A fully automatic topcoat machine for semiconductor substrate packaging with multi-station operation

Abstract

The utility model relates to the technical field of surface coating machines, and specifically discloses a full-automatic surface coating machine for semiconductor sheet packaging with multi-station operation. It includes a frame base, and is characterized in that: a feeding area, a接驳对位区 (connection and alignment area), a coating area and a discharging area are provided on the frame base; a feeding transportation table is provided in the feeding area, an intermediate transportation table is provided in the connection and alignment area, a discharging transportation table is provided in the discharging area, and the intermediate transportation table moves back and forth along the Y-axis in the connection and alignment area and the coating area on the frame base by arranging a Y-axis driving component; a coating gantry is provided on the coating area of the frame base, a nozzle component is provided on the coating gantry, and the nozzle component moves along the X-axis and the Z-axis on the coating gantry by arranging an X-axis driving component and a Z-axis driving component; a visual positioning device is provided on the nozzle component. In the utility model, multi-station parallel operation processing can be carried out simultaneously in the feeding area, the coating area and the discharging area, so as to improve the production efficiency, and the combination of XYZ three-axis movement and the visual positioning device improves the coating accuracy. It should be noted that the term "接驳对位区" in the original text seems to be a Chinese term that may need to be further defined or replaced with a more standard English term if possible for better clarity in the translation. Here it is directly translated as "接驳对位区" for the purpose of following the translation rules strictly while waiting for possible improvement.

Description

Technical Field

[0001] This utility model relates to the technical field of topcoat machines, and specifically discloses a fully automatic topcoat machine for semiconductor substrate packaging with multi-station operation. Background Technology

[0002] In the semiconductor packaging field, surface coating of COB modules or MLED boards is one of the key processes. This process typically requires precisely coating the chip surface with protective adhesives (such as silicone or epoxy resin) or optical materials (such as phosphor adhesives) to ensure product reliability and optical performance. However, traditional processes mostly rely on manual operation or semi-automatic equipment, which is not only inefficient but also results in extremely unstable coating accuracy. During manual coating, problems such as uneven adhesive application and coating position misalignment often occur, seriously affecting product performance and quality.

[0003] While existing fully automated topcoat machines have improved production efficiency to some extent, their loading and unloading efficiency remains low, and the coordination between multiple workstations is poor, resulting in significant waiting time during operation, low equipment utilization, and difficulty in improving production efficiency. Furthermore, the visual positioning accuracy of existing equipment is insufficient to meet the requirements of high-precision coating, further impacting product quality and production efficiency. These problems not only increase production costs but also reduce equipment stability and reliability, making it difficult to meet the demands of the modern semiconductor packaging industry for high-efficiency, high-precision production. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation.

[0005] This utility model discloses a fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation, which adopts the following technical solution:

[0006] A fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation includes a frame base, on which are arranged a loading area, a docking and alignment area, a coating area, and a unloading area. The loading area, docking and alignment area, and unloading area are arranged sequentially along the X-axis. The loading area is equipped with an infeed conveyor, the docking and alignment area is equipped with an intermediate conveyor, and the unloading area is equipped with an outfeed conveyor. The intermediate conveyor moves back and forth along the Y-axis between the docking and alignment area and the coating area on the frame base via a Y-axis drive assembly. The coating area on the frame base is equipped with a coating gantry, and the coating gantry is equipped with a nozzle assembly. The nozzle assembly moves along the X-axis and Z-axis on the coating gantry via X-axis drive assemblies and Z-axis drive assemblies, respectively. The nozzle assembly is equipped with a vision positioning device, which is used to detect the position of the substrate on the intermediate conveyor and feed back the information to the X-axis drive assembly and the Y-axis drive assembly.

[0007] Preferably, the frame base is provided with an ink receiving tray assembly, which is located at one end of the printhead assembly along the X-axis movement path and below the printhead assembly.

[0008] Preferably, the frame base is provided with a nozzle stop assembly, which is located at the other end of the nozzle assembly's movement path along the X-axis and below the nozzle assembly.

[0009] Preferably, the nozzle stop assembly is provided with sponge or non-woven fabric.

[0010] Preferably, the nozzle assembly is equipped with a temperature sensor and a flow sensor.

[0011] Preferably, the feeding area, the docking and alignment area, and the unloading area are all equipped with infrared sensors.

[0012] Preferably, the intermediate transport platform is provided with a fixture and a clamping assembly for driving the fixture to clamp the plate.

