PCBA board with high heat dissipation efficiency

Abstract

The utility model relates to the technical field of heat dissipation of PCBA boards, in particular to a PCBA board with high heat dissipation efficiency, which comprises a case shell, four corners of the top of the case shell are all fixedly connected with inner groove columns, a circuit board is arranged between the tops of the inner groove columns, four corners of the top of the circuit board are all provided with mounting holes, the mounting holes and the inner groove columns are positioned on the same vertical line, and the inner groove columns are arranged on the case shell. The top of the circuit board is fixedly connected with a chip, the top of the circuit board is provided with a cooling mechanism used for cooling the chip, plug pins are arranged in the inner groove columns and the mounting holes, inner sliding grooves are formed in the plug pins, and fixing mechanisms used for mounting and dismounting the circuit board are arranged between the inner groove columns and the mounting holes. Compared with the prior art, stable heat dissipation of the chip in a high-power and long-time working state is realized, the problems of circuit element performance reduction and equipment failure caused by high temperature of the circuit element are reduced, and long-term reliable operation of the PCBA board is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of PCBA board heat dissipation technology, and in particular to a PCBA board with high heat dissipation efficiency. Background Technology

[0002] PCBA circuit boards are functional electronic components that are soldered or mounted onto a printed circuit board according to design requirements using surface mount technology or through-hole mounting technology. As the core functional carrier of electronic devices, PCBA circuit boards are responsible for the transmission, control and power distribution of circuit signals. They are widely used in consumer electronics, communication equipment, industrial automation, new energy vehicles, medical equipment, aerospace and other fields, and can complete complex signal processing, logic control, power output or data interaction.

[0003] Currently, most traditional PCBA boards use heat sinks for heat conduction, followed by cooling fans for heat dissipation. However, under high power or long-term use, they cannot quickly dissipate heat from high-heat areas such as chips, relying solely on heat sinks and fans to reduce temperature. This results in low overall heat dissipation efficiency, making it difficult to meet the heat dissipation requirements of long-term high-power operation. At the same time, localized high temperatures can easily lead to a decline in the performance of circuit components, and in severe cases, even cause equipment failure. In addition, existing PCBA boards are fixed to the internal brackets or bases of the chassis by multiple screws, and the screws are usually distributed at the four corners or edges of the circuit board. With limited chassis space, the screws are located in narrow, obstructed, or deep holes, requiring the use of long and thin tools, such as long screwdrivers or special wrenches, to reach them. The disassembly process is cumbersome and time-consuming, and may even require the assistance of additional disassembly tools. Utility Model Content

[0004] In view of this, the purpose of this utility model is to propose a PCBA board with high heat dissipation efficiency to solve the problem that when used at high power or for a long time, it is impossible to quickly dissipate the heat of high heat areas such as chips, and the disassembly process is cumbersome, time-consuming, and even requires the assistance of additional disassembly tools.

[0005] To achieve the above objectives, this utility model provides a high heat dissipation efficiency PCBA board, including a chassis housing. Inner slot posts are fixedly connected to the four top corners of the chassis housing. A circuit board is disposed between the tops of the inner slot posts. Mounting holes are provided at the four top corners of the circuit board. The mounting holes and the inner slot posts are on the same vertical line. A chip is fixedly connected to the top of the circuit board. A cooling mechanism for cooling the chip is provided on the top of the circuit board. Inserts are provided inside the inner slot posts and mounting holes. The inserts have internal sliding grooves. A fixing mechanism for installing and removing the circuit board is provided between the inner slot posts and mounting holes.

[0006] Preferably, the cooling mechanism includes a graphene sheet, which is fixedly connected to the top of the chip. A heat dissipation fin is fixedly connected to the top of the graphene sheet. A circulation pump is fixedly connected to the top of the circuit board. A heat-absorbing microtube is fixedly connected to the output end of the circulation pump. A cooling fan is fixedly connected to the top of the circuit board. One end of the heat-absorbing microtube penetrates the interior of the heat dissipation fin and extends out of the outer wall of the heat dissipation fin. The other end of the heat-absorbing microtube is fixedly connected to the input end of the circulation pump.

[0007] Preferably, the fixing mechanism includes a slide rod, the top of which is rotatably connected to an externally threaded column, the top of which is provided with an internally threaded groove, the bottom of which is fixedly connected to a conical block, the outer walls of which are provided with ball grooves, the ball grooves communicating with the interior of the inner slide groove, the interior of which is provided with balls, and the inner walls of the inner groove column are provided with limit grooves.

[0008] Preferably, a rotatable block is fixedly connected to the top of the external threaded post to facilitate rotation of the external threaded post.

[0009] Preferably, the heat-absorbing microtubes inside the heat dissipation fins are arranged in a snake shape, and the heat-absorbing microtubes outside the heat dissipation fins are arranged in a U-shape near the side wall of the cooling fan.

