore, a traditional shell formed by combining two parts is replaced, the assembling step of the shell is omitted, and the assembling efficiency is further improved.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and in particular to a circuit board mounting housing, a power amplifier structure assembly, and a vehicle. Background Technology

[0002] The power amplifier in a car is a crucial component of the in-vehicle audio-visual system. Its function is to select and preprocess the audio input signal, and then amplify it to drive the speakers to produce sound. The power amplifier typically consists of a circuit board and a housing; the circuit board needs to be secured inside the housing for protection.

[0003] In related technologies, the amplifier housing consists of an upper cover and a lower cover, requiring the circuit board, upper cover, and lower cover to be assembled and fixed sequentially during assembly. This assembly process limits production efficiency, and because the upper and lower covers need to be formed using molds, the manufacturing cost is relatively high. Utility Model Content

[0004] This application provides a circuit board mounting housing, a power amplifier structure assembly, and a vehicle, aiming to improve the structure of the power amplifier housing to reduce the manufacturing cost of the power amplifier structure and improve assembly efficiency.

[0005] The specific technical solution is as follows:

[0006] An embodiment of the first aspect of this application provides a circuit board mounting housing, comprising a housing body, the housing body being an integrally formed structure having a mounting chamber inside. Further, the housing body has a placement opening communicating with the mounting chamber, and the mounting chamber has two sliding grooves extending from the placement opening into the mounting chamber. The openings of the two sliding grooves face each other and are arranged parallel to each other. The two sides of the circuit board are correspondingly inserted into the two sliding grooves and inserted into the mounting chamber along the sliding grooves. The housing body also has a first mounting hole for corresponding connection with a second mounting hole on the circuit board.

[0007] The shell body is a one-piece molded structure that can be injection molded or compression molded. After molding, it forms an installation chamber inside the structure. The placement port is connected to the installation chamber, allowing the circuit board to be placed into the installation chamber from the outside of the shell body. The slide can extend from the placement port into the installation chamber. That is, from the placement port, the two opposite sides of the circuit board can be inserted into the two slides respectively, and the circuit board is pushed towards the inside of the installation chamber along the extension direction of the slide until it is completely in the installation chamber. In this way, the shell body installs the circuit board through the slide. Furthermore, the second mounting hole is connected to the first mounting hole on the shell body, thereby fixing the circuit board on the one-piece molded shell body structure.

[0008] Therefore, the circuit board mounting housing provided in this embodiment, by setting a housing body with a mounting chamber and providing two sliding grooves on the cavity wall of the mounting chamber, allows the two sides of the circuit board to be inserted into the position of one sliding groove respectively. The circuit board moves into the mounting chamber along the extension direction of the sliding groove, thereby enabling the assembly of the circuit board on the one-piece molded housing body structure. In this way, on the one hand, the sliding grooves realize the assembly and fixation of the circuit board, making the circuit board assembly more convenient and faster. On the other hand, the one-piece molded housing body replaces the traditional housing formed by combining two parts, eliminating the assembly steps of the housing body, thereby further improving the assembly efficiency and increasing the production efficiency of the power amplifier structure. In addition, the one-piece molded housing body can be processed with a single mold, which can reduce the number of molds required, thereby saving process costs.

[0009] In some embodiments, the wall of the mounting chamber is provided with an abutment boss, which is configured to correspond to a chip disposed on the circuit board, so that the chip contacts the abutment boss. In this way, the abutment boss can provide a certain degree of support for the circuit board, and at the same time, facilitate the direct transfer of heat from the electronic components to the housing body, so that the heat can be dissipated in a timely manner.

[0010] In some embodiments, the shell body is further provided with a plurality of heat dissipation fins, all of which are spaced apart on the surface of the shell body. The heat dissipation fins can increase the surface area of ​​the shell body, thereby enhancing the heat dissipation effect of the shell body.

[0011] In some embodiments, the circuit board mounting housing further includes a connector disposed on the housing body, the housing body being connected to the mounting plane via the connector.

[0012] In some embodiments, the number of connectors is multiple, and the multiple connectors are arranged at circumferential intervals along the housing body. Multiple connectors can provide better fixation for the circuit board mounting housing, ensuring the structural stability of the power amplifier assembly during use.

[0013] An embodiment of the second aspect of this application provides a power amplifier assembly including a circuit board and a circuit board mounting housing as described above.

[0014] The power amplifier assembly provided in the second aspect of this application has the same beneficial effects as the circuit board mounting housing described above, and will not be repeated here.

