A dual-circulation device for electroplating immersion tank

Abstract

This utility model relates to the field of electroplating technology and discloses a dual-circulation device for an electroplating immersion tank, including an electroplating tank and a lower auxiliary tank, a first circulation component and a second circulation component. In the first circulation component, the mixing pipes are arranged in two rows along the width direction of the electroplating tank. The electroplating solution is injected into the tank in a mixed flow form by the continuous power provided by the first circulation pump, so as to achieve uniform distribution of liquid flow over a large area and at multiple points inside the tank. This quickly breaks the static layer of liquid and causes disturbance in the electroplating solution, improving the uniformity of liquid coverage on the surface of the electroplated parts. In the second circulation component, the mixing generation box is symmetrically arranged on the bottom wall of the electroplating tank and located between the two rows of mixing pipes. The second circulation pump draws electroplating solution from the lower auxiliary tank and flows upward evenly through the mixing generation box, so as to achieve a strong disturbance and replenishment effect on the bottom area of ​​the tank, significantly improving the fluidity and mixing intensity of the liquid at the bottom of the electroplating tank.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and more specifically, to a dual-circulation device for an electroplating immersion tank. Background Technology

[0002] With the rapid development of industries such as electronics manufacturing, new energy, and semiconductor packaging, electroplating, as a key step in surface treatment and functional layer deposition, plays an irreplaceable role in product performance and reliability. The electroplating process typically relies on the thorough mixing and stable flow of the electroplating solution to achieve uniform deposition of metal ions, ensuring consistent coating thickness, strong adhesion, and excellent surface finish. Especially in the electroplating of high-precision components or large-area products, the uniformity of the electroplating solution's flow and the intensity of disturbance become critical factors affecting electroplating quality. Therefore, higher requirements are placed on the circulation system structure of the electroplating equipment.

[0003] Most common electroplating equipment currently uses a single-loop system, where the electroplating solution is drawn from the main tank and then re-injected into the main tank to form a liquid loop. However, in actual operation, problems such as poor mixing and localized dead zones often occur. In particular, liquid accumulation or insufficient flow rate can easily form at the bottom of the electroplating tank, resulting in insufficient mixing of the electroplating solution and uneven temperature distribution. This leads to uneven thickness of the coating in some areas, and even deposition defects, making it difficult to meet the requirements for high-uniformity coating quality.

[0004] Therefore, there is a need to provide a dual circulation device for electroplating immersion tanks to solve the problems of insufficient mixing of electroplating solutions and uneven temperature distribution in the existing electroplating equipment circulation system. Utility Model Content

[0005] The main objective of this invention is to provide a dual-circulation device for an electroplating immersion tank, which aims to solve the technical problems mentioned in the background section.

[0006] The present invention adopts the following technical solution:

[0007] A dual-circulation device for an electroplating immersion tank, comprising:

[0008] An electroplating tank and a lower auxiliary tank, wherein the electroplating tank is disposed above the lower auxiliary tank;

[0009] The first circulation component includes a first circulation pump, the input end of which is connected to the lower auxiliary tank, and the output end of which is connected to a plurality of mixing pipes arranged in two rows, the mixing pipes being disposed in the electroplating tank.

[0010] The second circulation component includes a second circulation pump. The input end of the second circulation pump is connected to the lower auxiliary tank, and the output end of the second circulation pump is connected to two symmetrically arranged mixing boxes. The two mixing boxes are arranged on the inner bottom wall of the electroplating tank, and both mixing boxes are arranged between the two rows of mixing pipes to uniformly pump the electroplating solution into the electroplating tank.

[0011] Furthermore, the first circulation assembly also includes a first filter, which is disposed between the output end of the first circulation pump and the electroplating tank;

[0012] The second circulation assembly further includes a second filter, which is disposed between the input end of the second circulation pump and the lower auxiliary tank.

[0013] Furthermore, the output end of the first circulating pump is connected to two symmetrically arranged first output pipes, and the upper end of each of the two first output pipes is connected to several evenly distributed diversion pipes. The diversion pipes penetrate the bottom wall of the electroplating tank and extend into the electroplating tank, and the upper end face of the diversion pipes is connected to the mixing pipe.

