Semiconductor frame sucking and clamping integrated device

Abstract

The utility model discloses a semiconductor frame sucking and clamping integrated device, which comprises a mounting back plate, a buffer mechanism and a sucking and clamping mechanism, the buffer mechanism is fixed on the mounting back plate; the sucking and clamping mechanism is connected with the buffering mechanism, and the sucking and clamping mechanism sucks, clamps and supports the semiconductor frame; when the suction clamping mechanism contacts or releases the semiconductor frame, the buffer mechanism provides buffer force. The automatic feeding device is compact in structure, suitable for a semiconductor clip type feeding structure, small in occupied transverse space and capable of meeting corresponding feeding requirements; adjustment is convenient, and adaptability is wide; the whole set of device is low in cost and operation cost; the device is stable in operation and can adapt to most semiconductor frame products in the market; the weight is light, the corresponding module load can be reduced, the cost is reduced, and the productivity efficiency of the whole equipment is improved; and the risk of falling of the product in the moving process is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor frame loading and unloading technology, and in particular to a semiconductor frame suction and clamping integrated device. Background Technology

[0002] In recent years, with the rapid development of the semiconductor industry, the continuous advancement of chip manufacturing processes, and the sustained increase in packaging density, more stringent requirements have been placed on the performance, reliability, and production yield of semiconductor products. Semiconductor packaging, as a crucial downstream step in chip manufacturing, directly determines the final performance and lifespan of the product. In this process, downstream inspection is the core checkpoint for ensuring the yield of packaged products, while the efficiency and stability of the loading and unloading processes are important factors affecting the overall production cycle time and automation level.

[0003] Traditional manual loading and unloading methods are generally inefficient, lack precision, and struggle to guarantee consistency. Especially with large-scale production lines demanding high output, manual operation has gradually become a bottleneck restricting capacity release and cost optimization. While automation technology has become widespread, some semiconductor packaging processes have adopted automated loading and unloading solutions combining robotic arms and nozzles. However, existing technologies still have significant limitations for the specific process requirements of downstream molding compounds. For example, molding compounds often use a clip-type stacking method, which differs fundamentally from traditional lead frames in terms of shape, stacking density, and positioning accuracy requirements, making it difficult to directly adapt conventional loading and unloading mechanisms. Furthermore, semiconductor frame wafers are extremely thin and have a high perforation rate, making it easy for vacuum nozzles to fail during suction due to air leakage in the perforated areas. This can lead to wafer detachment or positional displacement, severely restricting the stability and yield of the loading and unloading process. Summary of the Invention

[0004] According to an embodiment of the present invention, a semiconductor frame suction and clamping integrated device is provided, comprising: a mounting backplate, a buffer mechanism, and a suction and clamping mechanism;

[0005] The buffer mechanism is fixed to the mounting back plate;

[0006] The suction clamping mechanism is connected to the buffer mechanism, and the suction clamping mechanism adsorbs and holds the semiconductor frame.

[0007] When the clamping mechanism contacts or releases the semiconductor frame, the buffer mechanism provides a buffering force.

[0008] Furthermore, the buffer mechanism includes: a guide rail, a slider, a connecting seat, a buffer mounting block, a guide pin, and a spring;

[0009] The guide rail is vertically fixed to the mounting back plate, and the buffer mounting block is fixed to the mounting back plate;

[0010] The slider is slidably mounted on the guide rail and connected to the connecting seat, which is connected to the suction clamping mechanism.

[0011] One end of the guide pin is fixed to the buffer mounting block, and the other end is inserted into the connecting seat and slidably connected to the connecting seat.

[0012] The spring is fitted onto the guide pin and connected to the buffer mounting block, and the spring provides elastic buffering force.

[0013] The guide pins and guide rails provide displacement compensation, dynamically adjusting the vertical movement of the suction clamping mechanism.

[0014] Furthermore, the connecting seat has a limit groove in the vertical direction, and a limit block is set in the limit groove. The limit block is fixed to the mounting back plate and limits the upper and lower limit stroke of the connecting seat.

[0015] Furthermore, it also includes: a buffer optical detector and a slotted photoelectric sensor;

[0016] The slotted photoelectric sensor is fixed to the mounting backplate;

[0017] The buffer light detector is U-shaped, with one end fixed to the connector. The opening direction of the buffer light detector is opposite to that of the slotted photoelectric sensor.

[0018] The slotted photoelectric sensor and the buffer photoelectric sensor work together to detect whether the mounting backplate has been moved into place.

[0019] Furthermore, the suction clamping mechanism includes:

[0020] A connecting rod is connected to a buffer mechanism, and the connecting rod has multiple mounting holes evenly spaced along its length.

