A silicon material polishing equipment

Abstract

This utility model relates to the field of polishing equipment, specifically disclosing a silicon material polishing device, including a polishing frame. Two polishing discs are mounted on the upper surface of the polishing frame. Guide mechanisms are mounted on both sides of the upper surface of the polishing frame for each polishing disc. A second vertical guide plate is mounted on the front guide mechanism, and a first vertical guide plate is mounted on the rear guide mechanism. A lifting motor is mounted on the upper surface of the first vertical guide plate, and a polishing head is mounted on the outer side of the lifting slide rail. A dressing device is mounted on the second vertical guide plate, located near the first vertical guide plate. By controlling the first and second vertical guide plates to correspond to the positions above the two polishing discs on the guide mechanisms, when one disc is being polished, the dressing device will level the other polishing disc. After one polishing cycle, the discs can be swapped for further polishing and leveling, improving processing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of polishing equipment, specifically a silicon material polishing equipment. Background Technology

[0002] Polishing is the final processing step for silicon wafers. It requires the polished surface to have lattice integrity, high flatness, and cleanliness. Mechanical-chemical polishing can obtain a surface without processing-induced alteration layers. To improve polishing efficiency, two polishing processes are required. In the first polishing, the mechanical action of abrasive grains and polishing cloth is used to break the hydration film on the silicon wafer surface for efficient polishing. Therefore, large-grained abrasive grains and polishing cloths with good air permeability must be used to form a thinner hydration film. The purpose is to obtain the thickness, flatness, etc. of the silicon wafer.

[0003] However, current silicon polishing setups require a leveler to level the polishing pad on the polishing pad after polishing before subsequent polishing can be performed, which slows down the processing efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a silicon material polishing device that solves the problems mentioned in the background.

[0005] This utility model provides the following technical solution: a silicon material polishing device, including a polishing frame, two polishing discs are mounted on the upper surface of the polishing frame, and guide mechanisms are mounted on both sides of the two polishing discs on the upper surface of the polishing frame. A second vertical guide plate is mounted on the guide mechanism located at the front, and a first vertical guide plate is mounted on the guide mechanism located at the rear. A lifting motor is mounted on the upper surface of the first vertical guide plate, and a lifting slide rail is mounted on the front surface of the first vertical guide plate. A polishing head is mounted on the outer side of the lifting slide rail, and a disc repairer is mounted on the second vertical guide plate on the side closest to the first vertical guide plate.

[0006] As a further embodiment of this utility model: a reciprocating screw is installed inside the first vertical guide plate and the second vertical guide plate, which is located inside the guide mechanism. The end of the reciprocating screw is connected to a drive motor, and a moving groove is provided on the upper surface of the guide mechanism.

[0007] As a further embodiment of this utility model: a polishing liquid tank is installed on one side of the lifting motor on the upper surface of the first vertical guide plate, and a spray pipe is connected to the side surface of the polishing liquid tank.

[0008] As a further improvement of this utility model, the polishing head is slidably connected to the lifting slide rail.

[0009] As a further embodiment of this utility model: a polishing pad is installed on the upper surface of the polishing disc, and a drive mechanism is installed on the lower surface of the polishing disc inside the polishing frame.

[0010] As a further embodiment of this utility model: both the first vertical guide plate and the second vertical guide plate are meshed and rotatably connected to the reciprocating screw, and both the first vertical guide plate and the second vertical guide plate are slidably connected to the movable slide groove.

[0011] As a further improvement of this utility model, the guiding mechanism is fixedly connected to the polishing frame.

[0012] As a further improvement of this utility model: a drain pump is installed at one end of the spray pipe inside the polishing liquid tank.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. By controlling the first vertical guide plate and the second vertical guide plate to be positioned above the two polishing discs on the guiding mechanism, when one disc is being polished, the dressing device will level the other polishing disc. After one polishing is completed, the discs can be switched for further polishing and leveling, thus improving processing efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a silicon material polishing device.

[0016] Figure 2 This is a schematic diagram of a guiding mechanism in a silicon material polishing device.

[0017] Figure 3 This is a schematic diagram of the structure of the first vertical guide plate in a silicon material polishing device;

[0018] Figure 4 This is a top view of a polishing frame in a silicon material polishing device.

[0019] In the diagram: 1. Polishing frame; 2. Guide mechanism; 3. First vertical guide plate; 4. Second vertical guide plate; 5. Polishing disc; 201. Moving slide; 202. Drive motor; 203. Reciprocating screw; 301. Polishing liquid tank; 302. Lifting motor; 303. Spray pipe; 304. Lifting slide rail; 305. Polishing head; 401. Dressing device. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1-4 As shown, this embodiment provides a silicon material polishing device, including a polishing frame 1. Two polishing discs 5 are mounted on the upper surface of the polishing frame 1. Polishing pads are mounted on the upper surface of the polishing discs 5. A drive mechanism is mounted on the lower surface of the polishing discs 5 inside the polishing frame 1. Guide mechanisms 2 are mounted on both sides of the two polishing discs 5 on the upper surface of the polishing frame 1. The guide mechanisms 2 are fixedly connected to the polishing frame 1. A second vertical guide plate 4 is mounted on the guide mechanism 2 located at the front. A first vertical guide plate 3 is mounted on the guide mechanism 2 located at the rear. A lifting motor 302 is mounted on the upper surface of the first vertical guide plate 3. A lifting slide rail 304 is mounted on the front surface of the first vertical guide plate 3. A polishing head 305 is mounted on the outer side of the lifting slide rail 304. The polishing head 305 is slidably connected to the lifting slide rail 304. A polishing device 401 is mounted on the side of the second vertical guide plate 4 close to the first vertical guide plate 3.

