Ultrasonic deburring and cleaning equipment used after wafer cutting

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment, discloses ultrasonic deburring and cleaning equipment after wafer cutting, and aims to solve the problem of incomplete cleaning caused by accumulation of wafers in the cleaning process. According to the utility model, through the upper cylinder body, the lower cylinder body, the buckle, the clamping groove, the first limiting block and the second limiting block, when the wafer is loaded, the upper cylinder body and the lower cylinder body are hinged, the wafer is flexibly opened and placed, and when the wafer is cleaned, the buckle and the clamping groove are clamped to form a relatively closed space, so that the full contact of cleaning liquid and the wafer is ensured, and the leakage of the wafer is prevented; a first limiting block and a second limiting block are welded to the inner walls of the upper barrel and the lower barrel respectively, the wafer is limited when the barrels are closed, excessive movement of the wafer is avoided, and uniform action of ultrasonic waves is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to an ultrasonic deburring and cleaning device after wafer dicing. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon, which is formed into a circular thin film after a series of processes such as crystal growth, grinding, polishing, and slicing. When wafers are cut, burrs may remain on the wafer surface. Existing wafer ultrasonic cleaning technology mainly uses ultrasonic waves to clean and remove stains through cavitation.

[0003] A search revealed that Chinese Patent Publication No. CN217966264U discloses a high-energy ultrasonic deburring device. A cylinder drives a gripper to move into the resonant pool. When the gripper contacts the placement basket, activating it allows the gripper to pick up the workpiece inside the basket, facilitating removal of the workpiece from the resonant pool. This avoids direct contact with the cleaning fluid inside the resonant pool, preventing injury. A connecting plate allows for length adjustment of the fixing plate, enabling the gripper to rotate flexibly for easy workpiece removal.

[0004] The above-mentioned and existing related technologies often have the following drawbacks: Although the pneumatic gripper can turn flexibly and is convenient for picking up objects, placing the wafer directly in the resonant pool for deburring and cleaning will cause wear on the wafer surface. Excessive movement or stacking of the wafer during the cleaning process will lead to an unstable wafer cleaning posture, resulting in the ultrasonic energy not being applied evenly to various areas of the wafer surface, thus reducing the cleaning quality. Utility Model Content

[0005] The technical problem to be solved by this invention is that the existing technology has the disadvantage of incomplete cleaning due to the accumulation of wafers during the cleaning process. To address this, we propose an ultrasonic deburring and cleaning device for wafers after dicing.

[0006] To achieve the above objectives, this application adopts the following technical solution: an ultrasonic deburring and cleaning device for wafer dicing, comprising a working chamber, wherein a roller component and a drive component are provided inside the working chamber, the roller component and the drive component are rotatably connected, a liquid inlet component is provided on one side of the working chamber, and a circulating liquid outlet component is provided on the other side of the working chamber.

[0007] The working chamber is equipped with a resonant pool and an ultrasonic generator. The ultrasonic generator is located at the lower end of the resonant pool. The roller assembly includes an upper cylinder and a lower cylinder disposed inside the resonant pool. One end of the upper cylinder and the lower cylinder are hinged together. A buckle is fixed on the outer surface of the upper cylinder, and a slot is fixed on the outer surface of the lower cylinder. The buckle engages with the slot. A first limiting block is provided on the inner wall of the upper cylinder, and a second limiting block is provided on the inner wall of the lower cylinder. The first limiting block and the second limiting block are in contact with each other. Filter holes are opened on the outer surfaces of both the upper cylinder and the lower cylinder. The upper cylinder and the lower cylinder limit the wafer and restrict excessive movement of the wafer inside the cylinder. The first limiting block and the second limiting block limit the wafer when the cylinder is closed, thereby improving the uniformity of deburring.

[0008] Preferably, the upper and lower cylinders are provided with rotating shafts on their sides, and the inner wall of the resonant pool is provided with a support. The rotating shafts are rotatably connected to the support, and the support achieves smooth rotation of the rotating shafts through bearings, thereby reducing frictional resistance.