[0015] In some embodiments, the circuit board includes a board body, with two opposite side portions of the board body respectively inserted into two grooves; further, a first mounting hole on the shell body is formed on the surface of the shell body and communicates with the grooves, and a second mounting hole is formed on the side portion of the body, and the board body and the shell body are connected by fasteners passing through the first mounting hole and the second mounting hole.

[0016] Because the fit between the side of the board and the slide is relatively tight, placing the first and second mounting holes at the position of the slide can prevent the circuit board from deforming significantly due to the connection after fastening, thereby further ensuring the structural and operational stability of the power amplifier assembly.

[0017] In some embodiments, the circuit board and the housing body are bonded together with thermally conductive adhesive. The use of thermally conductive adhesive not only improves the connection but also enhances heat transfer. Heat generated by the electronic components on the circuit board during use can be transferred to the housing body through the board and the thermally conductive adhesive, thus facilitating timely heat dissipation.

[0018] In some embodiments, a gap is formed between the circuit board and the cavity wall of the mounting chamber, the gap being 1mm-3mm wide. This gap serves two purposes: firstly, it creates a heat dissipation space between the circuit board and the housing body, facilitating heat dissipation from the circuit board; secondly, it provides space for slight movement of the circuit board relative to the housing body. For example, under bumpy conditions, even if the circuit board experiences slight displacement relative to the housing body, it will not rub against the electronic components on the circuit board, thereby further ensuring the stability of the circuit board during use.

[0019] An embodiment of the third aspect of this application provides a vehicle that includes the power amplifier assembly described above.

[0020] The vehicle provided by the embodiment of the third aspect of this application has the same beneficial effects as the power amplifier structure assembly described above, and will not be repeated here. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the assembled power amplifier structure assembly provided in the embodiments of this application;

[0022] Figure 2 This is a schematic diagram of the power amplifier assembly provided in this application before assembly;

[0023] Figure 3 This is a cross-sectional schematic diagram of the power amplifier structure assembly provided in the embodiments of this application;

[0024] Figure 4 This is a schematic diagram of the circuit board mounting housing provided in an embodiment of this application;

[0025] Figure 5 This is a schematic diagram of the circuit board mounting housing provided in an embodiment of this application from another perspective;

[0026] Figure 6 yes Figure 5 A magnified view of part A in the middle;

[0027] Figure 7 This is a top view of the circuit board mounting housing provided in an embodiment of this application;

[0028] Figure 8 yes Figure 7 A magnified view of part B in the middle section.

[0029] Explanation of reference numerals in the attached figures:

[0030] 10. Power amplifier assembly;

[0031] 100. Circuit board mounting housing;

[0032] 110. Shell body; 111. Mounting chamber; 112. Placement opening; 113. Slide groove; 114. First mounting hole; 115. Abutment boss; 120. Heat dissipation fins; 130. Connector;

[0033] 200, Circuit board; 210, Board body; 211, Second mounting hole; 220, Functional interface. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0035] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] The amplifier structure in a car is a crucial component of the in-vehicle audio-visual system. Installed in the vehicle body, it provides users with a comprehensive audio experience. The amplifier structure selects and pre-processes the audio input signal, then amplifies it to drive the speakers. An amplifier structure typically includes a circuit board assembly and a housing. The circuit board assembly is housed within the housing for protection.

[0039] As mentioned in the background section, the amplifier housing in related technologies consists of an upper cover and a lower cover. During assembly, the circuit board assembly must first be installed and fixed to one of the upper or lower covers, and then the other cover is fitted onto the circuit board assembly to form a complete structure. This assembly process limits production efficiency, and because the upper and lower covers need to be formed using molds, the manufacturing costs are relatively high. With increasingly fierce competition in the automotive industry, how to further reduce costs and increase efficiency has become a key focus for various automakers.

[0040] Based on the above, the applicant of this application has proposed a technical solution in the embodiments of this application. Specifically, it provides a circuit board mounting housing and a power amplifier structure assembly. By improving the structure of the circuit board mounting housing, the process cost of the power amplifier structure is reduced and the assembly efficiency is improved.

[0041] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0042] like Figure 1 , Figure 2 as well as Figure 3 As shown, an embodiment of the first aspect of this application provides a circuit board mounting housing 100, which includes a housing body 110. The housing body 110 is an integrally formed structure, and a mounting chamber 111 for placing a circuit board 200 is formed inside the housing body 110.

