Wafer oxidation film edge removing equipment

Abstract

The utility model discloses wafer oxidation film edge removing equipment, which relates to the field of wafer oxidation films and comprises a processing table, an adjusting frame is fixedly connected to the upper end of the processing table, a first motor is arranged on one side of the adjusting frame, a lead screw is arranged at the output end of the first motor, a guide groove is formed in the front side of the adjusting frame, and the lead screw is arranged in the guide groove. The interior of the guide groove is slidably connected with a guide block, and the rear side of the guide block is fixedly connected with a moving block. The wafer oxidation film removing device has the advantages that the wafer oxidation film can be removed through the first motor, the second motor, the third motor, the fixed disc, the movable block, the fixed disc and the like, a worker does not need to carry out handheld operation, and the working intensity of the worker is greatly reduced; and the collecting box can be quickly assembled and disassembled through a push block, a telescopic rod, a spring, a clamping rod and other assemblies, so that internal impurities can be cleaned in time, and meanwhile, the cleaning difficulty can also be reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer oxide films, and in particular to a wafer oxide film edge removal device. Background Technology

[0002] A silicon wafer is a silicon chip made from high-purity polycrystalline silicon through a specific process. First, high-purity polycrystalline silicon is dissolved and doped with silicon seed crystals. Then, it is slowly pulled out to form a cylindrical single-crystal silicon rod, or silicon ingot. Next, the silicon ingot undergoes grinding, polishing, and slicing processes to ultimately form a silicon wafer, which is what we commonly refer to as a wafer. During wafer manufacturing, a layer of silicon dioxide oxide film naturally grows at its edges. This oxide film reduces the quality of the wafer. Therefore, to ensure wafer quality, specialized removal equipment must be used to remove the silicon dioxide oxide film from the wafer edges.

[0003] However, in the existing technology, when workers use the removal equipment to clean the oxide film on the edge of the wafer, they need to hold the wafer close to the grinding wheel and rotate it, which undoubtedly increases the workload of the workers. Utility Model Content

[0004] The purpose of this invention is to provide a wafer oxide film edge removal device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer oxide film edge removal device, comprising a processing table, an adjusting frame fixedly connected to the upper end of the processing table, a first motor provided on one side of the adjusting frame, a lead screw provided at the output end of the first motor, a guide groove provided on the front side of the adjusting frame, a guide block slidably connected inside the guide groove, a moving block fixedly connected to the rear side of the guide block, a threaded hole provided inside the moving block, a connecting block fixedly connected to the right side of the moving block, a second motor provided inside the connecting block, a fixed plate provided at the output end of the second motor, and a fixing bolt provided inside the fixed plate;

[0006] A collection box is fixedly connected to the upper middle part of the processing table. A third motor is provided on the left side of the collection box, and a grinding wheel is provided at the output end of the third motor.

[0007] Preferably, a collection box is movably connected inside the collection box, a pull plate is fixedly connected to the front side of the collection box, a locking hole is opened inside the pull plate, and a fixing block is fixedly connected to the front side of the collection box.

[0008] Preferably, the fixed block has a sliding groove inside, a telescopic rod is provided inside the sliding groove, a spring is sleeved on the outside of the telescopic rod, a push block is fixedly connected to the lower end of the telescopic rod, and a locking rod is fixedly connected to the lower end of the push block.

[0009] Preferably, the internal thread of the moving block is adapted to the external thread of the lead screw.

[0010] Preferably, the number of fixed disks is two sets, and they are symmetrically arranged about the center line of the processing table.

[0011] Preferably, the pusher block slides inside the groove via a telescopic rod and a spring.

[0012] Using the above technical solution, by activating the first motor, the lead screw rotates, and under the action of the threaded hole inside the moving block, the fixed disk moves the wafer downward. At this time, the third motor is activated, and the grinding wheel rotates, thereby grinding the wafer. Simultaneously, the second motor can drive the fixed disk to rotate, changing the orientation of the wafer and achieving multi-angle grinding. During the movement of the moving block, the guide block slides inside the guide groove. The cooperation between the guide block and the guide groove can improve the stability of the moving block during movement. Through the components such as the first motor, second motor, third motor, fixed disk, moving block, and fixed disk, the oxide film on the wafer can be removed without manual operation by the operator, greatly reducing the workload of the operator.