[0009] Preferably, the driving component includes a motor disposed on one side of the working box, the output end of the motor is provided with a rotating shaft passing through the resonant pool, a second gear is sleeved on the outer surface of the rotating shaft, and a first gear is sleeved on the outer surface of one set of the rotating shafts. The second gear meshes with the first gear. The rotation of the second gear and the first gear causes the wafer in the cylinder to rotate evenly in the cleaning solution, so as to fully contact the ultrasonic energy and the cleaning solution.

[0010] Preferably, the inner wall of the resonant pool is provided with an inclined plate, and the liquid inlet component includes a liquid inlet provided on one side of the working box. One end of the liquid inlet is provided with a nozzle, which is located above the inclined plate. The nozzle ensures that the cleaning liquid can impact the surface of the inclined plate to form a uniform liquid film.

[0011] Preferably, the circulating liquid outlet component includes a return liquid tank located on the other side of the working chamber, an opening slot is provided on one side of the resonant cell, the return liquid tank is connected to the resonant cell through the opening slot, a filter screen is provided inside the return liquid tank, a baffle is hinged to the outer surface of the return liquid tank, and the bottom of the return liquid tank is used to collect impurities to prevent impurities from causing wear on the wafer in the resonant cell.

[0012] Preferably, the return liquid tank is provided with an outlet pipe and a circulation liquid pipe on one side. A water pump is provided at one end of the circulation liquid pipe, and a supply liquid pipe is provided at one end of the water pump. One end of the supply liquid pipe is connected to the inside of the resonant pool. The liquid in the return liquid tank is drawn out through the circulation liquid pipe and reinjected into the resonant pool through the supply liquid pipe, thus forming a recycling of the cleaning liquid.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] In this invention, the upper cylinder, lower cylinder, buckle, slot, first limiting block, and second limiting block are used to flexibly open and place the wafer when loading it through the hinge of the upper and lower cylinders. During the cleaning operation, the buckle and slot are used to form a relatively closed space, which ensures that the cleaning fluid is in full contact with the wafer and prevents the wafer from leaking out. The first limiting block and the second limiting block are welded to the inner walls of the upper and lower cylinders respectively, which limit the wafer when the cylinder is closed, avoid excessive movement of the wafer, and ensure uniform ultrasonic action. Attached Figure Description

[0015] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the roller component and the drive component of this utility model;

[0018] Figure 3 This is a cross-sectional view of the roller component of this utility model;

[0019] Figure 4 This is a cross-sectional view of the working box of this utility model;

[0020] Figure 5 This is a schematic diagram of the internal structure of the circulating liquid outlet component of this utility model;

[0021] Legend: 1. Working box; 11. Support; 12. Resonance pool; 13. Inclined plate; 14. Ultrasonic generator; 15. Opening slot; 2. Roller assembly; 21. Upper cylinder; 211. First limiting block; 22. Lower cylinder; 221. Second limiting block; 23. Rotating shaft; 24. First gear; 25. Filter hole; 26. Buckle; 27. Slot; 3. Drive assembly; 31. Motor; 32. Rotating shaft; 33. Second gear; 4. Liquid inlet assembly; 41. Liquid inlet; 5. Circulating liquid outlet assembly; 51. Filter screen; 52. Baffle; 53. Return liquid tank; 54. Circulating liquid pipe; 55. Water pump; 56. Liquid supply pipe; 57. Liquid outlet pipe. Detailed Implementation

