Submicron electric probe station

Abstract

The utility model discloses a submicron electric probe station. The submicron electric probe station comprises a mounting seat, an adjusting assembly, a chuck, a probe assembly and a visual inspection assembly, the adjusting assembly is fixed on the mounting seat, the chuck is fixed on the adjusting assembly, the chuck is used for placing a to-be-tested wafer, and the adjusting assembly is used for adjusting the positions of the chuck and the to-be-tested wafer; the probe assembly is fixed on the mounting seat, and the probe assembly is correspondingly arranged above the chuck; the visual detection assembly is fixed at the upper end of the mounting seat, the visual detection assembly and the probe assembly are correspondingly arranged, and the visual detection assembly can penetrate through the probe assembly to detect the to-be-detected wafer on the chuck. According to the utility model, visual positioning and visual detection are carried out on the to-be-detected wafer through the visual detection assembly, and the position of the to-be-detected wafer is adjusted through the adjusting assembly according to the relative displacement determined by the visual detection assembly, so that the positioning precision of the probe station is improved, and the probe assembly can accurately carry out needle insertion on the to-be-detected wafer; and detection of small-size devices is satisfied.

Description

Technical Field

[0001] This utility model relates to the field of probe station technology, and in particular to a submicron motorized probe station. Background Technology

[0002] Due to the rapid growth of the IC industry, wafer testing is playing an increasingly important role in the IC packaging and testing (semiconductor packaging and testing) industry. During the wafer production stage, probe stations are used to perform electrical testing. Probe stations are mainly used in the semiconductor, optoelectronic, integrated circuit, and packaging testing industries. They are widely used in the research and development of precision electrical measurements for complex, high-speed devices, aiming to ensure quality and reliability while reducing R&D time and device manufacturing process costs.

[0003] As the size of devices on wafers under test becomes smaller and smaller, the range that PADs (bonding pads) on the wafers can detect also becomes smaller and smaller. When probe stations perform probe testing on small wafers, it is difficult to insert probes, and the positioning accuracy of the probe station is not high, which can easily affect the accuracy of the test.

[0004] In the process of developing this utility model, the applicant discovered at least the following problems in the prior art:

[0005] Existing probe stations are not well-suited for testing small-sized devices. Utility Model Content

[0006] The purpose of this invention is to provide a submicron motorized probe stage to solve the technical problem that existing probe stages cannot effectively detect small-sized devices. The preferred technical solutions provided by this invention and their various technical effects are detailed below.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] This utility model provides a submicron motorized probe station, including a mounting base, an adjustment component, a chuck, a probe component, and a vision inspection component. The adjustment component is fixed on the mounting base, and the chuck is fixed on the adjustment component. The chuck is used to place the wafer to be tested, and the adjustment component is used to adjust the position of the chuck and the wafer to be tested. The probe component is fixed on the mounting base and is correspondingly disposed above the chuck. The vision inspection component is fixed at the upper end of the mounting base and is correspondingly disposed with the probe component. The vision inspection component can pass through the probe component to inspect the wafer to be tested on the chuck.

[0009] Optionally, the adjustment assembly includes an XY displacement platform and a Z displacement platform. The XY displacement platform is fixed on the mounting base, and the Z displacement platform is fixedly connected to the XY displacement platform. The XY displacement platform is used to control the Z displacement platform and the chuck to move in the X and Y directions, and the Z displacement platform is used to control the chuck to move in the Z direction.

[0010] Optionally, the probe assembly includes a fixing member, a probe holder, and a test probe. A first end of the fixing member is fixed to the mounting base, and a second end of the fixing member extends above the chuck. The probe holder is fixed to the second end of the fixing member, and the test probe is mounted on the probe holder. The probe holder is capable of adjusting the position of the test probe.

[0011] Optionally, the second end of the fixing member is provided with a through hole structure, the probe seat has a bearing structure, the probe seat and the through hole structure are matched with each other, the outer ring of the probe seat is fixed on the through hole structure, and a clamping member is fixed on the inner ring of the probe seat, the clamping member is used to fix the test probe.

