Separating and picking device and system for wafers

Abstract

The utility model relates to a wafer separating and picking device and system. The wafer separating and picking device comprises a support unit, a conveying unit, an uncovering unit, a sorting unit and a transfer unit. Wherein the conveying unit is arranged at the top end of the bracket unit, is connected with the bracket unit and is used for conveying a carrier loaded with a wafer; and the uncovering unit is arranged at the top end of the bracket unit, is positioned on one side of the downstream of the conveying unit, is connected with the bracket unit, and is used for opening the carrier loaded with the wafer. The carrier cover unlocking device has the advantages that the carrier cover can be unlocked through cooperative use of the support unit, the conveying unit and the cover opening unit, and the tedious steps of manual opening and closing are omitted; the sorting unit and the transfer unit are used in cooperation to sort foam packaging materials, oil absorption paper and wafers, and the wafers are transferred to a target position in cooperation with the transfer unit. And compared with traditional manual sorting, the efficiency is improved, fatigue errors caused by manual operation are avoided, and the sorting accuracy is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer separation and picking device and system. Background Technology

[0002] Semiconductor manufacturing is a highly precise and complex cutting-edge engineering project, the core of which is building electronic devices at the micrometer to nanometer scale on silicon wafers. The process begins with wafer fabrication, obtaining high-purity silicon wafers through crystal growth, dicing, and grinding. Then, photolithography transfers the circuit pattern to the wafer, followed by etching to create the circuit structure. Doping processes precisely implant impurities to adjust conductivity. Thin film deposition forms insulating and metal layers, ion implantation optimizes device performance, and chemical mechanical polishing achieves surface smoothness. Each step must be carried out in an ultra-clean room, relying on precision equipment to control errors down to the nanometer level. Finally, after testing, dicing, and packaging, chips are manufactured. The entire process involves multiple disciplines such as materials science, physics, and automation, and is the cornerstone of the modern electronics industry.

[0003] In semiconductor manufacturing, wafer transport and handling are critical steps. Traditional wafer transport devices typically employ manual operation or semi-automated equipment, resulting in low efficiency and poor precision. Furthermore, wafers need to be separated from other materials (such as foam and blotting paper) and stored in a categorized manner during transport, which traditional methods struggle to achieve in an efficient and precise manner.

[0004] Currently, no effective solution has been proposed to address the inefficiency of traditional wafer sorting in related technologies. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a wafer separation and picking device and system to solve the problem of inefficiency in traditional wafer sorting.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] In a first aspect, a wafer separation and picking device is provided, comprising:

[0008] Support unit;

[0009] A conveying unit is disposed at the top of the support unit and connected to the support unit, and is used to convey a carrier containing wafers;

[0010] A cover-opening unit is disposed at the top of the support unit and located on the downstream side of the conveying unit, and is connected to the support unit, for opening the carrier containing the wafer;

[0011] The sorting unit is located at the top of the support unit and above the downstream of the conveying unit, and is connected to the support unit for sorting wafers located on the carrier.

[0012] A transfer unit is disposed at the bottom of the inner side of the support unit and downstream of the sorting unit, and is used to transfer wafers.

[0013] In some embodiments, the support unit includes:

[0014] A base plate element, wherein the top of the base plate element is provided with the transfer unit and is connected to the transfer unit;

[0015] Two first support elements are symmetrically arranged on the top of the base plate element and respectively connected to the base plate element;

[0016] A top plate element is disposed between the two first support elements, and the top of the top plate element is provided with the conveying unit, the opening unit, and the sorting unit.

[0017] In some embodiments, the support unit further includes:

[0018] A plurality of movable elements are distributed at the bottom end of the base plate element and connected to the base plate element respectively, for driving the base plate element to move.

[0019] In some embodiments, the conveying unit includes:

[0020] A conveying drive element is disposed at the top of the support unit and connected to the support unit;

[0021] A placement element is connected to the output end of the conveying drive element and is used to place a carrier containing wafers and to drive the carrier containing wafers to move under the action of the conveying drive element.

[0022] In some embodiments, the lid-opening unit includes:

[0023] A first rotation drive element is disposed at the top of the support unit and located on the downstream side of the conveying unit, and is connected to the support unit.

[0024] The second support element is connected to the output end of the first rotation drive element and is used to rotate in the horizontal direction under the action of the first rotation drive element.

[0025] A first longitudinal drive element is disposed at the bottom end of the second support element and connected to the second support element, for following the movement of the second support element;

[0026] A first adsorption element is connected to the output end of the first longitudinal drive element and is used to follow the movement of the first longitudinal drive element and move vertically under the action of the first longitudinal drive element to open the carrier containing the wafer.

[0027] In some embodiments, the sorting unit includes:

[0028] A third support element is disposed at the top of the support unit and located above and downstream of the conveying unit, and is connected to the support unit.

[0029] A first lateral drive element is disposed at the end of the third support element and connected to the third support element;

[0030] A first movable element is connected to the output end of the first lateral drive element and is used to move horizontally under the action of the first lateral drive element.

[0031] A second longitudinal drive element is disposed at the end of the first movable element and connected to the first movable element, for following the movement of the first movable element;

[0032] The second movable element is connected to the output end of the second longitudinal drive element and is used to follow the movement of the longitudinal drive element and move in the vertical direction under the action of the second longitudinal drive element.

[0033] The second adsorption element is disposed at the bottom end of the second movable element and is used to follow the movement of the second movable element to adsorb the wafer.

[0034] In some embodiments, the transfer unit includes:

[0035] A base element is disposed at the bottom end of the inner side of the support unit and is located downstream of the sorting unit and connected to the support unit.

[0036] A second lateral drive element is disposed at the top of the base element and connected to the base element;

[0037] The third movable element is slidably disposed on the top end of the base element and connected to the output end of the second lateral drive element, for moving in the horizontal direction under the action of the second lateral drive element;

[0038] A third longitudinal drive element is disposed at the top end of the third movable element and connected to the third movable element, for following the movement of the third movable element;

[0039] The second rotational drive element is connected to the output end of the third longitudinal drive element and is used to follow the movement of the third longitudinal drive element and move in the vertical direction under the action of the third longitudinal drive element.

