Power device, inverter device and electronic equipment

Abstract

The utility model is suitable for the technical field of inverters, and provides a power device, an inverter device and electronic equipment. The power device comprises a heat dissipation substrate; the IGBT module is arranged on the heat dissipation substrate; the PCB is arranged on the side, opposite to the heat dissipation substrate, of the IGBT module, the PCB is provided with a groove, the IGBT module is provided with a pin, the position of the groove corresponds to the position of the pin, and the pin penetrates through the groove; the flexible connecting plate is arranged on one side, opposite to the IGBT module, of the PCB, and the flexible connecting plate is electrically connected with the IGBT module and the PCB; wherein the flexible connecting plate is respectively welded with the PCB and the IGBT module, so that the IGBT module is electrically connected with the PCB. According to the utility model, mutual stress between the IGBT module and the PCB can be absorbed through the flexible connecting plate, so that flexible connection between the PCB and the IGBT module can be realized, reduction of mechanical stress caused by thermal expansion and cold contraction or vibration is facilitated, and the effect of improving the reliability of electrical connection between the PCB and the IGBT module is achieved.

Description

Technical Field

[0001] This utility model belongs to the field of inverter technology, and in particular relates to a power device, inverter device and electronic equipment. Background Technology

[0002] An inverter is a power electronic device that converts direct current (DC) into alternating current (AC). Its main function is to convert electrical energy from DC sources (such as solar panels, batteries, etc.) into AC power that can be used by household appliances or the power grid. Inverters are used in many fields, especially in solar power systems, uninterruptible power supplies (UPS), and electric vehicles.

[0003] In existing technologies, when establishing electrical connections between the IGBT pins in the inverter power module and the PCB board, a hard solder connection is typically used between the IGBT pins and the PCB board vias. However, due to the difference in thermal expansion coefficients between the IGBT module and the PCB, pressure occurs between the PCB and the IGBT pins, and the solder connecting the PCB and IGBT pins is pulled, easily leading to poor electrical connections between the PCB and the IGBT. Utility Model Content

[0004] This invention provides a power device, an inverter device, and an electronic device, aiming to solve the problem of poor electrical connection between the PCB and IGBT in the power module of the inverter in the prior art.

[0005] This utility model embodiment is implemented as follows: the power device includes a heat dissipation substrate; an IGBT module disposed on the heat dissipation substrate; a PCB board disposed on the side of the IGBT module facing away from the heat dissipation substrate, the PCB board having a slot, the IGBT module having pins, the position of the slot corresponding to the position of the pins, the pins passing through the slot; and a flexible connecting plate disposed on the side of the PCB board facing away from the IGBT module, the flexible connecting plate electrically connecting the IGBT module and the PCB board; wherein, the flexible connecting plate is soldered to both the PCB board and the IGBT module to achieve the electrical connection between the IGBT module and the PCB board.

[0006] Furthermore, the flexible connection board includes pads and through holes spaced apart from the pads, the pads being soldered to the PCB board and the through holes being soldered to the pins.

[0007] Furthermore, the stiffness of the flexible connecting plate is between 60 Shore A and 90 Shore A.

[0008] Furthermore, a cushioning material is provided in the slot, and the cushioning material is arranged around the pin.

[0009] Furthermore, the PCB board is provided with solder joints, and the solder pads are soldered to the solder joints.

[0010] Furthermore, the PCB board is a flexible PCB board.

[0011] Furthermore, the flexible connecting plate and the solder pad are integrally formed, or the flexible connecting plate and the solder pad can be separately configured.

[0012] Furthermore, the flexible connecting plate is a flexible FPC board, and the pins are flexible cables.

[0013] Furthermore, the pin passes through the through-hole, with a portion of the pin protruding from the through-hole.

[0014] This utility model embodiment also provides an inverter device, which includes the power devices as described above.

[0015] This utility model embodiment also provides an electronic device, which includes the inverter device as described above.

