An X-ray detector module and radiation imaging device

Abstract

This utility model discloses an X-ray detector module and a radiation imaging device. The X-ray detector module includes: a mounting bracket for positioning and support; a functional circuit board mounted on the surface of the mounting bracket for receiving X-rays and forming a detection image; and a collimator mounted on the surface of the mounting bracket and enclosing the functional circuit board. The collimator is made of a metal material with high attenuation for X-rays, and a collimation slit is formed on the collimator. The collimation slit corresponds to the functional circuit board, allowing main rays perpendicular to the surface of the functional circuit board to enter the collimation slit, while preventing scattered rays inclined to the surface of the functional circuit board from entering the collimation slit. Using this X-ray detector module not only effectively suppresses scattered rays and improves image quality, but also provides radiation protection for the functional circuit board, extending its service life.

Description

Technical Field

[0001] This utility model relates to an X-ray detector module, and also to a radiation imaging device including the X-ray detector module, belonging to the field of radiation imaging technology. Background Technology

[0002] Currently, X-ray imaging equipment is increasingly widely used in fields such as security inspection and industrial flaw detection. The detector is the core component of X-ray imaging equipment, and users are placing increasing demands on it regarding its structure, performance, and ease of use.

[0003] The working principle of X-ray imaging equipment is as follows: An X-ray source generates X-rays, which are attenuated after penetrating the object being measured. The attenuated X-rays then reach the detector, where they are received to form an image. This detector can be a single detector or an array of multiple detectors. However, after the X-rays emitted from the source pass through the object, both attenuated primary rays and scattered rays are produced. Both the primary rays and some scattered rays reach the detector surface and are received. The primary rays are the useful signal for imaging, while the scattered rays are interference signals that are detrimental to imaging. Therefore, for X-ray imaging equipment, the reception of scattered rays by the detector should be minimized to improve image quality.

[0004] Furthermore, the installation accuracy of the detector within the X-ray imaging equipment is also a crucial factor affecting image resolution performance. How to quickly and accurately install the detector into the X-ray imaging equipment is a problem that needs to be solved.

[0005] Meanwhile, prolonged exposure to X-rays can degrade the performance and shorten the lifespan of electronic components, especially integrated circuit chips which are more sensitive to radiation. Therefore, when detectors are used in X-ray imaging equipment, it is desirable to protect the electronic components on the detector from radiation exposure, thereby extending the detector's lifespan. Summary of the Invention

[0006] The primary technical problem to be solved by this utility model is to provide an X-ray detector module.

[0007] Another technical problem to be solved by this utility model is to provide a radiation imaging device including the X-ray detector module.

[0008] To achieve the above technical objectives, the present invention adopts the following technical solution:

[0009] According to a first aspect of the present invention, an X-ray detector module is provided, comprising:

[0010] Mounting brackets are used for positioning and support;

[0011] A functional circuit board is mounted on the surface of the mounting bracket for receiving X-rays and forming a detection image;

[0012] A collimator is mounted on the surface of the mounting bracket and covers the functional circuit board. The collimator is made of a metal material that has high attenuation for X-rays, and a collimation slit is formed on the collimator.

[0013] The collimation slit corresponds to the functional circuit board, allowing the main ray perpendicular to the surface of the functional circuit board to enter the collimation slit, and preventing scattered rays inclined to the surface of the functional circuit board from entering the collimation slit.

[0014] Preferably, the functional circuit board includes:

[0015] A photodiode module, aligned with the collimation slit, is used to receive the main X-rays incident from the collimation slit and to convert the X-rays into electrical signals.

[0016] A data acquisition board is disposed on the side of the photodiode module away from the collimation slit and is electrically connected to the photodiode module to convert the electrical signal into a digital signal.

[0017] A processing board is disposed on the side of the acquisition board away from the photodiode module and connected to the surface of the mounting bracket; wherein the processing board is electrically connected to the acquisition board for converting the digital signal into image data, and the processing board is provided with a data cascading interface for outputting the image data.

[0018] Preferably, the photodiode module includes:

[0019] A low-energy photodiode module is disposed on the acquisition board and aligned with the collimation slit to receive low-energy X-rays and convert them into low-energy electrical signals.

