An LED lamp heat dissipation device

Abstract

This utility model discloses an LED lamp heat dissipation device, including an LED lamp module. The LED lamp module includes a circuit board and an LED lamp electrically connected and mounted at the bottom of the circuit board. It also includes a heat dissipation mechanism mounted at the top of the circuit board. The heat dissipation mechanism includes a heat dissipation substrate with a cavity filled with a heat dissipation medium. It also includes a heat dissipation pipe structure connected to the top of the heat dissipation substrate. Several heat dissipation capillaries are fixedly connected within the heat dissipation pipe structure, with the liquid inlet end of each capillary located within the cavity. This structure achieves high-efficiency heat dissipation by combining capillary heat dissipation with heat dissipation pipe heat dissipation, effectively solving the technical defect of high-temperature LED lamp modules that cannot be quickly cooled during operation.

Description

Technical Field

[0001] This utility model belongs to the field of LED lamp heat dissipation technology, and in particular relates to an LED lamp heat dissipation device. Background Technology

[0002] Automotive headlights are devices installed on automobiles to illuminate the road. Their main structure includes an LED light module and a lamp cover over the LED light module. The LED light module comprises multiple LED beads electrically connected to a circuit board. During operation, the LED beads emit light, generating heat in the process.

[0003] Therefore, in order to ensure the normal operation of LED lamp modules and avoid damage to circuit components on the circuit board due to high temperatures, existing technologies often involve installing heat dissipation devices on the LED lamp modules.

[0004] Current mainstream heat dissipation devices include heat sinks mounted on circuit boards, which exchange heat with the air to achieve heat dissipation. However, since the LED light modules and heat dissipation devices are installed inside the vehicle body structure, air cooling is not ideal.

[0005] Therefore, heat dissipation through a cooling medium has gradually become a more efficient and effective heat dissipation device. For example, Chinese Patent Publication No. CN104848112A,G discloses a high-power LED vehicle light that dissipates heat through heat pipes filled with a heat dissipation medium including components such as glycerin, ethanol, and acetone. Its working principle is as follows: when the LED vehicle light generates high temperatures, the heat pipes are heated, and the heated heat dissipation medium inside the heat pipes further transfers heat to dissipate the heat.

[0006] However, the technology of using heat dissipation media for vehicle headlights is still not mature enough. For example, although heat dissipation media are used to further conduct heat away from the headlights, the heat generated during operation is still greater for higher-power headlights (LED lighting chips have higher power and more quantity, resulting in higher illumination). Therefore, it is necessary to quickly cool down the heat generated by the LED lighting. In other words, a heat dissipation device with higher heat dissipation efficiency is needed to solve the high temperature problem generated during the operation of higher-power headlights. Utility Model Content

[0007] Based on the above background, the purpose of this utility model is to provide an LED lamp heat dissipation device.

[0008] To achieve the above objectives, the present invention adopts the following technical solution:

[0009] An LED lamp heat dissipation device includes an LED lamp module, the LED lamp module includes a circuit board and an LED lamp electrically connected to and mounted at the bottom of the circuit board, and also includes a heat dissipation mechanism mounted at the top of the circuit board;

[0010] The heat dissipation mechanism includes a heat dissipation substrate, a cavity is provided in the heat dissipation substrate, and the cavity is filled with a heat dissipation medium.

[0011] It also includes a heat dissipation pipe structure connected to the top of the heat dissipation substrate; several heat dissipation capillaries are fixedly connected inside the heat dissipation pipe structure, and the liquid inlet end of the heat dissipation capillaries is located inside the cavity.

[0012] Preferably, the heat dissipation pipe structure includes a heat dissipation pipe connected to the center of the top of the heat dissipation substrate;

[0013] The heat pipes and heat dissipation substrate are in a vacuum environment.

[0014] The outer wall of the heat dissipation capillary is heat-welded to the inner wall of the heat dissipation pipe.

[0015] Preferably, the heat dissipation capillaries are circumferentially distributed on the inner wall of the heat dissipation pipe.

[0016] Preferably, the heat dissipation mechanism further includes an air-cooling component;

[0017] The air-cooling component is used to cool the heat pipes and heat dissipation substrate.

