3D stacked novel power module

Abstract

The utility model discloses a 3D laminated novel power module, include: power module main part, the upper and lower both sides of power module main part all are fixedly connected with a heat dissipation bottom plate, the outside of power module main part is provided with the plastic package layer, and power module main part includes: two symmetrical interval arrangement's ceramic substrate, the upper and lower surface of ceramic substrate is covered copper and is arranged, and etching forms circuit, and the chip is all electrically connected on ceramic substrate, and the chip between two ceramic substrates and the chip and opposite side ceramic substrate between through a plurality of molybdenum block conduction, and the chip between two ceramic substrates staggered arrangement, the both sides of ceramic substrate are provided with the metal lead frame for with external electric connection, the upper and lower both sides of power module main part all are fixedly connected with heat dissipation bottom plate, and this both sides heat dissipation's mode can improve heat dissipation efficiency obviously, compared with traditional single -sided heat dissipation power module, both sides heat dissipation can increase the heat dissipation area, so that the heat can be more quickly from power module radiate.

Description

Technical Field

[0001] This utility model belongs to the field of chip heat dissipation technology, and specifically relates to a novel 3D stacked power module. Background Technology

[0002] Currently, the performance advantages of conventional bifacial modules on the market are not obvious. This is mainly due to their single cooling direction, low heat dissipation efficiency, and the inability to reduce the operating junction temperature of the module. Secondly, the chip layout design results in the same direction of the operating current between chips, which increases stray inductance. Additionally, the module structure is ordinary, requiring additional cooling channels during operation, which increases the size and weight of the entire system. As a result, the performance improvement of existing bifacial modules is not significant, and the SiC chip cannot fully utilize its advantages.

[0003] Therefore, this application provides a novel 3D stacked power module, which aims to solve the problems of low heat dissipation efficiency and low system integration of existing bifacial modules, and meet users' higher application requirements for bifacial modules. Utility Model Content

[0004] This invention provides a novel 3D stacked power module, which aims to solve the problems mentioned above in the background technology.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A novel 3D stacked power module includes: a power module body, wherein a heat dissipation base plate is fixedly connected to both the upper and lower sides of the power module body;

[0007] The power module body is provided with a plastic encapsulation layer on the outside. The power module body includes two symmetrically spaced ceramic substrates. The upper and lower surfaces of the ceramic substrates are coated with copper and etched to form circuits. Several chips are electrically connected on each ceramic substrate. The two ceramic substrates and the chips are connected to the opposite ceramic substrate through several molybdenum blocks. The chips between the two ceramic substrates are staggered.

[0008] The ceramic substrate has metal lead frames on both sides for external electrical connection.

[0009] Furthermore, a coolant flow channel is provided through the middle of the heat dissipation base plate, the coolant flow channel is arranged along the length direction of the heat dissipation base plate, and a plurality of heat dissipation columns are provided in the inner cavity of the coolant flow channel.

[0010] Furthermore, several heat dissipation columns form several rows in the coolant flow channel, with the heat dissipation columns in each row being distributed at equal intervals, and the heat dissipation columns in adjacent rows being arranged alternately.

[0011] Furthermore, the metal lead frame includes: several pairs of lead terminals and several lead plates, the lead plates and lead terminals are respectively disposed on both sides of the power module body, the lead plates are electrically connected to a ceramic substrate, and the several pairs of lead terminals are respectively electrically connected to several chips.

[0012] Furthermore, the chip is electrically connected to the circuitry on the ceramic substrate via bonding wires, and then electrically connected to the lead terminals.

[0013] Furthermore, the molding layer is epoxy resin.

[0014] Furthermore, the heat dissipation base plate is made of copper and has a nickel-plated surface.

[0015] Furthermore, the bonding wire is an aluminum wire.

[0016] Compared with the prior art, the present invention has the following technical effects:

[0017] 1. The 3D stacked power module of this utility model has heat dissipation base plates fixedly connected to both the upper and lower sides of the power module body. This dual-sided heat dissipation method can significantly improve heat dissipation efficiency. Compared with traditional single-sided heat dissipation power modules, dual-sided heat dissipation can increase the heat dissipation area, allowing heat to be dissipated from the power module more quickly. When the power module generates heat during operation, the heat can be transferred to the surrounding environment simultaneously through the upper and lower heat dissipation base plates, effectively reducing the internal temperature of the module and preventing chip performance degradation or even damage due to excessive temperature. This improves the reliability and stability of the power module and extends its service life.

