A grinding device for mold processing
By introducing a central fixing part and a buffer part into the grinding device, the problem of mold displacement during grinding is solved, and stable clamping and efficient grinding of the mold are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN GONGFU MOULD HEAT TREATMENT CO LTD
- Filing Date
- 2025-08-05
- Publication Date
- 2026-05-26
AI Technical Summary
Existing grinding devices are not convenient for fixing the mold during use, making it difficult to center the mold and hold it securely. This causes the mold to shift during the grinding process, affecting the accuracy and stability of the grinding operation.
The design employs a centrally fixed part and a buffer part. The power component provides driving force to clamp the mold in the center, and the elastic component of the buffer part buffers the force during the fixing process, ensuring that the mold does not shift or get damaged during the grinding process.
This method achieves stable clamping of the mold during the grinding process, avoids displacement, improves the accuracy and stability of the grinding operation, and ensures the smooth progress of the grinding process.
Smart Images

Figure CN224274495U_ABST