[0013] Preferably, the nozzle assembly includes a plurality of detachably configured dispensing valves.

[0014] Preferably, the feeding conveyor, intermediate conveyor, and discharge conveyor all include a conveyor and a hinged conveyor belt that matches the conveyor, and the conveyor is detachably mounted on the frame base.

[0015] Preferably, the Y-axis drive assembly includes a Y-axis track mounted on the frame base, a Y-axis moving stage mounted on the Y-axis track, and a Y-axis drive component for driving the Y-axis drive stage to move along the Y-axis track; the X-axis drive assembly includes an X-axis track mounted on the coating gantry, an X-axis drive stage mounted on the X-axis track, and an X-axis drive component for driving the X-axis drive stage to move along the X-axis track; the Z-axis drive assembly includes a Z-axis track mounted on the X-axis drive stage, a Z-axis drive stage mounted on the Z-axis track, and a Z-axis drive component for driving the Z-axis drive stage to move along the Z-axis track; the nozzle assembly is mounted on the Z-axis drive stage.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] This invention features a layout comprising a feeding area, a docking and alignment area, a coating area, and a discharging area. The feeding area has an infeed conveyor, the docking and alignment area has an intermediate conveyor, and the discharging area has an outlet conveyor. The coating area includes a nozzle assembly, an X-axis drive assembly, and a Z-axis drive assembly. A Y-axis drive assembly connects the docking and alignment area to the coating area. This allows for simultaneous multi-station parallel processing in the feeding, coating, and discharging areas, reducing waiting time and improving production efficiency. Furthermore, the XYZ three-axis motion combined with a vision positioning device effectively improves coating accuracy, reduces manual labor requirements, and lowers material waste. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a fully automatic topcoat machine for semiconductor substrate packaging with multi-station operation according to this embodiment.

[0019] Explanation of icon numbers:

[0020] 1. Frame base; 2. Feed conveyor; 3. Intermediate conveyor; 31. Fixture; 4. Discharge conveyor; 5. Conveyor; 6. Hinged conveyor belt; 7. Coating gantry; 8. Printhead assembly; 9. X-axis drive assembly; 10. Y-axis drive assembly; 11. Z-axis drive assembly; 12. Ink tray assembly; 13. Printhead stop assembly. Detailed Implementation

[0021] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] This embodiment discloses a fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation, referring to... Figure 1, which includes a frame base 1. An upper feeding area, a接驳对位区 (connector alignment area), a coating area, and a discharging area are provided on the frame base 1. The upper feeding area, the connector alignment area, and the discharging area are arranged in sequence along the X-axis; the upper feeding area is provided with a feeding transport table 2, the connector alignment area is provided with an intermediate transport table 3, the discharging area is provided with a discharging transport table 4, and the intermediate transport table 3 moves back and forth along the Y-axis in the connector alignment area and the coating area on the frame base 1 by means of a Y-axis driving component 10. Specifically, the feeding transport table 2, the intermediate transport table 3, and the discharging transport table 4 all include a transport table 5 and a hinge conveyor belt 6 that is配套 with the transport table 5. In other embodiments, other transport devices other than the hinge conveyor belt can also be used. In addition, a coating gantry 7 is provided on the coating area of the frame base 1, and a nozzle assembly 8 is provided on the coating gantry 7. The nozzle assembly 8 moves along the X-axis and the Z-axis on the coating gantry 7 by means of an X-axis driving component 9 and a Z-axis driving component 11; a visual positioning device is provided on the nozzle assembly 8. The visual positioning device is used to detect the position of the sheet on the intermediate transport table 3 and feedback information to the X-axis driving component 9 and the Y-axis driving component 10. The visual positioning device is specifically a high-resolution industrial camera combined with a light source, which can collect the position and size data of the sheet in real time. In addition, it can cooperate with image processing algorithms (template matching, edge detection) to achieve sub-pixel-level positioning accuracy, identify the position and size of the sheet, calculate the spraying route, and achieve precise spraying. By adopting this layout and collaborative working mode of the upper feeding area, the connector alignment area, the coating area, and the discharging area, efficient operation of multiple workstations is achieved. Each workstation processes in parallel, reducing waiting time, improving production efficiency, and the processing time for a single sheet is ≤ 30 seconds.