[0012] Optionally, the number of test probes is two, and the two test probes are symmetrically arranged on the probe holder by means of the clamping member.

[0013] Optionally, the visual inspection component includes a lens, a lens barrel, a camera, and an analyzer. The analyzer is fixed to the upper end of the mounting base. The lens, camera, and analyzer are all fixedly connected to the lens barrel, and the lens is located above the test probe. The light information acquired by the lens can be transmitted to the camera and the analyzer through the lens barrel. The camera is used for visual positioning, and the analyzer is used to analyze the light information acquired by the lens.

[0014] Optionally, the visual inspection component further includes a beam splitter. The lens barrel has a three-way structure. The first port of the lens barrel is fixedly connected to the analyzer, the second port of the lens barrel is fixedly connected to the lens, and the third port of the lens barrel is fixedly connected to the camera. The beam splitter is located at the turning position of the lens barrel and is used to transmit the light information acquired by the lens to the third port and the first port.

[0015] Optionally, the lens is a microscope lens.

[0016] Optionally, the wafer under test has multiple arrayed devices under test, each device under test having two bonding pads. When the test probe is inserted into the punctureable area of ​​the bonding pad, the probe station can detect the punctured device under test, and the vision inspection component can simultaneously acquire the light information of the punctured device under test and the light information of the device under test centered on the punctured device under test and within the shooting range of the vision inspection component.

[0017] Implementing one of the above-described technical solutions of this utility model has the following advantages or beneficial effects:

[0018] This invention uses a vision inspection component to perform visual positioning and inspection of the wafer under test, and adjusts the position of the wafer under test by an adjustment component according to the relative displacement determined by the vision inspection component, thereby improving the positioning accuracy of the probe station. This allows the probe component to accurately insert probes into the wafer under test, enabling the testing of small-sized devices. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0020] Figure 1 This is a first perspective view of an embodiment of the present utility model;

[0021] Figure 2 This is a second perspective view of an embodiment of the present utility model;

[0022] Figure 3 This is a cross-sectional view of the visual inspection component according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the probe assembly structure according to an embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the wafer structure to be tested according to an embodiment of this utility model;

[0025] Figure 6 yes Figure 5 Enlarged view of section A.

[0026] In the diagram: 1. Mounting base; 2. Adjustment assembly; 21. XY displacement platform; 22. Z displacement platform; 3. Chuck; 4. Probe assembly; 41. Fixture; 42. Probe holder; 43. Test probe; 44. Clamping component; 5. Vision inspection assembly; 51. Lens; 52. Lens barrel; 53. Camera; 54. Analyzer; 55. Beam splitter; 6. Wafer under test; 61. Device under test; 62. Bonding block. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, various exemplary embodiments described below will be referenced to the accompanying drawings, which form part of the exemplary embodiments, illustrating various exemplary embodiments that may be adopted to implement this utility model. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. It should be understood that they are merely examples of processes, methods, and apparatuses consistent with some aspects of this utility model disclosed as detailed in the appended claims, and other embodiments may be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and spirit of this utility model.

[0028] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the referred element must have a specific orientation, or be constructed and operated in a specific orientation. The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. The term "multiple" means two or more. The terms "connected" and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, communication connections, direct connections, indirect connections through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more of the related listed items. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0029] To illustrate the technical solution described in this utility model, specific embodiments are described below, showing only the parts related to the embodiments of this utility model.