[0018] Preferably, the air-cooling assembly includes an air guide shroud covering the heat dissipation pipe;

[0019] A cooling fan is installed on the top of the air guide shroud. During the heat dissipation process, the cooling fan drives the cooling airflow downwards.

[0020] The cooling fan is fixedly mounted on the top of the air guide shroud by several mounting arms.

[0021] Preferably, the air guide cover includes a central cover portion integrally formed at the bottom of the upper cover portion, and a lower cover portion integrally formed with the central cover portion;

[0022] The lower cover is arranged symmetrically, both vertically.

[0023] The transverse cross-sectional dimension of the central cover is smaller than that of the upper cover and the lower cover.

[0024] Preferably, the top of the heat dissipation substrate is fixedly connected to several support bases, and the bottom of the air guide shroud is fixedly installed on the support bases.

[0025] Preferably, the heat dissipation mechanism further includes a plurality of heat dissipation fins fixedly connected to the top of the heat dissipation substrate;

[0026] Several heat dissipation grooves are provided on the side walls on both sides of the heat dissipation fins.

[0027] The heat dissipation fins are arranged along the width of the heat dissipation substrate, and heat dissipation channels are formed between adjacent heat dissipation fins.

[0028] Preferably, a plurality of spirally coiled heat dissipation fins are fixedly connected to the outer wall of the heat dissipation pipe;

[0029] A heat dissipation groove structure is formed between adjacent spiral heat dissipation fins.

[0030] Preferably, a grid support is fixedly connected inside the heat dissipation substrate, and the grid support has mesh holes;

[0031] The grid support is supported inside the cavity.

[0032] This utility model has the following beneficial effects:

[0033] 1. The heat dissipation capillary structure design enables the physical process of a heat dissipation medium undergoing vaporization at high temperature and liquefaction at low temperature, continuously cooling down during this process. During heat dissipation, the heat dissipation capillary further assists in heat dissipation due to its capillary effect. Therefore, the synergistic heat dissipation structure formed by the heat dissipation pipes and capillary tubes achieves high-efficiency heat dissipation.

[0034] 2. The air guide is designed with a double-cone structure that is large at the top and bottom and narrow in the middle (i.e., the waist of the air guide is narrow). The purpose is that when the cold air is driven downward from the top of the air guide, it will encounter the narrow middle part, at which point the airflow speed will increase, thereby accelerating the downward flow of the cooling air and accelerating the cooling of the heat sink.

[0035] 3. During operation, guided by the air guide shroud, the cooling airflow flows downwards along the heat dissipation pipes, carrying away the heat and lowering its temperature. In this process, the cooling airflow ultimately acts on the heat dissipation substrate (at this point, due to the high airflow velocity, although heated, its temperature is still much lower than the substrate temperature), thus providing further air cooling to the substrate. As the heat dissipation pipe temperature decreases, the heat dissipation medium gradually cools down in the aforementioned manner, completing the physical transformation from vaporization to liquefaction, achieving high-efficiency heat dissipation.

[0036] 4. Through the design of heat dissipation fins, adjacent heat dissipation fins form a heat dissipation channel. When the cooling airflow enters the heat dissipation base plate, the cooling airflow flows outwards in all directions. Since the adjacent heat dissipation fins form a heat dissipation channel, the cooling airflow passes quickly through the heat dissipation channel. In this way, the heat dissipation efficiency between the heat dissipation fins and the cooling airflow is further improved.

[0037] 5. Several spirally coiled heat dissipation fins are fixedly connected to the outer wall of the heat dissipation pipe; a heat dissipation groove structure is formed between adjacent spiral heat dissipation fins. During operation, when the vertically downward driven cooling airflow comes into contact with the spiral heat dissipation fins, the spiral heat dissipation fins first increase the heat exchange efficiency. At the same time, guided by the spiral heat dissipation fins, the cooling airflow passes through the heat dissipation groove structure between the spiral heat dissipation fins, thereby further increasing the contact area between the heat dissipation pipe and the cooling airflow and improving the heat dissipation effect. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the overall structure in an embodiment of the present utility model;

[0040] Figure 2 This is an embodiment of the present utility model. Figure 1 A structural diagram from another perspective;

[0041] Figure 3 This is a schematic diagram of the heat dissipation fins in an embodiment of the present invention;

[0042] Figure 4 This is an embodiment of the present utility model. Figure 1 Sectional view in;

[0043] Figure 5 This is a schematic diagram of the heat dissipation channel formed by the heat dissipation fins in an embodiment of the present invention;

[0044] Figure 6 This is an embodiment of the present utility model. Figure 1 The right view in the image.

