A laser processing system

Abstract

This application provides a laser processing system, relating to the field of laser processing technology. It employs a Bessel beam to modify transparent workpieces. Specifically, through the coordinated operation of a pulsed laser beam, an optical modulator, multiple processing optical path units, and a moving stage, it enables large-format processing of transparent workpieces. By utilizing the electrical signal control of the optical modulator and the movement of the transparent workpiece by the moving stage, it is possible to increase production capacity several times over at a low cost, while achieving extremely high processing precision. Furthermore, this method of emitting a single processing beam sequentially requires no additional power from the laser and has low cost requirements. The design difficulty and stability risk of this laser processing system are low.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and more specifically, to a laser processing system. Background Technology

[0002] Through-glass vias (TGVs) have become a key technology in fields such as radio frequency devices, microelectromechanical systems (MEMS) packaging, and optoelectronic system integration. While the current mainstream laser-induced etching method can achieve high-quality through-hole processing, the overall processing efficiency still needs to be improved.

[0003] To this end, existing technologies include at least the following methods to improve processing efficiency:

[0004] The first approach, which uses the most conventional method of moving the workpiece with a linear motor to achieve patterned processing, involves increasing the moving speed of the linear motor shaft. However, this high-speed movement may cause thermal expansion errors, requiring a strong cooling system, which increases costs. Most importantly, the improvement effect is limited and cannot achieve the desired efficiency.

[0005] The second approach is to optimize efficiency by increasing the galvanometer: using the galvanometer to achieve high-speed beam scanning can theoretically significantly shorten non-processing time. However, this approach faces several challenges: (1) Galvanometer scanning requires extending the optical path, which places extremely high demands on the optical design of short focal length systems, easily introducing aberrations and reducing processing accuracy; (2) Jump delay limitation: the galvanometer jump delay is usually >50μs, resulting in limited actual capacity improvement; (3) Processing position accuracy error: the galvanometer position error under dynamic scanning is >5μm, making it difficult to meet high precision requirements. Utility Model Content

[0006] The purpose of this application is to provide a laser processing system that addresses the shortcomings of the prior art.

[0007] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0008] In one aspect of this application, a laser processing system is provided, including a laser, an optical modulator located on the laser output side, and a moving stage for placing a transparent workpiece. Multiple processing optical path units are provided between the optical modulator and the moving stage. Each processing optical path unit includes a fixed reflection component, a Bezier generation component, and a focusing lens component arranged sequentially.

[0009] The pulsed laser beam emitted by the laser is emitted sequentially at a certain angle after passing through the optical modulator. Each processing beam at a certain angle corresponds to a processing optical path unit. After passing through its corresponding processing optical path unit, each processing beam is incident on the transparent workpiece as a Bessel beam.

[0010] The moving stage is used to move the transparent workpiece so that the Bessel beam covers all target positions within the required processing area of ​​the transparent workpiece.

[0011] Optionally, the fixed reflection assembly includes a plurality of fixed reflection elements arranged sequentially;

[0012] Each processing beam is reflected sequentially by multiple fixed reflective elements in the corresponding processing optical path unit and then enters the transparent workpiece from the end of the processing optical path unit.

[0013] Optionally, at least some of the fixed reflective elements of the different processing optical path units are integrated into a single structure.

[0014] Optionally, at least some of the processing optical path units further include a polarization beam splitting component, which is disposed between the fixed reflection component and the Bessel generation component in the corresponding processing optical path unit;

[0015] The processing beam is modulated by the polarization beam splitter in the corresponding processing optical path unit and then incident on the transparent workpiece at the end of the processing optical path unit with a preset energy. There are at least two processing optical path units with different preset energies corresponding to the polarization beam splitter.

[0016] Optionally, the polarization beam splitter assembly includes a polarization beam splitter and a half-wave plate arranged sequentially.

[0017] Optionally, the laser processing system further includes a controller electrically connected to the optical modulator, the controller being used to control the optical modulator to modulate the pulsed laser beam into multiple processing beams according to the timing sequence.

[0018] Optionally, the Bessel generation component includes a first spatial light modulator or an axis conic lens, and the focusing lens component includes a second focusing lens and a first focusing lens arranged sequentially.

[0019] Optionally, the laser processing system further includes a polarization device disposed between the laser and the optical modulator, wherein the pulsed laser beam is adjusted to a preset polarization angle by the polarization device and then incident on the optical modulator.

[0020] Optionally, the optical modulator is any one of an acousto-optic deflector, an acousto-optic modulator, an electro-optic modulator, or a second spatial optical modulator.

[0021] Optionally, the moving stage includes a support platform and a drive actuator connected to the support platform. The drive actuator carries the support platform in a continuous and uniform motion during the processing. The drive actuator drives the support platform to move along a first direction and / or a second direction, wherein the first direction is perpendicular to the second direction.