[0030] Example 1:

[0031] like Figure 1 and Figure 2As shown, this utility model provides a submicron electric probe station, including a mounting base 1, an adjustment component 2, a chuck 3, a probe component 4, and a vision inspection component 5. The adjustment component 2 is fixed on the mounting base 1, and the chuck 3 is fixed on the adjustment component 2. The chuck 3 is used to place the wafer 6 to be tested. The adjustment component 2 is used to adjust the position of the chuck 3 and the wafer 6 to be tested. The probe component 4 is fixed on the mounting base 1 and is correspondingly positioned above the chuck 3. The vision inspection component 5 is fixed at the upper end of the mounting base 1 and is correspondingly positioned with the probe component 4. The vision inspection component 5 can pass through the probe component 4 to inspect the wafer 6 to be tested on the chuck 3. Specifically, the vision inspection component 5 passes through the middle area of ​​the probe component 4 and takes a picture of the wafer 6 under the probe component 4, determining the corresponding position of the test probe 43 of the probe component 4 and the wafer 6 under test, as well as the center position of the bonding pad 62 (described below) of a device under test 61 on the wafer 6 under test. This determines the relative displacement of the adjustment component 2. The adjustment component 2 adjusts the position of the chuck 3 and the wafer 6 under test fixed on the chuck 3 according to the relative displacement determined by the vision inspection component 5, so that the pin-piercing area of ​​the bonding pad 62 corresponds to the probe component 4, thereby achieving the positioning of the wafer 6 under test. Then, the adjustment component 2 adjusts the position between the wafer 6 under test and the probe component 4, enabling the probe component 4 to perform probe detection on the corresponding device under test 61. The vision inspection component 5 then performs visual inspection on the device under test 61 and the devices under test 61 centered on the device under test 61 within the shooting range of the vision inspection component 5.

[0032] This invention uses a vision inspection component 5 to perform visual positioning and visual inspection of the wafer 6 under test, and adjusts the position of the wafer 6 under test by the adjustment component 2 according to the relative displacement determined by the vision inspection component 5, thereby improving the positioning accuracy of the probe station so that the probe component 4 can accurately insert the probes into the wafer 6 under test, which can meet the requirements for testing small-sized devices.

[0033] As an optional implementation method, such as Figure 1As shown, the adjustment component 2 includes an XY displacement platform 21 and a Z displacement platform 22. The XY displacement platform 21 is fixed on the mounting base 1, and the Z displacement platform 22 is fixedly connected to the XY displacement platform 21. The XY displacement platform 21 is used to control the Z displacement platform 22 and the chuck 3 to move in the X and Y directions, and the Z displacement platform 22 is used to control the chuck 3 to move in the Z direction. Specifically, the Z direction is perpendicular to the plane where the wafer 6 under test is located. The XY displacement platform 21 has a repeatability of ±1µm. The XY displacement platform 21 can drive the Z displacement platform 22 and the chuck 3 to move in the X and Y directions, thereby moving the pin-piercing area of ​​the next test bonding pad 62 on the wafer 6 under test on the chuck 3 to the corresponding position of the test probe 43 of the probe assembly 4, completing the wafer positioning. Then, the XY displacement platform 21 keeps the X and Y directions stationary, and the Z displacement platform 22 moves along the Z direction closer to the test probe 43, so that the test probe 43 is inserted into the corresponding pin-piercing area of ​​the bonding pad 62, so that the probe station can detect the pinned device 61. After the current device under test (DUT) 61 has been tested, when the next DUT 61 needs to be tested, the XY displacement platform 21 remains stationary in the X and Y directions, while the Z displacement platform 22 moves away from the test probe 43 along the Z direction, causing the test probe 43 to disengage from the punctureable area of ​​the corresponding bonding pad 62. Then, the Z displacement platform 22 remains stationary, and the XY displacement platform 21 moves in the X and Y directions according to the relative displacement obtained by the vision inspection component 5, so that the punctureable area of ​​the bonding pad 62 of the next DUT 61 corresponds to the test probe 43, completing the positioning of the next DUT 61. Afterward, the XY displacement platform 21 remains stationary in the X and Y directions, while the Z displacement platform 22 moves closer to the test probe 43 along the Z direction, causing the test probe 43 to penetrate the punctureable area of ​​the corresponding bonding pad 62, so that the probe station can test the punctured DUT 61. The probe station repeats the above steps to complete the testing of each DUT 61 on the wafer 6 under test. When detecting the next device under test (DUT) 61, the next DUT 61 is the adjacent DUT 61 to the previously detected DUT 61, or other DUT 61 centered on the previously detected DUT 61 and within the field of view of the visual inspection component 5 (e.g., ...). Figure 6 As shown, the next device under test (DUT) 61 can be spaced apart from the previous DUT 61 that has completed testing, such as by one DUT 61, two DUT 61, etc. The positions of two adjacent DUTs 61 that need to be tested can be set according to requirements.