[0016] In this embodiment of the invention, a flexible connecting plate is welded to both the PCB board and the IGBT module, thereby achieving an electrical connection between them. The flexible connecting plate can also absorb the stress between the IGBT module and the PCB board, thus enabling a soft connection between them and avoiding a rigid connection between their pins. This helps reduce mechanical stress caused by thermal expansion and contraction or vibration, thereby improving the reliability of the electrical connection between the PCB board and the IGBT module. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the module structure of the electronic device provided in this embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of the module structure of the inverter device provided in this embodiment of the utility model;

[0019] Figure 3 This is a schematic diagram of the power device provided in an embodiment of the present invention;

[0020] Figure 4 yes Figure 3 A side view of the power device described herein;

[0021] Figure 5 yes Figure 3 A partially enlarged schematic diagram of point A in the power device described herein;

[0022] Figure 6 yes Figure 3 A schematic diagram of the PCB board structure in the power device described herein;

[0023] Figure 7 yes Figure 3 A schematic diagram of the flexible connecting plate in the power device described herein.

[0024] Explanation of key component symbols: 1000, electronic equipment; 1001, inverter device; 100, power device; 10, heat dissipation substrate; 20, PCB board; 30, IGBT module; 40, flexible connection board; 21, slot; 22, solder joint; 31, pin; 41, pad; 42, through hole. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0026] Please see Figure 1 The electronic device 1000 in this embodiment of the present invention may include the inverter device 1001. Specifically, the electronic device 1000 may be a power electronic device 1000, a household appliance, a renewable energy device, a power management device, an industrial device, a smart grid device, or other electronic devices. The electronic device 1000 includes an inverter device 1001 for power conversion.

[0027] Please see Figure 2 The inverter device 1001 in this embodiment of the present invention may include the power device 100 in this embodiment of the present invention. The power device 100 is a key component in the inverter device 1001 used to realize the conversion of DC to AC power.

[0028] To address the issue of poor contact that can easily occur in the existing technology where the IGBT pins in the inverter power module are electrically connected to the PCB via solder hard connection.

[0029] Please refer to the following: Figures 3 to 7The power device 100 of this embodiment includes a heat dissipation substrate 10, an IGBT module 30, a PCB board 20, and a flexible connection plate 40. The IGBT module 30 is disposed on the heat dissipation substrate 10. The PCB board 20 is disposed on the side of the IGBT module 30 facing away from the heat dissipation substrate 10. The PCB board 20 has a slot 21, and the IGBT module 30 has pins 31. The position of the slot 21 corresponds to the position of the pins 31, and the pins 31 pass through the slot 21. The flexible connection plate 40 is disposed on the side of the PCB board 20 facing away from the IGBT module 30, and the flexible connection plate 40 electrically connects the IGBT module 30 and the PCB board 20. The flexible connection plate 40 is soldered to both the PCB board 20 and the IGBT module 30 to achieve electrical connection between the IGBT module 30 and the PCB board 20.

[0030] Thus, in this embodiment of the invention, the flexible connecting plate 40 is welded to the PCB board 20 and the IGBT module 30 respectively, thereby achieving an electrical connection between the PCB board 20 and the IGBT module 30. Furthermore, the flexible connecting plate 40 can absorb the mutual stress between the IGBT module 30 and the PCB board 20, thereby achieving a soft connection between the PCB board 20 and the IGBT module 30. This avoids a hard connection (i.e., a rigid connection) between the pins 31 of the PCB board 20 and the IGBT module 30, which helps to reduce mechanical stress caused by thermal expansion and contraction or vibration, thereby improving the reliability of the electrical connection between the PCB board 20 and the IGBT module 30.

[0031] Furthermore, the PCB board 20 and the pins 31 of the IGBT module 30 are electrically connected via a flexible connecting plate 40. This flexible connecting plate 40 provides better flexibility, avoids stress and damage caused by rigid connections, and improves the overall reliability of the power device 100. Moreover, the flexible connecting plate 40 can absorb displacement caused by mechanical vibration and thermal expansion, avoiding stress concentration problems caused by rigid connections. Especially in high-power applications, this flexible connection contributes to the reliability and stability of the power device 100.