[0021] Several adsorption components are detachably fixed to the connecting rod through mounting holes, and the adsorption components adsorb and fix the semiconductor frame.

[0022] At least two gripping components are provided, which are detachably fixed to the connecting rod via mounting holes, and gripping and supporting the semiconductor frame.

[0023] Furthermore, the adsorption assembly includes: a mounting base, a manual adjustment screw, a mounting bracket, an air tube connector, and a buffer suction cup;

[0024] The mounting base is fixed to the connecting rod through mounting holes. The mounting base has an oblong hole and a square groove along the oblong hole at the bottom.

[0025] The bottom end of the manual adjustment screw passes through the oblong hole and connects to the mounting bracket, while the top end of the manual adjustment screw abuts against the mounting base.

[0026] The buffer suction cup is fixed on the mounting bracket, the air pipe connector is fixed on the buffer suction cup, and the buffer suction cup adsorbs the semiconductor frame.

[0027] Furthermore, the mounting bracket has a mounting end that mates with a square groove, and the mounting end is square or round.

[0028] Furthermore, it also includes: a vacuum generator and a manifold;

[0029] The vacuum generator and manifold are fixed to the mounting backplate;

[0030] The manifold is connected to the air pipe connector in each adsorption component and the flow is channeled to the vacuum generator, which drives the buffer suction cup to adsorb the semiconductor frame.

[0031] Furthermore, the gripping assembly includes: a pneumatic gripper, a pair of L-shaped clamping blocks, and a pair of fixing screws;

[0032] The pneumatic gripper is fixed to the connecting rod through mounting holes, and several fixing holes are spaced apart on each of the two output ends of the pneumatic gripper.

[0033] A pair of L-shaped clamping blocks are respectively set at a pair of output ends of the pneumatic gripper, and the L-shaped clamping blocks are fixed to the fixing holes by fixing screws;

[0034] Pneumatic grippers drive a pair of L-shaped clamps to close or open to hold or release the semiconductor frame.

[0035] Furthermore, it also includes: a proximity sensor and a laser sensor; the proximity sensor is fixed on the buffer mechanism, and the laser sensor is fixed on the mounting back plate, and the proximity sensor and the laser sensor detect the presence or absence of the product frame.

[0036] The semiconductor frame suction and clamping integrated device according to the present invention has a compact structure, is suitable for semiconductor clip-type feeding structures, occupies little lateral space, and can adapt to corresponding feeding requirements; it is easy to adjust and has wide adaptability; the whole device has low cost and low operating expenses; the device operates stably and can adapt to most semiconductor frame products on the market; it is lightweight, which can reduce the load on the corresponding modules, reduce costs, and improve the overall production efficiency of the equipment; and it effectively reduces the risk of products falling during movement.

[0037] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the semiconductor frame clamping device according to an embodiment of the present invention;

[0039] Figure 2 This is a schematic diagram of the buffer mechanism of the semiconductor frame clamping device according to an embodiment of the present invention;

[0040] Figure 3 This is a schematic diagram of the suction mechanism of the semiconductor frame suction clamping integrated device according to an embodiment of the present utility model;

[0041] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0042] Figure 5 This is a schematic diagram of the mounting bracket for the integrated semiconductor frame clamping device according to an embodiment of the present invention. Detailed Implementation

[0043] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0044] First, combine Figures 1-5 The semiconductor frame clamping device according to the present invention is described in an embodiment for handling semiconductor frames and has a wide range of applications.

[0045] like Figures 1-5 As shown, the semiconductor frame suction and clamping integrated device of this utility model embodiment includes: a mounting back plate 1, a buffer mechanism 2, and a suction and clamping mechanism 3.

[0046] Specifically, such as Figures 1-5 As shown, in this embodiment, the mounting backplate 1 is connected to an external moving mechanism, such as a robotic arm, and the buffer mechanism 2 is fixed to the mounting backplate 1. The suction clamping mechanism 3 is connected to the buffer mechanism 2. The suction clamping mechanism 3 adsorbs and clamps the semiconductor frame, holding it in place and preventing it from falling during rapid transport. When the suction clamping mechanism 3 contacts or releases the semiconductor frame, the buffer mechanism 2 provides a buffering force to prevent damage to the semiconductor frame. Through the above mechanisms, the semiconductor frame is fully adsorbed and fixed, reducing damage to the semiconductor frame during transport.