[0043] The circuit board mounting housing 100 provided in this embodiment has a housing body 110 that forms the main body shape of the circuit board mounting housing 100. It is an integrally molded structure. That is to say, after the housing body 110 is formed, the mounting chamber 111 for mounting the circuit board 200 is formed inside its structure.

[0044] The shell body 110 can be integrally formed in various ways, such as injection molding or compression molding. Injection molding uses thermoplastic materials such as ABS, PC, or modified PP, which are injected into a precision mold in a molten state at high temperature. After cooling and solidification, a complex integral part can be obtained. Compression molding is more suitable for thermosetting materials or applications requiring higher mechanical strength. In this embodiment, the shell body 110 is integrally formed using injection molding.

[0045] Furthermore, the housing body 110 has a placement opening 112, which is connected to the mounting chamber 111. The mounting chamber 111 has a sliding groove 113 on its wall, which extends from the placement opening 112 into the mounting chamber 111. There are two sliding grooves 113, with their openings facing each other, so that the two sides of the circuit board 200 can be inserted into the two sliding grooves 113 and can be inserted into the mounting chamber 111 along the sliding grooves 113.

[0046] The placement opening 112 connects to the mounting chamber 111, allowing the circuit board 200 to be inserted into the chamber. Therefore, the size of the placement opening 112 must be sufficient to accommodate the circuit board 200. Specifically, its width and height are both greater than the corresponding dimensions of the circuit board 200 to ensure its smooth passage. In actual design, the size of the placement opening 112 is typically 1-2 mm larger than the circuit board 200, ensuring smooth assembly while avoiding excessive size that could compromise structural strength. Furthermore, for example, the placement opening 112 can be located on one lateral side of the housing body 110 and connected to one side wall of the mounting chamber 111, facilitating assembly operations.

[0047] The slide grooves 113 extend from the placement opening 112 into the mounting chamber 111, and the two slide grooves 113 correspond to the two sides of the circuit board 200, respectively. That is, from the placement opening 112, the two opposite sides of the circuit board 200 can be inserted into the two slide grooves 113 respectively. Thus, the slide grooves 113 not only position the circuit board 200 but also guide its movement. Furthermore, the slide grooves 113 extend from the placement opening 112 into the mounting chamber 111, allowing the circuit board 200 to slide along the direction of the slide grooves 113 until it is completely located in the mounting chamber 111. In this way, the housing body 110 mounts the circuit board 200 via the slide grooves 113.

[0048] The cross-sectional shape of the groove 113 can be designed in various shapes as needed, the key being to achieve a good fit with the edge of the circuit board 200. For example, when the side of the circuit board 200 is the side of the board body, the groove 113 is a strip corresponding to the side. Preferably, the depth of the groove 113 is 1.5-2 times the length of the side of the circuit board 200, ensuring guiding stability without excessively increasing the volume of the casing.

[0049] Based on this, by opening a first mounting hole 114 on the housing body 110, it can correspond to the second mounting hole 211 on the circuit board 200. Then, by fasteners passing through the first mounting hole 114 and the second mounting hole 211, the circuit board 200 is connected to the housing body 110, ensuring the structural stability of the circuit board 200.

[0050] In practice, during the assembly process, the operator first pushes the circuit board 200 into the mounting chamber 111 inside the housing body along the slide groove 113 until the circuit board 200 is installed in place. After installation, the first mounting hole 114 on the housing body 110 is opposite to the second mounting hole 211 on the circuit board 200, that is, the first mounting hole 114 and the second mounting hole 211 extend coaxially. Then, screws and other fasteners are used to pass through the first mounting hole 114 and the second mounting hole 211 to complete the final fixation.

[0051] In summary, the circuit board mounting housing 100 provided in this application embodiment, by providing a housing body 110 with a mounting chamber 111 and opening a placement port 112 on the housing body 110 communicating with the mounting chamber 111, allows the circuit board 200 to be placed into the mounting chamber 111 through the placement port 112. Furthermore, two sliding grooves 113 are provided on the cavity wall of the mounting chamber 111, extending from the placement port 112 into the mounting chamber 111, and the openings of the two sliding grooves 113 face each other. In this way, the two sides of the circuit board 200 can be inserted into the position of one sliding groove 113 respectively, and the circuit board 200 can move into the mounting chamber 111 along the extending direction of the sliding groove 113. Inside, the circuit board 200 is connected to the first mounting hole 114 on the housing body 110 via the second mounting hole 211, thereby enabling the assembly of the circuit board 200 on the one-piece molded housing body 110 structure. The above configuration, on the one hand, realizes the assembly and fixation of the circuit board 200 through the slide groove 113, making the assembly of the circuit board 200 more convenient and faster. On the other hand, the one-piece molded housing body 110 replaces the traditional housing formed by combining two parts, eliminating the assembly steps of the outer shell, thereby further improving the assembly efficiency and increasing the production efficiency of the power amplifier structure. In addition, the one-piece molded housing body 110 can be processed with a single mold, which can also reduce the number of molds required, thereby saving process costs.

