Half-bridge plastic package type power module
By directly soldering signal and power terminal modules onto the substrate, the layout of the chip mounting area is optimized, solving the problems of high working junction temperature difference and stray inductance in SiC module packaging technology, simplifying the packaging process, and improving the reliability and high-frequency performance of the module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 合肥钧联汽车电子有限公司
- Filing Date
- 2025-06-13
- Publication Date
- 2026-05-19
AI Technical Summary
Existing SiC module packaging technology suffers from problems such as operating junction temperature difference, high stray inductance, complex packaging process, poor versatility, and high production cost. Traditional plastic-encapsulated half-bridge SiC modules have poor pin output flexibility and cannot meet the needs of complex circuit layouts.
By directly soldering signal and power terminal modules onto the substrate, external pins are eliminated, the chip mounting area layout is optimized, the signal transmission path is shortened, and the packaging process is simplified by utilizing the AMB ceramic substrate and molding layer for protection.
It improves the reliability and stability of the module, reduces production costs and complexity, enhances high-frequency performance and electrical reliability, and strengthens mechanical stability and electromagnetic compatibility.
Smart Images
Figure CN224265440U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor device technology, and in particular to a half-bridge plastic-encapsulated power module. Background Technology
[0002] In the current power module technology field, with the widespread application of SiC (silicon carbide) materials, the requirements for its packaging technology are becoming increasingly stringent. Although HPD-packaged SiC modules were once favored, many problems have been exposed in practical applications. For example, they perform poorly in terms of operating junction temperature, making it difficult to fully release the performance potential of SiC materials in high-temperature environments. The presence of stray inductance also limits its high-frequency performance. In addition, there are issues such as PC power cycling and unreliable high-temperature and high-humidity reverse bias of H3TRB, which prevent this packaging process from fully demonstrating the maximum advantages of SiC materials.
[0003] Traditional molded half-bridge SiC power modules with front-facing pins also face challenges. The fixed pin positions within the mold limit compatibility with various circuit topologies, significantly restricting their versatility and applicability. Furthermore, the poor pin flexibility makes it difficult to meet the complex and ever-changing requirements of actual circuit layouts. During the packaging process, the complex outward-leading frame structure greatly increases the packaging difficulty, leading to both increased production costs and reduced production efficiency. Utility Model Content
[0004] To address the problems existing in the prior art, this utility model provides a half-bridge plastic-encapsulated power module, which can effectively solve the problems existing in the prior art.
[0005] The technical solution of this utility model is:
[0006] According to one aspect of the present invention, the substrate includes: a substrate having at least one mounting unit, wherein one end face of the mounting unit has at least one chip mounting area, at least one power terminal module mounting area, and at least one signal terminal module mounting area, wherein the chip mounting area is located in the middle of the mounting unit, the power terminal module mounting area is located at the upper end and / or lower end of the mounting unit, and the signal terminal module mounting area is located on the outer periphery of the chip mounting area; the substrate also includes a signal terminal module and a power terminal module, wherein the signal terminal module is soldered to the signal terminal module mounting area, and the power terminal module is soldered to the power terminal module mounting area.
[0007] Furthermore, multiple mounting units are provided, and the multiple mounting units are distributed on the substrate.
[0008] Furthermore, there are two chip mounting areas, which are arranged in a mirror-symmetrical manner within the mounting unit.
[0009] Furthermore, the chip mounting area is concave, and multiple signal terminal module mounting areas are provided, one of which is located above the concave portion of the concave chip mounting area.
[0010] Furthermore, the number of power terminal module mounting areas is four, with three of the power terminal module mounting areas spaced apart at the upper end of the mounting unit, and one of the power terminal module mounting areas located at the lower end of the mounting unit.
[0011] Furthermore, one end of the signal terminal module is equipped with a pin, which is located within the orthographic projection area of the substrate.
[0012] Furthermore, the substrate and the mounting unit are externally encapsulated with a plastic sealing layer.
[0013] By adopting the above technical solution, the beneficial effects of this utility model compared with the prior art are as follows:
[0014] Firstly, this technical solution significantly simplifies the complex framework structure extraction process in traditional packaging by eliminating external pins and directly soldering the signal terminal module and power terminal module to the AMB substrate. The packaging steps are simpler, eliminating the need to fix, solder, and protect a large number of pins, thus reducing the difficulty of the process.