[0010] Preferably, the internal shape of the ball groove is consistent with the top and bottom shapes of the outer wall of the ball, and the inner diameter of the ball groove is larger than the outer diameter of the ball.

[0011] Preferably, the outer wall of the ball and the inner wall of the limiting groove are adapted to each other.

[0012] The beneficial effects of this utility model are:

[0013] 1. This high-efficiency PCBA board utilizes a cooling mechanism to efficiently conduct heat generated by the chip during high-power operation to the graphene sheet. The graphene sheet, with its excellent thermal conductivity, quickly and evenly distributes the heat to the heat dissipation fins, preventing localized overheating and improving heat dissipation response speed. The heat dissipation fins achieve rapid initial cooling under the forced airflow of the cooling fan. Simultaneously, a circulation pump drives the coolant circulation within the heat-absorbing microtubes. The coolant absorbs the conducted heat over a large area at the heat dissipation fins. Combined with the specific arrangement structure within the heat-absorbing microtubes, this significantly increases the heat exchange area and efficiency, solving the problem of traditional PCBA boards relying solely on air cooling. Furthermore, the heat-absorbing microtubes feature a U-shaped bend structure on the sidewall of the cooling fan, extending the coolant's cooling path and residence time, allowing the coolant to achieve sufficient cooling under the cooling fan's action. This further enhances the overall heat dissipation performance of the coolant circulation system, enabling stable heat dissipation of the chip under high-power, long-term operation. This reduces the performance degradation of circuit components due to high temperatures and equipment failures, ensuring long-term reliable operation of the PCBA board.

[0014] 2. This high-efficiency heat dissipation PCBA board utilizes a fixing mechanism that combines an external threaded post and a sliding rod with the limiting effect of a conical block and ball bearings. This allows for quick and stable fixing of the circuit board without relying on complex tools. Specifically, the plug can be easily and precisely positioned and fixed to the circuit board by rotating the rotating block, greatly reducing the disassembly difficulty caused by inconvenient screw positions or difficult tool operation. Furthermore, during disassembly, simply rotating the rotating block in the opposite direction moves the external threaded post upwards, releasing the limiting effect of the ball bearings, thereby achieving quick unlocking and disassembly of the circuit board. This significantly improves the efficiency of maintenance and installation. This simplified operation avoids the cumbersome operation of traditional fixing methods that require the use of long, thin tools due to chassis space limitations, improving work efficiency, reducing labor and time costs, and greatly enhancing ease of use and work efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only for this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;

[0017] Figure 2 This is a three-dimensional structural diagram of the heat dissipation mechanism of this utility model;

[0018] Figure 3This is a three-dimensional structural diagram of the heat dissipation fins and heat-absorbing microtubes of this utility model;

[0019] Figure 4 This is a three-dimensional structural diagram of the fixing mechanism of this utility model.

[0020] The diagram is marked as follows:

[0021] 1. Chassis housing; 2. Inner groove post; 3. Circuit board; 4. Mounting hole; 5. Chip; 6. Graphene sheet; 7. Heat sink fins; 8. Circulation pump; 9. Heat absorption microtube; 10. Cooling fan; 11. Plug; 12. Inner slide groove; 13. Slide rod; 14. External threaded post; 15. Internal threaded groove; 16. Conical block; 17. Ball groove; 18. Ball; 19. Limiting groove; 20. Rotary block. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments.

[0023] It should be noted that, unless otherwise defined, the technical or scientific terms used in this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "first," "second," and similar terms used in this utility model do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0024] like Figures 1 to 4 As shown, a high heat dissipation efficiency PCBA board includes a chassis housing 1. Inner slot posts 2 are fixedly connected to the four corners of the top of the chassis housing 1. A circuit board 3 is arranged between the tops of the inner slot posts 2. Mounting holes 4 are opened at the four corners of the top of the circuit board 3. The mounting holes 4 and the inner slot posts 2 are on the same vertical line. A chip 5 is fixedly connected to the top of the circuit board 3. A cooling mechanism for cooling the chip 5 is provided on the top of the circuit board 3. Inserts 11 are provided inside the inner slot posts 2 and the mounting holes 4. The inserts 11 have inner sliding grooves 12. A fixing mechanism for installing and removing the circuit board 3 is provided between the inner slot posts 2 and the mounting holes 4.

