An ink-cleaning device for probe testing

Abstract

This utility model relates to an ink cleaning device for probe testing, including a Y-axis moving mechanism, an X-axis moving mechanism, and an ink cleaning mechanism. The ink cleaning mechanism includes a base, an ink cleaning cylinder, and a wiping part. The base is located at the top of a second slider, and the ink cleaning cylinder is mounted on the base. The wiping part is fixed to the top of the ink cleaning cylinder. The wiping part includes a wiping base plate and a wiping brush, with the bottom end of the wiping base plate fixedly connected to the ink cleaning cylinder. By driving the wiping brush to move along the Y, X, and Z axes, the wiping part wipes the ink conduits of the dotting device along the Y, X, and Z axes, removing excess ink from the ink conduits, ensuring normal ink output, preventing excess ink from contaminating the wafer, and ensuring the accuracy of the dotting device's marking of defective products. Compared to existing methods that involve manually wiping the ink conduits of the dotting device, this method saves time and effort, has high cleaning efficiency, and reduces labor costs.

Description

Technical Field

[0001] This utility model relates to auxiliary equipment for wafer manufacturing, and more particularly to an ink removal device for probe testing. Background Technology

[0002] A probe tester is a device used to test wafers. Existing probe testers include a dotting device filled with ink. When the tester detects a defective wafer, the ink tube of the dotting device drips ink to mark the defective wafer, allowing workers to quickly identify it. However, after a period of use, excess ink remains on the ink tube of the dotting device. When this excess ink drips onto the wafer, it causes ink contamination, necessitating cleaning. Currently, this is done manually by wiping the excess ink periodically, which is time-consuming, labor-intensive, inefficient, and relatively costly. Utility Model Content

[0003] This invention aims to at least partially solve one of the technical problems in related technologies. To this end, this invention proposes an ink-cleaning device for probe testing.

[0004] The technical solution adopted by this utility model to solve its technical problem is: an ink cleaning device for probe testing, including a Y-axis moving mechanism, an X-axis moving mechanism and an ink cleaning mechanism;

[0005] The Y-axis moving mechanism includes a Y-axis slide rail and a first cylinder. A first slider is provided on the Y-axis slide rail, and an X-axis moving mechanism is provided at the top of the first slider. One end of the first slider is connected to the first cylinder, and the first slider moves along the Y-axis slide rail under the action of the first cylinder.

[0006] The X-axis moving mechanism includes an X-axis slide rail and a second cylinder. The bottom end of the X-axis slide rail is disposed on a first slider, and a second slider is disposed on the top end of the X-axis slide rail. The top end of the second slider is provided with an ink cleaning mechanism. The second slider is connected to the second cylinder, and the second slider moves along the X-axis slide rail under the action of the second cylinder.

[0007] The ink cleaning mechanism includes a base, an ink cleaning cylinder, and a wiping part; the base is located at the top of the second slider, the ink cleaning cylinder is provided on the base, and the wiping part is fixed at the top of the ink cleaning cylinder;

[0008] The wiping unit includes a wiping base plate and a wiping brush. The bottom end of the wiping base plate is fixedly connected to an ink-cleaning cylinder, and the top end of the wiping base plate and the bottom end of the wiping brush are detachably connected.

[0009] In a preferred embodiment of the present invention, the bottom end of the wiping base plate is provided with a connecting groove, and the bottom end of the wiping brush is provided with a connecting protrusion, the connecting protrusion and the connecting groove being matched and configured.

[0010] In a preferred embodiment of this invention, the wiping brush is made of an absorbent material.

[0011] In a preferred embodiment of this invention, the height of the wiping brush is greater than the height of the ink conduit of the dotting device.

[0012] In a preferred embodiment of the present invention, the wiping brush comprises, from top to bottom, a preliminary adsorption layer, a flow guiding layer, an absorption layer and a support layer; the preliminary adsorption layer is made of microfiber fabric or microporous rubber, the flow guiding layer is made of porous foam, the absorption layer is made of sponge, the support layer is made of rubber, and the connecting protrusion is provided at the bottom end of the support layer.