[0022] The beneficial effects of this application include:

[0023] This application provides a laser processing system for glass through-hole applications. It employs a Bessel beam to modify transparent workpieces. Specifically, through the coordinated operation of a pulsed laser beam, an optical modulator, multiple processing optical path components, and a moving stage, it enables large-format processing of transparent workpieces. By utilizing the electrical signal control of the optical modulator and the movement of the transparent workpiece driven by the moving stage, it is possible to increase production capacity several times over at minimal cost, while achieving extremely high processing accuracy. This is because the response delay of the optical modulator's electrical modulation method is extremely low (<10μs), resulting in high processing efficiency. Compared to conventional galvanometer solutions (galvanometer and moving stage), the production capacity is increased by at least 20 times. Furthermore, since the moving stage drives the movement of the transparent workpiece, there is no need for a galvanometer to control the mechanical deflection of the laser beam, resulting in high precision control over the processing position of the transparent workpiece.

[0024] Furthermore, this method of emitting one processing beam at a time does not require additional power from the laser, thus avoiding the need to increase the laser's power and keeping costs low.

[0025] Based on the modulation effect of the optical modulator and the fixed reflection and Bessel generation components in the processing optical path, there is no need to extend the optical path, making it suitable for short focal length systems. This laser processing system has low design difficulty and low stability risk. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is one of the structural schematic diagrams of a laser processing system provided in an embodiment of this application;

[0028] Figure 2 An isometric view of a transparent workpiece provided in an embodiment of this application;

[0029] Figure 3 One of the top views of a transparent workpiece provided in the embodiments of this application;

[0030] Figure 4 This is a second schematic diagram of a laser processing system provided in an embodiment of this application;

[0031] Figure 5 This is the third schematic diagram of a laser processing system provided in the embodiments of this application;

[0032] Figure 6 This is the fourth schematic diagram of a laser processing system provided in the embodiments of this application;

[0033] Figure 7 A second top view of a transparent workpiece provided in an embodiment of this application;

[0034] Figure 8 This is a third top view of a transparent workpiece provided in an embodiment of this application.

[0035] Icons: 110-Laser; 111-Pulsed laser beam; 112-Processing optical path unit; 1121-First processing optical path unit; 1122-Second processing optical path unit; 1123-Third processing optical path unit; 1124-Fourth processing optical path unit; 120-Polarization device; 130-Controller; 140-Optical modulator; 151-Fixed reflective element; 152-First integrated reflective element; 153-Second integrated reflective element; 160-Bezier generation component; 170-Moving stage; 180-Transparent workpiece; 181-Processing area; 182-Target position; 190-Half-wave plate. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] One aspect of this application provides a laser processing system, including a laser, an optical modulator located on the laser's output side, and a moving stage for placing a transparent workpiece. Multiple processing optical path units are located between the optical modulator and the moving stage. Each processing optical path unit includes a fixed reflection component, a Bessel beam generation component, and a focusing lens component arranged sequentially. A pulsed laser beam emitted from the laser is sequentially emitted from the optical modulator at an output angle, with each output angle corresponding to one processing optical path unit. Each processing beam, after passing through its corresponding processing optical path unit, is incident on the transparent workpiece as a Bessel beam. The moving stage is used to move the transparent workpiece so that the Bessel beam covers all target positions within the required processing area of ​​the transparent workpiece.

[0038] The optical modulator modulates multiple pulses in a pulsed laser beam at different times, forming multiple processing beams with their own exit angles emitted in a time sequence. Each processing beam with an exit angle corresponds to a processing optical path unit; that is, the number of processing beams is the same as the number of processing optical path units. Each processing beam is converted into a Bessel beam by the processing optical path unit and is incident perpendicularly onto multiple processing areas (i.e., different positions) of the transparent workpiece, thereby performing laser-based quality modification on the irradiated positions. Based on this, a moving stage is used to move the transparent workpiece, allowing each target position in each processing area to sequentially align with the end position of the processing optical path unit. Combined with the time-sequential processing beams, all target positions within multiple processing areas can be modified point-by-point.

[0039] It should be noted that, considering the large number of target positions to be processed for transparent workpieces, which means a large number of pulses are required, the number of pulses is generally much greater than the number of processing optical path units, that is, many processing beams have the same exit angle.

[0040] This application provides a laser processing system for glass through-hole applications. It employs a Bessel beam to modify transparent workpieces. Specifically, through the coordinated operation of a pulsed laser beam, an optical modulator, multiple processing optical path unit components, and a moving stage, it enables large-format processing of transparent workpieces. By utilizing the electrical signal control of the optical modulator and the movement of the transparent workpiece driven by the moving stage, it is possible to increase production capacity several times over at minimal cost, while achieving extremely high processing accuracy. This is because the response delay of the optical modulator's electrical modulation method is extremely low (<10μs), resulting in high processing efficiency. Compared to conventional galvanometer solutions (galvanometer and moving stage), the production capacity is increased by at least 20 times. Furthermore, since the moving stage drives the movement of the transparent workpiece, there is no need for a galvanometer to control the mechanical deflection of the laser beam, resulting in high precision control over the processing position of the transparent workpiece.