[0014] Furthermore, each of the mixing tubes has a spray hole on one side, and the spray holes of the two rows of mixing tubes are arranged opposite to each other.

[0015] A fixing rod is connected to the top of the mixing tube. The fixing rod has a notch that surrounds the mixing tube. The end of the fixing rod away from the mixing tube is fixedly connected to the electroplating tank.

[0016] Furthermore, the output end of the second circulation pump is connected to two symmetrically arranged second output pipes. The second output pipes penetrate the bottom wall of the electroplating tank and are flush with the inner bottom wall of the electroplating tank. The mixing generation box covers the second output pipes so that the electroplating solution is filled into the mixing generation box and then pumped into the electroplating tank.

[0017] Furthermore, the mixing generator box is a cavity structure with an open bottom, so that the mixing generator box covers the second output tube, and the upper surface of the mixing generator box is provided with a plurality of evenly distributed mixing holes.

[0018] Furthermore, the input end of the first circulation pump is connected to a first inlet pipe, which penetrates the lower sub-tank and extends into the bottom of the lower sub-tank. The end of the first inlet pipe away from the first circulation pump is connected to a perforated pipe for sucking up the sediment in the lower sub-tank.

[0019] The input end of the second circulation pump is connected to a second inlet pipe, which penetrates the lower auxiliary tank and is flush with the side wall of the lower auxiliary tank, and the second inlet pipe is higher than the first inlet pipe.

[0020] Furthermore, overflow plates are provided on opposite sides of the two mixing generating boxes. The overflow plates are fixedly connected to the electroplating tank to form an overflow recovery chamber. The overflow plates are provided with overflow holes. A return pipe is provided on the bottom wall of the electroplating tank corresponding to the overflow recovery chamber. The return pipe is connected to the lower auxiliary tank.

[0021] Beneficial effects:

[0022] This invention provides a dual-circulation device for an electroplating immersion tank. The electroplating tank and its lower auxiliary tank form a liquid interconnection foundation, constructing a dual-circulation system. In the first circulation component, mixing pipes are arranged in two rows along the width of the electroplating tank. The electroplating solution is injected into the tank in a mixed-flow manner by the continuous power provided by the first circulation pump, achieving uniform distribution of the liquid flow over a large area and at multiple points within the tank. This rapidly breaks the static liquid layer, creating disturbance in the electroplating solution and improving the uniformity of liquid coverage on the surface of the electroplated components. In the second circulation component, mixing generating boxes are symmetrically arranged on the bottom wall of the electroplating tank, located between the two rows of mixing pipes. The second circulation pump draws electroplating solution from the lower auxiliary tank and evenly flows upward through the mixing generating boxes, achieving a strong disturbance and replenishment effect on the bottom area of ​​the tank. This significantly improves the fluidity and mixing intensity of the liquid at the bottom of the electroplating tank, eliminates dead zones, and effectively enhances the dynamic mixing ability of the electroplating solution throughout the tank. It also achieves rapid equilibrium of the electroplating solution concentration and temperature, thus providing a stable and reliable process environment for highly consistent metal deposition. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a double circulation device for an electroplating immersion tank according to this utility model;

[0024] Figure 2 This is a front view schematic diagram of a double circulation device for an electroplating immersion tank according to this utility model;

[0025] Figure 3 This is a partial structural schematic diagram of the present invention;

[0026] Figure 4 This is a top view schematic diagram of the electroplating tank of this utility model;

[0027] Figure 5 This is a schematic diagram of the structure of the mixing tube of this utility model;

[0028] Figure 6 This is a schematic diagram of the structure of the mixing generator box of this utility model;

[0029] The components are as follows: 1. Electroplating tank; 2. Lower auxiliary tank; 3. First circulation assembly; 310. First circulation pump; 320. Mixing pipe; 321. Spray hole; 330. First filter; 340. First output pipe; 350. Diverter pipe; 360. First inlet pipe; 370. Porous pipe; 4. Second circulation assembly; 410. Second circulation pump; 420. Mixing generation box; 421. Mixing hole; 430. Second filter; 440. Second output pipe; 450. Second inlet pipe; 5. Fixing rod; 6. Overflow plate; 601. Overflow hole; 7. Overflow recovery chamber; 8. Return pipe.