[0040] A first transmission element is connected to the output end of the second rotation drive element, and is used to follow the movement of the second rotation drive element and to rotate in the horizontal direction under the action of the second rotation drive element;

[0041] A third rotational drive element is disposed at the top end of the first transmission element and connected to the first transmission element, for following the movement of the first transmission element;

[0042] The second transmission element is connected to the output end of the third rotation drive element and is used to follow the movement of the third rotation drive element and to rotate horizontally under the action of the third rotation drive element.

[0043] A fourth rotational drive element is disposed at the top end of the second transmission element and connected to the second transmission element, for following the movement of the second transmission element;

[0044] The third transmission element is connected to the output end of the fourth rotation drive element and is used to follow the movement of the fourth rotation drive element and to rotate horizontally under the action of the fourth rotation drive element.

[0045] A clamping element is disposed at the end of the third transmission element and connected to the third transmission element, for following the movement of the third transmission element to clamp the wafer.

[0046] In some embodiments, the transfer unit further includes:

[0047] A first cavity element is disposed at the output end of the third longitudinal drive element and is used to house the second rotation drive element;

[0048] The second cavity element is disposed at the top of the first transmission element and is used to house the third rotation drive element;

[0049] The third cavity element is disposed at the top of the second transmission element and is used to house the fourth rotation drive element.

[0050] Secondly, a separation and picking system is provided, comprising:

[0051] The separation and picking device as described in the first aspect;

[0052] A labeling device is disposed on one side of the support unit of the wafer separation and picking device and located upstream of the conveying unit of the wafer separation and picking device, for applying labels to the carrier containing the wafers;

[0053] A clamping device is disposed at the top of the conveying unit of the wafer separation and picking device and connected to the conveying unit for clamping a carrier containing wafers;

[0054] A detection device is disposed at the top of the support unit of the wafer separation and picking device and located on the side of the transfer unit of the wafer separation and picking device, for detecting wafer edges;

[0055] A storage device is disposed on the other side of the support unit of the wafer separation and picking device for storing wafers.

[0056] In some embodiments, the separation and picking system further includes:

[0057] A vacuum conveying device, which is connected to both the opening unit and the sorting unit of the separating and picking device, is used to convey vacuum to the opening unit and the sorting unit.

[0058] The present invention adopts the above technical solution and has the following technical effects compared with the prior art:

[0059] This invention discloses a wafer separation and picking device and system. The system utilizes the cooperation of a support unit, a conveying unit, and a cover-opening unit to unlock the carrier cover, eliminating the tedious manual opening and closing steps. The system also utilizes the cooperation of a sorting unit and a transfer unit to sort foam packaging materials, oil-absorbing paper, and wafers, and the transfer unit transfers the wafers to the target location. Compared to traditional manual sorting, this method improves efficiency, avoids fatigue errors caused by manual operation, and increases sorting accuracy. Attached Figure Description

[0060] Figure 1 This is a three-dimensional structural schematic diagram of the separating and picking device according to an embodiment of the present utility model;

[0061] Figure 2 This is a three-dimensional structural schematic diagram of the support unit according to an embodiment of the present utility model;

[0062] Figure 3 This is a three-dimensional structural schematic diagram of the conveying unit according to an embodiment of the present utility model;

[0063] Figure 4 This is a three-dimensional structural diagram of the opening unit according to an embodiment of the present utility model;

[0064] Figure 5 This is a three-dimensional structural diagram of the sorting unit according to an embodiment of the present utility model;

[0065] Figure 6a This is a three-dimensional structural schematic diagram of the transfer unit according to an embodiment of the present utility model;

[0066] Figure 6b This is an exploded view of the transfer unit according to an embodiment of the present utility model;

[0067] Figure 7 This is a schematic diagram of the separation pick-up plate structure according to an embodiment of the present utility model.

[0068] The attached figures are labeled as follows: 100, Separating and picking device;

[0069] 110. Support unit; 111. Base plate component; 112. First support component; 113. Top plate component; 114. Moving component;

[0070] 120. Conveying unit; 121. Conveying drive element; 122. Placement element;

[0071] 130. Opening unit; 131. First rotation drive element; 132. Second support element; 133. First longitudinal drive element; 134. First adsorption element;

[0072] 140. Sorting unit; 141. Third support element; 142. First lateral drive element; 143. First movable element; 144. Second longitudinal drive element; 145. Second movable element; 146. Second adsorption element;

[0073] 150. Transfer unit; 151. Base element; 152. Second transverse drive element; 153. Third movable element; 154. Third longitudinal drive element; 155. Second rotation drive element; 156. First transmission element; 157. Third rotation drive element; 158. Second transmission element; 159. Fourth rotation drive element; 1510. Third transmission element; 1511. Clamping element; 1512. First cavity element; 1513. Second cavity element; 1514. Third cavity element;

[0074] 200 Labeling device; 300 Clamping device; 400 Detection device; 500 Storage device; 600 Vacuum conveying device. Detailed Implementation

[0075] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0076] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0077] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0078] Example 1

[0079] This embodiment relates to the separation and picking device of this utility model.

[0080] like Figure 1 As shown, a wafer separation and picking device 100 includes a support unit 110, a conveying unit 120, a cover opening unit 130, a sorting unit 140, and a transfer unit 150. The conveying unit 120 is located at the top of the support unit 110 and connected to it, for conveying a carrier containing wafers. The cover opening unit 130 is located at the top of the support unit 110 and downstream of the conveying unit 120, and connected to it, for opening the carrier containing wafers. The sorting unit 140 is located at the top of the support unit 110 and above the downstream of the conveying unit 120, and connected to it, for sorting wafers located on the carrier. The transfer unit 150 is located at the bottom of the inner side of the support unit 110 and downstream of the sorting unit 140, for transferring wafers.

[0081] like Figure 2As shown, the support unit 110 includes a base plate element 111, two first support elements 112, and a top plate element 113. The top of the base plate element 111 is provided with a transfer unit 150 and is connected to the transfer unit 150. The two first support elements 112 are symmetrically arranged on the top of the base plate element 111 and are respectively connected to the base plate element 111. The top plate element 113 is disposed between the two first support elements 112, and the top of the top plate element 113 is provided with a conveying unit 120, a cover opening unit 130, and a sorting unit 140.