[0013] Using the above technical solution, by pushing the push block, the push block compresses the telescopic rod and spring. During this process, the locking rod slides out from the inside of the locking hole. Then, the pull plate is pulled to one side, and the pull plate drives the collection box to slide out from the inside of the collection box. At this time, the staff can clean the impurities inside. Similarly, during installation, the collection box is slid into the inside of the collection box. When the locking hole reaches the position of the locking rod, the spring rebounds, causing the telescopic rod to push the push block to move in the opposite direction. The locking rod re-enters the locking hole, thereby limiting the collection box and enabling normal use. The push block, telescopic rod, spring, locking rod and other components can quickly load and unload the collection box, thereby enabling timely cleaning of the impurities inside, and also reducing the difficulty of cleaning. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the adjustment frame structure of this utility model.

[0016] Figure 3 This is a schematic diagram of the movable block structure of this utility model.

[0017] Figure 4This is a schematic diagram of the collection box structure of this utility model.

[0018] Figure 5 This is a schematic diagram of the internal structure of the fixing block of this utility model.

[0019] In the diagram: 1. Processing table; 2. Adjustment frame; 3. First motor; 4. Lead screw; 5. Guide groove; 6. Guide block; 7. Moving block; 8. Threaded hole; 9. Connecting block; 10. Second motor; 11. Fixed plate; 12. Fixed bolt; 13. Collection box; 14. Third motor; 15. Grinding wheel; 16. Collection box; 17. Pull plate; 18. Locking hole; 19. Fixed block; 20. Slide groove; 21. Telescopic rod; 22. Spring; 23. Push block; 24. Locking rod. Detailed Implementation

[0020] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0021] Example 1

[0022] Please see Figures 1-5 This utility model provides a technical solution: a wafer oxide film edge removal device, including a processing table 1, an adjustment frame 2 fixedly connected to the upper end of the processing table 1, a first motor 3 provided on one side of the adjustment frame 2, a lead screw 4 provided at the output end of the first motor 3, a guide groove 5 opened on the front side of the adjustment frame 2, a guide block 6 slidably connected inside the guide groove 5, a moving block 7 fixedly connected to the rear side of the guide block 6, a threaded hole 8 opened inside the moving block 7, a connecting block 9 fixedly connected to the right side of the moving block 7, a second motor 10 provided inside the connecting block 9, a fixed plate 11 provided at the output end of the second motor 10, a fixing bolt 12 provided inside the fixed plate 11, a collection box 13 fixedly connected to the middle of the upper end of the processing table 1, a third motor 14 provided on the left side of the collection box 13, a grinding wheel 15 provided at the output end of the third motor 14, the internal thread of the moving block 7 is adapted to the external thread of the lead screw 4, and there are two sets of fixed plates 11, which are symmetrically arranged about the center line of the processing table 1.

[0023] Specifically, the first motor 3 is turned on, driving the lead screw 4 to rotate. Under the action of the threaded hole 8 inside the moving block 7, the fixed disk 11 moves the wafer downward. At this time, the third motor 14 is turned on, driving the grinding wheel 15 to rotate, thereby achieving the grinding of the wafer. At the same time, the second motor 10 can drive the fixed disk 11 to rotate, changing the orientation of the wafer and achieving multi-angle grinding. During the movement of the moving block 7, the guide block 6 slides inside the guide groove 5. The cooperation of the guide block 6 and the guide groove 5 can improve the stability of the moving block 7 during movement. Through the components such as the first motor 3, the second motor 10, the third motor 14, the fixed disk 11, the moving block 7, and the fixed disk 11, the removal of the oxide film on the wafer can be achieved without the need for manual operation by the staff, greatly reducing the workload of the staff.

[0024] Example 2

[0025] Please see Figures 1-5 This utility model provides a technical solution: a wafer oxide film edge removal device, wherein a collection box 16 is movably connected inside a collection box 13, a pull plate 17 is fixedly connected to the front side of the collection box 16, a locking hole 18 is opened inside the pull plate 17, a fixing block 19 is fixedly connected to the front side of the collection box 13, a sliding groove 20 is opened inside the fixing block 19, a telescopic rod 21 is provided inside the sliding groove 20, a spring 22 is sleeved on the outside of the telescopic rod 21, a push block 23 is fixedly connected to the lower end of the telescopic rod 21, a locking rod 24 is fixedly connected to the lower end of the push block 23, and the push block 23 slides inside the sliding groove 20 through the telescopic rod 21 and the spring 22.

[0026] Specifically, pushing the push block 23 compresses the telescopic rod 21 and the spring 22. During this process, the locking rod 24 slides out from the inside of the locking hole 18. Then, pulling the pull plate 17 to one side causes the collection box 16 to slide out from the inside of the collection box 13. At this time, the staff can clean the impurities inside. Similarly, during installation, the collection box 16 is slid into the inside of the collection box 13. When the locking hole 18 reaches the position of the locking rod 24, the spring 22 rebounds, causing the telescopic rod 21 to push the push block 23 to move in the opposite direction. The locking rod 24 re-enters the locking hole 18, thus limiting the collection box 16, which can then be used normally. The components such as the push block 23, telescopic rod 21, spring 22, and locking rod 24 can quickly load and unload the collection box 16, thereby enabling timely cleaning of the impurities inside and reducing the difficulty of cleaning.