[0047] Specifically, such as Figures 1-5As shown, in this embodiment, the buffer mechanism 2 includes: a guide rail 21, a slider 22, a connecting seat 23, a buffer mounting block 24, a guide pin 25, and a spring; the guide rail 21 is vertically fixed on the mounting back plate 1, and the buffer mounting block 24 is fixed on the mounting back plate 1; the slider 22 is slidably disposed on the guide rail 21 and connected to the connecting seat 23, the connecting seat 23 is connected to the suction clamping mechanism 3, and the guide rail 21 guides the movement of the slider 22 and the connecting seat 23; one end of the guide pin 25 is fixed to the buffer mounting block 24, and the other end is inserted into the connecting seat 25. The spring is fitted inside the connector 23 and slidably connected to the connecting seat 23; the spring is sleeved on the guide pin 25 and connected to the buffer mounting block 24, and the spring provides elastic buffering force; the guide pin 25 and the guide rail 21 provide displacement compensation and dynamically adjust the vertical movement of the suction clamping mechanism 3. Under normal conditions, the connecting seat 23 is located at the bottom of its travel stroke due to gravity. As the external moving mechanism drives the suction clamping mechanism 3 to move down and contact the product, the connecting seat 23 is forced to move up, compressing the spring and providing buffering force to prevent direct crushing of the semiconductor frame.

[0048] Furthermore, such as Figures 1-5 As shown, in this embodiment, the connecting seat 23 has a limiting groove 26 in the vertical direction, and a limiting block 27 is provided in the limiting groove 26. The limiting block 27 is fixed on the mounting back plate 1. The limiting block 27 limits the upper and lower limit travel of the connecting seat 23. When the limiting block 27 is stationary, the movement of the connecting seat 23 will drive the limiting groove 26 to move up and down, so that the upper and lower ends of the limiting groove 26 abut against the limiting block 27, thereby limiting the upper and lower limit travel of the connecting seat 23.

[0049] Furthermore, such as Figures 1-5 As shown, in this embodiment, it also includes: a buffer light detection plate 28 and a slotted photoelectric sensor 29; the slotted photoelectric sensor 29 is fixed on the mounting back plate 1; the buffer light detection plate 28 is U-shaped, one end of the buffer light detection plate 28 is fixed on the connecting seat 23, and the opening direction of the buffer light detection plate 28 is opposite to that of the slotted photoelectric sensor 29; the slotted photoelectric sensor 29 and the buffer light detection plate 28 cooperate to detect whether the mounting back plate 1 has moved into place. Specifically, under normal conditions, the connecting seat 23 is located at the bottom of its movement stroke due to gravity. As the external moving mechanism drives the suction clamping mechanism 3 to move down and contact the product, the connecting seat 23 will compress the spring and move up, driving the buffer light detection plate 28 to move up until it moves to the opening of the slotted photoelectric sensor 29. After the slotted photoelectric sensor 29 detects the signal, it indicates that the mounting back plate 1 has moved into place and stops moving down to prevent overpressure on the product.

[0050] Specifically, such as Figures 1-5As shown, in this embodiment, the suction clamping mechanism 3 includes: a connecting rod 31, which is connected to the buffer mechanism 2. The connecting rod 31 has multiple mounting holes 311 evenly spaced along its length. The connecting rod 31 is also marked with scales corresponding to the mounting holes 311 at different positions, making them visually visible and facilitating quick adjustment and replacement of the fixed positions of the adsorption components and the clamping components; several adsorption components 32, which are detachably fixed to the connecting rod 31 through the mounting holes 311. The adsorption components 32 adsorb and fix the semiconductor frame. Through multiple adsorption components 32, multi-point adsorption can be achieved, solving the problem of air leakage caused by single-point adsorption due to the multiple hollow parts of the semiconductor frame; and at least two clamping components 33, which are detachably fixed to the connecting rod 31 through the mounting holes 311. The clamping components 33 clamp and support the semiconductor frame, and the at least two clamping components 33 ensure the stability of the clamping.

[0051] Furthermore, such as Figures 1-5 As shown, in this embodiment, the adsorption assembly 32 includes: a mounting base 321, a manual adjustment screw 322, a mounting bracket 323, an air pipe connector 324, and a buffer suction cup 325; the mounting base 321 is fixed to the connecting rod 31 through the mounting hole 311, the mounting base 321 has an oblong hole 3211, and the bottom of the mounting base 321 has a square groove 3212 along the oblong hole 3211; the bottom end of the manual adjustment screw 322 passes through the oblong hole 3211 and is connected to the mounting bracket 323, and the top end of the manual adjustment screw 322 abuts against the mounting base 321; the buffer suction cup 325 is fixed on the mounting bracket 323, the air pipe connector 324 is fixed on the buffer suction cup 325, and the buffer suction cup 325 adsorbs the semiconductor frame. The length direction of the oblong hole 3211 is perpendicular to the length direction of the connecting rod 31. The position of the mounting bracket 323 can be easily adjusted through the oblong hole 3211 and the manual adjusting screw 322. The position of the buffer suction cup 325 can be adjusted in two directions through the oblong hole 3211 and the mounting hole 311 on the connecting rod 31. Multiple manual adjusting screws 322, mounting brackets 323, air pipe connectors 324, and buffer suction cups 325 can be flexibly provided on the mounting base 321. The mounting base 321 is marked with graduations for easy and intuitive adjustment. The buffer suction cup 325 is an existing design that further reduces pressure damage to the product.