[0052] In this embodiment, the circuit board mounting housing 100 is described with reference to a horizontal plane. Based on this, the mounting chamber 111 extends horizontally, and the placement opening 112 is located on one lateral side of the housing body 110 and communicates with the mounting chamber 111. Correspondingly, the circuit board 200 is also placed horizontally inside the mounting chamber 111. Furthermore, to facilitate the placement of the circuit board 200, the distance between the two sliding grooves 113, the depth of the sliding grooves 113, and the width can be slightly larger than the width and thickness of the circuit board 200. For example, the depth of the two sliding grooves 113 plus the distance between the two sliding grooves 113 can be 2mm greater than the width of the circuit board 200, and the width of the sliding grooves 113 can be 1mm greater than the thickness of the circuit board 200, thereby facilitating the insertion of the two side portions of the circuit board 200 into the sliding grooves 113.

[0053] In addition, a certain gap can be formed between the circuit board 200 and the cavity wall of the mounting chamber 111. This gap can form a heat dissipation space between the circuit board 200 and the housing body 110, which facilitates the dissipation of heat on the circuit board 200. On the other hand, it also provides space for slight movement of the circuit board 200 relative to the housing body 110. For example, under bumpy conditions, even if the circuit board 200 is slightly displaced relative to the housing body 110, it will not rub against the electronic components on the circuit board 200, thereby further ensuring the stable use of the circuit board 200.

[0054] In practice, the width of the gap between the circuit board 200 and the cavity wall of the mounting chamber 111 can be set to 1mm-3mm to provide sufficient displacement space. For example, in this embodiment, the gap is set to 2mm.

[0055] Additionally, it should be noted that the aforementioned gap can be formed only at the location between the circuit board 200 and the mounting chamber 111. In locations where electronic components are not involved, the circuit board 200 and the housing body 110 can also be in direct contact, such as between the side of the circuit board 200 and the groove 113.

[0056] like Figure 4 As shown, in some embodiments, an abutment boss 115 may be provided on the cavity wall of the mounting chamber 111. This abutment boss 115 is used to correspond with electronic components on the circuit board 200, so that the electronic components contact the abutment boss 115. The abutment boss 115 provides support to the circuit board 200 and facilitates the direct transfer of heat from the electronic components to the housing body 110, allowing for timely heat dissipation. Specifically, the abutment boss 115 is located on the cavity wall facing the component mounting surface of the circuit board 200 to facilitate correspondence with the electronic components.

[0057] The circuit board mounting housing 100 provided in this application embodiment can be specifically applied to the power amplifier structure assembly 10 to house the circuit board 200 of the power amplifier structure assembly 10. Therefore, in relation to the circuit board mounting housing 100, this embodiment also provides a power amplifier structure assembly 10.

[0058] The power amplifier assembly 10 includes a circuit board 200 and the aforementioned circuit board mounting housing 100. The circuit board 200 includes a board body 210 and multiple chips. The board body 210 serves as a substrate for the chips, i.e., an empty circuit board. Each chip is arranged and mounted on the surface of the circuit board 200 at a predetermined position to perform its corresponding function. The mounting cavity 111 formed inside the housing body 110 is configured to accommodate the entire circuit board 200, that is, to accommodate the board body 210 and all modules.

[0059] Specifically, the chips mounted on circuit board 200 include modules such as processors and transformers. The processor is responsible for signal modulation, amplification, and control command output, and can be preferentially placed in an area with good heat dissipation. The transformer is used for voltage conversion (such as converting the input power supply voltage to the operating voltage required by the power amplifier chip). The above and other chips can be mounted on the surface of board 210 in predetermined positions. Other specific circuit designs related to the power amplifier structure are existing technologies and will not be described in detail here.