[0025] Further, see attached document. Figure 2 and Figure 3 As shown, the cooling mechanism includes a graphene sheet 6, which is fixedly connected to the top of the chip 5. A heat dissipation fin 7 is fixedly connected to the top of the graphene sheet 6. A circulation pump 8 is fixedly connected to the top of the circuit board 3. A heat-absorbing microtube 9 is fixedly connected to the output end of the circulation pump 8. Coolant flows inside the heat-absorbing microtube 9. A heat dissipation fan 10 is fixedly connected to the top of the circuit board 3. One end of the heat-absorbing microtube 9 penetrates the interior of the heat dissipation fin 7 and extends out of the outer wall of the heat dissipation fin 7. One end of the heat-absorbing microtube 9 is fixedly connected to the input end of the circulation pump 8. The heat-absorbing microtube 9 inside the heat dissipation fin 7 is arranged in a snake shape. The heat-absorbing microtube 9 outside the heat dissipation fin 7 is close to the side wall of the heat dissipation fan 10 and arranged in a U shape.

[0026] When the cooling mechanism is working, the chip 5 generates a large amount of heat during high-power operation. This heat is preferentially conducted to the graphene sheet 6. The graphene sheet 6, relying on its excellent thermal conductivity, quickly transfers the heat to the heat dissipation fins 7. Subsequently, the cooling fan 10 is activated to force air cooling of the heat dissipation fins 7, achieving initial cooling. Then, the circulation pump 8 is activated, which drives the coolant inside the heat-absorbing microtube 9 to circulate. When the coolant flows through the heat dissipation fins 7, it can fully absorb the heat conducted by the heat dissipation fins 7. Combined with the specific arrangement shape inside the heat-absorbing microtube 9, a large-area heat exchange effect is achieved on the heat dissipation fins 7. After absorbing heat, the coolant continues to flow to a position close to the cooling fan 10. While the cooling fan 10 cools the heat dissipation fins 7, it also effectively cools the coolant at the same time. In addition, the heat-absorbing microtube 9 forms a U-shaped bending structure on the side wall of the cooling fan 10, which further extends the cooling path and residence time of the coolant, significantly improving the cooling effect of the coolant. Overall, efficient and stable heat dissipation of the chip 5 is achieved.

[0027] Through the cooling mechanism, when the chip 5 operates at high power, the heat generated can be efficiently conducted to the graphene sheet 6. The graphene sheet 6, utilizing its excellent thermal conductivity, quickly and evenly distributes the heat to the heat dissipation fins 7, avoiding the problem of localized overheating of the chip 5 and improving the heat dissipation response speed. Under the forced air cooling effect of the cooling fan 10, the heat dissipation fins 7 can achieve rapid initial cooling. Simultaneously, the circulation pump 8 drives the coolant circulation within the heat-absorbing microtubes 9. The coolant can absorb the conducted heat over a large area at the heat dissipation fins 7, combined with the specific heat dissipation mechanism within the heat-absorbing microtubes 9... The fabric structure significantly improves the heat exchange area and efficiency, solving the problem of traditional PCBA boards relying on single air cooling. In addition, the heat-absorbing microtubes 9 have a U-shaped bending structure on the side wall of the heat dissipation fan 10, which extends the cooling path and residence time of the coolant, allowing the coolant to be fully cooled under the action of the heat dissipation fan 10. This further improves the overall heat dissipation performance of the coolant circulation system, thereby achieving stable heat dissipation of the chip 5 under high power and long-term working conditions. This reduces the performance degradation of circuit components caused by high temperature and equipment failure, ensuring the long-term reliable operation of the PCBA board.

[0028] Further, see attached document. Figure 1 and Figure 4 As shown, the fixing mechanism includes a slide rod 13, an external threaded column 14 rotatably connected to the top of the slide rod 13, an internal threaded groove 15 opened on the top of the plug 11, a conical block 16 fixedly connected to the bottom of the slide rod 13, ball grooves 17 opened on both sides of the outer wall of the plug 11, the ball grooves 17 are interconnected with the interior of the inner slide groove 12, a ball 18 is placed inside the ball groove 17, a limiting groove 19 is opened on both sides of the inner wall of the inner groove column 2, the outer wall of the ball 18 is adapted to the inner wall of the limiting groove 19, and a convenient rotating block 20 is fixedly connected to the top of the external threaded column 14 to facilitate the rotation of the external threaded column 14.

[0029] When using the fixing mechanism, the operator first takes the circuit board 3 and aligns the mounting hole 4 on the circuit board 3 with the top of the inner groove post 2. Then, the plug 11 is inserted so that the plug 11 passes through the mounting hole 4 and the inside of the inner groove post 2 in sequence to achieve the initial positioning of the circuit board 3.

[0030] Next, the rotating block 20 set at the top of the plug 11 is rotated. The rotating block 20 drives the external threaded column 14 to rotate in the internal threaded groove 15 and move downward along the internal threaded groove 15. While the external threaded column 14 moves downward, it drives the slide rod 13 connected to it to slide down along the internal slide groove 12. During the downward movement of the slide rod 13, it drives the tapered block 16 at its lower end to move downward synchronously. During the movement, the tapered block 16 applies radial extrusion force to the balls 18 distributed on both sides, causing some of the balls 18 to roll into the limiting groove 19, thus achieving effective fixation of the circuit board 3.