[0032] In addition, compared to the connection between the PCB board 20 and the IGBT module 30 via a flexible cable, the flexible connection plate 40 can also provide some protection for the pins 31 of the IGBT module 30 and the PCB board 20, thereby improving the overall mechanical stability of the power device 100.

[0033] Specifically, the power device 100 includes a heat dissipation substrate 10, which is the bottom layer of the entire structure. Multiple power-generating elements can be disposed on the heat dissipation substrate 10, which is responsible for providing heat dissipation support for the multiple power-generating elements. Optionally, the heat dissipation substrate 10 can be made of a material with high thermal conductivity, such as copper or aluminum, to effectively dissipate the heat generated by the power-generating elements.

[0034] Please refer to the following: Figures 3 to 7 A number of IGBT modules 30 are disposed on the heat dissipation substrate 10. The number of IGBT modules 30 can be one or more. The heat dissipation substrate 10 can dissipate the heat generated when the IGBT modules 30 do work. The IGBT modules 30 are the work elements disposed on the heat dissipation substrate 10.

[0035] The PCB board 20 is stacked on the IGBT module 30. In other words, the IGBT module 30 is located between the heat dissipation substrate 10 and the PCB board 20. In this utility model, one PCB board 20 is stacked on multiple IGBT modules 30. The way to establish an electrical connection between the PCB board 20 and each IGBT module 30 is specifically through a flexible connecting plate 40.

[0036] Each PCB board 20 has multiple slots 21, and each IGBT module 30 has multiple pins 31. The slots 21 of the PCB board 20 are correspondingly arranged with the pins 31 of the IGBT module 30, and the pins 31 of the IGBT module 30 pass through the slots 21 and are located within the accommodating space formed by the slots 21. Multiple pins 31 of adjacent IGBT modules 30 can pass through a single slot 21; this is not limited here.

[0037] Please refer to the following: Figures 3 to 7 Specifically, regarding the method of setting up the flexible connection board 40, firstly, the PCB board 20 is stacked on multiple IGBT modules 30. Then, slots 21 are made in the PCB board 20, and the positions of the slots 21 correspond to the positions of each pin 31 in the IGBT module 30. That is, each pin 31 of the IGBT module 30 is located in the slot 21, which is different from the traditional method of connecting IGBTs and PCB board 20 by soldering. In this utility model, multiple flexible connection boards 40 are provided. For each flexible connection board 40, the first side of the flexible connection board 40 is electrically connected to the PCB board 20, and the second side of the flexible connection board 40 is electrically connected to some pins 31 of the IGBT module 30. In this way, the electrical connection of the PCB board and the IGBT module 30 can be realized.

[0038] Of course, the first side of the flexible connection plate 40 can be electrically connected to the PCB board 20 by soldering, and the second side of the flexible connection plate 40 can be electrically connected to the PCB board 20 by soldering to the pin 31 of the IGBT module 30.

[0039] Furthermore, to further reduce the hard contact between the PCB board 20 and the IGBT module 30, in one possible implementation, the flexible connection board 40 is specifically a flexible FPC board, and the pins 31 are specifically flexible cables. The PCB board 20 can specifically be a flexible PCB board 20.

[0040] Flexible FPC boards not only possess excellent conductivity and electrical insulation properties but also exhibit high flexibility, enabling them to adapt to various installation spaces and dynamic environments. By mounting the FPC board on the PCB board 20, and combining it with the flexible PCB board 20, the reliability of the electrical connection between the PCB board 20 and the IGBT module 30 can be further improved. Moreover, the design of the flexible FPC board allows for the integration of multiple layers of wires in the circuit, enabling it to support complex electrical connections while providing good vibration resistance.

[0041] Furthermore, by specifically designating pin 31 as a flexible cable, the reliability of the electrical connection between the PCB board 20 and the IGBT module 30 can be further improved.