[0052] Furthermore, such as Figures 1-5As shown, in this embodiment, the mounting bracket 323 has a mounting end 3231, which mates with the square groove 3212. The mounting end 3231 can be square or round. If the mounting end 3231 is square, it can slide along the square groove 3212 to adjust the position of the oblong hole 3211 along its length. If the mounting end 3231 is round, it can not only slide along the square groove 3212 to adjust the position of the oblong hole 3211 along its length, but also rotate to adjust its position. The position of the buffer suction cup 325 can be adjusted by the mounting hole 311 on the connecting rod 31, the oblong hole 3211 on the mounting base 321, and the end shape of the mounting bracket 323, adapting to different semiconductor frame products and offering wide applicability.

[0053] Furthermore, such as Figures 1-5 As shown, in this embodiment, it also includes: a vacuum generator 34 and a manifold 35; the vacuum generator 34 and the manifold 35 are fixed on the mounting back plate 1; the manifold 35 is connected to the air pipe connector 324 in each adsorption component 32 and the air flow is collected to the vacuum generator 34. The manifold 35 collects the air pipe connectors 324 in multiple adsorption components 32 and outputs them uniformly to the vacuum generator 34, which is aesthetically pleasing, convenient, and easy to adjust uniformly. The vacuum generator 34 drives the buffer suction cup 325 to adsorb the semiconductor frame.

[0054] Furthermore, such as Figures 1-5 As shown, in this embodiment, the gripping assembly 33 includes: a pneumatic gripper 331, a pair of L-shaped clamping blocks 332, and a pair of fixing screws 333. The pneumatic gripper 331 is fixed to the connecting rod 31 through mounting holes 311, and a plurality of fixing holes 3311 are spaced apart on each of the pair of output ends of the pneumatic gripper 331. The pair of L-shaped clamping blocks 332 are respectively disposed on the pair of output ends of the pneumatic gripper 331, and the L-shaped clamping blocks 332 are locked and fixed at the fixing holes 3311 by fixing screws 333. The pneumatic gripper 331 drives the pair of L-shaped clamping blocks 332 to close or separate to support or release the semiconductor frame. The distance between the pair of L-shaped clamping blocks 332 can be adjusted by fixing holes 3311 and fixing screws 333 to adapt to semiconductor frames of different sizes and improve applicability.

[0055] Specifically, such as Figures 1-5 As shown, this embodiment also includes: a proximity sensor 4 and a laser sensor 5; the proximity sensor 4 is fixed on the buffer mechanism 2, and the laser sensor 5 is fixed on the mounting back plate 1. The proximity sensor 4 and the laser sensor 5 detect the presence or absence of the product frame. The proximity sensor 4 determines whether the product will fall during movement, and the laser sensor 5 determines whether non-metallic products will fall during movement. This method is comprehensive, reliable, and has good applicability.

[0056] In use, the external moving mechanism moves the entire device to directly above the semiconductor frame loading area, and then moves the entire device downward. The buffer suction cup 325 begins to contact the semiconductor frame, and the connecting seat 23 is compressed by an upward force, which in turn moves the buffer photodetector 28 upward. The device continues to move downward until the slotted photoelectric sensor 29 senses the buffer photodetector 28, indicating that the entire device has moved into place. The vacuum generator 34 drives the buffer suction cup 325 to adsorb the semiconductor frame with negative pressure, and the pneumatic gripper 331 then drives a pair of L-shaped clamps 332 to close and support the semiconductor frame, thus fixing the semiconductor frame.

[0057] Above, refer to Figures 1-5 This invention describes a semiconductor frame clamping device according to an embodiment of the present invention. It features a compact structure, is suitable for semiconductor clip-type feeding structures, occupies minimal lateral space, and can adapt to various feeding requirements. It is easy to adjust and has wide adaptability. The entire device has low cost and low operating expenses. The device operates stably and can be adapted to most semiconductor frame products on the market. It is lightweight, which reduces the load on the corresponding modules, lowers costs, and improves the overall equipment production efficiency. It also effectively reduces the risk of products falling during movement.