[0020] A high-energy photodiode module is disposed on the acquisition board and located behind the low-energy photodiode module along the X-ray propagation direction, so as to receive high-energy X-rays passing through the low-energy photodiode module and convert them into high-energy electrical signals.

[0021] The low-energy photodiode module and the high-energy photodiode module are both electrically connected to the acquisition board to transmit the low-energy electrical signal and the high-energy electrical signal to the acquisition board, respectively.

[0022] Preferably, the collimator includes:

[0023] The first collimation part is connected to the surface of the mounting bracket and located on one side of the functional circuit board to partially cover the functional circuit board.

[0024] The second collimation part is connected to the surface of the mounting bracket and located on the other side of the functional circuit board, so as to cooperate with the first collimation part to wrap the functional circuit board together.

[0025] Wherein, a first collimation protrusion is formed at one end of the first collimation part, and a second collimation protrusion is formed at one end of the second collimation part. The first collimation protrusion and the second collimation protrusion are parallel to each other and have a preset gap, thereby forming the collimation slit.

[0026] Preferably, the first alignment boss is movably disposed at one end of the first alignment part, and the second alignment boss is movably disposed at one end of the second alignment part, so that the first alignment boss and the second alignment boss can move relative to each other, thereby jointly adjusting the gap size of the alignment slit.

[0027] Preferably, the surface of the mounting bracket is provided with a plurality of collimator mounting holes and a plurality of collimator positioning pins, and the bottom of the collimator is provided with a plurality of threaded holes and a plurality of pin holes;

[0028] The plurality of pin holes are respectively inserted into the plurality of collimator positioning pins to install and position the collimator; the plurality of threaded holes are respectively connected to the plurality of collimator mounting holes to install and fix the collimator.

[0029] Preferably, the surface of the mounting bracket is further provided with multiple circuit board connection holes and multiple circuit board positioning pins, and the functional circuit board has multiple circuit board connection posts and multiple circuit board positioning holes.

[0030] The plurality of circuit board positioning pins are inserted into the plurality of circuit board positioning holes to install and position the functional circuit board; the plurality of circuit board connecting posts are connected to the plurality of circuit board connecting holes to install and fix the functional circuit board.

[0031] Preferably, the mounting bracket has a clearance opening at a position corresponding to the data cascading interface.

[0032] Preferably, the collimator is integrally formed.

[0033] According to a second aspect of the present invention, a radiation imaging device is provided, including the above-described X-ray detector module.

[0034] Compared with the prior art, the present invention has the following technical effects:

[0035] (1) By setting a collimator, the main ray can pass through the collimation slit and be directed toward the functional circuit board, while the scattered rays cannot enter the collimation slit, thereby effectively suppressing the scattered rays and improving the image quality.

[0036] (2) A collimator made of a metal material with high attenuation of X-rays is used, and the functional circuit board is wrapped with the collimator to protect the functional circuit board from radiation and improve the service life of the functional circuit board.

[0037] (3) By coordinating the positioning and installation of the mounting bracket with the functional circuit board and collimator, the overall installation accuracy and assembly efficiency of the detector module are improved.

[0038] (4) The size of the collimation slit is adjusted by the relative movement of the first collimation boss and the second collimation boss. Thus, the opening size of the collimation slit can be freely adjusted as needed to adapt to different radiation imaging scenarios. Attached Figure Description

[0039] Figure 1 A schematic diagram of the structure of an X-ray detector module provided in an embodiment of this utility model;

[0040] Figure 2 This is a schematic diagram illustrating the use of an X-ray detector module to suppress scattered rays.

[0041] Figure 3 This is a top view of the mounting bracket in an embodiment of the present invention;

[0042] Figure 4 This is a front view of the mounting bracket in an embodiment of the present invention;

[0043] Figure 5 This is a top view of the functional circuit board in an embodiment of the present invention;

[0044] Figure 6 This is a side view of the functional circuit board in an embodiment of the present invention;

[0045] Figure 7 This is a rear view of the collimator in an embodiment of the present invention;

[0046] Figure 8 This is a side view of the collimator in an embodiment of the present invention;

[0047] Figure 9 This is a schematic diagram of the collimator in another embodiment of the present invention. Detailed Implementation

[0048] The technical content of this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0049] This invention provides an X-ray detector module that significantly improves image quality by using a collimator to prevent the detector module from receiving scattered X-rays. Furthermore, the collimator is made of a metal material with high attenuation for X-rays, thus protecting the functional circuit board of the detector module and extending its lifespan.

