A micro-tension wire guide mechanism for winding bonded copper wire

Abstract

This utility model discloses a micro-tension wire guiding mechanism for winding bonded copper wire, including a fixed bracket positioned upstream of the winding device. A guide rod is vertically mounted on the fixed bracket via a fixed seat. A slider is slidably connected to the guide rod via a sliding bushing. A central shaft is mounted on the slider, and a large rotating wheel is rotatably connected to the central shaft. Connecting shafts are equidistantly mounted along the circumference of the large rotating wheel, and guide wheels are rotatably connected to the connecting shafts. A knob bolt is mounted at the bottom of the fixed seat below the slider. This utility model provides tension to the bonded copper wire by setting a large rotating wheel that can be raised, lowered, moved, and rotated, and which is also equipped with a rotatable guide wheel. The knob bolt can be adjusted in advance to change the corresponding support force according to the diameter, hardness, and other properties of the bonded copper wire being produced. The large rotating wheel can be raised and lowered to directly change the tension. The simultaneous rotation of the large and small rotating wheels reduces the resistance experienced by the bonded copper wire, making it less prone to tensile deformation, thereby achieving the effect of protecting the bonded copper wire.

Description

Technical Field

[0001] This utility model relates to the field of bonding copper wire production technology, specifically to a bonding copper wire winding micro-tension guide mechanism. Background Technology

[0002] Copper bonding wires have significant applications in modern technology, particularly in semiconductor packaging, where they are primarily used to connect chips to external circuits, ensuring smooth transmission of current and signals. These wires are typically made of 4N high-purity copper, possessing a simple single-crystal structure and excellent mechanical properties. Their low ball and wire hardness facilitates bonding without damaging the chip. They also exhibit excellent electrical and thermal conductivity. Through the addition of trace elements or special processing, they possess good oxidation resistance, high elongation, and high breaking strength, enabling them to withstand high stress. Furthermore, they exhibit better arcing during bonding, preventing wire collapse.

[0003] The final step in the production of bonding copper wire is winding and packaging. The wire is laid out using a wire guide in the winding device, and then wound up by a torque motor that drives the winding reel. Because the bonding copper wire travels a long distance on the production line, its tension is difficult to maintain consistently. Therefore, a tension guiding mechanism is needed to provide tension while guiding the wire, ensuring consistent winding tightness in the packaged product and guaranteeing its aesthetic appearance.

[0004] Most existing bonding copper wire tensioning guide mechanisms use numerous S-shaped sheaves to turn and transport the bonding copper wire. At the same time, springs are installed on some of these sheaves. By pulling or supporting the sheaves, the sheaves can tighten the loose bonding copper wires to achieve a certain degree of tension.

[0005] However, the tension adjustment of the bonding copper wire by the aforementioned tension guide mechanism relies entirely on the spring force. The spring constant, the diameter and hardness of the bonding copper wire, and the resistance encountered during the feeding of the bonding copper wire all affect the final tension on the bonding copper wire. Because the bonding copper wire is fed a long distance on the tension guide mechanism and has many contacts with the wire wheel, the resistance encountered by the bonding copper wire is increased. At this time, since the tension provided by the tension guide mechanism is relatively fixed, it is easy for the bonding copper wire to be overstretched due to the increased resistance, which will eventually cause irreversible deformation, directly affecting the quality of the product and resulting in defects. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a micro-tension guide mechanism for winding bonded copper wire, which solves the problem that the tension provided by existing bonded copper wire tension guide mechanisms is relatively fixed, causing the bonded copper wire to be easily stretched excessively due to increased resistance, ultimately resulting in irreversible deformation.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0008] A bonding copper wire winding micro-tension guiding mechanism includes a fixed bracket disposed upstream of a winding device. A guide rod is vertically mounted on the fixed bracket via a fixed seat. A slider is slidably connected to the guide rod via a sliding bushing. A central shaft is mounted on the slider. A large rotating wheel is rotatably connected to the central shaft. Connecting shafts are equidistantly mounted on the large rotating wheel along the circumference. A guide wheel is rotatably connected to the connecting shaft.

[0009] A knob bolt is installed at the bottom of the fixed base below the slider, and a spring telescopic rod is installed at the bottom of the slider. The knob bolt is supported at the bottom of the spring telescopic rod.

[0010] The fixed bracket is equipped with a pressure wheel and a support wheel on both sides above the large rotating wheel to limit the bonding copper wires. The large rotating wheel supports the bonding copper wires through a guide wheel located above the central shaft.

[0011] Preferably, there are two light rods, which are symmetrically arranged on both sides of the central axis.

