A coating device for transistor processing

Abstract

This utility model discloses a coating device for transistor processing, including a base with an open top, an adsorption mechanism, a lifting mechanism, and a supporting mechanism. The adsorption mechanism is connected to one side of the base via the lifting mechanism, and the lifting mechanism is fixed to one side of the base. The supporting mechanism is disposed inside the base. The adsorption mechanism is used to fix the transistor, the lifting mechanism is used to adjust the height of the transistor during the coating process, and the supporting mechanism is used to support the adhesive. This utility model belongs to the field of transistor processing technology, specifically addressing the problems of transistors having irregular shapes, making it difficult to hold them stably with clamps, and the adhesive being placed in a glue tank, easily exposed to air, making it difficult to ensure the quality of the adhesive and affecting the coating effect.

Description

Technical Field

[0001] This utility model belongs to the field of transistor processing technology, and in particular relates to a coating device for transistor processing. Background Technology

[0002] A transistor, also known as a bipolar junction transistor or crystal transistor, is a semiconductor device that controls current. Transistor manufacturing requires assembly and bonding.

[0003] CN202321919171.5 discloses a coating device for transistor processing, which uses a screw and clamping plate to hold the transistor, and then dips and scrapes it, saving adhesive. However, when using this device, some transistors are not particularly regular in shape, and it is difficult to hold them stably with the clamping plate. In addition, the adhesive is placed in the adhesive box, which is easy to come into contact with air, making it difficult to guarantee the quality of the adhesive and affecting the coating effect. Utility Model Content

[0004] The technical problem this invention aims to solve is that some transistors are not regularly shaped, making them difficult to hold stably with clamps. Furthermore, when the adhesive is placed in the adhesive box, it is easily exposed to air, making it difficult to guarantee the quality of the adhesive and affecting the coating effect.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a coating device for transistor processing, comprising a base with an open top, and further comprising an adsorption mechanism, a lifting mechanism and a support mechanism. The adsorption mechanism is connected to one side of the base through the lifting mechanism, the lifting mechanism is fixed to one side of the base, and the support mechanism is disposed inside the base. The adsorption mechanism is used to fix the transistor, the lifting mechanism is used to adjust the height of the transistor during the coating process, and the support mechanism is used to support the adhesive.

[0006] Furthermore, the adsorption mechanism includes an adsorption plate, adsorption holes, a connecting pipe, and an air pump. The air pump is connected to the base via a lifting mechanism. One end of the connecting pipe is connected to the output end of the air pump. The adsorption plate is connected to the base via the lifting mechanism. The adsorption plate is an internally inflated membrane mechanism. The other end of the connecting pipe is connected to the adsorption plate. The adsorption holes are formed on the adsorption plate and are evenly spaced around the axis of the adsorption plate.

[0007] Furthermore, the lifting mechanism includes a mounting plate, an electric telescopic rod, a connecting horizontal rod, and a connecting vertical rod. The mounting plate is fixed to one side of the base, the electric telescopic rod is fixed to the mounting plate, one end of the connecting horizontal rod is fixed to the telescopic end of the electric telescopic rod, the connecting vertical rod is fixed to the other end of the connecting horizontal rod, the air pump is fixed to the top of the connecting vertical rod, and the suction plate is fixed to the lower end of the connecting vertical rod.

[0008] Furthermore, the supporting mechanism includes a supporting cavity and a box cover. The box cover is movably snapped into the top opening of the base. The box cover and the inner opening of the base form a supporting cavity. The box cover has an adhesive application hole, and the adhesive application hole corresponds to the adsorption hole.

[0009] Furthermore, a gel bag is placed in the center of the bearing cavity, and a drain pipe is connected to the gel bag, with a one-way valve on the drain pipe.

[0010] Furthermore, the upper surface of the box cover is provided with a flexible adhesive scraper, which is arranged in an inverted L-shape and symmetrically arranged with the adhesive application hole as the center.