[0041] It should be understood that the transparent workpiece can be a glass substrate. After the transparent workpiece has undergone laser modification by a laser processing system, the modified area can be further treated by wet etching to ultimately form micropores at various target locations as desired.

[0042] Figure 1 This is one of the structural schematic diagrams of a laser processing system provided in an embodiment of this application. Please refer to... Figure 1 The laser processing system includes a laser 110, an optical modulator 140, and a moving stage 170.

[0043] Laser 110 can be, for example, a solid-state laser, a semiconductor laser, or a fiber laser. Preferably, only one laser is used to save costs. Laser 110 can output a laser beam in the form of pulses, i.e., a pulsed laser beam 111; therefore, the pulsed laser beam 111 comprises multiple pulses. Generally, one pulse corresponds to one target position.

[0044] The optical modulator 140 is located on the output side of the laser 110. Therefore, the pulsed laser beam 111 emitted from the laser 110 can enter the optical modulator 140, and multiple pulses in the pulsed laser beam 111 are sequentially entered into the optical modulator 140 according to a time sequence. The optical modulator 140 can modulate the multiple incident pulses one by one, and then emit them one by one in a time sequence. For easy distinction, each pulse is emitted as a processing beam after being modulated by the optical modulator 140. Therefore, multiple incident pulses can be emitted sequentially as processing beams after being modulated one by one by the optical modulator 140. The core of the modulation of the optical modulator 140 lies in controlling the output angle of the processing beam, and more specifically, in controlling multiple processing beams to emit at N different output angles, where N≥2.

[0045] The optical modulator 140 has multiple processing optical path units 112 on the light-emitting side. It is important to understand that due to the differences in the spatial positions of different processing optical path units, different processing optical path units have different requirements for the incident angle of the beam. In order for the processing beam emitted from the optical modulator 140 to be able to successfully select the corresponding processing optical path unit for incident, the emission angle of the processing beam when it is emitted from the optical modulator 140 needs to match the incident angle required by the processing optical path unit. Therefore, the aforementioned setting of N should first be consistent with the number of processing optical path units, and form a relationship of one emission angle corresponding to one processing optical path unit. This correspondence is established through the processing beam: a processing beam with an emission angle is incident on one processing optical path unit, then this emission angle corresponds to this processing optical path unit.

[0046] For example: Please refer to Figure 1 Four processing optical path units 112 are shown (namely, the first processing optical path unit 1121, the second processing optical path unit 1122, the third processing optical path unit 1123, and the fourth processing optical path unit 1124). The aforementioned N=4, that is, the multiple processing beams emitted from the photoelectric modulator have four emission angles, namely the first emission angle (corresponding to the first processing optical path unit 1121), the second emission angle (corresponding to the second processing optical path unit 1122), the third emission angle (corresponding to the third processing optical path unit 1123), and the fourth emission angle (corresponding to the fourth processing optical path unit 1124).

[0047] Assume that four pulses from the pulsed laser beam 111 are sequentially incident on the first processing optical path unit 1121, the second processing optical path unit 1122, the third processing optical path unit 1123, and the fourth processing optical path unit 1124 after passing through the optical modulator 140. First, the first pulse from the pulsed laser beam 111 is incident on the optical modulator 140 and modulated to form a first processing beam with a first exit angle. This first processing beam then enters the first processing optical path unit 1121. Next, the second pulse from the pulsed laser beam 111 is modulated by the optical modulator 140 to form a second processing beam with a second exit angle. This second processing beam then enters the second processing optical path unit 1122. Finally, the third pulse from the pulsed laser beam 111 is modulated by the optical modulator 140 to form a third processing beam with a third exit angle. This third processing beam then enters the third processing optical path unit 1123. Next, the fourth pulse incident light modulator 140 in the pulsed laser beam 111 is modulated to form a fourth processing beam with a fourth exit angle, and the fourth processing beam is then incident on the fourth processing optical path unit 1124.

[0048] The above only shows an example of four processing beams with different exit angles. Of course, there can be more pulses and more processing beams, which can be set up with reference to the above examples and descriptions. Of course, as can be seen from the foregoing description, there may be cases where different processing beams with the same exit angle are incident on the same processing optical path unit. For example, a fifth pulse, a sixth pulse, and an Mth pulse can continue to be modulated by the optical modulator. It should be understood that the processing beams formed by the subsequent pulses will choose one of the first to fourth processing optical path units for incident. If the fifth processing beam formed by the fifth pulse chooses the first processing optical path unit for incident, it means that the fifth processing beam has the same exit angle as the first processing beam.

[0049] Figure 2 An isometric view of a transparent workpiece 180 provided in an embodiment of this application; Figure 3 This is a top view of a transparent workpiece 180 provided in an embodiment of this application. Figure 3 for Figure 2 A schematic diagram of the transparent workpiece 180° in a top-down view.