[0027] Working Principle: When using this wafer oxide film edge removal equipment, the wafer to be removed is first placed between two sets of fixed disks 11 and securely fixed with fixing bolts 12. After fixing, the first motor 3 is turned on, driving the lead screw 4 to rotate. Under the action of the threaded hole 8 inside the moving block 7, the fixed disk 11 moves the wafer downwards. At this time, the third motor 14 is turned on, driving the grinding wheel 15 to rotate, thereby grinding the wafer. Simultaneously, the second motor 10 can drive the fixed disk 11 to rotate, changing the orientation of the wafer and achieving multi-angle grinding. During the movement of the moving block 7, the guide block 6 slides inside the guide groove 5. The cooperation of the guide block 6 and the guide groove 5 improves the stability of the moving block 7 during movement. Through the components such as the first motor 3, second motor 10, third motor 14, fixed disk 11, moving block 7, and fixed disk 11, the removal of the wafer oxide film can be achieved without manual operation, greatly reducing labor costs. The removal of oxide film and other impurities reduces the workload of the staff. The removed oxide film and other impurities fall into the collection box 16 inside the collection box 13. When the collection box 16 needs to be cleaned, push the push block 23. The push block 23 compresses the telescopic rod 21 and the spring 22. During this process, the locking rod 24 slides out from the inside of the locking hole 18. Then, pull the pull plate 17 to one side. The pull plate 17 drives the collection box 16 to slide out from the inside of the collection box 13. At this time, the staff can clean the impurities inside. Similarly, during installation, the collection box 16 is slid into the inside of the collection box 13. When the locking hole 18 reaches the position of the locking rod 24, the spring 22 rebounds, causing the telescopic rod 21 to push the push block 23 to move in the opposite direction. The locking rod 24 re-enters the locking hole 18, thereby limiting the collection box 16 and enabling normal use. The push block 23, telescopic rod 21, spring 22, locking rod 24 and other components can quickly load and unload the collection box 16, thereby enabling timely cleaning of the impurities inside and reducing the difficulty of cleaning.

[0028] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A wafer oxide film edge removal device, comprising a processing table (1), characterized in that: An adjustment frame (2) is fixedly connected to the upper end of the processing table (1). A first motor (3) is provided on one side of the adjustment frame (2). A lead screw (4) is provided at the output end of the first motor (3). A guide groove (5) is provided on the front side of the adjustment frame (2). A guide block (6) is slidably connected inside the guide groove (5). A moving block (7) is fixedly connected to the rear side of the guide block (6). A threaded hole (8) is provided inside the moving block (7). A connecting block (9) is fixedly connected to the right side of the moving block (7). A second motor (10) is provided inside the connecting block (9). A fixed plate (11) is provided at the output end of the second motor (10). A fixing bolt (12) is provided inside the fixed plate (11). A collection box (13) is fixedly connected to the upper middle part of the processing table (1). A third motor (14) is provided on the left side of the collection box (13), and a grinding wheel (15) is provided at the output end of the third motor (14).

2. The wafer oxide film edge removal device according to claim 1, characterized in that: The collection box (13) is movably connected to the inside of the collection box (16), and a pull plate (17) is fixedly connected to the front side of the collection box (16). The pull plate (17) has a card hole (18) inside, and a fixing block (19) is fixedly connected to the front side of the collection box (13).

3. The wafer oxide film edge removal device according to claim 2, characterized in that: The fixed block (19) has a sliding groove (20) inside, and a telescopic rod (21) is provided inside the sliding groove (20). A spring (22) is sleeved on the outside of the telescopic rod (21). A push block (23) is fixedly connected to the lower end of the telescopic rod (21), and a locking rod (24) is fixedly connected to the lower end of the push block (23).

4. The wafer oxide film edge removal device according to claim 1, characterized in that: The internal thread of the moving block (7) is adapted to the external thread of the lead screw (4).

5. The wafer oxide film edge removal device according to claim 1, characterized in that: The number of fixed disks (11) is two sets, and they are symmetrically arranged about the center line of the processing table (1).

6. The wafer oxide film edge removal device according to claim 3, characterized in that: The pusher (23) slides inside the groove (20) via the telescopic rod (21) and the spring (22).

Images