[0045] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0046] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0047] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0048] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0049] Example 1

[0050] like Figure 1-6 As shown, an LED lamp heat dissipation device includes an LED lamp module 1, wherein the LED lamp module 1 is a high-power LED lamp module 1 commonly used in existing vehicle headlights. Its main structure includes a circuit board 11 and an LED lamp electrically connected and installed at the bottom of the circuit board 11. The working principle and structure are the same as those of the LED lamp module 1 in existing automotive headlights. During operation, the LED lamp is powered by the circuit board 11 for illumination.

[0051] Those skilled in the art can learn about the specific structure and working principle of the LED lamp module 1 disclosed in this utility model by consulting technical manuals and dictionaries.

[0052] In order to solve the technical defect that the high temperature generated during the operation of the high-power LED lamp module 1 cannot be cooled down quickly in a short time, this utility model improves the heat dissipation structure of the existing LED lamp module 1.

[0053] Specifically, a heat dissipation mechanism is installed at the top of the circuit board 11. By improving the heat dissipation mechanism, a more efficient heat dissipation method is achieved.

[0054] Specifically, the heat dissipation mechanism includes a heat dissipation substrate 4 (the heat dissipation substrate 4 is made of copper with excellent thermal conductivity), and a cavity is provided inside the heat dissipation substrate 4, which is filled with a heat dissipation medium.

[0055] The heat dissipation medium is a conventional heat dissipation medium disclosed in the prior art, including, for example, using ethanol as a heat dissipation medium.

[0056] It also includes a heat dissipation pipe structure connected to the top of the heat dissipation substrate 4; the specific structure of the heat dissipation pipe structure is as follows: the heat dissipation pipe structure includes a heat dissipation pipe 5 (the heat dissipation pipe 5 is made of copper with excellent thermal conductivity) connected to the center of the top of the heat dissipation substrate 4; the heat dissipation pipe 5 and the heat dissipation substrate 4 are in a vacuum environment. Under negative pressure, the boiling point of the heat dissipation medium decreases, making it easier to generate steam through heat conduction.

[0057] Meanwhile, in order to further improve the heat dissipation effect, several heat dissipation capillaries 6 are fixedly connected inside the structure of the heat dissipation pipe 5. The liquid inlet end of the heat dissipation capillaries 6 is located in the cavity (that is, the lower end of the heat dissipation capillaries 6 extends into the heat dissipation substrate 4).

[0058] The heat dissipation capillary tube 6 is distributed circumferentially along the inner wall of the heat dissipation tube 5. The heat dissipation capillary tube 6 is fixed to the inner wall of the heat dissipation tube 5 by heat welding, which is the same as the existing heat dissipation capillary tube 6.

[0059] The upper end of the heat dissipation capillary tube 6 rests against the upper side of the heat dissipation tube 5.

[0060] The heat dissipation capillary tube 6 is used to dissipate heat during operation. The capillary effect of the heat dissipation capillary tube 6 is used for heat dissipation. The capillary heat dissipation and the heat dissipation of the heat pipe 5 work together to increase the heat dissipation efficiency and improve the heat dissipation performance.

[0061] Specifically, during operation, when the LED module 1 generates high temperature, the heat is conducted to the heat dissipation substrate 4, which is in contact with the LED module 1 (circuit board 11). Due to its large contact area, the heat dissipation substrate 4 provides initial rapid cooling. As the vehicle's LED module 1 continues to operate and high-temperature heat conduction occurs, the heat dissipation medium within the heat dissipation substrate 4 is heated. Because the heat dissipation substrate 4 and heat pipe 5 are in a vacuum environment, the heat dissipation medium is more likely to boil and generate heat dissipation vapor. This vapor exchanges heat with the heat pipe 5 (which is cooled by the air-cooling components described below). After the heat exchange, the vapor liquefies due to the temperature drop. A large amount of liquefied vapor slides down the inner wall of the heat pipe 5 back to the heat dissipation substrate 4. The liquefied heat dissipation medium then cools down further, further reducing the temperature of the high-temperature medium within the heat dissipation substrate 4.