[0082] The cross-section of the base plate element 111 is rectangular.

[0083] In some of these embodiments, the base plate element 111 is made of metal.

[0084] In some of these embodiments, the base plate element 111 is a base plate.

[0085] In some embodiments, the first support element 112 has an n-shaped cross-section. Specifically, the first support element 112 includes two first vertical plates and a first horizontal plate. The two first vertical plates are symmetrically disposed at the top of the base plate element 111 and are respectively connected to the base plate element 111; the first horizontal plate is disposed between the two first vertical plates, and a top plate element 113 is disposed at the end of the first horizontal plate and is respectively connected to the two first vertical plates and the top plate element 113.

[0086] The dimensions of the first vertical plate are matched with the dimensions of the base plate element 111. Generally, the side length of the first vertical plate is smaller than the length and width of the base plate element 111, and the height of the first vertical plate is greater than the height of the base plate element 111.

[0087] The fixed connection between the first horizontal plate and the first vertical plate includes, but is not limited to, bolt connection.

[0088] The dimensions of the first horizontal board match the dimensions of the first vertical board. Generally, the length of the first horizontal board is greater than the side length of the first vertical board, the width of the first horizontal board is equal to the side length of the first vertical board, and the height of the first horizontal board is less than the height of the first vertical board.

[0089] The length of the first horizontal plate is equal to the distance between the two first vertical plates.

[0090] In some embodiments, the first support element 112 is fixedly connected to the base plate element 111, including but not limited to bolt connections.

[0091] In some of these embodiments, the first support element 112 is made of metal.

[0092] In some embodiments, the top plate element 113 has an L-shaped cross-section. Specifically, the top plate element 113 includes a second vertical plate and a second horizontal plate. The second vertical plate is disposed between the two first horizontal plates, and a conveying unit 120, a cover-opening unit 130, and a sorting unit 140 are disposed at the top of the second vertical plate, and are respectively connected to the two first horizontal plates, the conveying unit 120, the cover-opening unit 130, and the sorting unit 140; the second horizontal plate is disposed on the side of the second vertical plate and is respectively connected to the second vertical plate and a first horizontal plate.

[0093] The dimensions of the second vertical plate match the dimensions of the first support element 112. Generally, the length of the second vertical plate is greater than the width of the first horizontal plate, the width of the second vertical plate is less than the length of the first horizontal plate, and the height of the second vertical plate is equal to the height of the first horizontal plate.

[0094] The length of the second vertical plate is equal to the distance between the two second support elements 132 (two first horizontal plates).

[0095] The second horizontal plate is fixedly connected to the second vertical plate, including but not limited to being integrally formed.

[0096] The dimensions of the second horizontal board match the dimensions of the second vertical board. Generally, the length of the second horizontal board is greater than the width of the second vertical board, the width of the second horizontal board is less than the length of the second vertical board, and the height of the second horizontal board is equal to the height of the second vertical board.

[0097] The dimensions of the second horizontal plate are matched with the dimensions of the first support element 112. Generally, the length of the second horizontal plate is less than the length of the first horizontal plate.

[0098] In some embodiments, the top plate element 113 is fixedly connected to the two first support elements 112, including but not limited to bolt connections.

[0099] In some of these embodiments, the top plate element 113 is made of metal.

[0100] Furthermore, the support unit 110 also includes a plurality of movable elements 114. The plurality of movable elements 114 are distributed at the bottom end of the base plate element 111 and are respectively connected to the base plate element 111 to drive the base plate element 111 to move.

[0101] In some embodiments, a plurality of movable elements 114 are distributed at the four corners of the bottom end of the base plate element 111. For example, a movable element 114 is provided at each of the four corners of the bottom end of the base plate element 111.

[0102] In some embodiments, the movable element 114 is fixedly connected to the base plate element 111, including but not limited to bolted connections.

[0103] In some of these embodiments, the movable element 114 is a caster wheel.

[0104] like Figure 3 As shown, the conveying unit 120 includes a conveying drive element 121 and a placement element 122. The conveying drive element 121 is disposed at the top of the support unit 110 and connected to the support unit 110; the placement element 122 is connected to the output end of the conveying drive element 121 and is used to place the carrier containing the wafer and drive the carrier containing the wafer to move under the action of the conveying drive element 121.

[0105] Specifically, the conveying drive element 121 is disposed at the top of the top plate element 113 and connected to the top plate element 113.

[0106] More specifically, the conveying drive element 121 is disposed at the top of the second vertical plate and connected to the second vertical plate.

[0107] In some embodiments, the conveying drive element 121 is fixedly connected to the top plate element 113, including but not limited to bolted connections.

[0108] In some embodiments, the conveying drive element 121 is a first linear transmission device. For example, the conveying drive element 121 consists of a guide rail slider, a slide rail, and rolling elements (balls or rollers), mainly serving a guiding and supporting function, and is used in conjunction with a drive assembly (such as a lead screw or motor). The conveying drive element 121 is a conventional technique in the art and will not be described in detail here.

[0109] The cross-section of the component 122 is rectangular.

[0110] In some embodiments, the placement element 122 is fixedly connected to the conveying drive element 121, including but not limited to bolted connections.

[0111] In some of these embodiments, the placement element 122 is made of metal.

[0112] In some of these embodiments, the placement element 122 is a placement plate.

[0113] like Figure 4As shown, the opening unit 130 includes a first rotation drive element 131, a second support element 132, a first longitudinal drive element 133, and a first adsorption element 134. The first rotation drive element 131 is located at the top of the support unit 110 and downstream of the conveying unit 120, and is connected to the support unit 110. The second support element 132 is connected to the output end of the first rotation drive element 131 and is used to rotate horizontally under the action of the first rotation drive element 131. The first longitudinal drive element 133 is located at the bottom end of the second support element 132 and is connected to the second support element 132, and is used to follow the movement of the second support element 132. The first adsorption element 134 is connected to the output end of the first longitudinal drive element 133 and is used to follow the movement of the first longitudinal drive element 133 and move vertically under the action of the first longitudinal drive element 133 to open the carrier containing the wafer.

