Motorcycle idling start-stop controller
By designing a centralized groove and optimizing the heat-conducting material, the problems of potting material usage and demolding difficulty in the motorcycle idle start-stop controller were solved, resulting in cost reduction and improved heat dissipation, and a beautiful and stable product was designed.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU GONGCHENG ELECTRICAL TECH CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-05-22
AI Technical Summary
In the design process of existing motorcycle idle start-stop controllers, unreasonable groove design leads to increased use of potting compound, resulting in high cost and difficulty in demolding, which affects the product's appearance and performance stability.
The design employs a concentrated groove design, which concentrates the grooves in the recessed area, reducing the number of grooves and the area they occupy, increasing the platform area, improving heat dissipation by using thermally conductive materials, and reducing the amount of potting compound and demolding difficulty by optimizing the heat conduction path.
It effectively reduces the amount of potting compound used, lowers costs and demolding difficulty, while improving heat dissipation and product reliability, achieving a beautiful, stable, and low-cost design.
Smart Images
Figure CN224267174U_ABST
Abstract
Description
Technical Field
[0001] This application relates to controllers, specifically to a motorcycle idle start-stop controller. Background Technology
[0002] In the design process of motorcycle idle start-stop controller, it is necessary to consider not only how to realize its various functions, but also the structure and heat dissipation. Therefore, how to make the two complement each other and design a beautiful, stable, and low-cost product has become the goal that engineers are constantly pursuing.
[0003] In common printed circuit board (PCB) designs, for surface mount devices (SMD) components, the corresponding housing is generally a platform adapter. For through-hole devices (DUT) components, the housing needs corresponding recesses inside for adaptation. Sometimes, to achieve the shortest possible trace length, DUT components are placed close together, resulting in multiple recesses inside the housing. Later, during potting of the semi-finished product, considering the flow direction and velocity of the potting compound, these recesses need to be connected, increasing the recess area. This not only increases the amount of potting compound used and costs but also introduces the risk of difficulty in demolding the housing. Utility Model Content
[0004] To overcome the above-mentioned defects, this application provides a motorcycle idle start-stop controller that reduces the area occupied by the groove, thereby greatly reducing the amount of potting compound used, lowering costs and reducing the difficulty of demolding.
[0005] The technical solution adopted by this application to solve its technical problem is:
[0006] A motorcycle idle start-stop controller includes a housing, a printed circuit board assembly, and a plug support plate. The housing has a platform and a recessed area, the recessed area being located on one side of the platform, and a groove is formed in the recessed area. The printed circuit board assembly includes a printed circuit board with a front and a back side arranged opposite to each other. Large components and power devices are fixedly mounted on the back side. The printed circuit board assembly is fixedly mounted inside the housing, and the large components are placed in the groove. A plug is fixedly mounted on the plug support plate, and the plug support plate is fixedly mounted in the recessed area of the housing.
[0007] Optionally, the upper surface of the platform includes a plane, and the upper surface of the platform is provided with a heat dissipation area, with the power device facing the heat dissipation area.
[0008] Optionally, the platform is provided with a recess, and the recess is provided with a plurality of protrusions. The recess and the protrusions form the heat dissipation area. There is a gap between two adjacent protrusions, and the distance between two adjacent protrusions is equal.
[0009] Optionally, the upper surface of the bump is flush with the upper surface of the platform; or, the upper surface of the bump is lower than the upper surface of the platform.
[0010] Optionally, the recesses and bumps are coated with a thermally conductive material, including thermally conductive adhesive or thermally conductive silicone grease.
[0011] Optionally, surface mount components are fixedly attached to the front side of the printed circuit board, screw holes and injection ports are provided on the printed circuit board, and heat dissipation teeth are provided on the outer side of the housing, with the heat dissipation teeth located on the lower surface of the platform.
[0012] Optionally, there is a gap between the back side of the printed circuit board and the platform, the gap being 1.5±0.2mm, and the gap is filled with thermally conductive material, including thermally conductive adhesive or thermally conductive silicone grease.
[0013] Optionally, the recessed area is fixedly provided with a plug plate, and the plug support plate is provided with a slot. During assembly, the plug plate is inserted into the slot.