[0018] 2. The novel 3D stacked power module of this invention utilizes several molybdenum blocks for electrical conduction between two ceramic substrates and between the chip and the opposite ceramic substrate. Molybdenum has excellent thermal conductivity, enabling it to rapidly conduct heat generated by the chip to the ceramic substrate and heat sink while transmitting current, further enhancing the module's heat dissipation performance. Furthermore, the coefficient of thermal expansion of molybdenum is close to that of the chip and ceramic substrate, reducing thermal stress caused by temperature changes and lowering the risk of damage to the chip and other components.

[0019] 3. The heat dissipation base plate of the novel 3D stacked power module described in this utility model has a closed channel structure. The module does not require an additional matching cooling water channel structure, reducing the overall weight and volume. Several heat dissipation columns arranged within the coolant flow channel significantly increase the heat dissipation area in contact with the coolant. As the coolant flows through the channel, it makes full contact with the heat dissipation columns, allowing the coolant to carry away more heat. Compared to a smooth flow channel without heat dissipation columns, the heat dissipation columns provide additional heat dissipation surface, making the heat transfer from the heat dissipation base plate to the coolant more efficient, thereby more effectively reducing the temperature of the power module and ensuring its normal and stable operation. Attached Figure Description

[0020] Figure 1 This is an overall schematic diagram of a novel 3D stacked power module according to the present invention;

[0021] Figure 2 This is a schematic diagram of the main body of a 3D stacked novel power module according to the present invention;

[0022] Figure 3 This is a side view of the main body of a 3D stacked novel power module according to this utility model;

[0023] Figure 4 This is an overall side view of a novel 3D stacked power module according to this utility model;

[0024] Figure 5 This is a cross-sectional view of the coolant flow channel of a novel 3D stacked power module according to this utility model;

[0025] Figure 6 This is a rotational exploded view of the main body of the power module of the 3D stacked novel power module described in this utility model;

[0026] Figure 7 This is a schematic diagram of the upper ceramic substrate of a novel 3D stacked power module according to this utility model;

[0027] Figure 8 This is a schematic diagram of the lower ceramic substrate of a novel 3D stacked power module according to this utility model;

[0028] Figure 9 This is a schematic diagram of the current flow direction of a novel 3D stacked power module according to this utility model;

[0029] Figure 10 This is an infrared thermal image of the chip of a novel 3D stacked power module as described in this utility model;

[0030] Figure 11 It is an infrared thermal image of a power module chip using existing technology.

[0031] In the picture:

[0032] 1. Power module body; 101. Ceramic substrate; 102. Chip; 103. Molybdenum block; 104. Bonding wire; 105. Lead terminal; 106. Lead board;

[0033] 2. Plastic sealant layer;

[0034] 3. Heat dissipation base plate; 301. Coolant flow channel; 302. Heat dissipation column. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to specific embodiments of this application and the accompanying drawings.

[0036] like Figure 1-3 and Figure 6-8 As shown, a novel 3D stacked power module is characterized by comprising: a power module body 1, wherein a heat dissipation base plate 3 is fixedly connected to both the upper and lower sides of the power module body 1;

[0037] The power module body 1 is provided with a plastic encapsulation layer 2 on its exterior. The power module body 1 includes two symmetrically spaced ceramic substrates 101. The upper and lower surfaces of the ceramic substrates 101 are coated with copper and etched to form circuits. Several chips 102 are electrically connected to each ceramic substrate 101. The two ceramic substrates 101 and the chips 102 are connected to the opposite ceramic substrate 101 through several molybdenum blocks 103. The chips 102 between the two ceramic substrates 101 are staggered.

[0038] Metal lead frames for external electrical connection are provided on both sides of the ceramic substrate 101.

[0039] like Figure 9 As shown, the current loop formed by the ceramic substrate 101, chip 102, molybdenum block 103 and metal lead frame causes the current flow of the chip 102 on the two ceramic substrates 101 to be opposite.

[0040] In the circuitry of a power module, parasitic inductance affects the rate of change of current, leading to problems such as voltage spikes and potentially damaging the chip. When the current flows in opposite directions on the chip 102 on the two ceramic substrates 101, according to the principle of electromagnetic induction, the magnetic fields they generate are in opposite directions. These opposing magnetic fields partially cancel each other out, effectively reducing the parasitic inductance of the entire current loop. Lower parasitic inductance helps reduce voltage spikes, making the power module more stable during switching, improving the efficiency of power conversion, and reducing energy loss.