[0114] Specifically, the first rotation drive element 131 is disposed at the top of the top plate element 113 and located on the downstream side of the conveying drive element 121, and is connected to the top plate element 113.

[0115] More specifically, the first rotation drive element 131 is disposed at the top of the second vertical plate and connected to the second vertical plate.

[0116] In some embodiments, the first rotation drive element 131 is fixedly connected to the top plate element 113, including but not limited to bolt connection.

[0117] In some embodiments, the first rotation drive element 131 is a first drive motor. The first rotation drive element 131 is a conventional technique in the art and will not be described in detail here.

[0118] In some embodiments, the second support element 132 includes a base plate, two third vertical plates, and a third horizontal plate. The base plate is connected to the output end of the first rotation drive element 131; the two third vertical plates are symmetrically disposed at the top of the base plate and are respectively connected to the base plate; the third horizontal plate is disposed at the top of the third vertical plates, and the bottom end of the third horizontal plate is provided with a first longitudinal drive element 133, which is respectively connected to the two third vertical plates and the first longitudinal drive element 133.

[0119] The third vertical plate is fixedly connected to the base plate, including but not limited to bolt connections.

[0120] The dimensions of the third vertical plate are matched with the dimensions of the substrate. Generally, the radial dimension (maximum length, thickness) of the third vertical plate is smaller than the radial dimension of the substrate, and the axial dimension (height) of the third vertical plate is larger than the axial dimension of the substrate.

[0121] The third horizontal plate is fixedly connected to the third vertical plate, including but not limited to bolt connections.

[0122] The dimensions of the third horizontal board match the dimensions of the third vertical board. Generally, the length of the third horizontal board is greater than the maximum length of the third vertical board, the width of the third horizontal board is greater than the width of the third vertical board, and the height of the third horizontal board is less than the height of the third vertical board.

[0123] The width of the third horizontal plate is equal to the distance between the two third vertical plates.

[0124] In some embodiments, the second support element 132 is fixedly connected to the first rotation drive element 131, including but not limited to bolt connections.

[0125] In some of these embodiments, the second support element 132 is made of metal.

[0126] In some embodiments, the first longitudinal drive element 133 is fixedly connected to the second support element 132, including but not limited to bolt connection.

[0127] In some embodiments, the first longitudinal drive element 133 is a first telescopic cylinder. The first longitudinal drive element 133 is a conventional technique in the art and will not be described in detail here.

[0128] In some of these embodiments, the first adsorption element 134 is fixedly connected to the first longitudinal drive element 133, including but not limited to bolt connections.

[0129] In some embodiments, the first adsorption element 134 is a first vacuum adsorption disk. The first adsorption element 134 is a conventional technique in the art and will not be described in detail here.

[0130] like Figure 5As shown, the sorting unit 140 includes a third support element 141, a first lateral drive element 142, a first movable element 143, a second longitudinal drive element 144, a second movable element 145, and a second adsorption element 146. The third support element 141 is disposed at the top of the support unit 110 and located above and downstream of the conveying unit 120, and is connected to the support unit 110; the first lateral drive element 142 is disposed at the end of the third support element 141 and is connected to the third support element 141; the first movable element 143 is connected to the output end of the first lateral drive element 142 and is used to move horizontally under the action of the first lateral drive element 142; the second longitudinal drive element 144 is disposed at the end of the first movable element 143 and is connected to the first movable element 143 and is used to follow the movement of the first movable element 143; the second movable element 145 is connected to the output end of the second longitudinal drive element 144 and is used to follow the movement of the longitudinal drive element and move vertically under the action of the second longitudinal drive element 144; the second adsorption element 146 is disposed at the bottom end of the second movable element 145 and is used to follow the movement of the second movable element 145 to adsorb the wafer.

[0131] Specifically, the third support element 141 is disposed at the top of the top plate element 113 and located above and downstream of the conveying drive element 121, and is connected to the top plate element 113.

[0132] More specifically, the third support element 141 is disposed at the top of the second vertical plate and connected to the second vertical plate.

[0133] In some embodiments, the cross-section of the third support element 141 is n-shaped. Specifically, the third support element 141 includes two fourth vertical plates and a fourth horizontal plate. The two fourth vertical plates are symmetrically arranged at the top of the second vertical plate and are respectively connected to the second vertical plate; the fourth horizontal plate is arranged between the two fourth vertical plates, and a first lateral driving element 142 is provided at the end of the fourth horizontal plate and is respectively connected to the two fourth vertical plates and the first lateral driving element 142.

[0134] The dimensions of the fourth vertical plate match the dimensions of the top plate element 113. Generally, the length of the fourth vertical plate is less than the width of the second vertical plate, the width of the fourth vertical plate is less than the length of the second vertical plate, and the height of the fourth vertical plate is greater than the height of the second vertical plate.

[0135] The fixed connection between the fourth horizontal plate and the fourth vertical plate includes, but is not limited to, integral molding.

[0136] The dimensions of the fourth horizontal board match those of the fourth vertical board. Generally, the length of the fourth horizontal board is greater than the width of the fourth vertical board, the width of the fourth horizontal board is equal to the length of the fourth vertical board, and the height of the fourth horizontal board is less than the height of the fourth vertical board.

[0137] The length of the fourth horizontal plate is equal to the distance between the two fourth vertical plates.

[0138] In some embodiments, the third support element 141 is fixedly connected to the top plate element 113, including but not limited to bolt connections.

[0139] In some of these embodiments, the third support element 141 is made of metal.

[0140] In some embodiments, the first lateral drive element 142 is fixedly connected to the third support element 141, including but not limited to bolt connections.

[0141] In some embodiments, the first lateral drive element 142 is a second linear transmission device. For example, the first lateral drive element 142 consists of a guide rail slider, a slide rail, and rolling elements (balls or rollers), mainly serving a guiding and supporting function, and is used in conjunction with a drive assembly (such as a lead screw or motor). The first lateral drive element 142 is a conventional technique in the art and will not be described in detail here.