[0014] The beneficial effects of this application are: the grooves are concentrated in the recessed area, which reduces the number of grooves and the groove channels through which the potting compound flows, thus reducing the total area occupied by the grooves and increasing the area of the platform. This can greatly reduce the amount of potting compound used, reduce costs, and reduce the difficulty of demolding. The structure of this application is simple and the heat dissipation effect is good. Attached Figure Description
[0015] Figure 1 This is an exploded view of the controller in this application;
[0016] Figure 2 This is an assembly diagram of the controller in this application;
[0017] Figure 3 This is a cross-sectional view of the controller in this application;
[0018] Figure 4 This is a structural schematic diagram of the printed circuit board assembly and plug support plate in this application;
[0019] Figure 5 This is one of the structural schematic diagrams of the outer shell in this application;
[0020] Figure 6 This is the second schematic diagram of the outer shell in this application;
[0021] Figure 7 This is the third schematic diagram of the outer shell in this application;
[0022] Figure 8 This is the fourth schematic diagram of the outer shell in this application;
[0023] In the diagram: 100-House casing, 110-Platform, 111-Heat dissipation area, 112-Dent, 113-Bump, 120-Recessed area, 121-Groove, 122-Insert board, 130-Heat dissipation fins, 200-Printed circuit board assembly, 210-Printed circuit board, 211-Front side, 212-Back side, 213-Screw hole, 214-Insulation port, 220-Large components, 221-Surface mount electrolytic capacitor, 222-Through-hole electrolytic capacitor, 230-Power devices, 240-Surface mount components, 250-Screw, 300-Plug support plate, 310-Plug, 320-Slot. Detailed Implementation
[0024] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the embodiments of this application. Obviously, the embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0025] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of the terms can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0026] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0027] Example: Figures 1-8 As shown, a motorcycle idle start-stop controller includes a housing 100, a printed circuit board assembly 200, and a plug support plate 300. The housing 100 contains a platform 110 and a recessed area 120. The area of the platform 110 is larger than the area of the recessed area 120, which is located on one side of the platform 110. A groove 121 is formed within the recessed area 120. The printed circuit board assembly 200 includes a printed circuit board 210 with a front side 211 and a back side 212 arranged opposite to each other. A large component 220 and a power device 230 are fixedly mounted on the back side 212. The printed circuit board assembly 200 is fixedly installed within the housing 100, and the large component 220 is placed in the groove 121. A plug 310 is fixedly mounted on the plug support plate 300 and electrically connected to the printed circuit board 210. The plug support plate 300 is fixedly installed in the recessed area 120 of the housing 100. like Figure 4 As shown, the large components 220 are components with relatively large heights, including surface-mount electrolytic capacitors 221, through-hole electrolytic capacitors 222, etc.
[0028] In this application, a recessed area 120 is centrally located within the housing 100, while the remaining areas of the housing 100 are large-area platforms 110. A plug support plate 300 is installed in the recessed area 120. Larger components 220 are uniformly arranged on the back side 212 of the printed circuit board 210. The recessed area 120 has grooves 121 of varying depths according to the height of each large component 220. When the printed circuit board assembly 200 is placed inside the housing 100, the large components 220 are uniformly located in the recessed area 120, and each large component 220 is inserted into a suitable groove 121, with the large components 220 located near the plug 310. By concentrating the grooves 121 in the recessed area 120, this application reduces the number of grooves 121 and the groove channels for potting compound flow, thus reducing the total area occupied by the grooves 121 and increasing the area of the platform 110. This significantly reduces the amount of potting compound used, lowers costs, and simplifies demolding.
[0029] like Figure 3 , Figure 5 and Figure 7 As shown, the upper surface of the platform 110 includes a plane, and a heat dissipation area 111 is provided on the upper surface of the platform 110. The power device 230 is directly opposite the heat dissipation area 111. That is, the power device 230 is located directly above the heat dissipation area 111, which facilitates the heat dissipation of the power device 230.
[0030] like Figure 5As shown, the platform 110 has a recess 112, and the recess 112 has multiple protrusions 113. The recess 112 and the protrusions 113 form the heat dissipation area 111. There is a gap between two adjacent protrusions 113, and the distance between two adjacent protrusions 113 is equal. Optionally, the heat dissipation area 111 is a rectangular area composed of multiple concave and convex surfaces. The heat dissipation area 111 is provided on a large area of the platform 110 inside the outer shell 100. The heat dissipation area 111 not only increases the heat dissipation area, but also increases the friction between the coated thermally conductive material and the outer shell 100.
[0031] Optionally, the upper surface of the protrusion 113 is flush with the upper surface of the platform 110; or, the upper surface of the protrusion 113 is lower than the upper surface of the platform 110.
[0032] The recesses 112 and the bumps 113 are coated with a thermally conductive material, including thermally conductive adhesive or thermally conductive grease. When the power device 230 generates heat, the heat dissipation path of the power device 230 is: the power device encapsulation, the thermally conductive material, and the heat dissipation fins 130 of the housing 100. When the power device 230 is flip-mounted on the printed circuit board 210, that is, mounted on the back side 212 of the printed circuit board 210, when it generates heat, the heat of the power device 230 is quickly conducted to the housing 100 through the thermally conductive material and the uneven structure of the heat dissipation area 111, thus improving the heat conduction effect.
[0033] like Figure 2 , Figure 4 and Figure 7 As shown, surface mount components 240 are fixedly attached to the front side 211 of the printed circuit board 210. The printed circuit board 210 has screw holes 213 and a filling port 214. The outer side of the housing 100 is provided with heat dissipation fins 130, which are located on the lower surface of the platform 110. The surface mount components 240 include integrated circuits (ICs), MCUs, etc. Replacing discrete components with integrated circuits not only reduces the number of components but also improves the product's reliability. The screw holes 213 are for screws 250 to be inserted, the filling port 214 is for injecting potting compound into the housing 100, and the heat dissipation fins 130 enhance heat dissipation.