[0015] Secondly, it reduces potential failure points caused by factors such as solder joints between pins and the module, contact resistance, and mechanical stress on the pins themselves, which are inherent to traditional pin connection methods. Direct soldering enhances the stability of the internal connections of the module, improves the reliability of the module in harsh working environments such as vibration and temperature changes, and reduces the risk of failure caused by loose connections, oxidation, and other problems.
[0016] Third, it shortens the signal transmission path and current loop, effectively reducing the module's stray inductance. For high-frequency applications, lower stray inductance can reduce electromagnetic interference and voltage spikes during switching, improve power conversion efficiency, and make the module's performance more stable when operating at high frequencies.
[0017] Fourth, symmetrical arrangement of the chip mounting area enables heat to be evenly conducted to the substrate, avoiding local overheating and improving thermal stability; it facilitates uniform current distribution, reduces electric field concentration, and enhances electrical reliability; it balances the module's center of gravity, disperses mechanical stress, and improves mechanical stability; it helps reduce electromagnetic interference and enhances electromagnetic compatibility; it also simplifies manufacturing and packaging processes, improves production efficiency and product quality consistency, and thus optimizes the performance of the power module in all aspects. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the planar structure of the present invention;
[0020] Figure 2 This is a three-dimensional structural diagram of the present invention;
[0021] Figure 3 This is a schematic diagram of the planar structure of the present invention with the metal bonding lines and chip removed;
[0022] Figure 4 This is a schematic diagram of the planar structure of the mounting unit in this utility model, wherein the area within the dashed line is the chip mounting area;
[0023] Figure 5 This is a schematic diagram of the planar structure of the mounting unit in this utility model, wherein the area within the dashed line is the power terminal module mounting area;
[0024] Figure 6 This is a schematic diagram of the planar structure of the mounting unit in this utility model, wherein the area within the dashed line is the signal terminal module mounting area;
[0025] In the figure: substrate-1, mounting unit-2, chip mounting area-21, recess-210, power terminal module mounting area-22, signal terminal module mounting area-23, metal bonding component-3, chip-4, signal terminal module-5, power terminal module-6. Detailed Implementation
[0026] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are only for illustrating the present invention and do not limit the scope of the present invention. Similarly, the following embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.
[0027] like Figures 1 to 6 As shown, this solution provides a half-bridge plastic-encapsulated power module.
[0028] Please see Figures 1 to 6The system includes: a substrate 1, preferably an AMB ceramic substrate, and the substrate 1 having at least one mounting unit 2. Specifically, multiple mounting units 2 are provided and distributed on the substrate 1. In this embodiment, the number of mounting units 2 is three, and the three mounting units 2 are spaced apart on the substrate 1.
[0029] Please see Figures 1 to 6 The mounting unit 2 has at least one chip mounting area 21, at least one power terminal module mounting area 22 and at least one signal terminal module mounting area 23 distributed on one end face. The chip mounting area 21 is located in the middle of the mounting unit 2.
[0030] Please see Figure 4 Preferably, there are two chip mounting areas 21, which are arranged symmetrically in mirror image of each other in the mounting unit 2. Chips 4 are distributed within each chip mounting area 21. Each chip mounting area 21 is concave. Chips 4 are electrically connected to the substrate 1 via metal bonding wires 3.
[0031] Please see Figure 5 The power terminal module mounting area 22 is located at the upper and / or lower end of the mounting unit 2. There are four power terminal module mounting areas 22: three are spaced apart at the upper end of the mounting unit 2, and one is located at the lower end. Specifically, the power terminal module mounting area 22 at the lower end of the mounting unit 2 is symmetrical to the power terminal module mounting area 22 located in the middle of the upper end of the mounting unit 2. The power terminal module 6 is soldered to the power terminal module mounting area 22. If there is only one power terminal module 6, it can be soldered to any of the four power terminal module mounting areas 22. Copper metal electrodes are provided on both the upper and lower end faces of the power terminal module 6. The copper metal electrode on one exposed end face of the power terminal module 6 is soldered to an external device for electrical connection; the copper metal electrode on the other end face is soldered to the power terminal module mounting area 22.