[0034] As an optional implementation method, such as Figure 4As shown, the probe assembly 4 includes a fixing member 41, a probe holder 42, and a test probe 43. The first end of the fixing member 41 is fixed to the mounting base 1, and the second end of the fixing member 41 extends above the chuck 3. The probe holder 42 is fixed to the second end of the fixing member 41, and the test probe 43 is mounted on the probe holder 42. The probe holder 42 can adjust the position of the test probe 43. Specifically, the probe holder 42 and the test probe 43 are fixed to the mounting base 1 by the fixing member 41 to ensure the stability of the probe assembly 4. The probe holder 42 and the test probe 43 are positioned above the chuck 3, facilitating contact between the test probe 43 and the wafer 6 to be tested on the chuck 3. The probe holder 42 has adjustable X, Y, and Z direction capabilities, enabling it to control the test probe 43 for precise needle insertion. In this invention, the probe holder 42 can be configured as a structure similar to a three-dimensional manual adjustment stage, where the position of the probe holder 42 on the fixing member 41 can be changed by adjusting screws, thus achieving adjustable X, Y, and Z direction capabilities for the probe holder 42. Alternatively, the position of the fixing member 41 on the mounting base 1 can be adjusted to adjust the position of the probe holder 42 in the X and Y directions. Furthermore, by utilizing the bearing structure of the probe holder 42, its position in the Z direction can be adjusted. The probe holder 42 drives the test probe 43 to rotate around the Z-axis, avoiding the side of the bonding pad 62 of the device under test 61, allowing the test probe 43 to be inserted into the puncture-accessible area of ​​the bonding pad 62 at a 45° angle.

[0035] As an optional implementation method, such as Figure 4 As shown, the second end of the fixing member 41 has a through-hole structure, and the probe seat 42 has a bearing structure. The probe seat 42 matches the through-hole structure, and the outer ring of the probe seat 42 is fixed on the through-hole structure. The inner ring of the probe seat 42 has a clamping member 44 fixed on it, which is used to fix the test probe 43. Specifically, the through-hole structure corresponds to the lens 51 of the vision inspection component 5. The through-hole structure is preferably circular and matches the probe seat 42. The probe seat 42 is fixed inside the through-hole structure. The probe seat 42 has a bearing structure, and the clamping member 44 fixed on the inner ring of the probe seat 42 can rotate around the Z-axis through the working principle of the bearing structure, thereby adjusting the insertion direction of the test probe 43.

[0036] As an optional implementation method, such as Figure 4 As shown, there are two test probes 43, which are symmetrically arranged on the probe holder 42 via clamping members 44. Specifically, the number of test probes 43 can be selected as two, and the two test probes 43 cooperate with each other to complete the testing of one device under test 61. The number of test probes 43 can be adaptively set according to actual needs, and the number of test probes 43 is preferably 1-5.