[0142] In some embodiments, the first movable element 143 is fixedly connected to the first lateral drive element 142, including but not limited to bolted connections.

[0143] In some of these embodiments, the first active element 143 is made of metal.

[0144] In some of these embodiments, the first active element 143 is a first movable plate.

[0145] In some embodiments, the second longitudinal drive element 144 is fixedly connected to the first movable element 143, including but not limited to bolt connections.

[0146] In some embodiments, the second longitudinal drive element 144 is a third linear transmission device. For example, the second longitudinal drive element 144 consists of a guide rail slider, a slide rail, and rolling elements (balls or rollers), mainly serving a guiding and supporting function, and is used in conjunction with a drive assembly (such as a lead screw or motor). The second longitudinal drive element 144 is a conventional technique in the art and will not be described in detail here.

[0147] In some embodiments, the second movable element 145 is fixedly connected to the second longitudinal drive element 144, including but not limited to bolted connections.

[0148] In some of these embodiments, the second active element 145 is made of metal.

[0149] In some of these embodiments, the second active element 145 is a second movable plate.

[0150] In some embodiments, the second adsorption element 146 is fixedly connected to the second movable element 145, including but not limited to bolt connections.

[0151] In some embodiments, the second adsorption element 146 is a second vacuum adsorption disk. The second adsorption element 146 is a conventional technique in the art and will not be described in detail here.

[0152] like Figure 6a , Figure 6bAs shown, the transfer unit 150 includes a base element 151, a second lateral drive element 152, a third movable element 153, a third longitudinal drive element 154, a second rotation drive element 155, a first transmission element 156, a third rotation drive element 157, a second transmission element 158, a fourth rotation drive element 159, a third transmission element 1510, and a clamping element 1511. The base element 151 is located at the bottom of the inner side of the support unit 110, downstream of the sorting unit 140, and connected to the support unit 110. A second lateral drive element 152 is located at the top of the base element 151 and connected to it. A third movable element 153 is slidably located at the top of the base element 151 and connected to the output end of the second lateral drive element 152, for moving horizontally under the action of the second lateral drive element 152. A third longitudinal drive element 154 is located at the top of the third movable element 153 and connected to it, for following the movement of the third movable element 153. A second rotation drive element 155 is connected to the output end of the third longitudinal drive element 154, for following the movement of the third longitudinal drive element 154 and moving vertically under the action of the third longitudinal drive element 154. A first transmission element 156 is connected to the output end of the second rotation drive element 155, for following the movement of the second rotation drive element 155 and moving vertically under the action of the third longitudinal drive element 154. The second rotation drive element 155 rotates horizontally under the action of the third rotation drive element 157, which is located at the top of the first transmission element 156 and connected to it, for following the movement of the first transmission element 156; the second transmission element 158 ​​is connected to the output end of the third rotation drive element 157, for following the movement of the third rotation drive element 157 and rotating horizontally under the action of the third rotation drive element 157; the fourth rotation drive element 159 is located at the top of the second transmission element 158 ​​and connected to it, for following the movement of the second transmission element 158; the third transmission element 1510 is connected to the output end of the fourth rotation drive element 159, for following the movement of the fourth rotation drive element 159 and rotating horizontally under the action of the fourth rotation drive element 159; the clamping element 1511 is located at the end of the third transmission element 1510 and connected to it, for following the movement of the third transmission element 1510 to clamp the wafer.

[0153] Specifically, the base element 151 is disposed at the top of the base plate element 111 and is connected to the base plate element 111.

[0154] The base element 151 has a rectangular cross-section.

[0155] The dimensions of the base element 151 are matched with the dimensions of the base plate element 111. Generally, the length of the base element 151 is less than the width of the base plate element 111, the width of the base element 151 is less than the length of the base plate element 111, and the height of the base element 151 is less than the height of the base plate element 111.

[0156] In some embodiments, the base element 151 is fixedly connected to the base plate element 111, including but not limited to bolt connections.

[0157] In some of these embodiments, the base element 151 is made of metal.

[0158] In some of these embodiments, the base element 151 is a base plate.

[0159] In some embodiments, the second lateral drive element 152 is fixedly connected to the base element 151, including but not limited to bolt connections.

[0160] In some embodiments, the second lateral drive element 152 is a fourth linear transmission device. For example, the second lateral drive element 152 consists of a guide rail slider, a slide rail, and rolling elements (balls or rollers), mainly serving a guiding and supporting function, and is used in conjunction with a drive assembly (such as a lead screw or motor). The second lateral drive element 152 is a conventional technique in the art and will not be described in detail here.

[0161] The cross-section of the third active element 153 is rectangular.

[0162] The dimensions of the third movable element 153 are matched with the dimensions of the base element 151. Generally, the length of the third movable element 153 is less than the width of the base element 151, and the width of the third movable element 153 is less than the length of the base element 151.

[0163] In some embodiments, the third movable element 153 is slidably connected to the base element 151. For example, the third movable element 153 and the base element 151 are connected via a slide rail and a slider.

[0164] In some embodiments, the third movable element 153 is fixedly connected to the second lateral drive element 152, including but not limited to bolted connections.

[0165] In some of these embodiments, the third active element 153 is made of metal.

[0166] In some of these embodiments, the third active element 153 is a third movable plate.

[0167] In some embodiments, the third longitudinal drive element 154 is fixedly connected to the third movable element 153, including but not limited to bolted connections.

[0168] In some embodiments, the third longitudinal drive element 154 is a second telescopic cylinder. The third longitudinal drive element 154 is a conventional technique in the art and will not be described in detail here.

[0169] In some embodiments, the second rotation drive element 155 is fixedly connected to the third longitudinal drive element 154, including but not limited to bolt connection.

[0170] In some embodiments, the second rotation drive element 155 is a second drive motor. The second rotation drive element 155 is a conventional technique in the art and will not be described in detail here.

[0171] The cross-section of the first transmission element 156 is a rounded rectangle.

[0172] In some embodiments, the first transmission element 156 is fixedly connected to the second rotation drive element 155, including but not limited to bolt connection.