[0030] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0032] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] Reference Figures 1 to 6 This utility model proposes a double circulation device for an electroplating immersion tank, comprising: an electroplating tank 1 and a lower auxiliary tank 2, wherein the electroplating tank 1 is disposed above the lower auxiliary tank 2;

[0036] The first circulation component 3 includes a first circulation pump 310. The input end of the first circulation pump 310 is connected to the lower auxiliary tank 2, and the output end of the first circulation pump 310 is connected to a plurality of mixing pipes 320 arranged in two rows. The mixing pipes 320 are disposed in the electroplating tank 1.

[0037] The second circulation component 4 includes a second circulation pump 410. The input end of the second circulation pump 410 is connected to the lower auxiliary tank 2, and the output end of the second circulation pump 410 is connected to two symmetrically arranged mixing boxes 420. The two mixing boxes 420 are arranged on the inner bottom wall of the electroplating tank 1, and both mixing boxes 420 are arranged between the two rows of mixing pipes 320 to uniformly pump the electroplating solution into the electroplating tank 1.

[0038] In the above embodiment, an electroplating tank 1 and a lower auxiliary tank 2 are disposed on the overall structure. The electroplating tank 1 is positioned above the lower auxiliary tank 2, and the two form the basic structure for liquid flow, allowing the electroplating solution to be stored and circulated in separate zones between the main tank and the auxiliary tank. This facilitates the distribution of liquid processing load and improves the overall liquid flow management efficiency. The electroplating tank 1 is the main process tank that carries the workpiece to be electroplated, while the lower auxiliary tank 2 serves to receive and store the bottom return liquid, providing a source of liquid for the second circulation system.

[0039] The first circulation component 3 includes a first circulation pump 310, whose input end is connected to the lower auxiliary tank 2 to draw electroplating solution from the lower auxiliary tank 2. Its output end is connected to two rows of mixing pipes 320 arranged in an array along the width of the electroplating tank 1, forming a multi-point distributed mixed-flow jet structure. When the first circulation pump 310 is started, the electroplating solution is sprayed out from the mixing pipes 320 at a controlled flow rate, breaking the static layer on the liquid surface and forming a flow field with disturbance characteristics. This not only enhances the fluidity and adhesion of the electroplating solution on the workpiece surface but also promotes continuous exchange of metal ions in the solution, improving deposition efficiency.

[0040] The second circulation component 4 includes a second circulation pump 410 and two mixing chambers 420. The input end of the second circulation pump 410 is connected to the lower auxiliary tank 2, from which it draws the settled or returned electroplating solution. Its output end is connected to the two mixing chambers 420, which are symmetrically arranged on the inner bottom wall of the electroplating tank 1 and located between the two rows of mixing pipes 320, ensuring coverage of the bottom area of ​​the tank in terms of liquid flow disturbance and avoiding the formation of flow dead zones or deposition blind zones. The mixing chambers 420 inject the electroplating solution back into the tank in a disturbed state through a bottom-up jetting method, significantly enhancing the agitation and mixing efficiency of the electroplating solution at the bottom of the tank, and effectively achieving rapid equilibrium of the concentration and temperature of the liquid at the bottom. The synergistic effect of this dual circulation system enables the liquid flow inside the entire electroplating tank 1 to form a dynamic circulation with vertical linkage and mutual disturbance, thereby ensuring a highly consistent liquid environment during the electroplating process and meeting the stringent requirements of precision processes for the uniformity and consistency of the coating.

[0041] refer to Figure 1 In one embodiment, the first circulation component 3 further includes a first filter 330, which is disposed between the output end of the first circulation pump 310 and the electroplating tank 1.

[0042] The second circulation component 4 also includes a second filter 430, which is disposed between the input end of the second circulation pump 410 and the lower auxiliary tank 2.