[0062] This completes a physical process in which the heat dissipation medium vaporizes at high temperature and liquefies at low temperature, continuously cooling down during the process. During the heat dissipation process, the heat dissipation capillary tube 6 further assists in heat dissipation due to its capillary effect (using the capillary effect of capillary tubes to assist in heat dissipation is a common application based on this property of capillary tubes in the prior art, and those skilled in the art can know this by consulting technical manuals and dictionaries: in order to improve heat dissipation efficiency, the capillary heat dissipation effect of capillary tubes is often used in the prior art).

[0063] Therefore, with the synergistic heat dissipation structure formed by heat pipe 5 and heat dissipation capillary 6, high-efficiency heat dissipation is achieved.

[0064] Example 2

[0065] like Figure 1-6 As shown, based on the structure of Embodiment 1, in order to further increase the heat dissipation efficiency, the heat dissipation mechanism also includes an air-cooling component; the air-cooling component is used to air-cool the heat dissipation pipe 5 and the heat dissipation substrate 4.

[0066] Specifically, the air-cooling assembly includes an air guide shroud 2 that covers the heat sink 5. The air guide shroud 2 is designed with a double-cone structure that is large at the top and bottom and narrow in the middle (i.e., the waist of the air guide shroud 2 is narrow). This is designed so that when the cold air is driven downward from the top of the air guide shroud 2, it encounters the narrow middle part, at which point the airflow velocity increases, thereby accelerating the downward flow of the cooling air and accelerating the cooling of the heat sink 5.

[0067] Specifically, the air guide cover 2 includes an upper cover 21 integrally formed with a central cover 22 (i.e., waist position) at the bottom of the upper cover 21, and a lower cover 23 integrally formed with the central cover 22; the lower cover 21 and the lower cover 23 are arranged symmetrically above and below.

[0068] The transverse cross-sectional dimension of the central cover 22 is smaller than that of the upper cover 21 and the lower cover 23. That is, the air guide cover 2 is designed with a narrow waist and large upper and lower port diameters to achieve airflow acceleration as described above when the airflow passes through the narrow central cover.

[0069] Meanwhile, a cooling fan 3 is installed on the top of the aforementioned air guide shroud 2. During the heat dissipation process, the cooling fan 3 drives the cooling airflow downwards.

[0070] Among them, the cooling fan 3 is a conventional cooling fan 3 disclosed in the prior art. It has the same structure as the existing cooling fan 3, including a housing and a motor and fan blades installed in the housing. During operation, the motor drives the fan blades to drive the cooling airflow down along the air guide shroud 2.

[0071] Similar to the existing cooling fan 3, the cooling fan 3 is fixedly installed on the top of the air guide shroud 2 by several mounting arms 31 (that is, one end of the mounting arm is fixed to the housing and the other end is fixed to the air guide shroud 2. The fixing method and structure are the conventional fixing structure of the existing cooling fan 3, such as the outer end of the mounting arm being fastened to the side wall of the shroud opening of the air guide shroud 2 by bolts).

[0072] According to the existing cover fixing method, four rectangular support seats 42 (columnar structure) are fixedly connected to the top of the heat dissipation base plate 4, and the bottom of the air guide cover 2 is fixedly installed on the support seats 42.

[0073] During operation, guided by the air guide shroud 2, the cooling airflow flows downwards along the heat dissipation pipe 5, carrying away the heat energy and lowering its temperature. In this process, the cooling airflow ultimately acts on the heat dissipation substrate 4 (at this point, due to the high airflow velocity, although heated, its temperature is still much lower than the temperature of the heat dissipation substrate 4), thus providing further air cooling to the heat dissipation substrate 4. As the temperature of the heat dissipation pipe 5 decreases, the heat dissipation medium gradually cools down in the manner described above, completing the physical transformation process from vaporization to liquefaction, achieving high-efficiency heat dissipation.