[0042] Specifically, regarding the connection method of the flexible cable, in one possible implementation, the flexible cable is connected to the IGBT module 30 via a pin or connector. Specifically, one end of the flexible cable can be crimped onto a pin, and the pin and IGBT module 30 can be easily and reliably connected via the pin, suitable for applications requiring frequent disassembly or maintenance, facilitating user replacement of the flexible cable. Alternatively, the flexible cable can be connected to the IGBT module 30 via a connector. The use of a connector provides a more robust and durable contact between the flexible cable and the IGBT module 30, improving the reliability of the connection and suitable for scenarios requiring long-term reliable operation.

[0043] Furthermore, the PCB board 20 can be fixed to the IGBT module 30 with self-tapping screws, avoiding stress concentration and poor contact problems caused by hard connection between the PCB board 20 and the IGBT module 30.

[0044] In one possible implementation, the hardness of the flexible connection plate 40 at room temperature is between 60 Shore A and 90 Shore A. For example, it can be 60 Shore A, 65 Shore A, 70 Shore A, 75 Shore A, 80 Shore A, 85 Shore A, or 90 Shore A. This ensures a flexible connection between the IGBT module 30 and the PCB board 20 while preventing insufficient soldering strength of the flexible connection plate 40, which could lead to poor soldering between the flexible connection plate 40 and the PCB board 20.

[0045] Furthermore, the flexible connection board 40 includes pads 41 and through holes 42 spaced apart from the pads 41. The pads 41 are soldered to the PCB board 20, and the through holes 42 are soldered to the pins 31. Thus, the flexible connection board 40 can be soldered to the PCB board 20 via the pads 41, achieving an electrical connection between the flexible connection board 40 and the PCB board 20. The pads 41 facilitate soldering between the flexible connection board 40 and the PCB board 20, reducing soldering difficulty. Simultaneously, the flexible connection board 40 can be soldered to the pins 31 of the IGBT module 30, achieving an electrical connection between the flexible connection board 40 and the IGBT module 30. The through holes 42 facilitate soldering between the flexible connection board 40 and the IGBT module 30, reducing soldering difficulty.

[0046] Specifically, pin 31 can pass through through hole 42 of flexible connecting plate 40, with a portion of pin 31 protruding from through hole 42. Through hole 42 is specifically soldered to the non-end portion of pin 31. In this way, during subsequent testing, the test tool can still establish an electrical connection with pin 31 with sufficient space.

[0047] Specifically, by soldering the flexible connection plate 40 to the pads 41, the contact area between the flexible connection plate 40 and the PCB board 20 can be increased, thereby reducing the transmission resistance between the flexible connection plate 40 and the PCB board 20, and thus improving the current transmission efficiency between the IGBT module 30 and the PCB board 20.

[0048] Furthermore, the flexible connecting plate 40 and the solder pad 41 are integrally formed, or the flexible connecting plate 40 and the solder pad 41 can be separately set.

[0049] When the flexible connection plate 40 and the pad 41 are integrally formed, they become a single unit. This reduces the number of contact points in the power device 100, improving the stability of the connection between the flexible connection plate 40 and the pad 41. Furthermore, since the flexible connection plate 40 and the pad 41 are integrally formed, meaning they are pre-integrated, their modular design greatly simplifies the installation and assembly process. Engineers no longer need to connect each flexible connection plate 40 and pad 41 individually, saving time, improving cable installation efficiency, and reducing the possibility of human error.

[0050] When the flexible connector 40 and the pad 41 are separately configured, the user can freely adjust the size of the pad 41 according to the actual situation. This improves the flexibility of the flexible connector 40 configuration. For example, when the connection strength between the flexible connector 40 and the PCB board 20 is insufficient, the connection stability between the flexible connector 40 and the PCB board 20 can be improved by adjusting the size of the pad 41. Optionally, the pad 41 can specifically be a surface mount pad 41.

[0051] Furthermore, the PCB board 20 is provided with solder joints 22, and the pads 41 are soldered to the solder joints 22. Specifically, in order to increase the connection stability between the flexible connecting board 40 and the PCB board 20 and prevent cold solder joints, the PCB board 20 is also provided with solder joints 22 corresponding to the pads 41. During soldering, the user can solder the pads 41 to the solder joints 22 to increase the soldering stability and facilitate the positioning of the flexible connecting board 40.

