Embedded circuit board

Abstract

The utility model discloses an embedded circuit board, which relates to the technical field of circuit boards and comprises a lower substrate, criss-cross radiating grooves are arranged at the top of the lower substrate, a radiating frame is arranged at the tops of the radiating grooves, a plurality of groups of radiating fins are arranged on the outer side of the radiating frame, and a plurality of groups of parallel transverse radiating blocks and vertical radiating blocks are arranged in the radiating frame. The transverse heat dissipation blocks and the vertical heat dissipation blocks are arranged in a crossed mode and make contact at the crossed points, mounting frames are arranged at the tops of the transverse heat dissipation blocks and the tops of the vertical heat dissipation blocks, mounting grooves are formed in the inner sides of the mounting frames, clamping mechanisms are arranged in the mounting grooves, multiple sets of battery cell plates are arranged in the mounting frames, and clamping mechanisms are arranged in the battery cell plates. According to the embedded circuit board, the heat dissipation performance is optimized, the structural performance and the reliability of the embedded circuit board are improved, and the increasingly complicated application requirements of electronic equipment are met.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to embedded circuit boards. Background Technology

[0002] In today's highly information-driven society, electronic devices have become an indispensable part of people's daily lives and industrial production. From smartphones and computers to industrial control systems and medical equipment, various electronic devices are changing our world at an unprecedented speed. Among these electronic devices, there is a key component that silently undertakes important functions such as signal transmission, power distribution, and data processing. That is the circuit board. As the core component of electronic devices, the quality of the design and manufacturing technology of the circuit board directly affects the performance, reliability, and cost of the entire device. Embedded circuit board structure, as an important form of circuit board technology, is widely used in various electronic devices due to its compact structure and high integration. However, in practical applications, this structure has also revealed some shortcomings.

[0003] Existing embedded circuit boards, due to their dense component density, have difficulty dissipating heat quickly, which can easily lead to localized overheating, affecting the stability and lifespan of electronic components. Secondly, the structural design of embedded circuit boards makes it quite difficult to repair or replace electronic components once they malfunction. Since the components are tightly encapsulated inside the circuit board, repair personnel often need to spend a lot of time and effort to disassemble and reassemble them, which not only increases repair costs but may also cause secondary damage to the circuit board. Utility Model Content

[0004] The present invention proposes an embedded circuit board that solves the problems of poor heat dissipation performance and difficulty in maintenance and replacement of existing embedded circuit boards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An embedded circuit board includes a lower substrate. The top of the lower substrate has crisscrossing heat dissipation grooves, and the top of each heat dissipation groove has a heat dissipation frame. Multiple heat dissipation fins are arranged on the outer side of the heat dissipation frame, and multiple parallel horizontal and vertical heat dissipation blocks are arranged inside the heat dissipation frame. The horizontal and vertical heat dissipation blocks are arranged intersectingly and contact each other at their intersection points. A mounting frame is provided on the top of each horizontal and vertical heat dissipation block. A mounting groove is provided inside the mounting frame, and a clamping mechanism is provided inside the mounting groove. Multiple battery cell boards are arranged inside the mounting frame, and a snap-fit ​​mechanism is provided inside each battery cell board. A detachable cooling fan is provided on the top of each battery cell board.

[0007] Preferably, the clamping mechanism includes a slide rail, a damping telescopic rod, a spring, a clamping plate, a limiting groove, a threaded hole, a threaded knob, and a slider. The mounting groove has slide rails on both sides, a clamping plate is provided above the slide rails, and the bottom and top of the clamping plate are provided with sliders that match the slide rails and are slidably connected.

[0008] Preferably, the mounting groove is provided with multiple sets of damping telescopic rods, and the damping telescopic rods are provided with springs on their outer sides, and the damping telescopic rods are connected to the clamping plate.

[0009] Preferably, two sets of threaded holes are provided on the outer side of the mounting frame at one end, inside the mounting groove, and a matching threaded knob is provided inside the threaded hole. The threaded knob is connected to the clamping plate to form a clamping structure.