[0023] As a preferred solution, an ink receiving tray assembly 12 is provided on the frame base 1. The ink receiving tray assembly 12 is at one end of the movement route of the nozzle assembly 8 along the X-axis and is located below the nozzle assembly 8. After the sheet is sprayed, the X-axis driving component 9 will automatically drive the nozzle assembly 8 to move above the ink receiving tray assembly 12, preventing the ink from falling on the equipment tabletop, thus keeping the equipment tabletop clean, avoiding ink contamination of the equipment, extending the service life of the equipment, and at the same time being beneficial to maintaining a good production environment.

[0024] As a preferred solution, a nozzle stop component 13 is provided on the frame base 1. The nozzle stop component 13 is at the other end of the movement route of the nozzle assembly 8 along the X-axis and is located below the nozzle assembly 8. A sponge or non-woven fabric is provided on the nozzle stop component 13. When the machine stops working, the nozzle assembly 8 stops at the position of the nozzle stop component 13. The sponge or non-woven fabric can absorb a small amount of ink that may drip when the nozzle stops, preventing the ink from depositing on the equipment, thus ensuring the smoothness of the nozzle, ensuring that the equipment can work normally when it is started next time, improving the stability and reliability of the equipment, and reducing the maintenance cost of the equipment.

[0025] As a preferred embodiment, the printhead assembly 8 is equipped with a temperature sensor and a flow sensor. The temperature and flow sensors can monitor the temperature and ink flow rate in real time during the spraying process, ensuring the stability and consistency of the spraying process, avoiding spraying quality problems caused by temperature and flow fluctuations, and improving product quality and stability.

[0026] As a preferred solution, infrared sensors are installed in the loading area, the docking and alignment area, and the unloading area. The infrared sensors can identify the entry and exit of the sheet metal and also have a counting function, enabling real-time monitoring of the sheet metal flow, realizing automated monitoring and management of the production process, and improving production efficiency and management level.

[0027] As a preferred embodiment, the intermediate transport table 3 is equipped with a jig 31 and a clamping assembly for driving the jig 31 to clamp the sheet metal. The jig 31 and the clamping assembly can ensure the stability and accuracy of the sheet metal during transportation and spraying, prevent the sheet metal from shifting or shaking during movement, thereby further improving the accuracy and quality of spraying.

[0028] As a preferred embodiment, the nozzle assembly 8 includes multiple detachably mounted dispensing valves. These multi-channel dispensing valves support different glue volumes and flow rates, meeting the spraying needs of various specifications and requirements. They also facilitate quick replacement and adjustment based on different production needs, improving equipment adaptability and production efficiency.

[0029] As a preferred option, the conveyor platforms 5 on the infeed conveyor platform 2, intermediate conveyor platform 3, and discharge conveyor platform 4 can all be detached from the frame base 1. This design allows the conveyor platforms 5 to be quickly replaced and adjusted according to production needs, improving the flexibility and adaptability of the equipment, while also facilitating equipment maintenance and upkeep.

[0030] As a preferred embodiment, the Y-axis drive assembly 10 includes a Y-axis rail mounted on the frame base 1, a Y-axis moving stage mounted on the Y-axis rail, and a Y-axis drive component for driving the Y-axis drive stage to move along the Y-axis rail; the X-axis drive assembly 9 includes an X-axis rail mounted on the coating gantry 7, an X-axis drive stage mounted on the X-axis rail, and an X-axis drive component for driving the X-axis drive stage to move along the X-axis rail; the Z-axis drive assembly 11 includes a Z-axis rail mounted on the X-axis drive stage, a Z-axis drive stage mounted on the Z-axis rail, and a Z-axis drive component for driving the Z-axis drive stage to move along the Z-axis rail; the nozzle assembly 8 is mounted on the Z-axis drive stage. In other embodiments, the Z-axis rail can be mounted on the frame base 1, the X-axis rail can be mounted on the Z-axis drive stage, and the nozzle assembly 8 can be mounted on the X-axis drive stage, which also achieves drive control of the X and Z axes of the nozzle assembly 8. The X-axis drive component, Y-axis drive component, and Z-axis drive component can be cylinders or stepper motors. The high-precision XYZ three-axis motion platform can dynamically adjust the coating path and perform precise spraying operations according to the shape and size of the sheet material, achieving uniform spraying of complex shapes and large-area sheets, thus improving the quality and efficiency of spraying.