[0074] Example 3

[0075] like Figure 1-6 As shown, based on the structure of Embodiment 2, this embodiment further enhances the heat dissipation effect by including several heat dissipation fins 41 (preferably made of copper with excellent heat dissipation performance) fixedly connected to the top of the heat dissipation substrate 4. To improve the heat dissipation effect, following the existing method of improving the heat dissipation efficiency of the heat dissipation fins 41, several heat dissipation grooves 411 are provided on the side walls on both sides of the heat dissipation fins 41. The heat dissipation grooves 411 are used to increase the heat dissipation area, that is, the groove structure design increases the total contact area between the heat dissipation fins 41 and the cooling airflow, thereby improving the heat dissipation effect.

[0076] Specifically, the heat dissipation fins 41 are arranged along the width direction of the heat dissipation substrate 4, and a heat dissipation channel A is formed between adjacent heat dissipation fins 41.

[0077] With the above layout, adjacent heat dissipation fins 41 form a heat dissipation channel A. When the cooling airflow enters the heat dissipation substrate 4, the cooling airflow flows outwards, and adjacent heat dissipation fins 41 form a heat dissipation channel A. Therefore, the cooling airflow passes quickly through the heat dissipation channel A, thereby further improving the heat dissipation efficiency between the heat dissipation fins 41 and the cooling airflow.

[0078] Example 4

[0079] like Figure 1-6 As shown, this embodiment is based on the structure of embodiment 3 and has the same heat dissipation principle as the heat dissipation fin 41. In order to increase the heat exchange speed of the heat dissipation pipe 5, a number of spiral heat dissipation fins 51 (similarly made of copper) are fixedly connected to the outer wall of the heat dissipation pipe 5; a heat dissipation groove structure is formed between adjacent spiral heat dissipation fins 51.

[0080] During operation, when the vertically downward driven cooling airflow comes into contact with the spiral heat dissipation fins 51, the spiral heat dissipation fins 51 first increase the heat exchange efficiency. At the same time, under the guidance of the spiral heat dissipation fins 51, the cooling airflow passes through the heat dissipation groove structure between the spiral heat dissipation fins 51, thereby further increasing the contact area between the heat dissipation pipe 5 and the cooling airflow and improving the heat dissipation effect.

[0081] Example 5

[0082] like Figure 1-6 As shown, this embodiment discloses the vacuum processing process of the heat dissipation substrate 4 and the heat dissipation pipe 5, as well as the liquid addition process of the heat dissipation medium.

[0083] I. Vacuuming Procedure

[0084] Pretreatment and cleaning

[0085] Inner wall cleaning: Use acetone or alcohol to ultrasonically clean the inner wall of the copper pipe to thoroughly remove oil, oxides and processing residues (the heat dissipation of car lights has extremely high requirements for cleanliness, and residues will cause the working fluid to deteriorate).

[0086] Leak detection test: After sealing one end of the copper pipe, fill it with 0.5-0.8MPa nitrogen gas, immerse it in water and check for air bubbles to ensure there are no tiny leaks.

[0087] Connect to vacuum system

[0088] Use a special vacuum clamp (with silicone sealing ring) to clamp the open end of the copper tube and connect it to the high vacuum molecular pump assembly to avoid the expansion of residual gas caused by the high temperature environment of the car headlights.

[0089] The copper tube has an irregular shape and requires a flexible vacuum chamber to assist in air extraction.

[0090] Vacuuming and degassing

[0091] Vacuuming in stages: First, pre-evacuate to 10⁻¹ Pa using a rotary vane pump, then switch to a molecular pump to evacuate to 10⁻⁴ Pa, reducing evacuation time.

[0092] Heating and degassing: The copper tube is heated to 120-150℃ (simulating the high temperature conditions of car lights) to accelerate the release of adsorbed gas for 1-2 hours.

[0093] II. Injection Procedure

[0094] Working fluid selection and proportioning

[0095] High-temperature working fluids: ethanol, acetone

[0096] Liquid injection control: The working fluid volume should be 20%-30% of the internal volume of the copper tube. It needs to be injected precisely using a servo metering pump. Excessive injection will cause the heat pipe to start up late.