[0043] In the above embodiments, the first circulation component 3 and the second circulation component 4 are respectively equipped with filters. The first filter 330 is disposed between the output end of the first circulation pump 310 and the electroplating tank 1, and the second filter 430 is located between the input end of the second circulation pump 410 and the lower auxiliary tank 2. The function of the filters is to remove impurities in the electroplating solution, such as metal particles, deposits, or other contaminants, to prevent these impurities from being reintroduced into the electroplating tank 1 or the auxiliary tank during the circulation process, thus affecting the quality of the electroplating solution and the stability of the electroplating process.

[0044] refer to Figure 2 and Figure 3In one example, the output end of the first circulation pump 310 is connected to two symmetrically arranged first output pipes 340. The upper ends of the two first output pipes 340 are connected to several evenly distributed diversion pipes 350. The diversion pipes 350 penetrate the bottom wall of the electroplating tank 1 and extend into the electroplating tank 1. The upper end face of the diversion pipes 350 is connected to the mixing pipe 320.

[0045] In the above embodiment, the output end of the first circulation pump 310 is connected to two symmetrically arranged first output pipes 340, and the upper end of each first output pipe 340 is connected to several evenly distributed diversion pipes 350. The diversion pipes 350 penetrate the bottom wall of the electroplating tank 1 and extend into the interior of the electroplating tank 1. The upper end face of the diversion pipe 350 is connected to the mixing pipe 320 to form a liquid distribution channel. The electroplating solution is guided to the bottom of the electroplating tank 1 through the diversion pipes 350, making the flow of the electroplating solution more uniform and ensuring that the liquid flows into the tank from multiple inlet points, effectively reducing local unevenness in liquid distribution and the occurrence of flow dead zones.

[0046] refer to Figure 4 and Figure 5 In one embodiment, each of the plurality of mixing pipes 320 has a spray hole 321 on one side, and the spray holes 321 of the two rows of mixing pipes 320 are arranged opposite to each other.

[0047] The top end of the mixing pipe 320 is connected to a fixing rod 5. The fixing rod 5 has a slot that surrounds the mixing pipe 320. The end of the fixing rod 5 away from the mixing pipe 320 is fixedly connected to the electroplating tank 1.

[0048] In the above embodiment, each side of the mixing tube 320 is provided with a spray hole 321, and the spray holes 321 of the two rows of mixing tubes 320 are arranged opposite to each other. A fixing rod 5 is connected to the top of the mixing tube 320, and a retaining groove is provided on the fixing rod 5 to surround the mixing tube 320. The end of the fixing rod 5 away from the mixing tube 320 is fixedly connected to the electroplating tank 1. The spray holes 321 allow the electroplating solution to be poured into the electroplating tank 1, and the liquid spraying creates disturbance, breaking the static layer of the liquid, thereby enhancing the metal ion exchange efficiency and the uniformity of the plating layer. The connection between the fixing rod 5 and the electroplating tank 1 ensures the stability of the mixing tube 320.

[0049] refer to Figure 1 and Figure 2 In one embodiment, the output end of the second circulation pump 410 is connected to two symmetrically arranged second output pipes 440. The second output pipes 440 penetrate the bottom wall of the electroplating tank 1 and are flush with the inner bottom wall of the electroplating tank 1. The mixing box 420 covers the second output pipes 440 so that the electroplating liquid is filled into the mixing box 420 and then pumped into the electroplating tank 1.

[0050] In the above embodiment, the output end of the second circulation pump 410 is connected to two symmetrically arranged second output pipes 440. The second output pipes 440 penetrate the bottom wall of the electroplating tank 1, and the ends of the second output pipes 440 are flush with the inner bottom wall of the electroplating tank 1. A mixing flow generating box 420 covers the second output pipes 440 so that after the electroplating solution is filled into the mixing flow generating box 420, it is pumped into the electroplating tank 1. This allows the electroplating solution to flow uniformly into the electroplating tank 1 through the mixing flow generating box 420, and forms a strong turbulent flow during the flow process. This effectively improves the liquid flow distribution in the bottom area of ​​the electroplating tank 1, eliminates dead zones in the liquid flow, and ensures more uniform liquid mixing and heat exchange in the bottom area of ​​the tank.

[0051] refer to Figure 6 In one embodiment, the mixing box 420 is a cavity structure with an open bottom, so that the mixing box 420 covers the second output tube 440, and the upper surface of the mixing box 420 is provided with a plurality of evenly distributed mixing holes 421.