[0173] In some of these embodiments, the first transmission element 156 is made of metal.

[0174] In some of these embodiments, the first transmission element 156 is a first transmission arm.

[0175] In some embodiments, the third rotation drive element 157 is fixedly connected to the first transmission element 156, including but not limited to bolt connection.

[0176] In some embodiments, the third rotation drive element 157 is a third drive motor. The third rotation drive element 157 is a conventional technique in the art and will not be described in detail here.

[0177] The cross-section of the second transmission element 158 ​​is a rounded rectangle.

[0178] The dimensions of the second transmission element 158 ​​are matched with the dimensions of the first transmission element 156. Generally, the radial dimension of the second transmission element 158 ​​is smaller than the radial dimension of the first transmission element 156, and the axial dimension of the second transmission element 158 ​​is smaller than the axial dimension of the first transmission element 156.

[0179] In some embodiments, the second transmission element 158 ​​is fixedly connected to the third rotation drive element 157, including but not limited to bolt connection.

[0180] In some of these embodiments, the second transmission element 158 ​​is made of metal.

[0181] In some of these embodiments, the second transmission element 158 ​​is a second transmission arm.

[0182] In some embodiments, the fourth rotation drive element 159 is fixedly connected to the second transmission element 158, including but not limited to bolt connection.

[0183] In some embodiments, the fourth rotation drive element 159 is a fourth drive motor. The fourth rotation drive element 159 is a conventional technique in the art and will not be described in detail here.

[0184] The dimensions of the third transmission element 1510 are matched with those of the second transmission element 158. Generally, the radial dimension of the third transmission element 1510 is larger than that of the second transmission element 158, and the axial dimension of the fourth transmission element is larger than that of the second transmission element 158.

[0185] In some embodiments, the third transmission element 1510 is fixedly connected to the fourth rotation drive element 159, including but not limited to bolt connection.

[0186] In some of these embodiments, the third transmission element 1510 is made of metal.

[0187] In some of these embodiments, the third transmission element 1510 is a third transmission arm.

[0188] In some embodiments, the clamping element 1511 is fixedly connected to the third transmission element 1510, including but not limited to bolted connections.

[0189] In some embodiments, the clamping element 1511 is an electrically driven gripper. For example, the clamping element 1511 is used in conjunction with a drive end (stepper motor) and a gripping end (two-finger gripper). The clamping element 1511 is a conventional technique in the art and will not be described in detail here.

[0190] Furthermore, the transfer unit 150 also includes a first cavity element 1512, a second cavity element 1513, and a third cavity element 1514. The first cavity element 1512 is disposed at the output end of the third longitudinal drive element 154 and is used to house the second rotation drive element 155; the second cavity element 1513 is disposed at the top end of the first transmission element 156 and is used to house the third rotation drive element 157; the third cavity element 1514 is disposed at the top end of the second transmission element 158 ​​and is used to house the fourth rotation drive element 159.

[0191] The cross-section of the first cavity element 1512 is circular.

[0192] The dimensions of the first cavity element 1512 are matched with the dimensions of the third longitudinal drive element 154. Generally, the radial dimension of the first cavity element 1512 is smaller than the radial dimension of the third longitudinal drive element 154, and the axial dimension of the first cavity element 1512 is smaller than the axial dimension of the third longitudinal drive element 154.

[0193] In some of these embodiments, the first cavity element 1512 is a first cavity.

[0194] The cross-section of the second cavity element 1513 is circular.

[0195] The dimensions of the second cavity element 1513 are matched with the dimensions of the first transmission element 156. Generally, the radial dimension of the second cavity element 1513 is smaller than the radial dimension of the first transmission element 156, and the axial dimension of the second cavity element 1513 is smaller than the axial dimension of the first transmission element 156.

[0196] In some of these embodiments, the second cavity element 1513 is a second cavity.

[0197] The cross-section of the third cavity element 1514 is circular.

[0198] The dimensions of the third cavity element 1514 are matched with the dimensions of the second transmission element 158. Generally, the radial dimension of the third cavity element 1514 is smaller than the radial dimension of the second transmission element 158, and the axial dimension of the third cavity element 1514 is smaller than the axial dimension of the second transmission element 158.

[0199] In some of these embodiments, the third cavity element 1514 is a third cavity.

[0200] The method of using this utility model is as follows:

[0201] (a) Placement Operation

[0202] The wafer-containing carrier is placed on top of the placement element 122, and the wafer-containing carrier is fixed on top of the placement element 122 by an electric chuck.

[0203] The first storage carrier and the second storage carrier are placed at the top of the outer side of the frame element, and below the first lateral drive element 142, on the other side downstream of the conveying drive element 121.

[0204] (II) Opening the lid

[0205] Start the conveying drive element 121 to work, so that it drives the carrier carrying the wafer to move along the axial direction of the conveying drive element 121 toward the opening unit 130 through the placement element 122, until it moves to the designated position (the downstream position of the conveying drive element 121).

[0206] The first rotation drive element 131 is activated, causing it to drive the first adsorption element 134 to rotate horizontally via the second support element 132 and the first longitudinal drive element 133, until the first adsorption element 134 is rotated directly above the carrier containing the wafer.

[0207] The first longitudinal drive element 133 is activated, causing it to drive the first adsorption element 134 to move vertically toward the carrier containing the wafer until the first adsorption element 134 comes into contact with the cover of the carrier containing the wafer. The vacuum pump is then activated to deliver vacuum to the first adsorption element 134, thereby adsorbing the cover of the carrier containing the wafer.

[0208] The first longitudinal drive element 133 operates, causing it to drive the cover of the wafer-carrying carrier to move vertically away from the wafer-carrying carrier via the first adsorption element 134. The first rotation drive element 131 operates, causing it to drive the cover of the wafer-carrying carrier to rotate horizontally via the first adsorption element 134 until the cover of the wafer-carrying carrier is moved away from directly above the wafer-carrying carrier.

[0209] (III) Foam Sorting Operation

[0210] The first lateral drive element 142 is activated, causing it to drive the second adsorption element 146 to move horizontally through the first movable element 143 and the second movable element 145 until the second adsorption element 146 is moved directly below the carrier containing the wafer.