[0034] Optionally, a gap exists between the back surface 212 of the printed circuit board 210 and the platform 110, the gap being 1.5 ± 0.2 mm. This gap is filled with a thermally conductive material, including thermally conductive adhesive or thermally conductive silicone grease. The gap can be adjusted in height depending on the product. Since the back surface 212 of the printed circuit board 210 contains few other components, and the gap between the printed circuit board 210 and the platform 110 is small, the stress it withstands during thermal shock is reduced.
[0035] like Figure 2 , Figure 4 andFigure 8 As shown, the recessed area 120 is fixedly provided with a plug plate 122, and the plug support plate 300 is provided with a slot 320. During assembly, the plug plate 122 is inserted into the slot 320.
[0036] The manufacturing process of this application includes the following steps:
[0037] Step 1: Apply a thermally conductive material, such as thermal adhesive or thermal grease, to the heat dissipation area of the outer casing 100;
[0038] Step 2: Place the printed circuit board assembly 200 inside the housing 100. Large components 220, such as surface mount electrolytic capacitors 221 and through-hole electrolytic capacitors 222, are placed in the groove 121. The power device 230 is located directly above the heat dissipation area 111. The plug plate 122 on the housing 100 is inserted into the slot 320 on the plug support plate 300.
[0039] Step 3: The power device 230 is encapsulated in a heat-conducting material, then the printed circuit board assembly 200 is soldered, and the printed circuit board 210 is secured to the housing 100 with screws 250 to form a semi-finished product.
[0040] Step 4: Place the semi-finished product into the machine for potting. The potting material is injected into the semi-finished product from the injection port 214 of the printed circuit board 210. The potting material first flows into the recessed area 120 and the groove 121, and then slowly fills upwards, immersing the platform 110 and the back side 212 of the printed circuit board 210. Finally, it fills upwards to the front side 211 of the printed circuit board 210 until it is flush with the outer shell 100, thereby completing the potting of the controller.
[0041] It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be determined by the appended claims.
Claims
1. A motorcycle idle start-stop controller, characterized in that: The device includes a housing (100), a printed circuit board assembly (200), and a plug support plate (300). The housing (100) contains a platform (110) and a recessed area (120), the recessed area (120) being located on one side of the platform (110). A groove (121) is formed within the recessed area (120). The printed circuit board assembly (200) includes a printed circuit board (210), the printed circuit board (210) having a front face (211) and a rear face (211) arranged opposite to each other. On the back side (212), large components (220) and power devices (230) are fixedly installed. The printed circuit board assembly (200) is fixedly installed inside the housing (100), and the large components (220) are placed in the groove (121). A plug (310) is fixedly provided on the plug support plate (300), and the plug support plate (300) is fixedly installed in the recessed area (120) of the housing (100).
2. The motorcycle idle start-stop controller according to claim 1, characterized in that: The upper surface of the platform (110) includes a plane, and the upper surface of the platform (110) is provided with a heat dissipation area (111), and the power device (230) is directly opposite the heat dissipation area (111).
3. The motorcycle idle start-stop controller according to claim 2, characterized in that: The platform (110) is provided with a recess (112), and a plurality of protrusions (113) are provided in the recess (112). The recess (112) and the protrusions (113) form the heat dissipation area (111). There is a gap between two adjacent protrusions (113), and the distance between two adjacent protrusions (113) is equal.
4. The motorcycle idle start-stop controller according to claim 3, characterized in that: The upper surface of the protrusion (113) is flush with the upper surface of the platform (110); or, the upper surface of the protrusion (113) is lower than the upper surface of the platform (110).
5. The motorcycle idle start-stop controller according to claim 3, characterized in that: The recess (112) and the bump (113) are coated with a thermally conductive material, which includes thermally conductive adhesive or thermally conductive silicone grease.
6. The motorcycle idle start-stop controller according to claim 1, characterized in that: The front side (211) of the printed circuit board (210) is fixedly attached with surface mount components (240). The printed circuit board (210) has screw holes (213) and injection ports (214). The outer side of the housing (100) is provided with heat dissipation teeth (130), which are located on the lower surface of the platform (110).
7. The motorcycle idle start-stop controller according to claim 1, characterized in that: There is a gap between the back side (212) of the printed circuit board (210) and the platform (110), the gap being 1.5±0.2mm, and the gap being filled with thermally conductive material, including thermally conductive adhesive or thermally conductive silicone grease.
8. The motorcycle idle start-stop controller according to claim 1, characterized in that: The recessed area (120) is fixedly provided with a plug plate (122), and the plug support plate (300) is provided with a slot (320). During assembly, the plug plate (122) is inserted into the slot (320).