[0010] Preferably, the battery cell board is divided into a power module, a signal processing module, and a communication module, and electronic components are provided on the top of the battery cell board, with heat dissipation holes provided on the sides of the electronic components inside the battery cell board.

[0011] Preferably, the locking mechanism includes a locking slot and a locking block, and one end of the battery cell board side is provided with multiple sets of locking slots, while the other end of the battery cell board side is provided with multiple sets of locking blocks that match the locking slots and are in movable locking position.

[0012] Preferably, the top of the battery cell board is provided with an upper substrate, and the surface of the upper substrate is provided with a copper-clad layer. A support frame is installed on the top of the copper-clad layer by bolts, and the top of the support frame is provided with a placement groove that matches the cooling fan. The cooling fan is installed in the placement groove by screws.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. This embedded circuit board has crisscrossing heat dissipation grooves on the top of the lower substrate. The heat dissipation frame contains multiple sets of parallel horizontal and vertical heat dissipation blocks. Heat is introduced into the heat dissipation frame through the horizontal and vertical heat dissipation blocks, and is initially dissipated by the heat dissipation fins on the outside of the heat dissipation frame. The horizontal and vertical heat dissipation blocks are arranged in a crisscross pattern and contact each other at the intersection point, which helps to increase the contact area with the battery cell board and improve the heat dissipation speed. By setting up heat dissipation fans, copper cladding, and heat dissipation grooves, the circuit board layout is improved, heat dissipation channels are increased, and heat dissipation efficiency is improved. At the same time, a combination of active and passive heat dissipation is adopted. The heat dissipation fans are used to assist in heat dissipation and timely dissipate heat, reduce the circuit board temperature, reduce the heat accumulation area, and further improve the heat dissipation efficiency.

[0015] 2. The mounting slot is equipped with a clamping mechanism. This mechanism uses springs, damping telescopic rods, threaded knobs, and clamping plates to firmly clamp the circuit board inside the mounting frame without the need for welding or screw fixing. This clamping structure not only simplifies the installation process but also improves the stability and shock resistance of the circuit board. At the same time, the design of the clamping structure also allows users to adjust the position and angle of the circuit board according to actual needs, further improving space utilization. It also facilitates the maintenance and replacement of the battery cell board.

[0016] 3. The battery cell board is equipped with a snap-fit ​​mechanism. One side of the battery cell board has multiple sets of snap-fit ​​slots, and the other side of the battery cell board has multiple sets of snap-fit ​​blocks that match the snap-fit ​​slots. The standardized snap-fit ​​blocks and slots allow for quick connection between the chip and the circuit board. The snap-fit ​​mechanism not only simplifies the installation and disassembly of the battery cell board but also improves the reliability of the electrical connection between battery cell boards. Furthermore, the snap-fit ​​structure divides the battery cell board into a power module, a signal processing module, and a communication module, facilitating the replacement and upgrading of chips in the subsequent battery cell board process, further enhancing the convenience of maintenance and upgrades of electronic equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the exploded structure of this utility model.

[0019] Figure 3 This is a schematic diagram of the clamping mechanism of this utility model.

[0020] Figure 4 This is a schematic diagram of the snap-fit ​​mechanism of this utility model.