[0052] In the above embodiment, the mixing chamber 420 is a cavity structure with an open bottom, allowing the electroplating solution to enter the mixing chamber 420 through the opening and undergo initial filling. The upper surface of the mixing chamber 420 has several evenly distributed mixing holes 421. These holes 421 are used to spray the electroplating solution into the electroplating tank 1 at a uniform speed and direction. By providing an effective source of liquid disturbance, the fluidity of the electroplating solution within the electroplating tank 1 is enhanced, thus fully promoting the circulation and heat exchange of the electroplating solution within the tank. Furthermore, the cavity structure with the open bottom and the evenly distributed mixing holes 421 ensure the accuracy of the liquid spray direction, effectively avoiding problems such as uneven liquid flow and poor deposition.

[0053] In one embodiment, the input end of the first circulation pump 310 is connected to a first inlet pipe 360, the first inlet pipe 360 ​​penetrates the lower sub-tank 2 and extends into the bottom of the lower sub-tank 2, and the end of the first inlet pipe 360 ​​away from the first circulation pump 310 is connected to a porous pipe 370 for sucking up the sediment in the lower sub-tank 2.

[0054] The input end of the second circulation pump 410 is connected to a second inlet pipe 450. The second inlet pipe 450 penetrates the lower auxiliary tank 2 and is flush with the side wall of the lower auxiliary tank 2. The second inlet pipe 450 is higher than the first inlet pipe 360.

[0055] In the above embodiment, the input end of the first circulation pump 310 is connected to a first inlet pipe 360, which penetrates the bottom of the lower sub-tank 2 and extends into it. One end of the first circulation pump 310, away from the first circulation pump 310, is connected to a porous pipe 370. The porous pipe 370 is used to more smoothly extract deposits and impurities from the lower sub-tank 2, ensuring the cleanliness of the electroplating solution entering the electroplating tank 1. The input end of the second circulation pump 410 is connected to a second inlet pipe 450, which penetrates the lower sub-tank 2 and is flush with its inner wall. In terms of height, the second inlet pipe 450 is positioned above the first inlet pipe 360. The porous pipe 370 effectively extracts deposits from the bottom of the sub-tank, preventing these impurities from entering the electroplating tank 1 and affecting the electroplating quality. Simultaneously, the higher position of the second inlet pipe 450 guides the clean liquid in the sub-tank into the second circulation system, ensuring that the circulation of the electroplating solution is not disturbed by deposits, thereby maintaining the purity and stability of the liquid in the electroplating tank 1.

[0056] refer to Figure 4 In one embodiment, overflow plates 6 are provided on opposite sides of the two mixed flow generating boxes 420. The overflow plates 6 are fixedly connected to the electroplating tank 1 to form an overflow recovery chamber 7. The overflow plates 6 are provided with overflow holes 601. The bottom wall of the electroplating tank 1 is provided with a return pipe 8 corresponding to the overflow recovery chamber 7. The return pipe 8 is connected to the lower auxiliary tank 2.

[0057] In the above embodiment, overflow plates 6 are respectively provided on the two mutually distant sides of the two mixing generation boxes 420. The overflow plates 6 are fixedly connected to the electroplating tank 1 to form an overflow recovery chamber 7. The overflow plates 6 have overflow holes 601. A return pipe 8 is provided on the bottom wall of the electroplating tank 1 corresponding to the position of the overflow recovery chamber 7. The return pipe 8 is connected to the lower auxiliary tank 2, which can effectively recover the electroplating solution overflowing from the electroplating tank 1 and guide the overflowing liquid back to the lower auxiliary tank 2 through the return pipe 8, realizing the secondary use of the liquid. At the same time, the overflow plates 6 and overflow holes 601 can not only prevent the liquid in the tank from being too full or overflowing, but also effectively remove foreign matter from the upper liquid surface and increase the activity of the solution. Sending the liquid back to the lower auxiliary tank 2 through the return pipe 8 helps to maintain a stable amount of liquid in the electroplating tank 1, while avoiding system instability caused by excessive liquid loss, thereby achieving better recycling.