[0013] The beneficial effects of this invention are as follows: By driving the wiping brush to move along the Y, X, and Z axes, the wiping unit wipes the ink conduits of the dotting device along these axes, removing excess ink and ensuring normal ink output. This prevents excess ink from contaminating the chip and ensures the accuracy of the dotting device's marking of defective products. Compared to existing methods that involve manually wiping the ink conduits, this invention saves time and effort, has high cleaning efficiency, and reduces labor costs. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model. Figure 1 ;

[0015] Figure 2 This is a schematic diagram of the structure of this utility model. Figure 2 ;

[0016] Figure 3 This is a schematic diagram of the wiping part structure of this utility model;

[0017] Figure 4 This is a schematic diagram of the wiping brush structure of this utility model;

[0018] In the figure: Y-axis moving mechanism 1; Y-axis slide rail 101; first cylinder 102; first slider 103; X-axis moving mechanism 2; X-axis slide rail 201; second cylinder 202; second slider 203; ink cleaning mechanism 3; base 301; ink cleaning cylinder 302; wiping part 303; wiping base plate 3031; wiping brush 3032; preliminary adsorption layer 3032a; guide layer 3032b; absorption layer 3032c; support layer 3032d; connecting groove 3033; connecting protrusion 3034. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0021] like Figures 1 to 4 The ink cleaning device for probe testing is shown, including a Y-axis moving mechanism 1, an X-axis moving mechanism 2, and an ink cleaning mechanism 3.

[0022] The Y-axis moving mechanism 1 includes a Y-axis slide rail 101 and a first cylinder 102. A first slider 103 is provided on the Y-axis slide rail 101. An X-axis moving mechanism 2 is provided at the top of the first slider 103. One end of the first slider 103 is connected to the first cylinder 102, and the first slider 103 moves along the Y-axis slide rail 101 under the action of the first cylinder 102.

[0023] The X-axis moving mechanism 2 includes an X-axis slide rail 201 and a second cylinder 202. The bottom end of the X-axis slide rail 201 is disposed on the first slider 103, and the top end of the X-axis slide rail 201 is provided with a second slider 203. The top end of the second slider 203 is provided with an ink cleaning mechanism 3. The second slider 203 is connected to the second cylinder 202, and the second slider 203 moves along the X-axis slide rail 201 under the action of the second cylinder 202.

[0024] The ink cleaning mechanism 3 includes a base 301, an ink cleaning cylinder 302, and a wiping part 303; the base 301 is located at the top of the second slider 203, the ink cleaning cylinder 302 is provided on the base 301, and the wiping part 303 is fixed at the top of the ink cleaning cylinder 302.

[0025] This invention is placed on a support platform. A robotic arm places the wafer into the wafer tray, and a probe testing machine performs probe testing on the material. After the test, a dotting device marks defective wafers. When the number of dots made by the dotting device reaches a set number, the ink cleaning device of this invention is activated to clean the ink conduit of the dotting device. Specifically, the first cylinder 102 is activated, which drives the first slider 103 to move along the first slide rail 101, thereby realizing the movement of the X-axis moving mechanism and the ink cleaning mechanism along the Y-axis, so that the ink cleaning mechanism is close to the ink conduit of the dotting device in the Y-axis direction. Then, the second cylinder 202 is activated, which drives the second slider 203 to move along the second slide rail 201, so that the second slider 203 drives the ink cleaning mechanism 3 to move along the X-axis, so that the ink cleaning mechanism is close to the ink conduit of the dotting device in the X-axis direction. When the ink cleaning mechanism 3 is located at the lower part of the ink conduit of the dotting device, the device is activated. The ink-cleaning cylinder 302 drives the wiping unit 303 to rise and approach the ink conduit of the dotting device, realizing the movement of the wiping unit 303 in the Z-axis direction. Then, it drives the first cylinder 102 and the second cylinder 202 respectively, causing the wiping unit 303 to move along the Y-axis and X-axis directions. This allows the wiping unit to wipe the ink conduit of the dotting device in the Y-axis and X-axis directions, removing excess ink from the ink conduit, ensuring normal ink output, preventing excess ink from contaminating the chip, and ensuring the accuracy of the dotting device's marking of defective products. After cleaning the ink conduit of the dotting device, the wiping unit resets, and the dotting device continues dotting.

[0026] The wiping unit 303 described in this application includes a wiping base plate 3031 and a wiping brush 3032. The bottom end of the wiping base plate 3031 is fixedly connected to the ink cleaning cylinder 302, that is, the ink conduit of the dotting device is cleaned by the wiping brush 3032. The top end of the wiping base plate 3031 and the bottom end of the wiping brush 3032 are detachably connected, which makes it easy to remove the wiping brush 3032 from the wiping base plate 3031 for cleaning or replacement, so as to ensure the ink cleaning effect on the ink conduit of the dotting device.

[0027] In a preferred embodiment, the wiping base plate 3031 of this application has a connecting groove 3033 at its bottom top, and the wiping brush 3032 has a connecting protrusion 3034 at its bottom end. The connecting protrusion 3034 and the connecting groove 3033 are matched and configured. That is, the connection between the wiping part 3032 and the wiping base plate 3031 is achieved by the connecting protrusion 3034 being inserted into the connecting groove 3033. Since the wiping brush 303 rises upward under the action of the ink cleaning cylinder, and the wiping part 3032 faces the ink conduit of the dotting device, the wiping part 3032 is effectively prevented from disengaging from the connecting groove 3033 when it cleans the ink conduit of the dotting device.