[0022] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0023] Reference Figures 1-5 As shown, this utility model provides a technical solution: an ultrasonic deburring and cleaning device for wafer dicing, including a working box 1, a resonant pool 12 fixed inside the working box 1, the resonant pool 12 for containing cleaning fluid, and a roller component 2 rotatably connected inside the resonant pool 12, the roller component 2 including an upper cylinder 21 and a lower cylinder 22, the upper cylinder 21 and the lower cylinder 22 providing a carrying space for the wafer, and the two are hinged at one end, which can be opened and closed flexibly. During loading, the hinged end is opened and the diced wafer is placed into the cylinder; during the cleaning operation, the upper cylinder 21 and the lower cylinder 22 are locked together by the buckle 26 and the slot 27, forming a relatively closed space, ensuring that the cleaning fluid is in full contact with the wafer, and preventing the wafer from leaking out during the cleaning process. A first limiting block 211 is welded to the inner wall of the upper cylinder 21, and a second limiting block 221 is welded to the inner wall of the lower cylinder 22. When the upper cylinder 21 and the lower cylinder 22 are closed... When the time is right, the first limiting block 211 and the second limiting block 221 limit the wafer, restricting the excessive movement of the wafer in the cylinder, so that the wafer maintains a relatively stable posture during the cleaning process, ensuring that the ultrasonic waves can act evenly on the wafer surface, and improving the uniformity of deburring. A driving component 3 is fixed on one side of the working box 1. The driving component 3 is rotatably connected to the roller component 2. The driving component 3 drives the roller component 2 to rotate slowly in the resonance pool 12. The liquid inlet component 4 is set on one side of the working box 1 and is responsible for introducing the external cleaning liquid into the resonance pool 12 of the working box 1. The liquid circulation outlet component 5 is located on the other side of the working box 1. The cleaning liquid is recycled through the liquid circulation outlet component 5. An ultrasonic generator 14 is fixed on the inner wall of the working box 1. The ultrasonic generator 14 is installed at the lower end of the resonance pool 12. The ultrasonic generator 14 efficiently transmits ultrasonic energy to the cleaning liquid, generating a cavitation effect to achieve deburring cleaning.

[0024] Reference Figure 2 and Figure 3 As shown in this embodiment: the sides of the upper cylinder 21 and the lower cylinder 22 are rotatably connected to the support 11 on the inner wall of the resonance pool 12 via the rotating shaft 23, forming the rotational support system of the roller component 2. The rotating shaft 23 is made of high-strength stainless steel to ensure low-friction rotation with the support 11. The support 11 is fixed to the inner wall of the resonance pool 12 and adopts a Y-shaped structure design. Bearings are installed on the inner side of the support 11, and the rotating shaft 23 is smoothly rotated through the bearings to reduce frictional resistance and extend service life.

[0025] Reference Figure 2 As shown in this embodiment: the driving component 3 mainly includes a motor 31, a rotating shaft 32, and a second gear 33. The motor 31 is rigidly connected and fixed to the outer wall of the working box 1 to ensure the stability of operation. The output end of the motor 31 is rigidly connected to one end of the rotating shaft 32. The other end of the rotating shaft 32 extends through the side wall of the resonant pool 12 into the interior. The second gear 33 is fixedly sleeved on the outer surface of the rotating shaft 32 by a key connection. The first gear 24 is sleeved on the outer surface of one set of rotating shafts 23. After the motor 31 starts, the output torque is transmitted to the rotating shaft 32 through the coupling, causing the rotating shaft 32 to rotate synchronously. The rotating shaft 32 drives the second gear 33 to rotate through the key connection. The second gear 33 meshes with the first gear 24, transmitting power to the rotating shaft 23. The rotating shaft 23 drives the upper cylinder 21 and the lower cylinder 22 to rotate as a whole, so that the wafers in the cylinder are evenly turned in the cleaning fluid and fully contact the ultrasonic energy and the cleaning fluid.