[0021] The following are the labeling elements in the diagram: 1. Lower substrate; 2. Heat sink; 3. Heat sink frame; 4. Horizontal heat sink block; 5. Vertical heat sink block; 6. Mounting frame; 7. Mounting slot; 8. Battery cell board; 9. Cooling fan; 10. Slide rail; 11. Damping telescopic rod; 12. Spring; 13. Clamping plate; 14. Heat sink fin; 15. Limiting slot; 16. Threaded hole; 17. Threaded knob; 18. Slider; 19. Electronic component; 20. Heat sink hole; 21. Bayonet; 22. Locking block; 23. Upper substrate; 24. Copper cladding layer; 25. Bolt; 26. Support frame; 27. Placement slot; 28. Screw. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Reference Figures 1-4This utility model provides a technical solution: an embedded circuit board, including a lower substrate 1, with crisscrossing heat dissipation grooves 2 on the top of the lower substrate 1, and a heat dissipation frame 3 on the top of the heat dissipation grooves 2. Multiple sets of heat dissipation fins 14 are arranged on the outside of the heat dissipation frame 3, and multiple sets of parallel horizontal heat dissipation blocks 4 and vertical heat dissipation blocks 5 are arranged inside the heat dissipation frame 3. The horizontal heat dissipation blocks 4 and vertical heat dissipation blocks 5 are arranged intersectingly and contact each other at the intersection point. A mounting frame 6 is arranged on the top of the horizontal heat dissipation blocks 4 and vertical heat dissipation blocks 5. A mounting groove 7 is arranged on the inside of the mounting frame 6, and a clamping mechanism is arranged inside the mounting groove 7. Multiple sets of battery cell boards 8 are arranged inside the mounting frame 6, and a snap-fit ​​mechanism is arranged inside the battery cell board 8. A detachable cooling fan 9 is arranged on the top of the battery cell board 8.

[0024] Reference Figure 1 , Figure 4 The battery cell board 8 is divided into a power module, a signal processing module, and a communication module. Electronic components 19 are provided on the top of the battery cell board 8. Heat dissipation holes 20 are provided on the side of the electronic components 19 inside the battery cell board 8. An upper substrate 23 is provided on the top of the battery cell board 8, and a copper-clad layer 24 is provided on the surface of the upper substrate 23. A support frame 26 is installed on the top of the copper-clad layer 24 by bolts 25. A placement slot 27 matching the heat dissipation fan 9 is provided on the top of the support frame 26. The heat dissipation fan 9 is installed inside the placement slot 27 by screws 28.

[0025] In practical implementation, when using an embedded circuit board, to dissipate heat, firstly, the horizontal heat sink 4 and the vertical heat sink 5 transfer the heat from the bottom of the battery cell board 8 into the heat sink frame 3. The heat sink frame 3 dissipates heat through the outer heat sink 14. At the same time, the copper layer 24 on the top of the battery cell board 8 conducts some heat. Then, the cooling fan 9 is activated, blowing air into the mounting frame 6. Another part of the heat enters the heat sink frame 3 through the heat dissipation holes 20, and then is discharged from the heat dissipation groove 2 on the top of the lower substrate 1. This accelerates the internal air circulation of the embedded circuit board, increases the heat dissipation channels, and improves the heat dissipation efficiency. Through the above operations, the temperature of the circuit board is reduced, the area of ​​heat accumulation is reduced, and the heat dissipation efficiency is further improved.

[0026] Reference Figure 2 , Figure 3The clamping mechanism includes a slide rail 10, a damping telescopic rod 11, a spring 12, a clamping plate 13, a limiting groove 15, a threaded hole 16, a threaded knob 17, and a slider 18. The mounting groove 7 has slide rails 10 on both sides, and a clamping plate 13 is provided above the slide rails 10. The bottom and top of the clamping plate 13 are provided with sliders 18 that match the slide rails 10 and are slidably connected. The mounting groove 7 has multiple sets of damping telescopic rods 11, and springs 12 are provided on the outside of the damping telescopic rods 11. The damping telescopic rods 11 are connected to the clamping plate 13. The outer side of one end of the mounting frame 6 is provided inside the mounting groove 7 with two sets of threaded holes 16. The threaded holes 16 are provided with matching threaded knobs 17. The threaded knobs 17 are connected to the clamping plate 13 to form a clamping structure. The snap-fit ​​mechanism includes a snap-fit ​​21 and a snap-fit ​​block 22. The side of one end of the battery cell board 8 has multiple sets of snap-fit ​​21, and the side of the other end of the battery cell board 8 has multiple sets of snap-fit ​​blocks 22 that match the snap-fit ​​21 and are movably snap-fitted.