[0032] Please see Figure 6The signal terminal module mounting area 23 is located on the outer periphery of the chip mounting area 21; it also includes a signal terminal module 5 and a power terminal module 6, with the signal terminal module 5 soldered to the signal terminal module mounting area 23. Multiple signal terminal module mounting areas 23 are provided, one of which is located above the recess 210 of the concave chip mounting area 21. In this embodiment, there are four signal terminal module mounting areas 23, with two signal terminal module mounting areas 23 located above the recesses 210 of the two concave chip mounting areas 21, and the two signal terminal module mounting areas 23 are mirror-symmetrical; the other two signal terminal module mounting areas 23 are spaced apart along the length of the substrate 1 at the right end of the substrate 1. If there is only one signal terminal module 5, this signal terminal module 5 can be soldered to any position among the four signal terminal module mounting areas 23.
[0033] In this embodiment, a pin (not shown) is mounted on one end of the signal terminal module 5, and the pin is located within the orthographic projection area of the substrate 1. The substrate 1 and the mounting unit 2 are covered with a plastic encapsulation layer (not shown). Copper metal electrodes are provided on both the upper and lower end faces of the signal terminal module 5. The copper metal electrode on the upper end face of the signal terminal module 5 is soldered to the pin, and the copper metal electrode on the lower end face of the signal terminal module 5 is soldered to the mounting area 23 of the signal terminal module.
[0034] Working principle:
[0035] When this half-bridge molded power module is in operation, it first receives external control signals through the pins on the signal terminal module 5. Since the signal terminal module 5 is directly soldered to the signal terminal module mounting area 23 and located on the outer periphery of the chip mounting area 21, it can quickly and stably transmit control signals to the chip 4 within the chip mounting area 21, thereby controlling the power module's conduction and cutoff, achieving efficient conversion and regulation of electrical energy. The power terminal module 6 is directly soldered to the power terminal module mounting area 22, and through optimized layout and soldering methods, it is tightly connected to the chip 4, efficiently transmitting the electrical energy output from the chip 4 to the external circuit to complete tasks such as power amplification and driving. The entire process is carried out under the protection of the molding layer, avoiding interference and damage to internal components from the external environment. At the same time, the compact internal structure design also results in a shorter signal transmission path, reducing energy loss and improving the efficiency and reliability of the power module. Moreover, by eliminating external pins, the internal space is utilized more rationally, further improving the module's performance and stability.
[0036] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A half-bridge molded power module, characterized in that, include: The substrate (1) is provided with at least one mounting unit (2). One end face of the mounting unit (2) is provided with at least one chip mounting area (21), at least one power terminal module mounting area (22) and at least one signal terminal module mounting area (23). The chip mounting area (21) is located in the middle of the mounting unit (2). The power terminal module mounting area (22) is located at the upper end and / or lower end of the mounting unit (2). The signal terminal module mounting area (23) is located on the outer periphery of the chip mounting area (21). The substrate also includes a signal terminal module (5) and a power terminal module (6). The signal terminal module (5) is soldered to the signal terminal module mounting area (23). The power terminal module (6) is soldered to the power terminal module mounting area (22).
2. The half-bridge molded power module as described in claim 1, characterized in that, The mounting unit (2) is provided in multiple ways, and the multiple mounting units (2) are distributed on the substrate (1).
3. A half-bridge molded power module as described in claim 1, characterized in that, The number of chip mounting areas (21) is two, and the two chip mounting areas (21) are arranged in a mirror-symmetrical manner in the mounting unit (2).
4. A half-bridge molded power module as described in claim 1 or 3, characterized in that, The chip mounting area (21) is concave, and multiple signal terminal module mounting areas (23) are provided, one of which is located above the recess (210) of the concave chip mounting area (21).
5. A half-bridge molded power module as described in claim 4, characterized in that, The number of power terminal module mounting areas (22) is four, of which three power terminal module mounting areas (22) are spaced apart at the upper end of the mounting unit (2), and one power terminal module mounting area (22) is located at the lower end of the mounting unit (2).
6. A half-bridge molded power module as described in claim 1, characterized in that, One end of the signal terminal module (5) is equipped with a pin, which is located in the orthographic projection area of the substrate (1).
7. A half-bridge molded power module as described in claim 1, characterized in that, The substrate (1) and the mounting unit (2) are covered with a plastic sealing layer.