[0097] Vacuum negative pressure liquid injection technology

[0098] Dynamic injection method:

[0099] While maintaining a vacuum, the working fluid is injected directly into the bottom of the copper tube through an injection needle.

[0100] Immediately after injection, a second vacuum process is initiated to remove any trace amounts of gas that may have been introduced during the injection process.

[0101] Quick sealing: The injection port is sealed instantly by cold welding or laser welding to prevent air backflow.

[0102] Anti-backflow design: The injection needle has a built-in one-way valve to prevent the working fluid from being drawn back due to negative pressure after injection.

[0103] Post-treatment and enhanced sealing

[0104] Weld point reinforcement: Argon arc welding is used to reinforce the seal to ensure no leakage under vehicle headlight vibration.

[0105] Coating protection: A high-temperature resistant epoxy resin coating is sprayed onto the outer wall of the copper tube to prevent oxidation and corrosion.

[0106] Of course, the above description is not intended to limit the present utility model, and the present utility model is not limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the present utility model should also fall within the protection scope of the present utility model.

Claims

1. An LED lamp heat dissipation device, comprising an LED lamp module, the LED lamp module including a circuit board and an LED lamp electrically connected and mounted on the bottom of the circuit board, characterized in that, It also includes a heat dissipation mechanism installed at the top of the circuit board; The heat dissipation mechanism includes a heat dissipation substrate, a cavity is provided in the heat dissipation substrate, and the cavity is filled with a heat dissipation medium. It also includes a heat dissipation pipe structure connected to the top of the heat dissipation substrate; several heat dissipation capillaries are fixedly connected inside the heat dissipation pipe structure, and the liquid inlet end of the heat dissipation capillaries is located inside the cavity.

2. The LED lamp heat dissipation device according to claim 1, characterized in that, The heat dissipation pipe structure includes a heat dissipation pipe connected to the center of the top of the heat dissipation substrate; The heat pipes and heat dissipation substrate are in a vacuum environment. The outer wall of the heat dissipation capillary is heat-welded to the inner wall of the heat dissipation pipe.

3. The LED lamp heat dissipation device according to claim 1, characterized in that, The heat dissipation capillaries are circumferentially distributed on the inner wall of the heat dissipation tube.

4. The LED lamp heat dissipation device according to claim 2, characterized in that, The heat dissipation mechanism also includes an air-cooling component; The air-cooling component is used to cool the heat pipes and heat dissipation substrate.

5. The LED lamp heat dissipation device according to claim 4, characterized in that, The air-cooling assembly includes an air guide shroud covering the heat dissipation pipes; A cooling fan is installed on the top of the air guide shroud. During the heat dissipation process, the cooling fan drives the cooling airflow downwards. The cooling fan is fixedly mounted on the top of the air guide shroud by several mounting arms.

6. The LED lamp heat dissipation device according to claim 5, characterized in that, The air guide cover includes an upper cover portion integrally formed at the bottom of the upper cover portion, and a lower cover portion integrally formed at the bottom of the upper cover portion; The lower cover is arranged symmetrically, both vertically. The transverse cross-sectional dimension of the central cover is smaller than that of the upper cover and the lower cover.

7. The LED lamp heat dissipation device according to claim 5, characterized in that, The top of the heat dissipation substrate is fixedly connected to several support bases, and the bottom of the air guide shroud is fixedly installed on the support bases.

8. The LED lamp heat dissipation device according to claim 1, characterized in that, The heat dissipation mechanism also includes several heat dissipation fins fixedly connected to the top of the heat dissipation substrate; Several heat dissipation grooves are provided on the side walls on both sides of the heat dissipation fins. The heat dissipation fins are arranged along the width of the heat dissipation substrate, and heat dissipation channels are formed between adjacent heat dissipation fins.

9. The LED lamp heat dissipation device according to claim 2, characterized in that, Several spiral heat dissipation fins are fixedly connected to the outer wall of the heat dissipation pipe. A heat dissipation groove structure is formed between adjacent spiral heat dissipation fins.

10. The LED lamp heat dissipation device according to claim 1, characterized in that, A grid support is fixedly connected inside the heat dissipation substrate, and the grid support has mesh holes. The grid support is supported inside the cavity.

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