[0031] When circuit board 3 needs to be disassembled or repaired, the operator rotates the rotating block 20 in the opposite direction, causing the external threaded column 14 to rotate in the opposite direction within the internal threaded groove 15 and gradually move upward. When the external threaded column 14 moves upward, it drives the sliding rod 13 and the conical block 16 to reset upward. After the conical block 16 moves upward, it releases the radial limit on the ball 18. The ball 18 rolls back into the ball groove 17 under the action of gravity. At this time, the operator can directly pull out the plug 11 to release the limiting state of circuit board 3, thereby realizing the quick disassembly and replacement of circuit board 3, simplifying the maintenance and installation process, and improving work efficiency.

[0032] This fixing mechanism utilizes the cooperation of the external threaded post 14 and the slide bar 13, combined with the limiting effect of the conical block 16 and the ball bearing 18, to achieve quick and stable fixing of the circuit board 3 without relying on complex tools. Specifically, the plug 11 can easily achieve precise positioning and fixing of the circuit board 3 by rotating the rotating block 20, greatly reducing the disassembly difficulty caused by inconvenient screw positions or difficult tool operation. At the same time, during disassembly, simply rotating the rotating block 20 in the opposite direction will move the external threaded post 14 upward, releasing the limiting effect of the ball bearing 18, thereby achieving quick unlocking and disassembly of the circuit board 3, significantly improving the efficiency of maintenance and installation. Through this simplified operation, the cumbersome operation of using long and thin tools due to the space limitations of the chassis in traditional fixing methods is avoided, improving work efficiency, reducing labor and time costs, and greatly improving ease of use and work efficiency.

[0033] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples; within the framework of the present invention, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in the details for the sake of brevity.

[0034] This utility model is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A high heat dissipation efficiency PCBA board, comprising a chassis housing (1), wherein inner slot posts (2) are fixedly connected to the four corners of the top of the chassis housing (1), and a circuit board (3) is disposed between the tops of the inner slot posts (2), characterized in that: Mounting holes (4) are provided at the four corners of the top of the circuit board (3). The mounting holes (4) and the inner slot post (2) are on the same vertical line. A chip (5) is fixedly connected to the top of the circuit board (3). A cooling mechanism for cooling the chip (5) is provided on the top of the circuit board (3). A plug (11) is provided inside the inner slot post (2) and the mounting hole (4). An inner sliding groove (12) is provided inside the plug (11). A fixing mechanism for installing and removing the circuit board (3) is provided between the inner slot post (2) and the mounting hole (4).

2. The high heat dissipation efficiency PCBA board according to claim 1, characterized in that, The cooling mechanism includes a graphene sheet (6), which is fixedly connected to the top of the chip (5). A heat dissipation fin (7) is fixedly connected to the top of the graphene sheet (6). A circulation pump (8) is fixedly connected to the top of the circuit board (3). A heat-absorbing microtube (9) is fixedly connected to the output end of the circulation pump (8). A heat dissipation fan (10) is fixedly connected to the top of the circuit board (3). One end of the heat-absorbing microtube (9) penetrates the interior of the heat dissipation fin (7) and extends out of the outer wall of the heat dissipation fin (7). One end of the heat-absorbing microtube (9) is fixedly connected to the input end of the circulation pump (8).

3. A high heat dissipation efficiency PCBA board according to claim 2, characterized in that, The fixing mechanism includes a slide rod (13), the top of which is rotatably connected to an external threaded column (14), the top of which is provided with an internal threaded groove (15), the bottom of which is fixedly connected to a conical block (16), the outer walls of which are provided with ball grooves (17), the ball grooves (17) are connected to the interior of the inner slide groove (12), the ball grooves (17) are placed inside the ball grooves (17), and the inner walls of the inner groove column (2) are provided with limit grooves (19).

4. A high heat dissipation efficiency PCBA board according to claim 3, characterized in that, The top of the external threaded column (14) is fixedly connected to a rotatable block (20) that facilitates rotation of the external threaded column (14).

5. A high heat dissipation efficiency PCBA board according to claim 2, characterized in that, The heat-absorbing microtubes (9) inside the heat dissipation fins (7) are arranged in a snake shape, and the heat-absorbing microtubes (9) outside the heat dissipation fins (7) are close to the side wall of the heat dissipation fan (10) and arranged in a U shape.

6. A high heat dissipation efficiency PCBA board according to claim 3, characterized in that, The inner shape of the ball groove (17) is consistent with the top and bottom shapes of the outer wall of the ball (18), and the inner diameter of the ball groove (17) is larger than the outer diameter of the ball (18).

7. A high heat dissipation efficiency PCBA board according to claim 3, characterized in that, The outer wall of the ball (18) and the inner wall of the limiting groove (19) are adapted to each other.

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