[0050] Please refer to the reference. Figures 1 to 3 The moving stage 170 is located at the end of multiple processing optical path units (the end used for light emission), and a transparent workpiece 180 can be placed on the moving stage 170. First, the transparent workpiece 180 is described: the transparent workpiece 180 can have several processing areas 181, and each processing area 181 can have a number of target positions 182 distributed within it. Each target position 182 is the position that needs to be modified by laser irradiation.

[0051] To efficiently process the transparent workpiece 180, multiple processing areas 181 and multiple processing optical path units 112 can be matched one-to-one. The end of each processing optical path unit 112 is located within its corresponding processing area 181, ensuring that each processing beam (which is converted into a Bessel beam after passing through the processing optical path unit) can be incident on a target position within the processing area 181. Therefore, each target position needs to be irradiated and modified by at least one processing beam. With the movement of the moving stage 170, the beam emitted from the end of each processing optical path unit 112 processes all target positions within its corresponding processing area 181. Each processing beam can irradiate its target position, ensuring that all target positions within all processing areas of the transparent workpiece are covered, i.e., irradiated, by the processing beam during the movement of the transparent workpiece.

[0052] In some possible implementations, such as Figures 4 to 6 As shown, each processing optical path unit 112 includes a fixed reflective component. The fixed reflective component can change the propagation direction of the incident processing beam, so that the end of each processing optical path unit 112 is located in its corresponding processing area 181. When necessary, the distance between the ends of each processing optical path unit 112 can also be adjusted in this way. Furthermore, the angle at which the processing beam finally incident on the transparent workpiece can also be adjusted, for example, the processing beam can be perpendicular to the transparent workpiece 180, improving the perpendicularity of the micro-hole processing.

[0053] In some possible implementations, such as Figure 4 As shown, the fixed reflective assembly includes a plurality of fixed reflective elements 151 arranged sequentially. It should be understood that... Figure 4 The fixed reflection components in each of the processing optical path units 112 shown have the same number and type of fixed reflection elements 151. In other embodiments, the number and / or type of fixed reflection elements 151 in the fixed reflection components of different processing optical path units 112 may also be different.

[0054] In this way, each processing beam can be reflected in sequence by multiple fixed reflective elements 151 in the corresponding processing optical path unit 112 and then be perpendicularly incident on the transparent workpiece 180 from the end of the processing optical path unit 112.

[0055] In some possible implementations, at least some of the fixed reflective elements 151 of the different processing optical path units 112 can be integrated into a single structure. For example... Figure 4In this process, the first fixed reflective element located on the light-emitting side of the optical modulator 140 in all processing optical path units 112 is integrated into a single structure as the first integrated reflective element 152, while the two subsequent fixed reflective elements 151 arranged along the light-emitting path in the processing optical path unit 112 are each arranged independently; for example, Figure 5 As shown, in Figure 4 Based on this, the second fixed reflective elements located on the light-emitting side of the optical modulator 140 in all processing optical path units 112 are integrated into a single structure, serving as the second integrated reflective element 153. Of course, to ensure the independence of the ends of each processing optical path unit 112, the fixed reflective elements 151 located at the ends of each processing optical path unit 112 can be made independent of each other, for example... Figures 4 to 6 .

[0056] In some possible implementations, the fixed reflecting element 151 can be any of a plane mirror, a curved mirror, a reflecting prism, a polarizing beam splitter, etc. The fixed reflecting element 151 can be used in combination with different mirror types. For example... Figure 4 In a processing optical path unit 112: the first integrated reflective element 152 is a reflective prism, and the remaining two fixed reflective elements 151 arranged sequentially along the optical path are both plane reflectors; for example... Figure 6 In the process of optical path unit 112, the first integrated reflective element 152 is a polarizing beam splitter, and the remaining two fixed reflective elements 151 arranged sequentially along the optical path are both plane reflectors.

[0057] In some possible implementations, such as Figures 4 to 6 As shown, the Bezier generation component 160 is located on the light-emitting side of the fixed reflector component. The Bezier beam can be used to laser-modify transparent workpieces, generating modified contour lines to facilitate the formation of micropores after subsequent etching. For ease of understanding, the specific structures of two types of the Bezier generation component 160 are schematically shown below:

[0058] One example: the Bessel generation component 160 includes a first spatial light modulator, that is, the processing beam in the incident processing optical path unit 112 is modulated by the first spatial light modulator to form a Bessel beam. Another example: the Bessel generation component 160 includes an axial cone mirror, that is, the processing beam in the incident processing optical path unit 112 is converted into a Bessel beam by reflection or refraction through the axial cone mirror.

[0059] In some possible implementations, each of the processing optical path units further includes a focusing mirror assembly located on the light-emitting side of the Bessel generation assembly. The focusing mirror assembly includes a second focusing mirror and a first focusing mirror arranged sequentially. The focusing function of the second and first focusing mirrors allows the light spot formed by the resulting Bessel beam to be focused to a smaller size.