[0211] The second longitudinal drive element 144 is activated, causing it to drive the second adsorption element 146 to move vertically toward the carrier containing the wafer via the second movable element 145, until the second adsorption element 146 comes into contact with the foam packaging material (i.e., foamed plastic) inside the carrier containing the wafer. The vacuum pump is then activated to deliver vacuum to the second adsorption element 146, thereby adsorbing the foam packaging material.

[0212] The second longitudinal drive element 144 operates, causing it to move the foam packaging material vertically away from the carrier containing the wafer via the second adsorption element 146. The first transverse drive element 142 operates, causing it to move the foam packaging material horizontally via the second adsorption element 146 until the foam packaging material is moved directly above the first storage carrier. The second longitudinal drive element 144 operates, causing it to move the foam packaging material vertically towards the first storage carrier until the foam is placed on the first storage carrier.

[0213] (iv) Oil-absorbing paper sorting operation

[0214] The coordinated operation of the first transverse driving element 142, the second longitudinal driving element 144, and the second adsorption element 146 (the specific workflow and sorting operation of method (III) are basically the same, and will not be repeated here) drives the oil-absorbing paper to move vertically toward the direction of the second storage carrier until the oil-absorbing paper is placed in the second storage carrier.

[0215] (V) Wafer Sorting Operation

[0216] The coordinated operation of the first lateral driving element 142, the second longitudinal driving element 144, and the second adsorption element 146 (the specific workflow and sorting operation of method (III) are basically the same, and will not be repeated here) drives the wafer to move vertically away from the carrier containing the wafer until it leaves the carrier.

[0217] (vi) Edge detection operation

[0218] The second lateral drive element 152 is activated, causing it to drive the clamping element 1511 to move horizontally through the cooperation between the first transmission element 156, the second transmission element 158, and the third transmission element 1510.

[0219] The third longitudinal drive element 154 is activated, causing it to drive the clamping element 1511 to move vertically through the cooperation between the first transmission element 156, the second transmission element 158, and the third transmission element 1510.

[0220] The second rotation drive element 155 is activated, causing it to rotate the clamping element 1511 horizontally through the cooperation of the first transmission element 156, the second transmission element 158, and the third transmission element 1510. The third rotation drive element 157 is activated, causing it to rotate the clamping element 1511 horizontally through the cooperation of the second transmission element 158 ​​and the third transmission element 1510. The fourth rotation drive element 159 is activated, causing it to rotate the clamping element 1511 horizontally through the third transmission element 1510, until the clamping element 1511 is moved to a suitable position (so that the clamping element 1511 is located at the wafer adsorbed on the second adsorption element 146, i.e., below the second adsorption element 146).

[0221] Start the clamping element 1511 to clamp the wafer (after clamping the wafer, the second adsorption element 146 loses the negative pressure and thus separates from the wafer);

[0222] Subsequently, the cooperation between the second lateral drive element 152, the third longitudinal drive element 154, the second rotation drive element 155, the third rotation drive element 157, and the fourth rotation drive element 159 drives the wafer to move to the edge finder through the clamping element 1511, and performs edge detection.

[0223] (vii) Storage operations

[0224] The cooperation between the second lateral drive element 152, the third longitudinal drive element 154, the second rotation drive element 155, the third rotation drive element 157, and the fourth rotation drive element 159 drives the wafer to move into the SMIF device via the clamping element 1511 for storage.

[0225] The advantages of this invention are that the carrier lid can be unlocked by the cooperation of the support unit 110, the conveying unit 120, and the opening unit 130, eliminating the tedious steps of manual opening and closing; the sorting unit 140 and the transfer unit 150 can sort foam packaging materials, oil-absorbing paper, and wafers, and the transfer unit 150 can transfer the wafers to the target location. Compared with traditional manual sorting, this improves efficiency, avoids fatigue errors caused by manual operation, and improves sorting accuracy.

[0226] Example 2

[0227] This embodiment relates to the separation and picking system of this utility model.

[0228] like Figure 7 As shown, a wafer separation and picking system includes a wafer separation and picking device 100, a labeling device 200, a clamping device 300, a detection device 400, and a storage device 500 as described in Embodiment 1. The labeling device 200 is disposed on one side of the support unit 110 of the wafer separation and picking device 100 and located upstream of the conveying unit 120 of the wafer separation and picking device 100, for labeling a carrier containing wafers; the clamping device 300 is disposed at the top of the conveying unit 120 of the wafer separation and picking device 100 and connected to the conveying unit 120, for clamping the carrier containing wafers; the detection device 400 is disposed at the top of the support unit 110 of the wafer separation and picking device 100 and located on the side of the transfer unit 150 of the wafer separation and picking device 100, for detecting wafer edges; and the storage device 500 is disposed on the other side of the support unit 110 of the wafer separation and picking device 100 for storing wafers.

[0229] Specifically, the labeling device 200 is disposed on one side of the base plate element 111 and is located upstream of the conveying drive element 121; the clamping device 300 is disposed on the top of the placement element 122 and is connected to the placement element 122; the detection device 400 is disposed on the top of the top plate element 113 and is located on the side of the third longitudinal drive element 154 and is connected to the top plate element 113; and the storage device 500 is disposed on the other side of the base plate element 111.

[0230] More specifically, the detection device 400 is located at the top of the second horizontal plate and is connected to the second horizontal plate.

[0231] In some embodiments, the labeling device 200 is a labeling machine. The labeling device 200 is a conventional technique in the art and will not be described in detail here.

[0232] In some embodiments, the clamping device 300 is an electric chuck. The clamping device 300 is a conventional technique in the art and will not be described in detail here.

[0233] In some embodiments, the detection device 400 is an Aliner edge finder. The detection device 400 is a conventional technique in the art and will not be described in detail here.

[0234] In some embodiments, the storage device 500 is an SMIF device. The storage device 500 is a conventional technique in the art and will not be described in detail here.