[0026] An inclined plate 13 is fixed to the inner wall of the resonance pool 12. The inclined surface of the inclined plate 13 can deposit impurities in the cleaning fluid to the bottom of the resonance pool 12. The liquid inlet component 4 includes an inlet 41 and a nozzle. The inlet 41 is located on one side of the working box 1. One end of the inlet 41 is connected to the nozzle through a reducing connector. The nozzle adopts a fan-shaped nozzle and is fixed above the inclined plate 13 to ensure that the cleaning fluid can impact the surface of the inclined plate 13 to form a uniform liquid film. The other end of the inlet 41 is connected to the external cleaning fluid supply pipeline through a quick-connect flange to realize the efficient introduction of the cleaning fluid.

[0027] Reference Figure 4 and Figure 5 As shown in this embodiment: the circulating liquid outlet component 5 includes a return liquid tank 53 located on the other side of the working box 1. An opening groove 15 is opened at the bottom of the side wall of the resonance pool 12. The return liquid tank 53 is connected to the resonance pool 12 through the opening groove 15 to form a circulation path for the cleaning liquid. The bottom of the opening groove 15 and the top of the return liquid tank 53 are connected by a flange to ensure a leak-free seal. The filter screen 51 is fixed inside the return liquid tank 53 by a bayonet. When the burrs removed by ultrasonic waves flow into the return liquid tank 53 with the cleaning liquid, large particles of impurities settle at the bottom of the return liquid tank 53, while small particles are intercepted by the filter screen 51 and remain at the bottom of the return liquid tank 53. When the impurities accumulate to a certain extent, the baffle 52 hinged to the outer surface of the return liquid tank 53 is opened to collect the impurities.

[0028] The outlet pipe 57 is located on the side wall of the return tank 53 and is connected to a manual ball valve for draining. When the cleaning fluid needs to be replaced or the equipment needs maintenance, the valve is opened and the liquid in the return tank 53 is discharged by gravity. The circulating pipe 54 is installed in the middle of the side wall of the return tank 53. The other end of the circulating pipe 54 is connected to the inlet of the water pump 55 through a flange to ensure a reliable seal. The supply pipe 56 connects the outlet of the water pump 55 to the resonance pool 12. The end of the supply pipe 56 extends into the interior of the resonance pool 12, and the opening direction is consistent with the rotation direction of the roller component 2 to promote the circulation of the cleaning fluid in the resonance pool 12. The cleaning fluid containing impurities flows from the resonance pool 12 into the return tank 53 through the opening groove 15. After being filtered by the filter screen 51, the clean liquid gathers at the bottom of the return tank 53. The water pump 55 is started to draw out the liquid in the return tank 53 through the circulating pipe 54 and re-inject it into the resonance pool 12 through the supply pipe 56, thus forming a recycling of the cleaning fluid.

[0029] Working principle: Open the hinged upper cylinder 21 and lower cylinder 22, place the diced wafer inside, and then engage it with the slot 27 via the buckle 26, making the two tightly closed to form a relatively enclosed space. At this time, the first limiting block 211 on the inner wall of the upper cylinder 21 contacts the second limiting block 221 on the inner wall of the lower cylinder 22 to limit the wafer and prevent it from moving excessively. Then, the liquid inlet component 4 starts to work, and the external cleaning fluid is delivered to the nozzle through the liquid inlet 41. The nozzle impacts the cleaning fluid onto the inclined plate 1 on the inner wall of the resonance cell 12. After forming a uniform liquid film, the liquid flows into the resonant pool 12 until the resonant pool 12 is filled with an appropriate amount of cleaning solution. After the cleaning operation is started, the ultrasonic generator 14, which is fixed to the lower end of the resonant pool 12 on the inner wall of the working box 1, runs and transmits ultrasonic energy to the cleaning solution, generating a cavitation effect, thereby achieving deburring and cleaning of the wafer. At the same time, the motor 31 of the drive component 3 starts, and the output torque is transmitted to the second gear 33 through the rotating shaft 32. The second gear 33 meshes with the first gear 24 sleeved on the rotating shaft 23, driving the rotating shaft 23. The rotation causes the drum assembly 2 to slowly rotate within the resonant pool 12. Because the outer surfaces of the upper and lower drum bodies 21 and 22 have filter holes 25, the cleaning fluid can freely enter and exit. The wafer rotates evenly within the drum, ensuring full contact with the ultrasonic cleaning fluid and guaranteeing uniform cleaning of all parts. During the cleaning process, impurities in the cleaning fluid settle under the action of the inclined plate 13. The cleaning fluid containing impurities flows into the return tank 53 through the opening trough 15 at the bottom of the side wall of the resonant pool 12. The filter screen 51 in the return tank 53 intercepts tiny particles. Impurities, especially large particles, settle at the bottom. The hinged baffle 52 can be opened periodically to clean the impurities. The circulating liquid outlet component 5 enables the recycling of the cleaning liquid. The water pump 55 re-injects the filtered cleaning liquid from the return liquid tank 53 into the resonance pool 12 through the circulating liquid pipe 54 and the supply liquid pipe 56. The opening direction of the supply liquid pipe 56 is consistent with the rotation direction of the roller component 2 to promote the circulation of the cleaning liquid. When it is necessary to replace the cleaning liquid or maintain the equipment, the manual ball valve on the liquid outlet pipe 57 on the side wall of the return liquid tank 53 is opened, and the liquid is discharged by gravity.