[0028] To ensure the effective cleaning of the ink conduit of the dotting device by the wiping brush 3032, the wiping brush 3032 in this application is made of absorbent material, which facilitates the rapid absorption of ink adhering to the outer ring of the ink conduit, improving cleaning efficiency. The height of the wiping brush 3032 in this application is greater than the height of the ink conduit of the dotting device, ensuring that the wiping brush 3032 completely covers the ink conduit and preventing the ink conduit from contacting the wiping base plate 3031, thus avoiding damage to the ink conduit.

[0029] In a preferred embodiment, the wiping brush 3032 comprises, from top to bottom, a preliminary adsorption layer 3032a, a flow guiding layer 3032b, an absorption layer 3032c, and a support layer 3032d; the preliminary adsorption layer 3032a is made of microfiber fabric or microporous rubber, the flow guiding layer 3032b is made of porous foam, the absorption layer 3032c is made of sponge, the support layer 3032d is made of rubber, and the connecting protrusion 3034 is disposed at the bottom end of the support layer 3032d. The microfiber fabric or microporous rubber is soft, providing a gentle and uniform contact surface when in contact with the ink conduit of the dotting device, preventing scratches. The tiny gaps between the fibers also trap fine ink particles, preventing ink from spreading outwards or contaminating other parts of the device during cleaning. Furthermore, the dense structure of the microfiber fabric or microporous rubber ensures durability, allowing it to withstand repeated friction with the ink conduit without damage. After the microfiber fabric or microporous rubber initially absorbs the ink, porous foam quickly guides the ink to the absorption layer, preventing ink buildup and reducing the risk of contamination. The sponge absorbs and stores the ink guided by the flow-guiding layer, preventing backflow. The rubber support layer has sufficient structural strength to prevent the wiping brush from deforming or collapsing during use, ensuring the overall stability of the brush and facilitating connection between the brush and the base plate.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.

Claims

1. An ink-cleaning device for probe testing, characterized in that, It includes a Y-axis moving mechanism (1), an X-axis moving mechanism (2), and an ink cleaning mechanism (3); The Y-axis moving mechanism (1) includes a Y-axis slide rail (101) and a first cylinder (102). A first slider (103) is provided on the Y-axis slide rail (101). An X-axis moving mechanism (2) is provided at the top of the first slider (103). One end of the first slider (103) is connected to the first cylinder (102), and the first slider (103) moves along the Y-axis slide rail (101) under the action of the first cylinder (102). The X-axis moving mechanism (2) includes an X-axis slide rail (201) and a second cylinder (202). The bottom end of the X-axis slide rail (201) is disposed on a first slider (103), and the top end of the X-axis slide rail (201) is provided with a second slider (203). The top end of the second slider (203) is provided with an ink cleaning mechanism (3). The second slider (203) is connected to the second cylinder (202), and the second slider (203) moves along the X-axis slide rail (201) under the action of the second cylinder (202). The ink cleaning mechanism (3) includes a base (301), an ink cleaning cylinder (302), and a wiping part (303); the base (301) is located at the top of the second slider (203), the base (301) is provided with an ink cleaning cylinder (302), and the top of the ink cleaning cylinder (302) is fixed with a wiping part (303); The wiping unit (303) includes a wiping base plate (3031) and a wiping brush (3032). The bottom end of the wiping base plate (3031) is fixedly connected to the ink cleaning cylinder (302), and the top end of the wiping base plate (3031) and the bottom end of the wiping brush (3032) are detachably connected.

2. The ink-cleaning device for probe testing according to claim 1, characterized in that, The bottom end of the wiping base plate (3031) is provided with a connecting groove (3033), and the bottom end of the wiping brush (3032) is provided with a connecting protrusion (3034). The connecting protrusion (3034) and the connecting groove (3033) are matched.

3. The ink-cleaning device for probe testing according to claim 1, characterized in that, The wiping brush (3032) is made of absorbent material.

4. The ink-cleaning device for probe testing according to claim 1, characterized in that, The height of the wiping brush (3032) is greater than the height of the ink conduit of the dotting device.

5. The ink-cleaning device for probe testing according to claim 2, characterized in that, The wiping brush (3032) comprises, from top to bottom, a preliminary adsorption layer (3032a), a flow guiding layer (3032b), an absorption layer (3032c), and a support layer (3032d). The preliminary adsorption layer (3032a) is made of microfiber fabric or microporous rubber, the flow guiding layer (3032b) is made of porous foam, the absorption layer (3032c) is made of sponge, and the support layer (3032d) is made of rubber. The connecting protrusion (3034) is located at the bottom of the support layer (3032d).

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