[0060] In some possible implementations, such as Figures 4 to 6 As shown, the laser processing system also includes a polarization device 120 disposed between the laser 110 and the optical modulator 140. Thus, the pulsed laser beam 111 is first adjusted by the polarization device 120 to a beam with a preset polarization angle before being incident on the optical modulator 140, thereby satisfying the polarization angle requirements of the optical modulator 140 for the incident beam. The polarization device 120 can be a half-wave plate.

[0061] In some possible implementations, the optical modulator 140 is one of an acousto-optic deflector, an acousto-optic modulator, an electro-optic modulator, and a second spatial optical modulator. For example, if the optical modulator 140 is an acousto-optic deflector, the exit angle of the output beam of the acousto-optic deflector can be controlled by changing the frequency of the modulation signal (specifically, in conjunction with...). Figure 4 As shown, the frequency of the modulation signal corresponding to the first pulse is f1, which corresponds to the first processing beam 1121 emitted from the optical modulator 140; the frequency of the modulation signal corresponding to the second pulse is f2, which corresponds to the second processing beam 1122 emitted from the optical modulator 140; the frequency of the modulation signal corresponding to the third pulse is f3, which corresponds to the third processing beam 1123 emitted from the optical modulator 140; and the frequency of the modulation signal corresponding to the fourth pulse is f4, which corresponds to the fourth processing beam 1124 emitted from the optical modulator 140. Changing the amplitude of the modulation signal can control the diffraction efficiency of the acousto-optic deflector.

[0062] In some possible implementations, the movement direction of the moving table 170 includes a first direction and a second direction that are perpendicular to each other. Specifically, the moving table includes a support platform and a drive actuator (such as a motor) connected to the support platform. The drive actuator is capable of moving the support platform along the first direction and / or the second direction, where the first direction is perpendicular to the second direction. During the processing, the drive actuator is capable of continuously moving the support platform at a constant speed.

[0063] In some possible implementations, the movement trajectory of the mobile stage 170 is S-shaped, which facilitates the processing of the target positions 182 within each processing area 181 in a row-by-row manner.

[0064] In some possible implementations, the moving speed of the mobile station 170 is constant, which simplifies control.

[0065] In some possible implementations, the controller 130 can be used to ensure that the optical modulator 140 accurately modulates each pulse. Please refer to... Figure 4 or Figure 5As shown, the laser processing system also includes a controller 130, which is electrically connected to the optical modulator 140. The controller 130 can output pulse signals to control the optical modulator 140. In addition, the controller 130 can also be electrically connected to the laser and / or the actuator to control the laser's light output or the actuator's operation.

[0066] In some possible implementations, at least some processing optical path units also include polarization beam splitters. For processing optical path units equipped with polarization beam splitters, the polarization beam splitters are located between the fixed reflection component and the Bessel generation component. The purpose of the polarization beam splitter is to adjust the energy of the final emitted beam in the processing optical path unit so as to meet the different processing energy requirements of different target positions. Therefore, after the processing beam is modulated by the polarization beam splitter in the processing optical path unit 112, it can be incident on the transparent workpiece 180 from the end of the processing optical path unit 112 with a preset energy. There are at least two processing optical path units 112 with different preset energies corresponding to the polarization beam splitters. Thus, when the laser energy required for the target position 182 is different, the polarization beam splitter in the processing optical path unit 112 can be adaptively adjusted so that the energy of the processing beam finally incident on the target position 182 matches the expected laser energy.

[0067] For example Figure 6 In this assembly, the polarization beam splitter includes a polarization beam splitter and a half-wave plate 190 arranged sequentially. The polarization beam splitter, utilizing its reflection function, can also serve as the first integrated reflective element 152 in a fixed reflective assembly. By sequentially adjusting the polarization state of the processing beam using the polarization beam splitter and the half-wave plate 190, the energy of each processing beam ultimately incident on the target position 182 can be flexibly adjusted.

[0068] The laser processing system of this application is applicable to the processing of various transparent workpieces 180, and the arrangement of the target positions 182 in each transparent workpiece 180 can be different. The following description, in conjunction with the accompanying drawings, will illustrate this system:

[0069] Example 1

[0070] Please refer to the reference. Figures 2 to 4The laser processing system includes a laser 110, a polarization device 120, an optical modulator 140 (acousto-optic deflector), a controller 130, and a moving stage 170. The controller 130 is electrically connected to the laser 110, the moving stage 170, and the optical modulator 140. The controller 130 controls the beam emitted from the optical modulator 140 to form four emission angles. Therefore, there are four processing optical path units 112 between the optical modulator 140 and the moving stage 170. The ends of the four processing optical path units 112 do not move during the entire processing process. Each processing optical path unit 112 is equipped with a fixed reflection component, a Bessel generation component 160, and a focusing lens component. The Bessel generation component 160 can convert the processing beam into a Bessel beam.