[0058] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the content of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A dual-circulation device for an electroplating immersion tank, characterized in that, include: Electroplating tank (1) and lower auxiliary tank (2), wherein the electroplating tank (1) is disposed above the lower auxiliary tank (2); The first circulation component (3) includes a first circulation pump (310), the input end of the first circulation pump (310) is connected to the lower auxiliary tank (2), and the output end of the first circulation pump (310) is connected to a plurality of mixing pipes (320) arranged in two rows, the mixing pipes (320) being arranged in the electroplating tank (1). The second circulation component (4) includes a second circulation pump (410). The input end of the second circulation pump (410) is connected to the lower auxiliary tank (2). The output end of the second circulation pump (410) is connected to two symmetrically arranged mixing boxes (420). The two mixing boxes (420) are arranged on the inner bottom wall of the electroplating tank (1), and both mixing boxes (420) are arranged between the two rows of mixing pipes (320) to uniformly pump the electroplating solution into the electroplating tank (1).

2. The double-circulation device for an electroplating immersion tank according to claim 1, characterized in that, The first circulation component (3) further includes a first filter (330), which is disposed between the output end of the first circulation pump (310) and the electroplating tank (1); The second circulation component (4) further includes a second filter (430), which is disposed between the input end of the second circulation pump (410) and the lower auxiliary tank (2).

3. The double-circulation device for an electroplating immersion tank according to claim 1, characterized in that, The output end of the first circulating pump (310) is connected to two symmetrically arranged first output pipes (340). The upper ends of the two first output pipes (340) are connected to several evenly distributed diversion pipes (350). The diversion pipes (350) penetrate the bottom wall of the electroplating tank (1) and extend into the electroplating tank (1). The upper end face of the diversion pipes (350) is connected to the mixing pipe (320).

4. The double-circulation device for an electroplating immersion tank according to claim 1, characterized in that, Each of the mixing pipes (320) has a spray hole (321) on one side, and the spray holes (321) of the two rows of mixing pipes (320) are arranged opposite to each other; The top end of the mixing tube (320) is connected to a fixing rod (5), the fixing rod (5) has a notch that surrounds the mixing tube (320), and the end of the fixing rod (5) away from the mixing tube (320) is fixedly connected to the electroplating tank (1).

5. The double-circulation device for an electroplating immersion tank according to claim 1, characterized in that, The output end of the second circulation pump (410) is connected to two symmetrically arranged second output pipes (440). The second output pipes (440) penetrate the bottom wall of the electroplating tank (1) and are flush with the inner bottom wall of the electroplating tank (1). The mixing box (420) covers the second output pipes (440) so that the electroplating liquid is filled into the mixing box (420) and then pumped into the electroplating tank (1).

6. The double-circulation device for an electroplating immersion tank according to claim 5, characterized in that, The mixing box (420) is a cavity structure with an open bottom, so that the mixing box (420) covers the second output tube (440), and the upper surface of the mixing box (420) is provided with a plurality of evenly distributed mixing holes (421).

7. The double-circulation device for an electroplating immersion tank according to claim 1, characterized in that, The input end of the first circulation pump (310) is connected to a first inlet pipe (360), which penetrates the lower sub-tank (2) and extends into the bottom of the lower sub-tank (2). The end of the first inlet pipe (360) away from the first circulation pump (310) is connected to a perforated pipe (370) for sucking up the sediment in the lower sub-tank (2). The input end of the second circulation pump (410) is connected to a second inlet pipe (450). The second inlet pipe (450) penetrates the lower sub-slot (2) and is flush with the side wall of the lower sub-slot (2). The second inlet pipe (450) is higher than the first inlet pipe (360).

8. The double-circulation device for an electroplating immersion tank according to claim 1, characterized in that, Overflow plates (6) are provided on opposite sides of the two mixing generating boxes (420). The overflow plates (6) are fixedly connected to the electroplating tank (1) to form an overflow recovery chamber (7). The overflow plates (6) are provided with overflow holes (601). The bottom wall of the electroplating tank (1) is provided with a return pipe (8) corresponding to the overflow recovery chamber (7). The return pipe (8) is connected to the lower auxiliary tank (2).

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