[0022] like Figure 2-3 As shown, in this embodiment, a reciprocating screw 203 is installed inside the first vertical guide plate 3 and the second vertical guide plate 4, which are located inside the guide mechanism 2. Both the first vertical guide plate 3 and the second vertical guide plate 4 are meshed and rotatably connected to the reciprocating screw 203. A drive motor 202 is connected to the end of the reciprocating screw 203. A movable slide groove 201 is provided on the upper surface of the guide mechanism 2. Both the first vertical guide plate 3 and the second vertical guide plate 4 are slidably connected to the movable slide groove 201. A polishing liquid tank 301 is installed on one side of the lifting motor 302 on the upper surface of the first vertical guide plate 3. A spray pipe 303 is connected to the side surface of the polishing liquid tank 301. A drain pump is installed at one end of the spray pipe 303 inside the polishing liquid tank 301.

[0023] The working principle of this utility model is as follows: During assembly, a first vertical guide plate 3 and a second vertical guide plate 4 are assembled above the two guide mechanisms 2. A polishing head 305 is mounted on the first vertical guide plate 3, and a dressing device 401 is mounted on the second vertical guide plate 4. The second vertical guide plate 4 and the first vertical guide plate 3 operate on the same driving principle and can both be used to control lifting. After the polishing liquid tank 301 is fixedly installed above the first vertical guide plate 3, and the spray pipe 303 is adjusted to a side position, the silicon material to be processed is adsorbed and fixed onto the lower surface of the polishing head 305. The reciprocating screw 203 is driven by a drive motor 202 controlled at the end of the first vertical guide plate 3, adjusting the first vertical guide plate 3 to a position above a polishing disc 5. The second vertical guide plate 4 is then controlled to move. The drive motor 202 at the end of the guide plate 4 drives the reciprocating screw 203 to move, adjusting the second vertical guide plate 4 to be above the other polishing disc 5. Then, the lifting motor 302 controls the polishing head 305 to move downwards on the outside of the lifting slide rail 304 and contact the upper surface of the polishing disc 5. At the same time, the dressing disc 401 contacts the upper surface of the other polishing disc 5, thus driving the two polishing discs 5 to rotate synchronously. One disc contacts the workpiece on the lower surface of the polishing head 305 for polishing, and the other disc contacts the dressing disc 401 and is leveled. After polishing is completed, the first vertical guide plate 3 and the second vertical guide plate 4 are moved above the guide mechanism 2 to change their relative positions. Then, the workpiece below the polishing head 305 can be replaced for the next polishing. At the same time, the dressing disc 401 performs leveling processing on the previous polishing disc 5.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon material polishing device, comprising a polishing frame (1), characterized in that, Two polishing discs (5) are mounted on the upper surface of the polishing frame (1). Guide mechanisms (2) are mounted on both sides of the two polishing discs (5) on the upper surface of the polishing frame (1). A second vertical guide plate (4) is mounted on the guide mechanism (2) located in front, and a first vertical guide plate (3) is mounted on the guide mechanism (2) located in the rear. A lifting motor (302) is mounted on the upper surface of the first vertical guide plate (3). A lifting slide rail (304) is mounted on the front surface of the first vertical guide plate (3). A polishing head (305) is mounted on the outer side of the lifting slide rail (304). A polishing device (401) is mounted on the side of the second vertical guide plate (4) close to the first vertical guide plate (3).

2. The silicon material polishing equipment according to claim 1, characterized in that, The first vertical guide plate (3) and the second vertical guide plate (4) are equipped with a reciprocating screw (203) inside the guide mechanism (2). The end of the reciprocating screw (203) is connected to a drive motor (202). The upper surface of the guide mechanism (2) is provided with a moving groove (201).

3. The silicon material polishing equipment according to claim 1, characterized in that, A polishing liquid tank (301) is installed on one side of the lifting motor (302) on the upper surface of the first vertical guide plate (3), and a spray pipe (303) is connected to the side surface of the polishing liquid tank (301).

4. The silicon material polishing equipment according to claim 1, characterized in that, The polishing head (305) is slidably connected to the lifting slide rail (304).

5. The silicon material polishing equipment according to claim 1, characterized in that, A polishing pad is installed on the upper surface of the polishing disc (5), and a drive mechanism is installed on the lower surface of the polishing disc (5) inside the polishing frame (1).

6. The silicon material polishing equipment according to claim 2, characterized in that, The first vertical guide plate (3) and the second vertical guide plate (4) are both meshed and rotatably connected to the reciprocating screw (203), and the first vertical guide plate (3) and the second vertical guide plate (4) are both slidably connected to the movable slide (201).

7. A silicon material polishing device according to claim 1, characterized in that, The guide mechanism (2) is fixedly connected to the polishing frame (1).

8. A silicon material polishing device according to claim 3, characterized in that, One end of the spray pipe (303) is located inside the polishing liquid tank (301) and is equipped with a drain pump.

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