Device for detecting warpage of wafer during hot drying

Abstract

The utility model relates to the technical field of wafer thermal drying devices, in particular to a wafer thermal drying warping detection device which comprises a platform and a supporting point arranged on the platform, the middle area of the platform is a supporting area, the supporting area is used for supporting the middle part of a wafer, and the supporting point is located in the supporting area; the area, located on the outer side of the supporting area, of the platform is a detection area, a probe parallel to the extending direction of a supporting point is arranged in the detection area, the probe is arranged in a lifting mode in the direction perpendicular to the surface of the platform, and a driving structure used for driving the probe to do lifting motion is arranged in the platform. The platform has the following effects that the supporting area located in the middle of the platform mainly supports the middle of the wafer, the probe located on the outer side of the supporting area achieves the function of making contact with the wafer after ascending and descending, and after hot drying is finished, if warping occurs, a gap exists between the probe and the wafer, so that the wafer is prevented from being damaged. At the moment, warpage of the wafer can be known through alarm or observation.

Description

Technical Field

[0001] This application relates to the technical field of wafer thermal baking apparatus, and in particular to a detection device for wafer thermal baking warpage. Background Technology

[0002] During the coating and baking process, a hot plate is used to heat the wafer, raising its overall temperature. However, due to the different coefficients of thermal expansion of the internal materials of the wafer, warping can easily occur around the periphery during heating, leading to an increase in wafer height. After baking, a robotic arm is typically used to retrieve the wafer. However, there is a risk of collision or wafer drop when the robotic arm picks up the warped wafer, necessitating optimization. Utility Model Content

[0003] To more easily determine whether a wafer has warped, this application provides a detection device for wafer warping during heat treatment.

[0004] This application provides a detection device for wafer warpage caused by thermal baking, which adopts the following technical solution: A detection device for wafer warpage caused by thermal baking includes a platform and support points disposed on the platform. The middle area of ​​the platform is a support area, which is used to support the middle part of the wafer. The support points are located within the support area. The area of ​​the platform outside the support area is a detection area. The detection area has probes parallel to the extension direction of the support points. The probes are vertically mounted in a direction perpendicular to the surface of the platform. The platform is provided with a driving structure for driving the probes to move vertically.

[0005] By adopting the above technical solution, the support area located in the middle of the platform mainly supports the middle part of the wafer, while the probe located outside the support area realizes the function of contacting the wafer after lifting and lowering. After the heat drying is completed, if warping occurs, there will be a gap between the probe and the wafer. At this time, the wafer warping can be detected by alarm or observation. In the subsequent wafer removal process, manual wafer removal can be used or the degree of warping can be determined to remove the wafer by a robotic arm.

[0006] Preferably, the support area is circular and is set at the same center as the wafer, and the detection area is annular.

[0007] Preferably, the probe has a contact sensor on its top for contacting the bottom of the wafer.

[0008] By adopting the above technical solution, this probe is mainly used to contact the wafer to determine whether warping has occurred.

[0009] Preferably, the probe has a distance sensor at its top for measuring the distance a from the bottom of the wafer.

[0010] By adopting the above technical solution, this probe can detect the distance between itself and the wafer. When 'a' is less than a certain value, the wafer can be picked up by a robotic arm.

[0011] Preferably, the drive structure includes a drive rod rotatably connected to the platform and a drive motor disposed on the platform and connected to the end of the drive rod. The end of the drive rod is threadedly connected to the probe, and the probe is circumferentially limited and axially slidingly connected to the platform.

[0012] By adopting the above technical solution, when the wafer warps during the process of judging warping by contact sensor, the probe can be moved upward again to contact the wafer again. At this time, the distance of the second movement can be obtained, and the approximate degree of wafer warping can be calculated by the distance, thereby determining whether the robot can successfully pick up the wafer.

[0013] Preferably, the bottom end of the probe is provided with a mating groove for the drive rod to pass through, and the inner wall of the mating groove is threadedly engaged with the drive rod.

[0014] Preferably, the platform has a sliding groove along the vertical direction for the probe to slide, and the probe has a limiting part with a rectangular cross section, and the sliding groove cooperates with the limiting part.

[0015] Preferably, the drive rod includes a smooth rod section connected to the drive motor and a threaded section embedded and threadedly connected to the mating groove. The bottom of the sliding groove has a receiving hole for the smooth rod section to pass through, and the inner wall of the receiving hole is used to circumferentially limit the smooth rod section.

[0016] Preferably, the drive motor has a ring edge around its periphery for fitting against the bottom of the platform, and the bottom of the platform is detachably connected to a fixing plate for fixing the ring edge to the platform.