[0060] The circuit board 200 is also equipped with functional interfaces, which are used to connect the circuit board 200 to other external electronic components. These functional interfaces may include, for example, audio input or output terminals, power interfaces, and communication ports (Bluetooth modules).

[0061] When setting the functional interfaces on the circuit board 200, the functional interfaces can be located on the side of the circuit board 200 closest to the placement port 112 to facilitate the connection of external wiring with the functional interfaces. Correspondingly, the size of the placement port 112 not only needs to match the size of the circuit board 200, but also needs to expose the functional interfaces to facilitate the connection of wiring by installers. For details, please refer to [reference needed]. Figure 1 and Figure 2 As shown.

[0062] like Figure 2 As shown, in some embodiments, the plate 210 has two opposing side portions, which can be respectively inserted into two sliding grooves 113. Furthermore, a first mounting hole 114 can be formed on the surface of the shell body 110 and communicate with the position of the sliding groove 113, while a second mounting hole 211 is correspondingly formed on the side portion of the plate 210 that matches the sliding groove 113. The shell body 110 and the circuit board 200 are connected and fixed by fasteners passing through the first mounting hole 114 and the second mounting hole 211. In this way, the shell body 110 is connected to the side portion of the plate 210, thereby achieving the connection between the shell body 110 and the circuit board 200.

[0063] Since the side of the board 210 and the slide groove 113 fit together very tightly, the first mounting hole 114 and the second mounting hole 211 are set at the position of the slide groove 113. This can prevent the circuit board 200 from deforming to a large extent due to the connection after fastening, thereby further ensuring the structural and operational stability of the power amplifier assembly 10.

[0064] For example, the fastener can be a connecting bolt, and the first mounting hole 114 and the second mounting hole 211 can be threaded holes. The circuit board 200 and the housing body 110 are assembled and fixed by screwing the connecting bolt into the first mounting hole 114 and the second mounting hole 211.

[0065] Furthermore, multiple second mounting holes 211 can be provided on the board body 210. Correspondingly, the number of first mounting holes 114 on the shell body 110 is the same as the number of second mounting holes 211 on the board body 210, and they correspond one-to-one. This can improve the fixing effect between the board body 210 and the shell body 110 of the circuit board 200.

[0066] In some embodiments, thermally conductive adhesive can also be provided between the circuit board 200 and the housing body 110, so that the circuit board 200 and the housing body 110 are bonded together by the thermally conductive adhesive. This not only improves the connection effect, but also enables better heat transfer through the thermally conductive adhesive. The heat generated by the electronic components on the circuit board 200 during use can be transferred to the housing body 110 through the board body 210 and the thermally conductive adhesive, thereby making better use of the timely dissipation of heat.

[0067] In practice, thermally conductive adhesive can be applied between the board 210 and the shell 110, or between the heat-generating element on the board and the shell 110. For example, if targeted heat dissipation is needed for a component that generates significant heat, the thermally conductive adhesive can be directly applied between the heat-generating component and the shell 110. In one possible implementation, the thermally conductive adhesive can be applied between the electronic component and the abutment boss 115 to achieve better heat transfer.

[0068] like Figures 1-5 As shown, in some embodiments, the shell body 110 is further provided with a plurality of heat dissipation fins 120, all of which are spaced apart on the surface of the shell body 110. The heat dissipation fins 120 effectively increase the surface area of ​​the shell body 110, thus enhancing the heat dissipation of the shell body 110. In specific implementation, multiple heat dissipation fins 120 can be provided on both the top and bottom surfaces of the shell to enhance the heat dissipation effect.

[0069] In order to enable the circuit board mounting housing 100 to be positioned at the mounting location of the power amplifier structure, the circuit board mounting housing 100 also includes a connector 130, which is disposed on the housing body 110 so that the housing body 110 is assembled onto the mounting plane of the power amplifier structure assembly 10 via the connector 130.

[0070] The mounting surface can be, for example, the outer casing of the power amplifier assembly 10, or a convenient mounting location for connecting other components within the power amplifier assembly 10, such as a loudspeaker. In practice, the connector 130 is connected and fixed to the corresponding connection part on the mounting surface.

[0071] In one possible implementation, the number of connectors 130 can be set to multiple, with multiple connectors 130 arranged at intervals along the circumference of the housing body 110. This can provide a better fixing effect on the circuit board mounting housing 100 and ensure the structural stability of the power amplifier assembly 10 during use.