[0012] Preferably, the pressing wheel and the supporting wheel are mounted on a fixed shaft on a fixed bracket, the large rotating wheel is an aluminum alloy disc, and the large rotating wheel is rotatably connected to the central shaft, the guide wheel to the connecting shaft, and the pressing wheel and the supporting wheel to the fixed shaft, respectively, through ceramic bearings.

[0013] Preferably, the wire guide wheel, the wire pressing wheel, and the wire supporting wheel are all ceramic V-groove wheels.

[0014] Preferably, the pressure roller is located between the support roller and the large rotating roller.

[0015] Preferably, the spring telescopic rod includes a sleeve vertically fixed to the bottom of the slider, a support spring installed inside the sleeve, and a movable support rod inserted into the lower end of the sleeve and supported at the bottom of the support spring.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] This invention provides tension to the bonding copper wire by setting a large rotating wheel that can be raised, lowered, moved, and rotated, and which is also equipped with a rotating guide wheel. The support force can be changed in advance by adjusting the knob bolt according to the diameter, hardness, and other properties of the bonding copper wire being produced. The large rotating wheel can be raised and lowered to directly change the tension. The large and small rotating wheels can rotate simultaneously, which reduces the resistance to the bonding copper wire and makes it less prone to tensile deformation, thereby protecting the bonding copper wire. This solves the problem that the tension provided by the existing bonding copper wire tension guide mechanism is relatively fixed, which makes the bonding copper wire prone to overstretching due to increased resistance and ultimately causing irreversible deformation. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the structure at the corresponding position of the large rotating wheel of this utility model;

[0020] Figure 3 This is a side view of the pressure roller of this utility model;

[0021] Figure 4 This is a schematic diagram of the internal structure of the spring telescopic rod of this utility model.

[0022] In the diagram: 1. Rewinding device; 2. Fixed bracket; 3. Fixed seat; 4. Smooth rod; 5. Slider; 6. Central shaft; 7. Large rotating wheel; 8. Connecting shaft; 9. Guide wheel; 10. Knob bolt; 11. Spring telescopic rod; 111. Sleeve; 112. Support spring; 113. Movable support rod; 12. Bonded copper wire; 13. Pressure roller; 14. Support roller; 15. Fixed shaft; 16. Ceramic bearing; 17. Cable guide; 18. Rewinding reel. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figure 1-4 As shown, this utility model provides a technical solution: a bonding copper wire winding micro-tension wire guiding mechanism, including a fixed bracket 2 disposed upstream of the winding device 1, a light rod 4 vertically mounted on the fixed bracket 2 via a fixed seat 3, a slider 5 slidably connected to the light rod 4 via a sliding bushing, a central shaft 6 mounted on the slider 5, and two light rods 4 symmetrically disposed on both sides of the central shaft 6.

[0025] A large rotating wheel 7 is rotatably connected to the central shaft 6. A connecting shaft 8 is equidistantly installed on the large rotating wheel 7 along the circumference. A guide wheel 9 is rotatably connected to the connecting shaft 8. The guide wheel 9, the pressure wheel 13, and the support wheel 14 are all ceramic V-groove wheels, which have a small contact area with the bonding copper wire 12, resulting in low resistance during the conveying of the bonding copper wire 12.

[0026] A knob bolt 10 is installed at the bottom of the fixed base 3 below the slider 5. A spring telescopic rod 11 is installed at the bottom of the slider 5. The knob bolt 10 is supported at the bottom of the spring telescopic rod 11. The spring telescopic rod 11 includes a sleeve 111 vertically fixed at the bottom of the slider 5, a support spring 112 installed in the sleeve 111, and a movable support rod 113 inserted into the lower end of the sleeve 111 and supported at the bottom of the support spring 112. The upward support force on the large rotating wheel 7 to the bonding copper wire 12 can be adjusted by turning the knob bolt 10. The specific adjustment range is determined by the quality inspection results of the bonding copper wire 12. If the diameter of the bonding copper wire 12 is too small, the knob bolt 10 is adjusted downward; otherwise, the knob bolt 10 is adjusted upward.

[0027] On the fixed bracket 2, at positions above both sides of the large rotating wheel 7, there are respectively a pressure wheel 13 and a support wheel 14 for limiting the bonding copper wire 12. The pressure wheel 13 is located between the support wheel 14 and the large rotating wheel 7. The large rotating wheel 7 supports the bonding copper wire 12 upward through the guide wheel 9. This support force is an external force after offsetting its own weight, which can avoid the bonding copper wire 12 being overstretched and undergoing irreversible deformation due to excessive support force.