[0017] Preferably, the fixing plate has a mounting hole for the drive motor to pass through, and the fixing plate also has a recessed groove concentric with the mounting hole, the recessed groove being used for the insertion of the ring edge.

[0018] In summary, this application includes at least one of the following beneficial technical effects:

[0019] 1. The support area located in the middle of the platform mainly supports the middle of the wafer, while the probe located outside the support area enables it to contact the wafer after lifting and lowering. If warping occurs after the heat treatment is completed, there will be a gap between the probe and the wafer. At this time, the wafer warping can be detected by alarm or observation.

[0020] 2. The support area located in the middle of the platform mainly supports the middle of the wafer, while the probe located outside the support area enables it to contact the wafer after lifting and lowering. If warping occurs after the heat treatment is completed, there will be a gap between the probe and the wafer. At this time, the wafer warping can be detected by alarm or observation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this application;

[0022] Figure 2 This is a top view of Embodiment 1 of this application;

[0023] Figure 3 This is a schematic diagram of the wafer support before heat baking in Embodiment 1 of this application;

[0024] Figure 4 This is a schematic diagram of the wafer warping after heat treatment in Embodiment 1 of this application;

[0025] Figure 5 This is a partial exploded view of Embodiment 1 of this application;

[0026] Figure 6 This is a schematic diagram of the drive rod structure in Embodiment 1;

[0027] Figure 7 This is a schematic diagram of the structure of the fixing plate in Example 1;

[0028] Figure 8 This is a schematic diagram of the drive rod structure in Embodiment 2 of this application.

[0029] Explanation of reference numerals in the attached drawings: 100, platform; 110, support point; 111, support area; 112, detection area; 113, probe; 114, contact sensor; 115, drive rod; 116, drive motor; 117, limiting part; 120, sliding groove; 121, receiving hole; 122, smooth rod section; 123, threaded section; 124, mating groove; 125, ring edge; 126, fixing plate; 127, mounting hole; 128, countersunk groove; 130, distance sensor. Detailed Implementation

[0030] The present application will be further described in detail below with reference to the accompanying drawings.

[0031] Example 1: Refer to Figure 1 , Figure 2Embodiment 1 of this application discloses a detection device for wafer warpage during thermal baking, including a platform 100 and support points 110 disposed on the platform 100. The central region of the platform 100 is a circular support area 111, which is concentric with the wafer. The support points 110 are located within the support area 111. The region of the platform 100 outside the support area 111 is an annular detection area 112, which has probes 113 parallel to the extension direction of the support points 110. In this embodiment, six probes 113 are evenly distributed circumferentially; in other embodiments, a greater number may be provided.

[0032] The probe 113 is positioned vertically in a direction perpendicular to the surface of the platform 100. A contact sensor 114 is mounted at the end of the probe 113 to detect whether it has made contact with the bottom of the wafer.

[0033] The specific operating procedure is as follows: Refer to point 3. Figure 4 First, the robotic arm places the wafer on the platform 100 and supports the wafer through the support point 110 in the middle area. At this time, the probe 113 is driven to move in a direction parallel to the support point 110, so that the probe 113 contacts the underside of the wafer.

[0034] Then, a heat-drying operation is performed. If warping occurs after the heat-drying is completed, the upper end of the probe 113 will not be in contact with the wafer, as can be determined by the contact sensor 114.

[0035] Subsequently, probe 113 is raised again until it contacts the wafer again. At this point, the degree of wafer warpage can be roughly calculated by the height h of the second rise. The range of the second rise height h is defined. When h is less than a certain value, the wafer can be picked up by a robotic arm. When h is greater than a certain value, it indicates that the warpage is too large and manual picking is required.

[0036] Specifically, refer to Figure 5 The platform 100 is provided with a drive structure for driving the probe 113 to move. The drive structure includes a drive rod 115 rotatably connected to the platform 100 and a drive motor 116 disposed on the platform 100 and connected to the end of the drive rod 115. The end of the drive rod 115 is threadedly connected to the probe 113. The probe 113 is circumferentially limited and axially slidably connected to the platform 100.

[0037] The lower section of probe 113 is a rectangular limiting part 117. Platform 100 has a sliding groove 120 that mates with the limiting part 117 in the vertical direction. In this embodiment, the lower end of the sliding groove 120 does not penetrate through platform 100. In this way, when the limiting part 117 moves, it can circumferentially limit probe 113 within the sliding groove 120 and realize sliding movement.