[0050] like Figure 1 As shown, the X-ray detector module provided in this embodiment includes a mounting bracket 1, a functional circuit board 2, and a collimator 3. The mounting bracket 1 provides positioning and support for the functional circuit board 2 and the collimator 3. The functional circuit board 2 is mounted on the surface of the mounting bracket to receive X-rays and form a detection image. The collimator 3 is mounted on the surface of the mounting bracket 1 and has a collimation slit 310 to effectively suppress scattered X-rays.

[0051] During assembly, first, the functional circuit board 2 is mounted on the mounting bracket 1; then, the collimator 3 is placed on the surface of the mounting bracket 1 and wraps around the functional circuit board 2, ensuring that the collimation slot 310 corresponds to the functional circuit board 2. (Refer to...) Figure 2 As shown, when the X-ray source 10 emits X-rays, the X-rays pass through the object under test 20 and are directed towards the detector module (part of which is the main ray and the other part is the scattered ray). The main ray perpendicular to the surface of the functional circuit board 2 can enter the collimation slit 310 and thus irradiate the functional circuit board 2, while the scattered ray inclined to the surface of the functional circuit board 2 cannot enter the collimation slit 310, thereby avoiding the image quality of the scattered ray.

[0052] like Figure 3 and Figure 4 As shown, in this embodiment, the mounting bracket 1 has a rectangular plate structure. The surface of the mounting bracket 1 is also provided with multiple circuit board connection holes 101 and multiple circuit board positioning pins 102. Correspondingly, the functional circuit board 2 has multiple circuit board connection posts 201 and multiple circuit board positioning holes 202 (e.g., ...). Figure 5 and Figure 6 (As shown). During specific installation, the functional circuit board 2 is installed and positioned by inserting multiple circuit board positioning pins 102 into multiple circuit board positioning holes 202; after the functional circuit board 2 is positioned, multiple circuit board connecting posts 201 are connected to multiple circuit board connecting holes 101 to install and fix the functional circuit board 2, thereby ensuring the stability of the functional circuit board 2.

[0053] Furthermore, the surface of the mounting bracket 1 is provided with multiple collimator mounting holes 103 and multiple collimator positioning pins 104. Correspondingly, the bottom of the collimator 3 is provided with multiple threaded holes 301 and multiple pin holes 302 (e.g., ...). Figure 7 and Figure 8 (As shown). In specific installation, the collimator 3 is installed and positioned by inserting multiple pin holes 302 into multiple collimator positioning pins 104 respectively; after the collimator 3 is positioned, multiple threaded holes 301 are bolted to multiple collimator mounting holes 103 respectively to install and fix the collimator 3, so as to ensure the stability of the collimator 3.

[0054] In addition, the surface of the mounting bracket 1 is provided with two clearance openings 105 for clearing the data cascading interface 231 on the functional circuit board 2 (described in detail below).

[0055] like Figure 5 and Figure 6 As shown, in this embodiment, the functional circuit board 2 includes a photodiode (PD) module 21, a data acquisition board 22, and a processing board 23. The photodiode module 21 is used to convert X-rays into electrical signals, and it includes a low-energy photodiode module 211 and a high-energy photodiode module 212. Specifically, the low-energy photodiode module 211 is disposed on the data acquisition board 22 and aligned with the collimation slit 310 to receive low-energy X-rays and convert them into low-energy electrical signals. The high-energy photodiode module 212 is disposed on the data acquisition board 22 and is located behind the low-energy photodiode module 211 along the X-ray propagation direction (i.e., behind...). Figure 1 and Figure 2 In this configuration, the high-energy photodiode module 212 is located below the low-energy photodiode module 211 to receive high-energy X-rays passing through the low-energy photodiode module and convert them into high-energy electrical signals. It is understood that both the low-energy photodiode module 211 and the high-energy photodiode module 212 are electrically connected to the acquisition board 22 to transmit low-energy and high-energy electrical signals to the acquisition board 22, respectively.