[0041] Reversing the current flow direction can make the circuit parameters on the two ceramic substrates 101 more balanced. For example, in a power module with multiple chips 102 connected in parallel, the current distribution of different chips 102 may be uneven due to individual differences in the chips 102 and the influence of circuit layout. By reversing the current flow direction, the current distribution of each chip 102 can be balanced to a certain extent, avoiding individual chips 102 from overheating and being damaged due to excessive current, thereby improving the overall reliability and lifespan of the power module.

[0042] like Figure 10-11 As shown, heat dissipation plates 3 are fixedly connected to both the upper and lower sides of the power module body 1. This dual-sided heat dissipation method can significantly improve heat dissipation efficiency. Compared with traditional single-sided heat dissipation power modules, dual-sided heat dissipation can increase the heat dissipation area, allowing heat to be dissipated from the power module more quickly. When the power module generates heat during operation, the heat can be transferred to the surrounding environment simultaneously through the upper and lower heat dissipation plates 3, effectively reducing the internal temperature of the module and preventing the performance of chip 102 from degrading or even being damaged due to excessive temperature. This improves the reliability and stability of the power module and extends its service life.

[0043] The two ceramic substrates 101 are connected by several molybdenum blocks 103, as are the chip 102 and the opposite ceramic substrate 101. Molybdenum has good thermal conductivity, which allows it to quickly conduct the heat generated by the chip 102 to the opposite ceramic substrate 101 and the heat sink 3 while carrying current, further enhancing the module's heat dissipation performance. In addition, the coefficient of thermal expansion of molybdenum is close to that of the chip 102 and the ceramic substrate 101, which can reduce thermal stress caused by temperature changes and lower the risk of damage to the chip and other components.

[0044] In one specific embodiment, chip 102 is a SiC MOS chip, a third-generation wide bandgap semiconductor chip; the metal lead frame is made of pure copper or pure copper plated with gold.

[0045] like Figure 1 and Figure 5 As shown, a coolant flow channel 301 is provided through the middle of the heat dissipation base plate 3. The coolant flow channel 301 is arranged along the length direction of the heat dissipation base plate 3, and a plurality of heat dissipation columns 302 are provided in the inner cavity of the coolant flow channel 301.

[0046] like Figure 5 As shown, several heat dissipation columns 302 form several rows in the coolant flow channel 301. The heat dissipation columns 302 in each row are distributed at equal intervals, and the heat dissipation columns 302 in adjacent rows are arranged alternately.

[0047] The heat dissipation base plate 3 features a closed-channel structure, eliminating the need for an additional cooling water channel structure for the power module, thus reducing the overall weight and volume. Several heat dissipation columns 302 within the coolant flow channel 301 significantly increase the heat dissipation area in contact with the coolant. As the coolant flows through the channel, it makes full contact with the heat dissipation columns 302, allowing the coolant to carry away more heat. Compared to a smooth flow channel without heat dissipation columns 302, the heat dissipation columns 302 provide additional heat dissipation surface, making the heat transfer from the heat dissipation base plate to the coolant more efficient, thereby more effectively reducing the temperature of the power module and ensuring its normal and stable operation.

[0048] As the coolant flows through the flow channel, the heat dissipation columns 302 create turbulence. Because the heat dissipation columns 302 in adjacent rows are staggered, the coolant continuously changes direction during flow, creating a turbulent state. This turbulence breaks down the boundary layer of the coolant, resulting in a more uniform heat distribution within the coolant and improving the heat exchange efficiency between the coolant, the heat dissipation columns 302, and the flow channel walls. Compared to laminar flow, turbulent flow can transfer heat more quickly from the heat dissipation columns 302 and the flow channel walls into the coolant, which then carries the heat away.

[0049] like Figure 2-4 and Figure 6-8 As shown, the metal lead frame includes: a plurality of pairs of lead terminals 105 and a plurality of lead plates 106. The lead plates 106 and lead terminals 105 are respectively disposed on both sides of the power module body 1. The lead plates 106 are electrically connected to a ceramic substrate 101, and the plurality of pairs of lead terminals 105 are respectively electrically connected to a plurality of chips 102.