[0071] A transparent workpiece 180 (glass substrate) is placed on the moving stage 170, such as Figure 2 and Figure 3 As shown, the transparent workpiece 180 has four processing areas A1-A4. The end of the first processing optical path unit 1121 is located in processing area A1, the end of the second processing optical path unit 1122 is located in processing area A2, the end of the third processing optical path unit 1123 is located in processing area A3, and the end of the fourth processing optical path unit 1124 is located in processing area A4. The end of the first processing optical path unit 1121 is used to process all target positions within processing area A1, and the second to fourth processing optical paths are similar. The target positions 182 within each processing area are arranged in the same rectangular array. Here, "identical" means that the rectangular array in one processing area can be regarded as a copy of the rectangular array in another processing area.

[0072] During the processing: First, alignment is completed, that is, the moving table 170 moves the transparent workpiece 180 so that the first row of target positions 182 in each processing area is in the same row as the end of each processing optical path unit 112, and processing starts from the leftmost target position 182 of the first row in each processing area.

[0073] Then, controller 130 controls the moving stage 170 to move along the first direction x. At time t1, the first target position 182 in the processing area A1 just moves to the end of the first processing optical path unit 1121. The first pulse of the pulsed laser beam 111 is emitted, modulated by the optical modulator 140 to form the first processing beam, which is then incident on the first processing optical path unit 1121. After being reflected by the fixed reflection component, it is incident on the Bessel generation component 160 and converted into a Bessel beam. After being focused by the focusing lens component, it is incident on the target position 182 from the end, completing the laser modification of the first target position 182 in the processing area A1. Among them, the first target position 182 is in Figure 3 In the diagram shown, the one in the upper left corner of processing area A1 is the one shown.

[0074] Subsequently, the mobile station 170 continued to move along the first direction x. Figure 3 In the example shown, the movement is along the positive x-direction. At time t3, the first target position 182 in the processing area A2 has just moved to the end of the second processing optical path unit 1122. The second pulse of the pulsed laser beam 111 is modulated by the optical modulator 140 to form a second processing beam, which is then incident on the second processing optical path unit 1122. After being reflected by the fixed reflection component, it is sequentially incident on the Bessel generation component 160 to be converted into a Bessel beam, and then focused by the focusing lens component and incident from the end to the target position 182 at time t3, completing the laser modification of the first target position 182 in the processing area A2. Similarly, in this embodiment, the first target position 182 in the processing area A2 is... Figure 3 In the diagram shown, the one in the upper left corner of processing area A2 is shown.

[0075] Subsequently, the moving stage 170 continues to move along the first direction x. At time t5, the first target position 182 in the processing area A3 just moves to the end of the third processing optical path unit 1123. The third pulse of the pulsed laser beam 111 is emitted, modulated by the optical modulator 140 to form a third processing beam, which is then incident on the third processing optical path unit 1123. After being reflected by the fixed reflection component, it is incident on the Bessel generation component 160 and converted into a Bessel beam. After being focused by the focusing lens component, it is incident on the target position 182 from the end at time t5, completing the laser modification of the first target position 182 in the processing area A3. Similarly, in this embodiment, the first target position 182 in the processing area A3 is... Figure 3 In the diagram shown, the one in the upper left corner of processing area A3 is the one shown.

[0076] Subsequently, the moving stage 170 continues to move along the first direction x. At time t7, the first target position 182 in the processing area A4 has just moved to the end of the fourth processing optical path unit 1124. The fourth pulse of the pulsed laser beam 111 is emitted, modulated by the optical modulator 140 to form a fourth processing beam, which is then incident on the fourth processing optical path unit 1124. After being reflected by the fixed reflection component, it is incident on the Bessel generation component 160 and converted into a Bessel beam. After being focused by the focusing lens component, it is incident on the target position 182 from the end at time t7, completing the laser modification of the first target position 182 in the processing area A4. Similarly, in this embodiment, the first target position 182 in the processing area A4 is... Figure 3 In the diagram shown, this is the one in the upper left corner of processing area A4. At this point, all processing optical path units 112 have completed one cycle.

[0077] Next, by repeating the above cycle, the laser enhancement of all target positions 182 in the first row within the processing area A1-A4 is completed. For example, in the second cycle: the moving stage 170 continues to move along the first direction x, and the second target position 182 in the processing area 181 just moves to the end of the first processing optical path unit 1121. The fifth pulse of the pulsed laser beam 111 is converted into the fifth processing beam by the optical modulator 140 and enters the first processing optical path unit 1121. After passing through the fixed reflection component, the Bessel generation component 160 and the focusing lens component, the laser enhancement of the second target position 182 in the processing area A1 is completed. Subsequently, the moving stage 170 continues to move along the first direction x. The second target position 182 in processing area A2 just moves to the end of the second processing optical path unit 1122. The sixth pulse of the pulsed laser beam 111 is modulated by the optical modulator 140 to form a sixth processing beam, which is then incident on the second processing optical path unit 1122. After passing through the fixed reflection component, the Bessel generation component 160, and the focusing lens component, the laser modification of the second target position 182 in processing area A2 is completed. Then, the laser modification of the second target position 182 in processing areas A3 and A4 is carried out in the same way. Thus, another cycle is completed.