[0056] The acquisition board 22 is used to receive the aforementioned low-energy electrical signals and high-energy electrical signals, and to perform integration and AD conversion, thereby converting the electrical signals into digital signals. The function of the acquisition board 22 is performed by a dedicated function chip mounted on the circuit board, which will not be described in detail here.

[0057] The processing board 23 is disposed on the side of the acquisition board 22 away from the photodiode module 21 and connected to the surface of the mounting bracket 1. The processing board 23 is electrically connected to the acquisition board 22 via a connector 24. The acquisition board 22 transmits the converted digital signal to the processing board 3 through the connector 24. The processing board 3 sorts and buffers the digital signal, thereby converting it into image data. Furthermore, the processing board 23 has two data cascading interfaces 231, located within two clearance openings 105. One data cascading interface 231 is used to receive data output from the subsequent detector module, and the other data cascading interface 231 is used to forward the received image data.

[0058] like Figure 7 and Figure 8 As shown, the collimator 3 includes a first collimating portion 31 and a second collimating portion 32. Both the first collimating portion 31 and the second collimating portion 32 are L-shaped (not limited to this shape; in other embodiments, they can also be semi-circular, arc-shaped, etc.). Furthermore, the bottom of both the first collimating portion 31 and the second collimating portion 32 has multiple threaded holes 301 and multiple pin holes 302. A first collimating boss 311 is formed at one end of the top of the first collimating portion 31, and a second collimating boss 321 is formed at one end of the top of the second collimating portion 32. The first collimating boss 311 and the second collimating boss 321 are parallel to each other and have a preset gap, thereby forming a collimation slit 310.

[0059] During installation, the first collimator 31 and the second collimator 32 are connected to the surface of the mounting bracket 1 via threaded holes 301 and pin holes 302, respectively. The first collimator 31 is positioned on one side of the functional circuit board 2, and the second collimator 32 is positioned on the other side, thus the first collimator 31 and the second collimator 32 together enclose the functional circuit board 2. It is understood that in this embodiment, both the first collimator 31 and the second collimator 32 are made of a metal material with high X-ray attenuation, thereby preventing excess X-rays from irradiating the functional circuit board 2, effectively protecting it and improving its service life.

[0060] like Figure 9 As shown, in another embodiment, the first collimation boss 311 is movably disposed on the top of the first collimation portion 31, and correspondingly, the second collimation boss 321 is movably disposed on the top of the second collimation portion 32, thereby allowing the first collimation boss 311 and the second collimation boss 321 to move relative to each other to jointly adjust the size of the collimation slit 310. Thus, the opening size of the collimation slit can be freely adjusted as needed to adapt to different radiation imaging scenarios.

[0061] In another embodiment, the collimator 3 can also be integrally formed by creating a collimation slit 310 by opening a hole in the surface of the collimator 3.

[0062] Based on the above embodiments, this utility model also provides a radiation imaging device, including the aforementioned X-ray detector module. The radiation imaging device may further include a radiation source, a controller, an image processing device, a display, and other structures. The controller can control the exposure of the radiation source, the processing device can process the image data output from the processing board 23, and finally, the display shows the image.

[0063] In summary, the X-ray detector module and radiation imaging device provided by this utility model embodiment have the following beneficial effects:

[0064] (1) By setting collimator 3, the main ray can pass through collimation slit 310 and be directed toward the functional circuit board 2, while the scattered ray cannot enter the collimation slit 310, thereby effectively suppressing the scattered ray and improving the image quality.

[0065] (2) The collimator 3 is made of a metal material that has high attenuation for X-rays, and the functional circuit board 2 is wrapped by the collimator 3, thereby providing radiation protection for the functional circuit board 2 and improving the service life of the functional circuit board 2.

[0066] (3) By positioning and installing the mounting bracket 1 in conjunction with the functional circuit board 2 and the collimator 3, the overall installation accuracy and assembly efficiency of the detector module are improved.

[0067] (4) The size of the collimation slit 310 is adjusted by the relative movement of the first collimation boss 311 and the second collimation boss 321. Thus, the opening size of the collimation slit can be freely adjusted as needed to adapt to different radiation imaging scenarios.