[0235] Furthermore, the separation and picking system also includes a vacuum conveying device 600. The vacuum conveying device 600 is connected to the opening unit 130 and the sorting unit 140 of the separation and picking device 100, respectively, and is used to convey vacuum to the opening unit 130 and the sorting unit 140.

[0236] Specifically, the vacuum conveying device 600 is connected to the first adsorption element 134 and the second adsorption element 146 respectively.

[0237] In some embodiments, the vacuum conveying device 600 is a vacuum pump. The vacuum conveying device 600 is a conventional technique in the art and will not be described in detail here.

[0238] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer separation and picking device, characterized in that, include: Support unit; A conveying unit is disposed at the top of the support unit and connected to the support unit for conveying a carrier containing wafers; A cover-opening unit is disposed at the top of the support unit and located on the downstream side of the conveying unit, and is connected to the support unit, for opening the carrier containing the wafer; The sorting unit is located at the top of the support unit and above the downstream of the conveying unit, and is connected to the support unit for sorting wafers located on the carrier. A transfer unit is disposed at the bottom of the inner side of the support unit and downstream of the sorting unit, and is used to transfer wafers.

2. The separating and picking device according to claim 1, characterized in that, The support unit includes: A base plate element, wherein the top of the base plate element is provided with the transfer unit and is connected to the transfer unit; Two first support elements are symmetrically arranged on the top of the base plate element and respectively connected to the base plate element; A top plate element is disposed between the two first support elements, and the top of the top plate element is provided with the conveying unit, the opening unit, and the sorting unit.

3. The separating and picking device according to claim 2, characterized in that, The support unit also includes: A plurality of movable elements are distributed at the bottom end of the base plate element and connected to the base plate element respectively, for driving the base plate element to move.

4. The separating and picking device according to claim 1, characterized in that, The conveying unit includes: A conveying drive element is disposed at the top of the support unit and connected to the support unit; A placement element is connected to the output end of the conveying drive element and is used to place a carrier containing wafers and to drive the carrier containing wafers to move under the action of the conveying drive element.

5. The separating and picking device according to claim 1, characterized in that, The cover opening unit includes: A first rotation drive element is disposed at the top of the support unit and located on the downstream side of the conveying unit, and is connected to the support unit. The second support element is connected to the output end of the first rotation drive element and is used to rotate in the horizontal direction under the action of the first rotation drive element. A first longitudinal drive element is disposed at the bottom end of the second support element and connected to the second support element, for following the movement of the second support element; A first adsorption element is connected to the output end of the first longitudinal drive element and is used to follow the movement of the first longitudinal drive element and move vertically under the action of the first longitudinal drive element to open the carrier containing the wafer.

6. The separating and picking device according to claim 1, characterized in that, The sorting unit includes: A third support element is disposed at the top of the support unit and located above and downstream of the conveying unit, and is connected to the support unit. A first lateral drive element is disposed at the end of the third support element and connected to the third support element; A first movable element is connected to the output end of the first lateral drive element and is used to move horizontally under the action of the first lateral drive element. A second longitudinal drive element is disposed at the end of the first movable element and connected to the first movable element, for following the movement of the first movable element; The second movable element is connected to the output end of the second longitudinal drive element and is used to follow the movement of the longitudinal drive element and move in the vertical direction under the action of the second longitudinal drive element. The second adsorption element is disposed at the bottom end of the second movable element and is used to follow the movement of the second movable element to adsorb the wafer.

7. The separating and picking device according to claim 1, characterized in that, The transfer unit includes: A base element is disposed at the bottom end of the inner side of the support unit and is located downstream of the sorting unit and connected to the support unit. A second lateral drive element is disposed at the top of the base element and connected to the base element; The third movable element is slidably disposed on the top end of the base element and connected to the output end of the second lateral drive element, for moving in the horizontal direction under the action of the second lateral drive element; A third longitudinal drive element is disposed at the top end of the third movable element and connected to the third movable element, for following the movement of the third movable element; The second rotational drive element is connected to the output end of the third longitudinal drive element and is used to follow the movement of the third longitudinal drive element and move in the vertical direction under the action of the third longitudinal drive element. A first transmission element is connected to the output end of the second rotation drive element, and is used to follow the movement of the second rotation drive element and to rotate in the horizontal direction under the action of the second rotation drive element; A third rotational drive element is disposed at the top end of the first transmission element and connected to the first transmission element, for following the movement of the first transmission element; The second transmission element is connected to the output end of the third rotation drive element and is used to follow the movement of the third rotation drive element and to rotate horizontally under the action of the third rotation drive element. A fourth rotational drive element is disposed at the top end of the second transmission element and connected to the second transmission element, for following the movement of the second transmission element; The third transmission element is connected to the output end of the fourth rotation drive element and is used to follow the movement of the fourth rotation drive element and to rotate horizontally under the action of the fourth rotation drive element. A clamping element is disposed at the end of the third transmission element and connected to the third transmission element, for following the movement of the third transmission element to clamp the wafer.

8. The separating and picking device according to claim 7, characterized in that, The transfer unit further includes: A first cavity element is disposed at the output end of the third longitudinal drive element and is used to house the second rotation drive element; The second cavity element is disposed at the top of the first transmission element and is used to house the third rotation drive element; The third cavity element is disposed at the top of the second transmission element and is used to house the fourth rotation drive element.

9. A separation and picking system, characterized in that, include: The separating and picking device as described in any one of claims 1 to 8; A labeling device is disposed on one side of the support unit of the wafer separation and picking device and located upstream of the conveying unit of the wafer separation and picking device, for applying labels to the carrier containing the wafers; A clamping device is disposed at the top of the conveying unit of the wafer separation and picking device and connected to the conveying unit for clamping a carrier containing wafers; A detection device is disposed at the top of the support unit of the wafer separation and picking device and located on the side of the transfer unit of the wafer separation and picking device, for detecting wafer edges; A storage device is disposed on the other side of the support unit of the wafer separation and picking device for storing wafers.

10. The separation and picking system according to claim 9, characterized in that, Also includes: A vacuum conveying device is connected to the opening unit and the sorting unit of the separating and picking device, respectively, and is used to convey vacuum to the opening unit and the sorting unit.

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