[0050] like Figure 6-8 As shown, the chip 102 is electrically connected to the circuit on the ceramic substrate 101 via bonding wire 104 and then electrically connected to the lead terminal 105.

[0051] The metal lead frame design facilitates easier connection of the power module to external circuits. The placement and arrangement of the lead plate 106 and lead terminals 105 can be designed according to standard mounting interfaces, enabling easy integration of the power module into various electronic devices or systems. This standardized design helps improve production efficiency, reduce production costs, and also facilitates equipment maintenance and replacement.

[0052] In one specific embodiment, the molding layer 2 is epoxy resin. Epoxy resin has excellent electrical insulation properties, which can effectively prevent leakage between the internal circuit of the power module and the outside world, ensuring electrical safety during use. When the power module is working, it can isolate the energized components such as the chip 102 and the ceramic substrate 101 from the surrounding environment, avoiding malfunctions or safety accidents caused by leakage.

[0053] In one specific embodiment, the heat dissipation base plate 3 is made of copper and has a nickel-plated surface. Copper has extremely high thermal conductivity, enabling it to quickly conduct heat generated by the power module away. As the heat dissipation base plate 3, copper can effectively reduce the internal temperature of the module, improving the operating efficiency and reliability of the power module. Nickel plating on the copper surface improves the corrosion resistance of the heat dissipation base plate 3. The nickel layer prevents oxidation and corrosion of copper in humid or corrosive environments, extending the service life of the heat dissipation base plate 3. Simultaneously, the nickel plating layer also improves the surface hardness and wear resistance of the heat dissipation base plate 3, making it more durable during use.

[0054] In one specific embodiment, the bonding wire 104 is aluminum wire. Aluminum is relatively inexpensive, and using aluminum wire as the bonding wire 104 can significantly reduce production costs compared to other metal bonding wire materials (such as gold wire). This cost reduction can enhance the product's market competitiveness during large-scale production of power modules.

[0055] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of the present utility model, and these all fall within the protection scope of the present utility model.

Claims

1. A novel 3D stacked power module, characterized in that, include: The power module body (1) has a heat dissipation base plate (3) fixedly connected to both the upper and lower sides of the power module body (1); The power module body (1) is provided with a plastic encapsulation layer (2) on the outside. The power module body (1) includes two symmetrically spaced ceramic substrates (101). The upper and lower surfaces of the ceramic substrates (101) are coated with copper and etched to form circuits. Several chips (102) are electrically connected on the ceramic substrates (101). The two ceramic substrates (101) are connected to each other and the chips (102) are connected to the opposite ceramic substrate (101) through several molybdenum blocks (103). The chips (102) between the two ceramic substrates (101) are staggered. The ceramic substrate (101) has metal lead frames on both sides for external electrical connection.

2. The novel 3D stacked power module according to claim 1, characterized in that, A coolant flow channel (301) is provided through the middle of the heat dissipation base plate (3). The coolant flow channel (301) is arranged along the length direction of the heat dissipation base plate (3). A plurality of heat dissipation columns (302) are provided in the inner cavity of the coolant flow channel (301).

3. The novel 3D stacked power module according to claim 2, characterized in that, Several heat dissipation columns (302) form several rows in the coolant flow channel (301), with the heat dissipation columns (302) in each row being distributed at equal intervals, and the heat dissipation columns (302) in adjacent rows being arranged alternately.

4. A novel 3D stacked power module according to claim 1, characterized in that, The metal lead frame includes: a plurality of pairs of lead terminals (105) and a plurality of lead plates (106), the lead plates (106) and the lead terminals (105) are respectively disposed on both sides of the power module body (1), the lead plates (106) are electrically connected to a ceramic substrate (101), and the plurality of pairs of lead terminals (105) are respectively electrically connected to a plurality of chips (102).

5. A novel 3D stacked power module according to claim 4, characterized in that, The chip (102) is electrically connected to the circuit on the ceramic substrate (101) via bonding wire (104) and then electrically connected to the lead terminal (105).

6. A novel 3D stacked power module according to claim 1, characterized in that, The sealing layer (2) is epoxy resin.

7. A novel 3D stacked power module according to claim 1, characterized in that, The heat dissipation base plate (3) is made of copper and has a nickel-plated surface.

8. A novel 3D stacked power module according to claim 5, characterized in that, The bonding wire (104) is an aluminum wire.

Images