[0028] The large rotating wheel 7 supports the bonding copper wire 12 via the guide wheel 9 located above the central shaft 6. The pressure wheel 13 and the support wheel 14 are mounted on the fixed shaft 15 on the fixed bracket 2. The large rotating wheel 7 is an aluminum alloy disc with high structural strength, light weight, and low rotational resistance. The large rotating wheel 7 is rotatably connected to the central shaft 6, the guide wheel 9 is connected to the connecting shaft 8, and the pressure wheel 13 and the support wheel 14 are connected to the fixed shaft 15 via ceramic bearings 16. The ceramic bearings 16 have low rotational resistance, which avoids excessive resistance in the conveying of the bonding copper wire 12, thus preventing tensile deformation.

[0029] Working principle:

[0030] The bonding copper wire 12 is conveyed on the production line, passing sequentially through the left-side support roller 14 and pressure roller 13, around the guide roller 9 located above the central shaft 6 on the large rotating wheel 7, and then through the right-side pressure roller 13 and support roller 14. Finally, it is laid out by the wire arranger 17 and wound and packaged by the winding reel 18. The guide roller 9, pressure roller 13, and support roller 14 are all ceramic V-groove rollers, with a small contact area with the bonding copper wire 12, resulting in low resistance during the conveying of the bonding copper wire 12. The large rotating wheel 7 is connected to the central shaft 6, the guide roller 9 to the connecting shaft 8, and the pressure roller 13 and support roller 14 are connected to the central shaft 6. Both the 4 and the fixed shaft 15 are rotatably connected via ceramic bearings 16. The ceramic bearings 16 have low rotational resistance, which avoids excessive resistance in the conveying of the bonding copper wire 12 and prevents it from being stretched and deformed. The knob bolts 10 can be adjusted in advance to change the corresponding support force according to the diameter, hardness and other properties of the bonding copper wire 12 currently being produced. The large roller 7 can be raised and lowered to directly change the tension. The large roller 7 and the small roller can rotate at the same time, so that the bonding copper wire 12 is subject to less resistance and is less prone to stretching and deformation, thereby achieving the effect of micro-tension wire guiding and protecting the bonding copper wire 12.

[0031] It should be noted that, in this document, terms such as “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A micro-tension wire guiding mechanism for winding bonded copper wire, characterized in that: It includes a fixed bracket (2) located upstream of the winding device (1), on which a guide rod (4) is vertically mounted via a fixed seat (3), and the guide rod (4) is slidably connected to a slider (5) via a sliding bushing, on which a central shaft (6) is mounted, and a large rotating wheel (7) is rotatably connected to the central shaft (6), and connecting shafts (8) are equidistantly mounted on the large rotating wheel (7) along the circumference, and a guide wheel (9) is rotatably connected to the connecting shaft (8); A knob bolt (10) is installed at the bottom of the fixed seat (3) below the slider (5), and a spring telescopic rod (11) is installed at the bottom of the slider (5). The knob bolt (10) is supported at the bottom of the spring telescopic rod (11). The fixed bracket (2) is equipped with a wire pressing wheel (13) and a wire supporting wheel (14) on both sides above the large rotating wheel (7) to limit the bonding copper wire (12). The large rotating wheel (7) supports the bonding copper wire (12) through the wire guiding wheel (9) located above the central shaft (6).

2. The bonding copper wire winding micro-tension guide mechanism according to claim 1, characterized in that: There are two light rods (4) arranged symmetrically on both sides of the central axis (6).

3. The bonding copper wire winding micro-tension guide mechanism according to claim 1, characterized in that: The pressing wheel (13) and the supporting wheel (14) are mounted on the fixed shaft (15) on the fixed bracket (2). The large rotating wheel (7) is an aluminum alloy disc. The large rotating wheel (7) is rotatably connected to the central shaft (6), the guide wheel (9) is connected to the connecting shaft (8), and the pressing wheel (13) and the supporting wheel (14) are connected to the fixed shaft (15) through ceramic bearings (16).

4. The bonding copper wire winding micro-tension guide mechanism according to claim 1, characterized in that: The wire guide wheel (9), the wire pressing wheel (13), and the wire supporting wheel (14) are all ceramic V-groove wheels.

5. The bonding copper wire winding micro-tension guide mechanism according to claim 1, characterized in that: The pressure roller (13) is located between the support roller (14) and the large rotating roller (7).

6. The bonding copper wire winding micro-tension guide mechanism according to claim 1, characterized in that: The spring telescopic rod (11) includes a sleeve (111) vertically fixed to the bottom of the slider (5), a support spring (112) installed in the sleeve (111), and a movable support rod (113) inserted into the lower end of the sleeve (111) and supported at the bottom of the support spring (112).

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