[0078] After all target positions 182 in the first row have been processed, the moving stage 170 can drive the transparent workpiece 180 to move along the second direction y, so that the target positions 182 in the second row are aligned with the ends of each processing optical path unit 112. Figure 3 In the example shown, the movement is along the positive y-direction. This cycle is then repeated until all target positions 182 have undergone laser modification. It should be understood that, to improve processing efficiency, when the first row is processed to the rightmost target position 182, after changing rows, the processing of the second row should begin from the rightmost of the second row target positions 182 in each processing area 181; that is, the movement trajectory of the moving stage 170 is similar to an S-shape.

[0079] Example 2

[0080] Please refer to the reference. Figure 4 and Figure 7 The laser processing system is the same as in Example 1, except that in this example, the laser processing system is used to process targets where positions 182 are irregularly arranged, for example... Figure 7 Although it still has four processing areas A1 to A4, the target positions 182 within each processing area are arranged in a different array. During processing, the target positions 182 within each processing area can still be laser-modified sequentially by scanning row by row. Figure 7 There are two rows in the processing area A1. The first row has two target positions 182, and the second row has four target positions 182. When laser refining, the first row can still be refined first, and then the second row can be refined.

[0081] To meet Figure 7 The processing of the transparent workpiece 180 shown requires control of the pulse interval of the pulsed laser beam 111.

[0082] During the processing: First, alignment is completed, that is, the moving table 170 moves the transparent workpiece 180 so that the first row of target positions 182 in each processing area 181 is in the same row as the end of each processing optical path unit 112, and processing starts from the leftmost target position 182 of the first row in each processing area.

[0083] Then the controller 130 controls the moving stage 170 to move along the first direction ( Figure 7 Moving from left to right, at time t1, the first target position 182 within the processing area A1 just reaches the end of the first processing optical path unit 1121. The first pulse of the pulsed laser beam 111 is emitted, modulated by the optical modulator 140 to form the first processing beam, which is then incident on the first processing optical path unit 1121. After passing through the fixed reflection component, the Bessel generation component 160, and the focusing lens component, the Bessel beam is incident on the target position 182 from the end at time t1, completing the laser modification of the first target position 182 within the processing area A1. The first target position 182 is located in... Figure 7 In the diagram shown, the one in the upper left corner of processing area A1 is the one shown.

[0084] Subsequently, the moving stage 170 continues to move along the first direction. At time t3, the first target position 182 (the leftmost position in the first row) within the processing area A4 has just moved to the end of the fourth processing optical path unit 1124. The second pulse of the pulsed laser beam 111 is emitted, and after being modulated by the optical modulator 140, it forms a second processing beam and enters the fourth processing optical path unit 1124. After being converted into a Bessel beam by the fixed reflection component, the Bessel generation component 160, and the focusing lens component, and focused, it enters the target position 182 from the end at time t3, completing the laser modification of the first target position 182 within the processing area A4. The first target position 182 is located in... Figure 7 In the diagram shown, the one in the upper left corner of processing area A4 is the one shown.

[0085] Subsequently, the moving stage 170 continues to move along the first direction. At time t5, the first target position 182 (the leftmost position in the first row) within the processing area A3 has just moved to the end of the third processing optical path unit 1123. The third pulse of the pulsed laser beam 111 is emitted, and after being modulated by the optical modulator 140, it forms a third processing beam and enters the third processing optical path unit 1123. After passing through the fixed reflection component, the Bessel generation component 160, and the focusing lens component, it is converted into a Bessel beam and focused, and then enters the target position 182 from the end at time t5, completing the laser modification of the first target position 182 within the processing area A3. The first target position 182 is located in... Figure 7 In the diagram shown, the one in the upper left corner of processing area A3 is the one shown.

[0086] Subsequently, the moving stage 170 continues to move along the first direction. At time t7, the first target position 182 (the leftmost position in the first row) within processing area A2 has just moved to the end of the second processing optical path unit 1122. The fourth pulse of the pulsed laser beam 111 is emitted, modulated by the optical modulator 140 to form the fourth processing beam, which is then incident on the second processing optical path unit 1122. After passing through the fixed reflection component, the Bessel generation component 160, and the focusing lens component, it is finally converted into a Bessel beam and focused, then incident on the target position 182 from the end at t7, completing the laser modification of the first target position 182 within processing area A2. Thus, all processing optical path units 112 complete one cycle. The first target position 182 is located at... Figure 7 In the diagram shown, the one in the upper left corner of processing area A2 is shown.