[0037] As an optional implementation method, such as Figure 3As shown, the visual inspection component 5 includes a lens 51, a lens barrel 52, a camera 53, and an analyzer 54. The analyzer 54 is fixed to the upper end of the mounting base 1. The lens 51, camera 53, and analyzer 54 are all fixedly connected to the lens barrel 52, and the lens 51 is located above the test probe 43. The light information acquired by the lens 51 can be transmitted to the camera 53 and analyzer 54 through the lens barrel 52. The camera 53 is used for visual positioning, and the analyzer 54 is used to analyze the light information acquired by the lens 51. Specifically, the analyzer 54 is fixed to the upper end of the mounting base 1 and is fixedly connected to the lens 51 and camera 53 through the lens barrel 52 to ensure the stability of the visual inspection component 5. The lens 51 is located above the test probe 43 and can acquire the light information of the test probe 43 and the wafer 6 under test below the test probe 43, and transmit the light information to the camera 53 and analyzer 54 through the lens barrel 52. When the test probe 43 of the probe assembly 4 penetrates the bonding pad 62 of a device under test (DUT) 61, the camera 53 simultaneously captures images of the bonding pads 62 surrounding the DUT 61 being probed. Through image analysis, the center position of the next bonding pad 62 to be tested is determined, thereby determining the relative displacement of the adjustment assembly 2 for the next movement. This allows the adjustment assembly 2 to move according to the relative displacement acquired by the camera 53, adjusting the position of the wafer under test 6 so that the next adjacent bonding pad 62 to be tested is positioned with the test probe 43, ensuring that the test probe 43 can accurately penetrate the next adjacent bonding pad 62. The analyzer 54 is an instrument similar to a spectrometer or colorimeter, capable of detecting the wafer under test 6 based on the acquired light information.

[0038] As an optional implementation method, such as Figure 3 As shown, the visual inspection component 5 also includes a beam splitter 55. The lens barrel 52 has a three-way structure. The first port of the lens barrel 52 is fixedly connected to the analyzer 54, the second port of the lens barrel 52 is fixedly connected to the lens 51, and the third port of the lens barrel 52 is fixedly connected to the camera 53. The beam splitter 55 is set at the turning position of the lens barrel 52 and is used to transmit the light information acquired by the lens 51 to the third port and the first port. Specifically, the lens barrel 52 has a three-way structure and includes a main barrel and a secondary barrel. The secondary barrel is perpendicular to the main barrel and fixedly connected. The lens barrel 52 has an integral structure. The first port and the second port of the lens barrel 52 are arranged opposite to each other. The main barrel containing the first port and the second port is perpendicular to the plane where the wafer 6 under test is located, so that the lens 51 fixed at the second port is located above the wafer 6 under test and the test probe 43, which facilitates the lens 51 to acquire the light information of the wafer 6 under test. Inside the lens barrel 52, at the position where the split tube and the main tube are connected, a beam splitter 55 is fixed so that when the light information acquired by the lens 51 is transmitted upward to the analyzer 54 on the first port, it can be transmitted to the camera 53 on the third port through the beam splitter 55.

[0039] As an optional implementation, lens 51 is a microscope lens 51. Specifically, lens 51 is preferably a 20x microscope lens 51.

[0040] As an optional implementation method, such as Figure 5 and Figure 6 As shown, the wafer under test 6 has multiple arrayed devices under test 61, each device under test 61 having two bonding pads 62. When the test probe 43 penetrates the punctureable area of ​​the bonding pad 62, the probe station can detect the punctured device under test 61, and the vision inspection component 5 can simultaneously acquire the light information of the punctured device under test 61 and the light information of the devices under test 61 centered on the punctured device under test 61 and within the imaging range of the vision inspection component 5. Specifically, the wafer under test 6 has multiple arrayed devices under test 61, and the probe station can detect multiple arrayed devices under test 61 sequentially. When the probe station detects the device under test 61, the test probe 43 can penetrate the corresponding punctureable area of ​​the bonding pad 62, avoiding deviation from the puncture area and ensuring that the test probe 43 will not damage the device. Figure 6 Images are captured for the visual inspection component 5.

[0041] The embodiment is merely a special case and does not indicate that this utility model is implemented in such a way.

[0042] The above description is merely a preferred embodiment of the present utility model. Those skilled in the art will understand that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present utility model. Furthermore, under the teachings of the present utility model, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of the present utility model. Therefore, the present utility model is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of the present utility model.