[0072] For example, the connector 130 can be a connecting plate with connecting holes. Correspondingly, the connecting holes on the connecting plate can be aligned with the connecting holes on the mounting surface to achieve the installation of the circuit board mounting housing 100 using fasteners. Of course, in other embodiments, the connection method of the connector 130 can also be selected from other methods such as snap-fit ​​or adhesive bonding.

[0073] An embodiment of the second aspect of this application also provides a vehicle, including a body and the aforementioned circuit board mounting housing 100 and power amplifier structure assembly 10.

[0074] In summary, the vehicle provided in this application embodiment includes a circuit board mounting housing 100 comprising a housing body 110 having a mounting chamber 111, and a placement opening 112 communicating with the mounting chamber 111 on the housing body 110, so that the circuit board 200 can be placed into the mounting chamber 111 through the placement opening 112. Furthermore, two sliding grooves 113 are provided on the cavity wall of the mounting chamber 111, extending from the placement opening 112 into the mounting chamber 111, and the openings of the two sliding grooves 113 face each other. Thus, the two sides of the circuit board 200 can be inserted into the position of one sliding groove 113 respectively, and the circuit board 200 can move along the extending direction of the sliding groove 113 to the mounting position. Inside the chamber 111, and correspondingly connected to the first mounting hole 114 on the shell body 110 through the second mounting hole 211, the circuit board 200 can be assembled on the one-piece molded shell body 110. The above configuration, on the one hand, realizes the assembly and fixation of the circuit board 200 through the slide groove 113, making the assembly of the circuit board 200 more convenient and faster. On the other hand, the one-piece molded shell body 110 replaces the traditional shell formed by combining two parts, eliminating the assembly steps of the outer shell, thereby further improving the assembly efficiency and increasing the production efficiency of the power amplifier structure. In addition, the one-piece molded shell body 110 can be processed with a single mold, which can also reduce the number of molds required, thereby saving process costs.

[0075] Furthermore, the specific configuration of the circuit board mounting housing 100 and the power amplifier assembly 10 has been described in detail in the above embodiments, and will not be repeated here.

[0076] It should be noted that the vehicle provided in this embodiment should also include other modules or components that enable the vehicle to operate normally. Here, the other modules or components included in the vehicle provided in this embodiment will not be described one by one.

[0077] The vehicle provided in this embodiment has better performance by adopting the power amplifier structure assembly described above.

[0078] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board mounting housing, characterized in that, Includes a shell body, which is a one-piece molded structure, and has an installation chamber inside the shell body; The housing body has a placement opening that communicates with the mounting chamber. The mounting chamber has a sliding groove on its wall that extends from the placement opening into the mounting chamber. There are two sliding grooves with their openings facing each other, so that the two sides of the circuit board can be inserted into the two sliding grooves and move along the sliding grooves into the mounting chamber. The housing body is also provided with a first mounting hole, which is used to connect with the second mounting hole of the circuit board.

2. The circuit board mounting housing according to claim 1, characterized in that, The cavity wall of the mounting chamber is provided with an abutment protrusion, which is used to correspond to the chip disposed on the circuit board so that the chip contacts the abutment protrusion.

3. The circuit board mounting housing according to claim 2, characterized in that, The shell body is also provided with a number of heat dissipation fins, and all the heat dissipation fins are arranged at intervals on the surface of the shell body.

4. The circuit board mounting housing according to claim 1, characterized in that, The circuit board mounting housing also includes a connector, which is disposed on the housing body and the housing body is connected to the mounting plane through the connector.

5. The circuit board mounting housing according to claim 4, characterized in that, The number of connectors is multiple, and the multiple connectors are arranged at intervals along the circumference of the shell body.

6. A power amplifier assembly, characterized in that, Includes a circuit board and a circuit board mounting housing as described in any one of claims 1-5.

7. The power amplifier assembly according to claim 6, characterized in that, The circuit board includes a board body, and two opposite side portions of the board body are respectively inserted into the two grooves; The first mounting hole is formed on the surface of the shell body and communicates with the slide groove. The second mounting hole is formed on the side. The plate body and the shell body are connected by fasteners passing through the first mounting hole and the second mounting hole.

8. The power amplifier assembly according to claim 6, characterized in that, The circuit board is bonded to the housing body with thermally conductive adhesive.

9. The power amplifier assembly according to claim 6, characterized in that, A gap is formed between the circuit board and the wall of the mounting chamber, and the width of the gap is 1mm-3mm.

10. A vehicle, characterized in that, Includes the power amplifier structure assembly as described in any one of claims 6-9.

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