[0031] The working principle of the fully automated topcoat machine for multi-station semiconductor substrate packaging in this solution is as follows:

[0032] When the sheet material is transferred from the feeding conveyor 2 to the intermediate conveyor 3, an infrared sensor confirms that the sheet material is on the fixture 31. The clamping assembly of the fixture 31 then clamps the sheet material for rapid positioning. The Y-axis drive assembly 10 drives the intermediate conveyor 3 to move towards the coating area, automatically stopping when it reaches the preset position. The spray nozzle assembly 8 moves on the coating gantry 7 to above the sheet material via the X-axis drive assembly 9. Feedback from the visual positioning device identifies the sheet material's position, and the Z-axis drive assembly 11 lowers it to the preset height to spray the upper surface of the sheet material. After spraying is complete... Then, the Z-axis drive assembly 11 drives the printhead assembly 8 to rise, and the X-axis drive assembly 9 drives the printhead assembly 8 to move onto the ink receiving tray assembly 12. At the same time, the Y-axis drive assembly 10 drives the intermediate transport table 3 to reset to the horizontal position between the feeding transport table 2 and the discharging transport table 4. The clamping assembly on the fixture 31 releases the sheet material, and the sheet material is transported on the intermediate transport table 3 to the discharging transport table 4 to complete the surface coating process of the sheet material. In this solution, the workstations in the feeding area, docking and alignment area and the unloading area of ​​the fully automatic surface coating machine can be carried out in parallel, thereby improving production efficiency.

[0033] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation, comprising a frame base, characterized in that: The machine base is equipped with a loading area, a docking and alignment area, a coating area, and a unloading area; The loading area, the docking and alignment area, and the unloading area are arranged sequentially along the X-axis; the loading area is equipped with a feeding conveyor, the docking and alignment area is equipped with an intermediate conveyor, and the unloading area is equipped with a discharging conveyor. The intermediate conveyor moves back and forth along the Y-axis between the docking and alignment area and the coating area on the frame base by setting a Y-axis drive assembly. The coating area of ​​the frame base is provided with a coating gantry, and the coating gantry is provided with a nozzle assembly. The nozzle assembly moves along the X-axis and Z-axis on the coating gantry by setting an X-axis drive assembly and a Z-axis drive assembly. The nozzle assembly is equipped with a vision positioning device, which is used to detect the position of the plate on the intermediate transport platform and feed back the information to the X-axis drive assembly and the Y-axis drive assembly.

2. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to claim 1, characterized in that, The base of the frame is provided with an ink receiving tray assembly, which is located at one end of the printhead assembly along the X-axis movement path and below the printhead assembly.

3. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to claim 2, characterized in that, The base of the frame is provided with a nozzle stop assembly, which is located at the other end of the nozzle assembly's movement path along the X-axis and below the nozzle assembly.

4. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to claim 3, characterized in that, The nozzle stop assembly is provided with sponge or non-woven fabric.

5. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to any one of claims 1-4, characterized in that, The nozzle assembly is equipped with a temperature sensor and a flow sensor.

6. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to any one of claims 1-4, characterized in that, Infrared sensors are installed in the feeding area, docking and alignment area, and unloading area.

7. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to any one of claims 1-4, characterized in that, The intermediate transport platform is equipped with a jig and a clamping assembly for driving the jig to clamp the plate.

8. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to any one of claims 1-4, characterized in that, The nozzle assembly includes multiple detachably mounted dispensing valves.

9. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to any one of claims 1-4, characterized in that, The feeding conveyor, intermediate conveyor, and discharge conveyor all include a conveyor platform and a hinged conveyor belt that is matched with the conveyor platform. The conveyor platform is detachably mounted on the frame base.

10. The fully automatic surface coating machine for semiconductor substrate packaging with multi-station operation according to any one of claims 1-4, characterized in that, The Y-axis drive assembly includes a Y-axis track mounted on the frame base, a Y-axis moving stage mounted on the Y-axis track, and a Y-axis drive component for driving the Y-axis drive stage to move on the Y-axis track. The X-axis drive assembly includes an X-axis track mounted on the coating gantry, an X-axis drive stage mounted on the X-axis track, and an X-axis drive component for driving the X-axis drive stage to move on the X-axis track. The Z-axis drive assembly includes a Z-axis track mounted on the X-axis drive platform, a Z-axis drive platform mounted on the Z-axis track, and a Z-axis drive component for driving the Z-axis drive platform to move on the Z-axis track; the nozzle assembly is mounted on the Z-axis drive platform.

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