[0027] In specific implementation, when an embedded circuit board needs repair or replacement, firstly, the threaded knob 17 is turned, causing the clamping plate 13 inside the mounting slot 7 to move backward within the slide rail 10, thus making it easy to remove the internal battery cell board 8 for repair or replacement. During installation, the battery cell boards 8 of different modules are aligned and clamped by the bayonet 21 and the clamping block 22. Then, the clamped battery cell board 8 is placed inside the limiting groove 15 on the side of the clamping plate 13, and clamped by the elastic action of the damping telescopic rod 11 and the spring 12. Then, the threaded knob 17 is turned in the opposite direction, causing the clamping plate 13 to move forward within the slide rail 10, thereby firmly clamping the circuit board inside the mounting frame 6. Through the above operations, users can easily adjust the position and angle of the circuit board according to actual needs, further improving space utilization, and also facilitating the maintenance and replacement of the battery cell board 8.

[0028] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. An embedded circuit board, comprising a lower substrate (1), characterized in that, The lower substrate (1) is provided with crisscrossing heat dissipation grooves (2) on the top, and a heat dissipation frame (3) is provided on the top of the heat dissipation grooves (2). Multiple heat dissipation fins (14) are provided on the outside of the heat dissipation frame (3), and multiple parallel horizontal heat dissipation blocks (4) and vertical heat dissipation blocks (5) are provided inside the heat dissipation frame (3). The horizontal heat dissipation blocks (4) and vertical heat dissipation blocks (5) are arranged in a cross pattern and contact each other at the intersection point. A mounting frame (6) is provided on the top of the horizontal heat dissipation blocks (4) and vertical heat dissipation blocks (5). A mounting groove (7) is provided on the inside of the mounting frame (6), and a clamping mechanism is provided inside the mounting groove (7). Multiple battery cell boards (8) are provided inside the mounting frame (6), and a snap-fit ​​mechanism is provided inside the battery cell board (8). A detachable heat dissipation fan (9) is provided on the top of the battery cell board (8).

2. The embedded circuit board according to claim 1, characterized in that, The clamping mechanism includes a slide rail (10), a damping telescopic rod (11), a spring (12), a clamping plate (13), a limiting groove (15), a threaded hole (16), a threaded knob (17), and a slider (18). The mounting groove (7) has slide rails (10) on both sides inside. The clamping plate (13) is provided above the slide rails (10), and the bottom and top of the clamping plate (13) are provided with sliders (18) that match the slide rails (10) and are slidably connected.

3. The embedded circuit board according to claim 2, characterized in that, The mounting groove (7) is provided with multiple sets of damping telescopic rods (11), and the damping telescopic rods (11) are provided with springs (12) on the outside of the outer side of the damping telescopic rods (11). The damping telescopic rods (11) are connected to the clamping plate (13).

4. The embedded circuit board according to claim 3, characterized in that, Two sets of threaded holes (16) are provided on the outside of the mounting frame (6) inside the mounting groove (7), and a matching threaded knob (17) is provided inside the threaded hole (16). The threaded knob (17) is connected to the clamping plate (13) to form a clamping structure.

5. The embedded circuit board according to claim 1, characterized in that, The battery cell board (8) is divided into a power module, a signal processing module, and a communication module. Electronic components (19) are provided on the top of the battery cell board (8). Heat dissipation holes (20) are provided on the side of the electronic components (19) inside the battery cell board (8).

6. The embedded circuit board according to claim 1, characterized in that, The locking mechanism includes a locking slot (21) and a locking block (22). One end of the battery cell board (8) has multiple sets of locking slots (21) on its side, and the other end of the battery cell board (8) has multiple sets of locking blocks (22) that match the locking slots (21) and are in a movable locking position.

7. The embedded circuit board according to claim 1, characterized in that, The top of the battery cell board (8) is provided with an upper substrate (23), and the surface of the upper substrate (23) is provided with a copper cladding layer (24). The top of the copper cladding layer (24) is provided with a support frame (26) by bolts (25), and the top of the support frame (26) is provided with a placement slot (27) that matches the heat dissipation fan (9). The heat dissipation fan (9) is installed inside the placement slot (27) by screws (28).

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