[0058] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes that element.

[0059] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A semiconductor frame clamping device, characterized in that, Includes: mounting backplate, cushioning mechanism, and suction clamping mechanism; The buffer mechanism is fixed to the mounting back plate; The suction clamping mechanism is connected to the buffer mechanism, and the suction clamping mechanism adsorbs and clamps the semiconductor frame; When the suction clamping mechanism contacts or releases the semiconductor frame, the buffering mechanism provides a buffering force; The buffer mechanism includes: a guide rail, a slider, a connecting seat, a buffer mounting block, a guide pin, and a spring; The guide rail is vertically fixed to the mounting back plate, and the buffer mounting block is fixed to the mounting back plate; The slider is slidably mounted on the guide rail and connected to the connecting seat, which is connected to the suction clamping mechanism. One end of the guide pin is fixed to the buffer mounting block, and the other end is inserted into the connecting seat and slidably connected to the connecting seat. The spring is sleeved on the guide pin and connected to the buffer mounting block, and the spring provides elastic buffering force. The guide pin and the guide rail provide displacement compensation, dynamically adjusting the vertical movement of the suction clamping mechanism; The suction clamping mechanism includes: A connecting rod, which is connected to the buffer mechanism, and the connecting rod is provided with a plurality of mounting holes evenly spaced along its length; A plurality of adsorption components are provided, wherein the adsorption components are detachably fixed to the connecting rod through the mounting holes, and the adsorption components adsorb and fix the semiconductor frame. At least two clamping assemblies are provided, which are detachably fixed to the connecting rod via the mounting holes, and the clamping assemblies clamp and support the semiconductor frame.

2. The semiconductor frame clamping device as described in claim 1, characterized in that, The connecting seat has a limiting groove in the vertical direction, and a limiting block is provided in the limiting groove. The limiting block is fixed on the mounting back plate and limits the upper and lower limit travel of the connecting seat.

3. The semiconductor frame clamping device as described in claim 1, characterized in that, It also includes: a buffer optical detector and a slotted photoelectric sensor; The slotted photoelectric sensor is fixed to the mounting back plate; The buffer light detector is U-shaped, with one end fixed to the connecting seat, and the opening direction of the buffer light detector is opposite to that of the slotted photoelectric sensor. The slotted photoelectric sensor and the buffer photodetector work together to detect whether the mounting backplate has moved into place.

4. The semiconductor frame clamping device as described in claim 1, characterized in that, The adsorption assembly includes: a mounting base, a manual adjustment screw, a mounting bracket, an air tube connector, and a buffer suction cup; The mounting base is fixed to the connecting rod through the mounting hole. The mounting base has an oblong hole and a square groove is formed at the bottom of the mounting base along the oblong hole. The bottom end of the manual adjustment screw passes through the oblong hole and is connected to the mounting bracket, while the top end of the manual adjustment screw abuts against the mounting base. The buffer suction cup is fixed on the mounting bracket, the air pipe connector is fixed on the buffer suction cup, and the buffer suction cup adsorbs the semiconductor frame.

5. The semiconductor frame clamping device as described in claim 4, characterized in that, The mounting bracket has a mounting end that mates with the square groove. The mounting end is square or circular.

6. The semiconductor frame clamping device as described in claim 4, characterized in that, It also includes: a vacuum generator and a manifold; The vacuum generator and the manifold are fixed to the mounting back plate; The manifold is connected to the air pipe connector in each of the adsorption components and flows to the vacuum generator, which drives the buffer suction cup to adsorb the semiconductor frame.

7. The semiconductor frame clamping device as described in claim 1, characterized in that, The gripping assembly includes: a pneumatic gripper, a pair of L-shaped clamping blocks, and a pair of fixing screws; The pneumatic gripper is fixed to the connecting rod through the mounting hole, and a number of fixing holes are spaced apart on each pair of output ends of the pneumatic gripper. The pair of L-shaped clamping blocks are respectively disposed at the pair of output ends of the pneumatic gripper, and the L-shaped clamping blocks are fixed at the fixing holes by the fixing screws; The pneumatic grippers drive the pair of L-shaped clamps to close or separate, in order to hold or release the semiconductor frame.

8. The semiconductor frame clamping device as described in claim 1, characterized in that, It also includes: a proximity sensor and a laser sensor; the proximity sensor is fixed on the buffer mechanism, and the laser sensor is fixed on the mounting back plate; the proximity sensor and the laser sensor detect the presence or absence of the semiconductor frame.

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