[0011] The beneficial effects of this utility model after adopting the above structure are as follows:

[0012] (1) Clamp the three-electrode through the adsorption holes on the adsorption plate, and use an air pump to inflate the adsorption plate to fully fix the three-electrode of various shapes.

[0013] (2) Place the colloid in the colloid bag and release it when using it so that it flows into the bearing cavity. Use the lifting assembly to pass the fixed transistor through the glue-coating hole to contact the colloid and reduce the contact of the colloid with air. Attached Figure Description

[0014] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0015] Figure 1 This is a schematic diagram of the overall structure of a coating device for transistor processing proposed in this utility model;

[0016] Figure 2 This is a schematic diagram of the adhesive coating device for transistor processing proposed in this utility model from another angle.

[0017] Figure 3 This is a cross-sectional view of the base of a gluing device for transistor processing proposed in this utility model;

[0018] Figure 4 for Figure 1 Enlarged view of point A.

[0019] In the attached diagram: 1. Base, 2. Adsorption mechanism, 3. Lifting mechanism, 4. Bearing mechanism, 5. Adsorption plate, 6. Adsorption hole, 7. Connecting pipe, 8. Air pump, 9. Mounting plate, 10. Electric telescopic rod, 11. Connecting horizontal bar, 12. Connecting vertical bar, 13. Bearing cavity, 14. Box cover, 15. Glue application hole, 16. Glue bag, 17. Liquid discharge pipe, 18. One-way valve, 19. Flexible glue scraper. Detailed Implementation

[0020] like Figure 1-4 As shown, a coating device for transistor processing includes a base 1 with an open top, an adsorption mechanism 2, a lifting mechanism 3, and a bearing mechanism 4. The adsorption mechanism 2 is connected to one side of the base 1 via the lifting mechanism 3, the lifting mechanism 3 is fixed to one side of the base 1, and the bearing mechanism 4 is disposed inside the base 1.

[0021] The adsorption mechanism 2 includes an adsorption plate 5, adsorption holes 6, a connecting pipe 7, and an air pump 8. The air pump 8 is connected to the base 1 via a lifting mechanism 3. One end of the connecting pipe 7 is connected to the output end of the air pump 8. The adsorption plate 5 is connected to the base 1 via the lifting mechanism 3. The adsorption plate 5 is an internally inflated membrane mechanism. The other end of the adsorption plate 5 is connected to the connecting pipe 7. The adsorption holes 6 are opened on the adsorption plate 5 and are evenly spaced around the axis of the adsorption plate 5.

[0022] like Figure 1-2 As shown, in order to achieve the lifting and lowering of the adsorption plate, the lifting mechanism 3 includes a mounting plate 9, an electric telescopic rod 10, a connecting horizontal rod 11, and a connecting vertical rod 12. The mounting plate 9 is fixed to one side of the base 1, the electric telescopic rod 10 is fixed to the mounting plate 9, one end of the connecting horizontal rod 11 is fixed to the telescopic end of the electric telescopic rod 10, the connecting vertical rod 12 is fixed to the other end of the connecting horizontal rod 11, the air pump 8 is fixed to the top of the connecting vertical rod 12, and the adsorption plate 5 is fixed to the lower end of the connecting vertical rod 12.

[0023] like Figure 1-4 As shown, in order to reduce the contact of the colloid with air and facilitate dipping, the carrier mechanism 4 includes a carrier cavity 13 and a box cover 14. The box cover 14 is movably snapped into the top opening of the base 1. The box cover 14 and the internal opening of the base 1 form the carrier cavity 13. The box cover 14 is provided with a glue application hole 15, which corresponds to the position of the adsorption hole 6. A colloid bag 16 is placed in the center of the carrier cavity 13. A liquid discharge pipe 17 is connected to the colloid bag 16. A one-way valve 18 is provided on the liquid discharge pipe 17. A flexible glue scraper 19 is provided on the upper surface of the box cover 14. The flexible glue scraper 19 is arranged in an inverted L shape and is symmetrically arranged with the glue application hole 15 as the center.