[0038] Reference Figure 5 ,Figure 6 The drive motor 116 is fixed to the lower side of the platform 100. The bottom of the sliding groove 120 has a receiving hole 121. The drive rod 115 includes a smooth rod section 122 connected to the drive motor 116 and a threaded section 123. The drive rod 115 passes through the receiving hole 121 and enters the sliding groove 120. At the same time, the bottom end of the probe 113 has a mating groove 124. The drive rod 115 is inserted into the mating groove 124. Specifically, the smooth rod section 122 mates with the receiving hole 121, while the threaded section 123 is threaded into the inner wall of the mating groove 124. When the drive motor 116 is working, the drive rod 115 rotates synchronously. Because the limiting part 117 keeps the probe 113 circumferentially confined within the sliding groove 120, the threaded section 123 will cause the probe 113 to rise as a whole, thereby achieving the purpose of contacting the wafer.

[0039] Reference Figure 5 , Figure 7 The drive motor 116 has a ring edge 125 around its periphery for fitting against the bottom of the platform 100. A fixing plate 126 is detachably connected to the bottom of the platform 100 for fixing the ring edge 125 to the platform 100. The fixing plate 126 can fix all the drive motors 116 together. The fixing plate 126 has mounting holes 127 for the drive motors 116 to pass through, and also has a recess 128 concentric with the mounting holes 127 for the ring edge 125 to be inserted. When the fixing plate 126 is installed on the underside of the platform 100, the drive motors 116 can be easily fixed to the underside of the platform 100 via the ring edge 125.

[0040] Example 2: The difference from Example 1 is that, referring to... Figure 8 In this embodiment, the probe 113 has a distance sensor 130 at its top, which is used to measure the distance 'a' between the probe 113 and the bottom of the wafer. When the wafer is placed, the probe 113 moves to a position where the distance between the probe 113 and the wafer is 0. When warping occurs, the distance 'a' between the probe 113 and the wafer can be detected. The degree of wafer warping can be determined by the distance 'a', thereby determining whether to operate with a robotic arm.

[0041] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A detection device for wafer warpage caused by thermal baking, comprising a platform (100) and support points (110) disposed on the platform (100), characterized in that: The middle area of ​​the platform (100) is a support area (111), which is used to support the middle part of the wafer. The support point (110) is located in the support area (111). The area of ​​the platform (100) outside the support area (111) is a detection area (112). The detection area (112) has a probe (113) parallel to the extension direction of the support point (110). The probe (113) is raised and lowered in a direction perpendicular to the surface of the platform (100). The platform (100) is provided with a driving structure for driving the probe (113) to move up and down.

2. The detection device for wafer warpage during thermal baking according to claim 1, characterized in that: The support area (111) is circular and is set at the same center as the wafer, and the detection area (112) is annular.

3. The detection device for wafer warpage during thermal baking according to claim 2, characterized in that: The probe (113) has a contact sensor (114) on top for contacting the bottom of the wafer.

4. The detection device for wafer warpage during thermal baking according to claim 2, characterized in that: The probe (113) has a distance sensor (130) on top for measuring the distance a from the bottom of the wafer.

5. The detection device for wafer warpage during thermal baking according to claim 3, characterized in that: The drive structure includes a drive rod (115) rotatably connected to the platform (100) and a drive motor (116) disposed on the platform (100) and connected to the end of the drive rod (115). The end of the drive rod (115) is threadedly connected to the probe (113). The probe (113) is circumferentially limited and axially slidingly connected to the platform (100).

6. The detection device for wafer warpage during thermal baking according to claim 5, characterized in that: The probe (113) has a mating groove (124) at its bottom end for the drive rod (115) to pass through, and the inner wall of the mating groove (124) is threadedly engaged with the drive rod (115).

7. The detection device for wafer warpage during thermal baking according to claim 6, characterized in that: The platform (100) is provided with a sliding groove (120) along the vertical direction for the probe (113) to slide. The probe (113) has a limiting part (117) with a rectangular cross section. The sliding groove (120) cooperates with the limiting part (117).

8. The detection device for wafer warpage during thermal baking according to claim 7, characterized in that: The drive rod (115) includes a smooth rod section (122) connected to the drive motor (116) and a threaded section (123) embedded and threadedly connected to the mating groove (124). The bottom of the sliding groove (120) has a receiving hole (121) for the smooth rod section (122) to pass through. The inner wall of the receiving hole (121) is used to circumferentially limit the smooth rod section (122).

9. The detection device for wafer warpage during thermal baking according to claim 5, characterized in that: The drive motor (116) has a ring edge (125) around its periphery for fitting against the bottom of the platform (100), and the bottom of the platform (100) is detachably connected to a fixing plate (126) for fixing the ring edge (125) to the platform (100).

10. The detection device for wafer warpage during thermal baking according to claim 9, characterized in that: The fixing plate (126) has a mounting hole (127) through which the drive motor (116) passes, and the fixing plate (126) also has a recess (128) concentric with the mounting hole (127), the recess (128) being used for the insertion of the ring edge (125).

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