[0030] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. An ultrasonic deburring and cleaning device for wafer dicing, characterized in that, It includes a working box, inside which are installed a roller assembly and a drive assembly, which are rotatably connected. A liquid inlet assembly is provided on one side of the working box, and a circulating liquid outlet assembly is provided on the other side of the working box. The working box is equipped with a resonant pool and an ultrasonic generator. The ultrasonic generator is located at the lower end of the resonant pool. The roller component includes an upper cylinder and a lower cylinder inside the resonant pool. One end of the upper cylinder and the lower cylinder are hinged together. A buckle is fixed on the outer surface of the upper cylinder, and a slot is fixed on the outer surface of the lower cylinder. The buckle engages with the slot. A first limiting block is provided on the inner wall of the upper cylinder, and a second limiting block is provided on the inner wall of the lower cylinder. The first limiting block and the second limiting block are in contact. Filter holes are provided on the outer surfaces of both the upper cylinder and the lower cylinder.

2. The ultrasonic deburring and cleaning equipment after wafer dicing according to claim 1, characterized in that: The upper and lower cylinders are provided with rotating shafts on their sides, and the inner wall of the resonance pool is provided with a support. The rotating shafts are rotatably connected to the support.

3. The ultrasonic deburring and cleaning equipment after wafer dicing according to claim 2, characterized in that: The driving component includes a motor disposed on one side of the working box. The output end of the motor passes through the resonant pool and is provided with a rotating shaft. A second gear is sleeved on the outer surface of the rotating shaft. A first gear is sleeved on the outer surface of one set of the rotating shafts. The second gear meshes with the first gear.

4. The ultrasonic deburring and cleaning equipment after wafer dicing according to claim 3, characterized in that: The inner wall of the resonance pool is provided with an inclined plate, and the liquid inlet component includes a liquid inlet located on one side of the working box, with a nozzle at one end of the liquid inlet, and the nozzle is located above the inclined plate.

5. The ultrasonic deburring and cleaning equipment after wafer dicing according to claim 1, characterized in that: The circulating liquid outlet component includes a return liquid tank located on the other side of the working chamber. An opening slot is provided on one side of the resonance pool. The return liquid tank is connected to the resonance pool through the opening slot. A filter screen is installed inside the return liquid tank, and a baffle is hinged to the outer surface of the return liquid tank.

6. The ultrasonic deburring and cleaning equipment after wafer dicing according to claim 5, characterized in that: The return tank is provided with an outlet pipe and a circulation pipe on one side. A water pump is provided at one end of the circulation pipe, and a supply pipe is provided at one end of the water pump. One end of the supply pipe is connected to the inside of the resonant pool.

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