[0087] Next, by repeating the above cycle, the laser enhancement of all target positions 182 in the first row within the processing area A1-A4 is completed. It should be understood that when controlling the pulse interval time of the pulsed laser beam 111, it is necessary to combine the moving speed and trajectory of the moving stage 170, so that when the target position 182 is located at the end of a certain processing optical path unit 112, the Bessel curve converted by the processing beam can be incident from that processing optical path unit 112 to the target position 182.

[0088] To facilitate the laser processing of irregular patterns, a movable light-shielding component can be added inside the laser 110. Unwanted pulses can be blocked by moving the light-shielding component into the optical path, and similarly, desired pulses can be smoothly incident on the light modulator 140 by moving the light-shielding component away from the optical path.

[0089] After all target positions 182 in the first row have been processed, the moving table 170 can drive the transparent workpiece 180 along the second direction ( Figure 7The system moves from top to bottom, aligning the second row of target positions 182 with the ends of each processing optical path unit 112. Processing continues until all target positions 182 have undergone laser modification. It should be understood that, to improve processing efficiency, when the first row reaches the rightmost target position 182, after changing rows, processing of the second row should begin from the rightmost of the second row of target positions 182 in each processing area 181; that is, the movement trajectory of the moving stage 170 is similar to an S-shape.

[0090] In some implementations, such as Figure 2 , Figure 3 and Figure 7 As shown, the transparent workpiece 180 is a single workpiece. In some embodiments, the transparent workpiece 180 can also be several independent workpieces, each of which can have several processing areas 181, as long as each processing area 181 corresponds to a processing optical path unit 112, for example... Figure 8 As shown, the transparent workpiece 180 can also be four independent workpieces, each of which can have a processing area 181, so that the ends of the aforementioned four processing optical path units 112 correspond one-to-one with the four processing areas 181.

[0091] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0092] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0093] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0094] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0095] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A laser processing system, characterized in that, It includes a laser, an optical modulator located on the laser's output side, and a moving stage for placing a transparent workpiece. Between the optical modulator and the moving stage, there are multiple processing optical path units. Each processing optical path unit includes a fixed reflection component, a Bezier generation component, and a focusing lens component arranged sequentially. The pulsed laser beam emitted by the laser is sequentially emitted as a processing beam with an output angle after passing through the optical modulator. Each processing beam with an output angle corresponds to one processing optical path unit. After passing through its corresponding processing optical path unit, each processing beam is incident on the transparent workpiece as a Bessel beam. The moving stage is used to move the transparent workpiece so that the Bessel beam covers all target positions within the required processing area of ​​the transparent workpiece.

2. The laser processing system as described in claim 1, characterized in that, The fixed reflection assembly includes a plurality of fixed reflection elements arranged sequentially. Each processing beam is reflected sequentially by multiple fixed reflective elements in the corresponding processing optical path unit and then enters the transparent workpiece from the end of the processing optical path unit.

3. The laser processing system as described in claim 2, characterized in that, At least some of the fixed reflective elements of the different processing optical path units are integrated into a single structure.

4. The laser processing system as described in claim 1, characterized in that, At least a portion of the processing optical path unit further includes a polarization beam splitting component, which is disposed between the fixed reflection component and the Bessel generation component in the corresponding processing optical path unit; The processing beam is modulated by the polarization beam splitter in the corresponding processing optical path unit and then incident on the transparent workpiece at the end of the processing optical path unit with a preset energy. There are at least two processing optical path units with different preset energies corresponding to the polarization beam splitter.

5. The laser processing system as described in claim 4, characterized in that, The polarization beam splitter assembly includes a polarization beam splitter and a half-wave plate arranged in sequence.

6. The laser processing system according to any one of claims 1 to 5, characterized in that, The laser processing system also includes a controller, which is electrically connected to the optical modulator. The controller is used to control the optical modulator to modulate the pulsed laser beam into multiple processing beams according to the timing sequence.

7. The laser processing system according to any one of claims 1 to 5, characterized in that, The Bessel generation component includes a first spatial light modulator or an axis-cone lens, and the focusing lens component includes a second focusing lens and a first focusing lens arranged sequentially.

8. The laser processing system according to any one of claims 1 to 5, characterized in that, The laser processing system also includes a polarization device disposed between the laser and the optical modulator, wherein the pulsed laser beam is adjusted to a preset polarization angle by the polarization device and then incident on the optical modulator.

9. The laser processing system according to any one of claims 1 to 5, characterized in that, The optical modulator is any one of an acousto-optic deflector, an acousto-optic modulator, an electro-optic modulator, or a second spatial optical modulator.

10. The laser processing system according to any one of claims 1 to 5, characterized in that, The moving stage includes a support platform and a drive actuator connected to the support platform. The drive actuator carries the support platform in a continuous and uniform motion during the processing. The drive actuator drives the support platform to move along a first direction and / or a second direction, wherein the first direction is perpendicular to the second direction.

Images