[0052] Furthermore, the PCB board 20 has multiple slots 21 and multiple flexible connecting plates 40, with each slot 21 corresponding to a different flexible connecting plate 40. Specifically, the number of flexible connecting plates 40 can be configured to correspond to the number of slots 21 in the PCB board 20. In other words, one flexible connecting plate 40 corresponds to one slot 21.

[0053] Furthermore, in one possible implementation, for the slot 21, a cushioning material is provided in the slot 21, and the cushioning material is arranged around the pin 31.

[0054] Specifically, in this embodiment of the invention, a buffer material is provided in the slot 21 of the PCB board 20, and the buffer material is specifically arranged around the pins 31 of the IGBT module 30. The buffer material surrounding the pins 31 can provide additional protection for the pins 31 of the IGBT module 30, thereby improving the reliability of the electrical connection between the PCB board 20 and the IGBT module 30. Furthermore, the use of the buffer material can reduce the contact resistance between the pins 31 of the PCB board 20 and the IGBT module 30, ensuring a good electrical connection between the PCB board 20 and the IGBT module 30, thereby improving the reliability of signal transmission.

[0055] Optionally, the cushioning material can be silicone, polyurethane, foam materials (such as polyethylene, polyurethane foam, and ethylene-vinyl acetate copolymer), or rubber materials. Silicone cushioning material is preferred.

[0056] Furthermore, regarding the arrangement of the PCB board 20 stacked on the IGBT module 30, in one possible implementation, the IGBT module 30 is provided with self-tapping screws, and the PCB board 20 is stacked on the IGBT module 30 through the self-tapping screws.

[0057] In this way, the PCB board 20 can be stacked on top of the IGBT module 30 and secured with self-tapping screws, simplifying the assembly process between the PCB board 20 and the IGBT module 30 and providing a stable mechanical connection. The self-tapping screws can be directly screwed into the pre-drilled holes in the IGBT module 30 without the need for additional nuts or washers, thereby improving connection stability and ensuring that the PCB board 20 is not easily loosened in high-temperature and high-vibration environments. Furthermore, this stacked structure effectively saves space, facilitates heat conduction, and improves heat dissipation efficiency.

[0058] In the description of this specification, the references to terms such as "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0059] Furthermore, the above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A power device, characterized in that, include: Heat dissipation substrate; IGBT module, wherein the IGBT module is disposed on the heat dissipation substrate; A PCB board is disposed on the side of the IGBT module facing away from the heat dissipation substrate. The PCB board has a slot, and the IGBT module has pins. The position of the slot corresponds to the position of the pins, and the pins pass through the slot. A flexible connecting plate is disposed on the side of the PCB board facing away from the IGBT module, and the flexible connecting plate electrically connects the IGBT module and the PCB board; The flexible connecting plate is welded to both the PCB board and the IGBT module to achieve electrical connection between the IGBT module and the PCB board.

2. The power device according to claim 1, characterized in that, The flexible connection board includes pads and through holes spaced apart from the pads. The pads are soldered to the PCB board, and the through holes are soldered to the pins.

3. The power device according to claim 2, characterized in that, The hardness of the flexible connecting plate is 60 Shore A to 90 Shore A.

4. The power device according to claim 1, characterized in that, A cushioning material is placed in the slot, and the cushioning material is arranged around the pin.

5. The power device according to claim 2, characterized in that, The PCB board has solder joints, and the solder pads are soldered to the solder joints.

6. The power device according to claim 2, characterized in that, The flexible connecting plate and the solder pad are integrally formed, or the flexible connecting plate and the solder pad can be separately set.

7. The power device according to claim 1, characterized in that, The flexible connecting plate is a flexible FPC board, and the pins are flexible cables.

8. The power device according to claim 2, characterized in that, The pin passes through the through-hole, and a portion of the pin protrudes from the through-hole.

9. An inverter device, characterized in that, The inverter device includes the power device as described in any one of claims 1 to 8.

10. An electronic device, characterized in that, The electronic device includes the inverter device as described in claim 9.

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