[0068] It should be noted that the above embodiments are merely illustrative examples. The technical solutions of the various embodiments can be combined, and all are within the protection scope of this utility model.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0070] The X-ray detector module and radiation imaging equipment provided by this utility model have been described in detail above. Any obvious modifications made to this utility model by those skilled in the art without departing from its essential content will constitute an infringement of the patent rights of this utility model and will incur corresponding legal liability.

Claims

1. An X-ray detector module, characterized by include: Mounting brackets are used for positioning and support; A functional circuit board is mounted on the surface of the mounting bracket for receiving X-rays and forming a detection image; A collimator is mounted on the surface of the mounting bracket and covers the functional circuit board. The collimator is made of a metal material that has high attenuation for X-rays, and a collimation slit is formed on the collimator. The collimation slit corresponds to the functional circuit board, allowing the main ray perpendicular to the surface of the functional circuit board to enter the collimation slit, and preventing scattered rays inclined to the surface of the functional circuit board from entering the collimation slit.

2. The X-ray detector module of claim 1, characterized in that The functional circuit board includes: A photodiode module, aligned with the collimation slit, is used to receive the main X-rays incident from the collimation slit and to convert the X-rays into electrical signals. A data acquisition board is disposed on the side of the photodiode module away from the collimation slit and is electrically connected to the photodiode module to convert the electrical signal into a digital signal. A processing board is disposed on the side of the acquisition board away from the photodiode module and is connected to the surface of the mounting bracket; The processing board is electrically connected to the acquisition board to convert the digital signal into image data, and the processing board is provided with a data cascading interface for outputting the image data.

3. The X-ray detector module as described in claim 2, characterized in that... The photodiode module includes: A low-energy photodiode module is disposed on the acquisition board and aligned with the collimation slit to receive low-energy X-rays and convert them into low-energy electrical signals. A high-energy photodiode module is disposed on the acquisition board and located behind the low-energy photodiode module along the X-ray propagation direction, so as to receive high-energy X-rays passing through the low-energy photodiode module and convert them into high-energy electrical signals. The low-energy photodiode module and the high-energy photodiode module are both electrically connected to the acquisition board to transmit the low-energy electrical signal and the high-energy electrical signal to the acquisition board, respectively.

4. The X-ray detector module as described in claim 1, characterized in that... The collimator includes: The first collimation part is connected to the surface of the mounting bracket and located on one side of the functional circuit board to partially cover the functional circuit board. The second collimator is connected to the surface of the mounting bracket and located on the other side of the functional circuit board, so as to cooperate with the first collimator to jointly wrap the functional circuit board; Wherein, a first collimation protrusion is formed at one end of the first collimation part, and a second collimation protrusion is formed at one end of the second collimation part. The first collimation protrusion and the second collimation protrusion are parallel to each other and have a preset gap, thereby forming the collimation slit.

5. The X-ray detector module as described in claim 4, characterized in that: The first alignment boss is movably disposed at one end of the first alignment part, and the second alignment boss is movably disposed at one end of the second alignment part, so that the first alignment boss and the second alignment boss can move relative to each other, thereby jointly adjusting the gap size of the alignment slit.

6. The X-ray detector module as described in claim 1, characterized in that: The surface of the mounting bracket is provided with multiple collimator mounting holes and multiple collimator positioning pins, and the bottom of the collimator is provided with multiple threaded holes and multiple pin holes. The plurality of pin holes are respectively inserted into the plurality of collimator positioning pins to install and position the collimator; the plurality of threaded holes are respectively connected to the plurality of collimator mounting holes to install and fix the collimator.

7. The X-ray detector module as described in claim 1, characterized in that: The surface of the mounting bracket is also provided with multiple circuit board connection holes and multiple circuit board positioning pins, and the functional circuit board has multiple circuit board connection posts and multiple circuit board positioning holes. The plurality of circuit board positioning pins are inserted into the plurality of circuit board positioning holes to install and position the functional circuit board; the plurality of circuit board connecting posts are connected to the plurality of circuit board connecting holes to install and fix the functional circuit board.

8. The X-ray detector module as described in claim 2, characterized in that: An avoidance opening is provided on the mounting bracket at a position corresponding to the data cascading interface.

9. The X-ray detector module as described in claim 1, characterized in that: The collimator is integrally formed.

10. A radiation imaging device, characterized in that... Includes the X-ray detector module as described in any one of claims 1 to 9.

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