[0024] In practical use, the transistor is placed in the adsorption hole 6. At this time, the air pump 8 can be used to inflate the adsorption plate 5 so that the adsorption hole 6 initially adapts to the size of the transistor. After placement, the adsorption plate 5 is further inflated so that the inner wall of the adsorption hole 6 is tightly attached to the outer wall of the transistor, so that it is stably adsorbed and fixed. The one-way valve 18 is opened so that the colloid in the colloid bag 16 flows into the carrier cavity 13. The electric telescopic rod 10 is started and lowered, bringing the adsorption plate 5 down and lowering the transistor. The transistor passes through the glue hole 15 and contacts the colloid for dipping. After dipping, the electric telescopic rod 10 is started in reverse so that the adsorption plate 5 drives the transistor up. During the rise of the transistor, it passes through the middle of the flexible glue scraper 19 and is squeezed to deform the flexible glue scraper 19. The flexible glue scraper 19 is made of silicone or rubber and scrapes off the excess colloid on the transistor, so that the excess colloid falls back into the carrier cavity 13.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents. In conclusion, if those skilled in the art, inspired by this description, design similar structural methods and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A coating apparatus for transistor processing, comprising a base (1) having an opening at the top, characterized in that: It also includes an adsorption mechanism (2), a lifting mechanism (3) and a support mechanism (4). The adsorption mechanism (2) is connected to one side of the base (1) through the lifting mechanism (3). The lifting mechanism (3) is fixed to one side of the base (1). The support mechanism (4) is set inside the base (1). The adsorption mechanism (2) is used to fix the transistor. The lifting mechanism (3) is used to adjust the height of the transistor during the coating process. The support mechanism (4) is used to support the adhesive.

2. The adhesive coating device for transistor processing according to claim 1, characterized in that: The adsorption mechanism (2) includes an adsorption plate (5), adsorption holes (6), a connecting pipe (7), and an air pump (8). The air pump (8) is connected to the base (1) via a lifting mechanism (3). One end of the connecting pipe (7) is connected to the output end of the air pump (8). The adsorption plate (5) is connected to the base (1) via the lifting mechanism (3). The adsorption plate (5) is an internally inflatable membrane mechanism. The other end of the adsorption plate (5) is connected to the connecting pipe (7). The adsorption holes (6) are opened on the adsorption plate (5). The adsorption holes (6) are evenly spaced around the axis of the adsorption plate (5).

3. The adhesive coating device for transistor processing according to claim 2, characterized in that: The lifting mechanism (3) includes a mounting plate (9), an electric telescopic rod (10), a connecting crossbar (11), and a connecting vertical rod (12). The mounting plate (9) is fixed on one side of the base (1), the electric telescopic rod (10) is fixed on the mounting plate (9), one end of the connecting crossbar (11) is fixed to the telescopic end of the electric telescopic rod (10), the connecting vertical rod (12) is fixed to the other end of the connecting crossbar (11), the air pump (8) is fixed to the top of the connecting vertical rod (12), and the adsorption plate (5) is fixed to the lower end of the connecting vertical rod (12).

4. The adhesive coating device for transistor processing according to claim 3, characterized in that: The supporting mechanism (4) includes a supporting cavity (13) and a box cover (14). The box cover (14) is movably snapped into the top opening of the base (1). The box cover (14) and the internal opening of the base (1) form a supporting cavity (13). The box cover (14) is provided with an adhesive hole (15), and the adhesive hole (15) corresponds to the position of the adsorption hole (6).

5. The adhesive coating device for transistor processing according to claim 4, characterized in that: A gel bag (16) is placed in the center of the bearing cavity (13). A drain pipe (17) is connected to the gel bag (16). A one-way valve (18) is provided on the drain pipe (17).

6. The adhesive coating device for transistor processing according to claim 4, characterized in that: The upper surface of the box cover (14) is provided with a flexible adhesive scraper (19), which is arranged in an inverted L shape and is symmetrically arranged with the adhesive application hole (15) as the center.

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