Claims

1. A submicron motorized probe stage, characterized in that, The device includes a mounting base (1), an adjustment component (2), a chuck (3), a probe component (4), and a vision inspection component (5). The adjustment component (2) is fixed on the mounting base (1), and the chuck (3) is fixed on the adjustment component (2). The chuck (3) is used to place the wafer to be tested (6), and the adjustment component (2) is used to adjust the position of the chuck (3) and the wafer to be tested (6). The probe component (4) is fixed on the mounting base (1) and is correspondingly arranged above the chuck (3). The vision inspection component (5) is fixed at the upper end of the mounting base (1) and is correspondingly arranged with the probe component (4). The vision inspection component (5) can pass through the probe component (4) to inspect the wafer to be tested (6) on the chuck (3).

2. The submicron motorized probe stage according to claim 1, characterized in that, The adjustment component (2) includes an XY displacement platform (21) and a Z displacement platform (22). The XY displacement platform (21) is fixed on the mounting base (1), and the Z displacement platform (22) is fixedly connected to the XY displacement platform (21). The XY displacement platform (21) is used to control the Z displacement platform (22) and the chuck (3) to move in the X and Y directions, and the Z displacement platform (22) is used to control the chuck (3) to move in the Z direction.

3. The submicron motorized probe stage according to claim 1, characterized in that, The probe assembly (4) includes a fixing member (41), a probe holder (42), and a test probe (43). The first end of the fixing member (41) is fixed to the mounting base (1), and the second end of the fixing member (41) extends above the chuck (3). The probe holder (42) is fixed to the second end of the fixing member (41), and the test probe (43) is mounted on the probe holder (42). The probe holder (42) is capable of adjusting the position of the test probe (43).

4. The submicron motorized probe stage according to claim 3, characterized in that, The second end of the fixing member (41) is provided with a through hole structure. The structure of the probe seat (42) is a bearing structure. The probe seat (42) matches the through hole structure. The outer ring of the probe seat (42) is fixed on the through hole structure. A clamping member (44) is fixed on the inner ring of the probe seat (42). The clamping member (44) is used to fix the test probe (43).

5. The submicron motorized probe stage according to claim 4, characterized in that, The number of test probes (43) is two, and the two test probes (43) are symmetrically arranged on the probe holder (42) by the clamping member (44).

6. The submicron motorized probe stage according to claim 3, characterized in that, The visual inspection component (5) includes a lens (51), a lens barrel (52), a camera (53), and an analyzer (54). The analyzer (54) is fixed to the upper end of the mounting base (1). The lens (51), camera (53), and analyzer (54) are all fixedly connected to the lens barrel (52). The lens (51) is located above the test probe (43). The light information acquired by the lens (51) can be transmitted to the camera (53) and the analyzer (54) through the lens barrel (52). The camera (53) is used for visual positioning, and the analyzer (54) is used to analyze the light information acquired by the lens (51).

7. The submicron motorized probe stage according to claim 6, characterized in that, The visual inspection component (5) further includes a beam splitter (55). The lens barrel (52) has a three-way structure. The first port of the lens barrel (52) is fixedly connected to the analyzer (54), the second port of the lens barrel (52) is fixedly connected to the lens (51), and the third port of the lens barrel (52) is fixedly connected to the camera (53). The beam splitter (55) is set at the turning position of the lens barrel (52). The beam splitter (55) is used to transmit the light information acquired by the lens (51) to the third port and the first port.

8. The submicron motorized probe stage according to claim 6, characterized in that, The lens (51) is a microscope lens (51).

9. The submicron motorized probe stage according to claim 3, characterized in that, The wafer under test (6) has multiple arrayed devices under test (61), each device under test (61) has two bonding pads (62). When the test probe (43) is inserted into the punctureable area of ​​the bonding pad (62), the probe station can detect the punctured device under test (61), and the vision detection component (5) can simultaneously acquire the light information of the punctured device under test (61) and the light information of the device under test (61) centered on the punctured device under test (61) and within the shooting range of the vision detection component (5).

Images